Wafer spray cleaning device

Abstract

The utility model relates to the technical field of semiconductor processing, and relates to a wafer spray cleaning device. Wafer products enter the cleaning chamber through the feeding port, the receiving mechanism receives the wafer products and transfers the wafer products to the rotating mechanism, the rotating mechanism drives the wafer products to rotate, the upper surfaces of the wafers are cleaned in a spraying mode through the cleaning device, the upper surfaces of the wafers can be evenly cleaned, and the wafer cleaning efficiency is improved. The cleaning effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and specifically to a wafer spray cleaning device. Background Technology

[0002] Wafer cleaning is a crucial step in semiconductor manufacturing, used to remove contaminants and impurities from the wafer surface. The quality of wafer cleaning directly affects the performance and yield of semiconductor devices. However, current wafer cleaning equipment suffers from complex structures, unreasonable layouts, and low integration, resulting in low cleaning efficiency and poor cleaning effects. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer spray cleaning device that can uniformly clean the upper surface of a wafer and improve the cleaning effect.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0005] A wafer spray cleaning device, comprising:

[0006] A cleaning cylinder, which contains a cleaning chamber for cleaning wafer products;

[0007] A baffle is provided on one side of the cleaning cylinder, and a feed inlet is provided on the baffle, which is connected to the cleaning chamber;

[0008] A rotating mechanism is provided in the cleaning chamber. The wafer product is fed onto the rotating mechanism through the feed port. The rotating mechanism is used to drive the wafer product to rotate.

[0009] A receiving mechanism is provided opposite to the feed port. The receiving mechanism is used to receive wafer products and transfer the wafer products to the rotating mechanism.

[0010] In one embodiment of the present invention, the baffle includes a baffle plate, the baffle plate has an arc-shaped structure, the baffle plate has a first opening, the cleaning cylinder has a second opening, the first opening and the second opening form a feed inlet, and a baffle assembly is provided on the feed inlet for opening and closing the feed inlet.

[0011] In one embodiment of the present invention, the material blocking assembly includes a material blocking cylinder, which is drivenly connected to a material blocking plate. The material blocking plate is disposed opposite to the feed inlet, and the material blocking cylinder drives the material blocking plate to block the feed inlet.

[0012] In one embodiment of this utility model, the receiving mechanism includes a lifting cylinder, which is driven to connect to a connecting frame. The connecting frame has an L-shaped structure and is driven to connect to the receiving frame. The receiving frame is arranged opposite to the rotating mechanism. The lifting cylinder drives the receiving frame to move so as to place the wafer products on the receiving frame onto the rotating mechanism.

[0013] In one embodiment of this utility model, a baffle is provided on the connecting frame. The baffle has an arc-shaped structure. One end of the baffle is disposed opposite to the material blocking frame. A slot is provided on the baffle, and the connecting frame passes through the slot.

[0014] In one embodiment of this utility model, the receiving rack is provided with a plurality of support seats, the support seats are provided with support rods, the ends of the support rods are provided with support portions, the support portions are provided with support spherical surfaces, and the plurality of support spherical surfaces surround to form a support plane for supporting the wafer products, and the plurality of support spherical surfaces are on the same support plane.

[0015] In one embodiment of this utility model, the rotating mechanism includes a rotating platform disposed on the bottom surface of the cleaning chamber. A mounting frame is disposed at the bottom of the cleaning cylinder, and a rotary motor is disposed on the mounting frame. The rotary motor is drivenly connected to the rotating platform, and the rotary motor is used to drive the wafer products on the rotating platform to rotate.

[0016] In one embodiment of this utility model, a fixed base is provided on the rotating stage, and a support surface matching the wafer product is provided on the fixed base. A vacuum adsorption groove is provided on the support surface, and the vacuum adsorption groove is connected to the suction hole on the fixed base.

[0017] In one embodiment of the present invention, the bottom of the cleaning cylinder is provided with a plurality of drain outlets, a drain pipe is provided on the drain outlets, and a filter screen is provided on the drain outlets.

[0018] In one embodiment of this utility model, a plurality of mounting holes are provided on the bottom surface of the cleaning cylinder, the plurality of mounting holes surround the rotating mechanism, a water spray pipe is provided on the mounting hole, a nozzle is provided on the water spray pipe, and the nozzle is disposed opposite to the wafer product on the rotating mechanism.

[0019] The beneficial effects of this utility model are:

[0020] The wafer product of this invention enters the cleaning chamber through the feed port. The receiving mechanism receives the wafer product and transfers it to the rotating mechanism. The rotating mechanism drives the wafer product to rotate. The cleaning equipment sprays and cleans the upper surface of the wafer, which can clean the upper surface of the wafer evenly and improve the cleaning effect. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a wafer spray cleaning device according to the present invention.

[0022] Figure 2 This is a schematic diagram of the receiving mechanism of this utility model.

[0023] Figure 3 This is a schematic diagram of the rotating mechanism of this utility model.

[0024] The following are the labels in the diagram: 1. Cleaning cylinder; 11. Cleaning chamber; 12. Drain outlet; 13. Drain pipe; 14. Mounting hole; 15. Nozzle; 2. Receiving mechanism; 21. Lifting cylinder; 22. Connecting frame; 23. Receiving rack; 24. Support component; 25. Support base; 26. Support rod; 27. Support spherical surface; 28. Baffle; 29. ​​Slot; 3. Rotating mechanism; 31. Rotary table; 32. Suction hole; 33. Vacuum adsorption tank; 34. Rotary motor; 4. Baffle rack; 5. Baffle rack; 51. First opening; 52. Second opening; 6. Baffle assembly; 61. Baffle plate; 62. Baffle cylinder. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figure 1 As shown, a wafer spray cleaning device includes:

[0027] The cleaning cylinder 1 has a cleaning chamber 11 inside for cleaning wafer products;

[0028] A baffle 54 is disposed on one side of the cleaning cylinder 1. The baffle 54 is provided with a feed inlet, which is connected to the cleaning chamber 11.

[0029] A rotating mechanism 3 is disposed in the cleaning chamber 11. The wafer product is fed onto the rotating mechanism 3 through the feed port. The rotating mechanism 3 is used to drive the wafer product to rotate.

[0030] The receiving mechanism 2 is arranged opposite to the feed port. The receiving mechanism 2 is used to receive the wafer products and transfer the wafer products to the rotating mechanism 3.

[0031] The wafer product of this utility model enters the cleaning chamber 11 through the feed port. The receiving mechanism 2 receives the wafer product and transfers it to the rotating mechanism 3. The rotating mechanism 3 drives the wafer product to rotate. The upper surface of the wafer is sprayed and cleaned by the cleaning equipment, which can clean the upper surface of the wafer evenly and improve the cleaning effect.

[0032] In one embodiment of this utility model, the baffle 54 includes a baffle plate 61, which has an arc-shaped structure and a first opening 51. The cleaning cylinder 1 is provided with a second opening 52, and the first opening 51 and the second opening 52 form a feed inlet. A baffle assembly 6 is provided on the feed inlet, which is used to open and close the feed inlet. The wafer can be easily entered into the cleaning cylinder 1 for cleaning through the feed inlet. The structure is reasonable and easy to use.

[0033] In one embodiment of this utility model, the baffle assembly 6 includes a baffle cylinder 62, which is drivenly connected to a baffle plate 61. The baffle plate 61 is disposed opposite to the feed inlet. The baffle cylinder 62 drives the baffle plate 61 to shield the feed inlet. After the handling equipment such as the robot arm moves out, the baffle cylinder 62 drives the baffle plate 61 to shield the feed inlet, which can prevent the cleaning fluid of the wafer cleaning from splashing and ensure the cleanliness of the equipment.

[0034] In one embodiment of the present invention, the receiving mechanism 2 includes a lifting cylinder 21, which is driven to connect to a connecting frame 22. The connecting frame 22 has an L-shaped structure and is driven to connect to a receiving frame 23. The receiving frame 23 is disposed opposite to the rotating mechanism 3. The lifting cylinder 21 drives the receiving frame 23 to move so as to place the wafer products on the receiving frame 23 onto the rotating mechanism 3.

[0035] Specifically, the wafers are fed into the cleaning cylinder 1 through the feed port by a robotic arm or other handling equipment. The lifting cylinder 21 drives the receiving rack 23 to receive the wafers, which can provide secondary support and positioning for the wafers and play a role in transmission buffering. This effectively avoids direct contact between the wafers and the rotary table 31, thereby improving the wafer yield.

[0036] In one embodiment of the present invention, a baffle 28 is provided on the connecting frame 22. The baffle 28 has an arc-shaped structure. One end of the baffle 28 is disposed opposite to the baffle frame 54. A slot 29 is provided on the baffle 28, and the connecting frame 22 passes through the slot 29.

[0037] Specifically, the connecting frame 22 is inserted into the slot 29, and one end of the baffle 28 is positioned opposite to the baffle frame 54. The baffle 28 can shield the feeding mechanism 2 to prevent splashing during wafer cleaning, ensure the normal operation of the equipment, and avoid equipment damage.

[0038] In one embodiment of the present invention, the receiving rack 23 is provided with a plurality of support components 24, the support component 24 including a support base 25, the support base 25 is provided with a support rod 26, the end of the support rod 26 is provided with a support portion, the support portion is provided with a support spherical surface 27, the plurality of support spherical surfaces 27 surround to form a support plane for supporting the wafer product, and the plurality of support spherical surfaces 27 are on the same support plane.

[0039] Specifically, multiple supporting spheres 27 are arranged to form a supporting plane for supporting the wafer product, which supports the wafer at multiple points, effectively avoiding scratches caused by the support and ensuring the processing quality of the wafer.

[0040] In one embodiment of the present invention, the rotating mechanism 3 includes a rotating platform 31, which is disposed on the bottom surface of the cleaning chamber 11. A mounting frame is provided at the bottom of the cleaning cylinder 1, and a rotating motor 34 is disposed on the mounting frame. The rotating motor 34 is drivenly connected to the rotating platform 31, and the rotating motor 34 is used to drive the wafer products on the rotating platform 31 to rotate.

[0041] Specifically, during cleaning, the upper surface of the wafer is sprayed and cleaned by the cleaning equipment. The rotary motor 34 drives the wafer product on the rotary table 31 to rotate, which can uniformly clean the upper surface of the wafer and improve the cleaning effect.

[0042] In one embodiment of the present invention, a fixed base is provided on the rotary table 31, and a support surface matching the wafer product is provided on the fixed base. A vacuum adsorption groove 33 is provided on the support surface, and the vacuum adsorption groove 33 is connected to the suction hole 32 on the fixed base.

[0043] Specifically, the suction port 32 is connected to the vacuum generator, and negative pressure is generated through the suction port 32. Since the vacuum adsorption tank 33 is connected to the suction port 32 on the fixed base, the vacuum adsorption tank 33 also generates negative pressure to adsorb the wafer onto the support surface of the fixed base. This allows for rapid positioning of the wafer, preventing it from shaking during rotation and cleaning, effectively preventing the wafer from falling, and ensuring the cleaning efficiency of the wafer.

[0044] In one embodiment of the present invention, the bottom of the cleaning cylinder 1 is provided with a plurality of drain outlets 12, a drain pipe 13 is provided on the drain outlet 12, and a filter screen is provided on the drain outlet 12.

[0045] Specifically, multiple drain outlets 12 can quickly discharge the cleaning fluid, preventing the cleaning fluid from accumulating and splashing, which would affect the cleaning effect on the wafer. The drain outlets 12 are equipped with filters to coarsely filter the cleaning fluid, preventing impurities in the cleaning tube from clogging it and ensuring normal cleaning operation.

[0046] In one embodiment of the present invention, a plurality of mounting holes 14 are provided on the bottom surface of the cleaning cylinder 1, the plurality of mounting holes 14 surround the rotating mechanism 3, a water spray pipe is provided on the mounting hole 14, and a nozzle 15 is provided on the water spray pipe, the nozzle 15 being disposed opposite to the wafer product on the rotating mechanism 3.

[0047] Specifically, the nozzle 15 inside the cleaning cylinder 1 is positioned opposite to the wafer product on the rotating mechanism 3, spraying the lower surface of the wafer. This allows for the cleaning of both the upper and lower surfaces of the wafer in one go, improving the cleaning effect while taking up little space and being easy to use.

[0048] Usage process

[0049] The wafers are fed into the cleaning cylinder 1 through the feed port using a robotic arm or other handling equipment. The lifting cylinder 21 drives the receiving rack 23 to receive the wafers. After the robotic arm or other handling equipment moves out, the baffle cylinder 62 drives the baffle plate 61 to block the feed port. Multiple supporting spherical surfaces 27 form a supporting plane to support the wafers. The lifting cylinder 21 drives the wafers on the receiving rack 23 to move towards the rotary table 31 and place the wafers onto the rotating mechanism 3. The suction port 32 is connected to the vacuum generator, which generates negative pressure. Since the vacuum adsorption tank 33 is connected to the suction port 32 on the fixed base, the vacuum adsorption tank 33 also generates negative pressure, adsorbing the wafers onto the supporting surface of the fixed base. During cleaning, the upper surface of the wafers is sprayed cleaned by the cleaning equipment. The rotary motor 34 drives the wafers on the rotary table 31 to rotate, which can uniformly clean the upper surface of the wafers and improve the cleaning effect.

[0050] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A wafer spray cleaning apparatus, characterized by comprising: The utility model relates to a cleaning device for wafer products, comprising: a cleaning cylinder, which is internally provided with a cleaning chamber for cleaning wafer products; a material blocking frame, which is arranged on one side of the cleaning cylinder and is provided with a feeding port in communication with the cleaning chamber; a rotating mechanism, which is arranged in the cleaning chamber, and the wafer products are fed to the rotating mechanism through the feeding port, and the rotating mechanism is used to drive the wafer products to rotate; a material receiving mechanism, which is arranged opposite to the feeding port and is used to receive the wafer products and transfer them to the rotating mechanism.

2. The wafer spray cleaning apparatus of claim 1, wherein The material blocking frame comprises a material blocking plate, which is in an arc structure, and is provided with a first opening, and the cleaning cylinder is provided with a second opening, and the first opening and the second opening form the feeding port, and the feeding port is provided with a material blocking assembly, which is used to open and close the feeding port.

3. The wafer spray cleaning apparatus of claim 2, wherein The material blocking assembly comprises a material blocking cylinder, which is drivingly connected with the material blocking plate, and the material blocking plate is arranged opposite to the feeding port, and the material blocking cylinder drives the material blocking plate to shield the feeding port.

4. The wafer spray cleaning apparatus of claim 1, wherein The material receiving mechanism comprises a lifting cylinder, which is drivingly connected with a connecting frame, and the connecting frame is in an L-shaped structure, and is drivingly connected with a material receiving frame, which is arranged opposite to the rotating mechanism, and the lifting cylinder drives the material receiving frame to move so as to feed the wafer products on the material receiving frame to the rotating mechanism.

5. The wafer spray cleaning apparatus of claim 4, wherein The connecting frame is provided with a baffle, which is in an arc structure, and one end of the baffle is arranged opposite to the material blocking frame, and the baffle is provided with a clamping groove, and the connecting frame is arranged in the clamping groove.

6. The wafer spray cleaning apparatus of claim 4, wherein The material receiving frame is provided with a plurality of supporting seats, which are provided with supporting rods, and the ends of the supporting rods are provided with supporting portions, and the supporting portions are provided with supporting spherical surfaces, and a plurality of supporting spherical surfaces form a supporting plane for supporting the wafer products, and the plurality of supporting spherical surfaces are on the same supporting plane.

7. The wafer spray cleaning apparatus of claim 1, wherein The rotating mechanism comprises a rotating table, which is arranged on the bottom surface of the cleaning chamber, and the bottom of the cleaning cylinder is provided with a mounting frame, and the mounting frame is provided with a rotating motor, which is drivingly connected with the rotating table, and the rotating motor is used to drive the wafer products on the rotating table to rotate.

8. The wafer spray cleaning apparatus of claim 7, wherein The rotating table is provided with a fixing seat, which is provided with a supporting surface matched with the wafer products, and the supporting surface is provided with a vacuum suction groove, which is in communication with a suction hole in the fixing seat.

9. The wafer spray cleaning apparatus of claim 1, wherein The bottom of the cleaning cylinder is provided with a plurality of drainage ports, which are provided with drainage pipes and filter screens.

10. The wafer spray cleaning apparatus of claim 1, wherein The bottom surface of the cleaning cylinder is provided with a plurality of mounting holes, which are arranged around the rotating mechanism, and the mounting holes are provided with water spraying pipes, and the water spraying pipes are provided with nozzles, which are arranged opposite to the wafer products on the rotating mechanism.

Images