Packaging tool for optocoupler chip processing

Abstract

The utility model discloses a packaging tool for optocoupler chip processing, which relates to the technical field of optocoupler chip processing, and comprises a turntable, a base, a storage frame and an upper die, a lower die is arranged in the storage frame, the lower die is connected with the storage frame in an up-and-down sliding manner, a storage groove is formed in the top end of the upper die, and the upper die is connected with the storage groove in an up-and-down sliding manner. A storage groove is formed in the base, a feeding pipe is arranged in the storage groove, the feeding pipe penetrates through the upper mold and the limiting pressing plate to the inner side of the storage frame, the feeding pipe is fixedly connected with the upper mold, and the base is provided with a pushing mechanism which is used for driving the rotating disc to rotate and automatically pushing packaged chips out. According to the utility model, through the lifting pushing of the pushing mechanism, the positions of the plurality of storage frames are automatically switched, and after the switching, the optocoupler chip is pushed to rise through the lower die, so that the packaged optocoupler chip can be automatically pushed out of the storage frames, and the packaging efficiency of the optocoupler chip can be further improved.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler chip processing technology, specifically a packaging tool for optocoupler chip processing. Background Technology

[0002] An optocoupler chip is an electronic device that achieves isolated transmission of electrical signals through the photoelectric effect. It consists of a light-emitting element and a light-receiving element and has the characteristics of strong anti-interference ability, long life and high transmission efficiency. In the manufacturing process of optocoupler chips, in order to achieve physical protection, electrical connection and isolation of the chip and ensure normal heat dissipation, the optocoupler chip needs to be encapsulated with encapsulating glue. At the same time, in order to ensure stable connection between the chip and the circuit, improve the reliability and durability of the encapsulation, and simplify the encapsulation process, a pressure sealing method is used to encapsulate the optocoupler chip.

[0003] Existing tooling for packaging optocoupler chips uses a rotating turntable to achieve multi-station packaging. However, after the optocoupler chip is pressed and packaged, it needs to be manually removed from the mold cavity. This not only results in low loading and unloading efficiency but also easily damages the optocoupler chip or deforms its pins. To further improve the packaging efficiency of optocoupler chips, a packaging tooling for processing optocoupler chips is provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0004] The purpose of this invention is to provide a packaging fixture for processing optocoupler chips to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A packaging fixture for processing optocoupler chips includes a turntable, a base at the bottom of the turntable, and multiple storage frames equidistantly mounted on the top of the turntable. Each storage frame has an upper mold on its upper surface, extending into the inner cavity of the storage frame. A lower mold is located inside each storage frame and is slidably connected to it. A storage groove is formed at the top of the upper mold, and a feed pipe is located inside the storage groove. The feed pipe passes through the upper mold and a limiting pressure plate to the inner side of the storage frame and is fixedly connected to the upper mold. A pushing mechanism is provided on the base to drive the turntable to rotate and automatically push out the packaged chip.

[0007] The push mechanism includes:

[0008] Multiple connecting push rods are circumferentially and equidistantly arranged inside the base. The multiple connecting push rods are located below multiple storage frames. The connecting push rods pass through the base and turntable to the inside of the storage frames. The connecting push rods are slidably connected to the turntable, storage frames, and base. The lower mold is located at the top of the connecting push rods. The connecting push rods are fixedly connected to the lower mold.

[0009] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0010] In one alternative embodiment, the push mechanism further includes:

[0011] Limiting components are installed on the turntable;

[0012] The limiting component includes:

[0013] A limiting rotating cylinder is fixedly connected to the inner wall of the turntable. The limiting rotating cylinder extends into the interior of the base. A limiting rotating ring is integrally formed on the outer wall of the limiting rotating cylinder. Both the limiting rotating cylinder and the limiting rotating ring are rotatably connected to the base.

[0014] The limiting rotary drum is equipped with a guide assembly;

[0015] The base is equipped with a push component.

[0016] In one alternative embodiment, the guiding component includes:

[0017] Multiple circumferentially equidistant guide grooves are formed on the inner wall of the limiting rotating cylinder. Multiple circumferentially equidistant guide grooves are also formed on the inner wall of the limiting rotating cylinder. These guide grooves intersect with the limiting guide grooves. The inner wall of the top of one guide groove communicates with the inner wall of the top of another limiting guide groove. The inner wall of the bottom of one guide groove communicates with the inner wall of another limiting guide groove. A straight sliding groove is formed at the top of each of the multiple guide grooves on the limiting rotating cylinder. This straight sliding groove communicates with the inner wall of the guide groove. The depth of the inner wall at the bottom of the limiting guide groove is shallower than the depth of the inner wall at the top. The depth of the inner wall at the top of the limiting guide groove is equal to the depth of the inner walls of the straight sliding groove and the guide groove.

[0018] In one alternative embodiment, the push component includes:

[0019] A first electric push rod is installed at the bottom of the base. The output end of the first electric push rod is fixedly connected to a lifting push plate. The lifting push plate is located inside the base and is slidably connected to the base up and down.

[0020] The lifting push plate is equipped with a pressing component;

[0021] The lifting push plate is equipped with a lifting component.

[0022] In one alternative: the extrusion assembly is an extrusion push block fixedly connected to the top of the lifting push plate, the extrusion push block being located below a connecting push rod.

[0023] In one alternative: the lifting assembly is a lifting push column fixedly connected to the top of the lifting push plate, and the limiting rotary cylinder is slidably sleeved on the outer wall of the lifting push column;

[0024] The lifting push column is equipped with a locking component.

[0025] In one alternative embodiment, the engagement assembly includes:

[0026] Multiple limiting baffles are circumferentially and equidistantly arranged inside the lifting push column. One end of each of the multiple limiting baffles is fixedly connected to a positioning block. The outer wall of the positioning block away from the limiting baffle is hemispherical. The positioning block penetrates the lifting push column to the interior of the guide groove. The outer wall of the positioning block is tightly fitted with the bottom inner wall of the guide groove. The limiting baffles and positioning blocks are slidably connected to the lifting push column. The positioning blocks are slidably connected to the linear slide groove, the guide groove, and the limiting guide groove.

[0027] A reset component is provided on the limiting baffle.

[0028] In one alternative: the reset component is a spring disposed at the end of the limiting baffle away from the positioning block, one end of the spring is in contact with the outer wall of the limiting baffle, and the other end of the spring is in contact with the inner wall of the lifting push column.

[0029] In one alternative: a support frame is mounted on the top of the base, a second electric push rod is mounted on the top of the support frame, and an extrusion plate is fixedly connected to the output end of the second electric push rod. The extrusion plate is located between the support frame and the turntable, and the extrusion plate is located above an upper mold.

[0030] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0031] This invention uses a lifting and lowering mechanism to automatically switch the positions of multiple storage boxes. After switching, the lower mold pushes the optocoupler chip upward, thereby automatically pushing the packaged optocoupler chip out of the storage box, which can further improve the packaging efficiency of the optocoupler chip. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of this utility model.

[0033] Figure 2 This is a schematic diagram of the internal structure of the base of this utility model.

[0034] Figure 3This is a schematic diagram of the internal structure of the limiting rotating cylinder of this utility model.

[0035] Figure 4 For the present utility model Figure 2 A magnified schematic diagram of the structure at point A in the diagram.

[0036] Figure reference numerals: 1. Turntable; 201. First electric push rod; 202. Lifting push plate; 203. Extrusion push block; 204. Connecting push rod; 205. Positioning block; 206. Limiting rotary cylinder; 207. Straight slide; 208. Guide sloping groove; 209. Limiting guide groove; 2010. Spring; 2011. Limiting baffle; 2012. Lifting push column; 2013. Limiting rotating ring; 3. Storage frame; 4. Storage slot; 5. Upper mold; 6. Feed pipe; 7. Extrusion plate; 8. Support frame; 9. Second electric push rod; 10. Base; 11. Lower mold. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0038] In one embodiment, such as Figures 1-4 As shown, a packaging fixture for processing optocoupler chips includes a turntable 1, a base 10 at the bottom of the turntable 1, and multiple storage frames 3 equidistantly mounted on the top of the turntable 1. Each storage frame 3 has an upper mold 5 on its upper surface, extending into the inner cavity of the storage frame 3. A lower mold 11 is located inside the storage frame 3, and the lower mold 11 is slidably connected to the storage frame 3. A storage groove 4 is opened at the top of the upper mold 5, and a feed pipe 6 is installed inside the storage groove 4. The feed pipe 6 passes through the upper mold 5 and a limiting pressure plate to the inner side of the storage frame 3, and is fixedly connected to the upper mold 5. A support frame 8 is mounted at the top of the base 10, and a second electric push rod 9 is mounted at the top of the support frame 8. An extrusion plate 7 is fixedly connected to the output end of the second electric push rod 9. The extrusion plate 7 is located between the support frame 8 and the turntable 1, above one of the upper molds 5. A pushing mechanism is provided on the base 10 to drive the turntable 1 to rotate and automatically push out the packaged chip.

[0039] The pushing mechanism includes: multiple connecting push rods 204 circumferentially and equidistantly arranged inside the base 10, the multiple connecting push rods 204 being located below multiple storage frames 3 respectively, the connecting push rods 204 penetrating through the base 10, the turntable 1 to the inside of the storage frame 3, the connecting push rods 204 being slidably connected to the turntable 1, the storage frame 3, and the base 10, the lower mold 11 being located at the top of the connecting push rods 204, and the connecting push rods 204 being fixedly connected to the lower mold 11;

[0040] In this embodiment, when in use, the optocoupler chip is placed in the inner cavity of the storage frame 3 and installed on the top of the lower mold 11. Then, the upper mold 5 is placed on the top of the storage frame 3. At this time, the limiting pressure plate is inserted into the inside of the storage frame 3 under the drive of the upper mold 5. Then, the encapsulating glue is injected into the inner cavity of the storage frame 3 through the feeding pipe 6, so as to perform preliminary encapsulation of the optocoupler chip.

[0041] Then, the turntable 1 is rotated by the pushing mechanism, so that the positions of multiple storage boxes 3 can be switched. The lower mold 11 is pushed up along the inner wall of the storage box 3 by the connecting push rod 204. At the same time, the optocoupler chip is pushed by the lower mold 11, which pushes the upper mold 5 to rise synchronously. In this way, the packaged optocoupler chip can be automatically pushed out of the storage box 3, thereby further improving the packaging efficiency of the optocoupler chip.

[0042] When the optocoupler chip and the upper mold 5 move to the underside of the extrusion plate 7 via the storage frame 3 and the turntable 1, the second electric push rod 9 is activated to push the extrusion plate 7 to extrude the upper surface of the upper mold 5. This allows the upper mold 5 and the lower mold 11 to press and mold the optocoupler chip, thereby effectively improving the packaging quality of the optocoupler chip.

[0043] In one embodiment, such as Figures 2-4 As shown, the pushing mechanism also includes: a limiting component set on the turntable 1;

[0044] The limiting component includes: a limiting rotating cylinder 206 fixedly connected to the inner wall of the turntable 1, the limiting rotating cylinder 206 extending into the interior of the base 10, and a limiting rotating ring 2013 integrally formed on the outer wall of the limiting rotating cylinder 206. Both the limiting rotating cylinder 206 and the limiting rotating ring 2013 are rotatably connected to the base 10.

[0045] A guide assembly is provided on the limiting rotary drum 206;

[0046] A push component is provided on the base 10;

[0047] The guiding assembly includes: multiple circumferentially equidistant guide grooves 209 on the inner wall of the limiting rotary cylinder 206; multiple circumferentially equidistant guide grooves 208 on the inner wall of the limiting rotary cylinder 206; the multiple guide grooves 208 and the multiple limiting guide grooves 209 intersect each other; the inner wall of the top of the guide groove 208 communicates with the inner wall of the top of one limiting guide groove 209; the inner wall of the bottom of the guide groove 208 communicates with the inner wall of the bottom of another limiting guide groove 209; a straight sliding groove 207 is provided at the top of each of the multiple guide grooves 208 on the limiting rotary cylinder 206; the straight sliding groove 207 communicates with the inner wall of the guide groove 208; the depth of the inner wall of the bottom of the limiting guide groove 209 is shallower than the depth of the inner wall of the top; the depth of the inner wall of the top of the limiting guide groove 209 is equal to the depth of the inner walls of the straight sliding groove 207 and the guide groove 208.

[0048] The pushing component includes: a first electric push rod 201 installed at the bottom of the base 10, the output end of the first electric push rod 201 is fixedly connected to a lifting push plate 202, the lifting push plate 202 is located inside the base 10, and the lifting push plate 202 is slidably connected to the base 10 up and down.

[0049] An extrusion assembly is provided on the lifting push plate 202;

[0050] The lifting push plate 202 is equipped with a lifting component;

[0051] The lifting assembly is a lifting push column 2012 fixedly connected to the top of the lifting push plate 202, and the limiting rotary cylinder 206 is slidably sleeved on the outer wall of the lifting push column 2012.

[0052] The lifting push column 2012 is equipped with a locking component;

[0053] The engaging assembly includes: multiple limiting baffles 2011 circumferentially and equidistantly arranged inside the lifting push column 2012; a positioning block 205 is fixedly connected to one end of each limiting baffle 2011; the outer wall of the positioning block 205 away from the limiting baffle 2011 is hemispherical; the positioning block 205 penetrates the lifting push column 2012 to the interior of the guide groove 208; the outer wall of the positioning block 205 is tightly fitted with the bottom inner wall of the guide groove 208; the limiting baffles 2011 and the positioning block 205 are slidably connected to the lifting push column 2012; and the positioning block 205 is slidably connected to the linear slide groove 207, the guide groove 208, and the limiting guide groove 209.

[0054] A reset component is provided on the limit baffle 2011;

[0055] The reset component is a spring 2010 located at the end of the limit baffle 2011 away from the positioning block 205. One end of the spring 2010 contacts the outer wall of the limit baffle 2011, and the other end of the spring 2010 contacts the inner wall of the lifting push column 2012. Through the cooperation of the limit component, guide component, push component, lifting component, locking component and reset component, the turntable 1 can be driven to rotate, thereby automatically switching the position of multiple storage boxes 3.

[0056] In one embodiment, such as Figures 2-3 As shown, the extrusion assembly is an extrusion pusher 203 fixedly connected to the top of the lifting pusher plate 202. The extrusion pusher 203 is located below a connecting pusher 204. Through the cooperation between the extrusion pusher 203 and the connecting pusher 204, the positions of multiple storage frames 3 can be automatically switched, and the lower mold 11 can be pushed to move along the inner wall of the storage frame 3. In this way, the packaged optocoupler chip can be automatically pushed out of the storage frame 3, thereby further improving the packaging efficiency of the optocoupler chip.

[0057] The above embodiment discloses a packaging fixture for processing optocoupler chips. In use, the optocoupler chip is placed in the inner cavity of the storage frame 3 and installed on the top of the lower mold 11. Then, the upper mold 5 is placed on the top of the storage frame 3. At this time, the limiting pressure plate is inserted into the interior of the storage frame 3 under the drive of the upper mold 5. Then, the encapsulating glue is injected into the inner cavity of the storage frame 3 through the feed pipe 6, so as to perform preliminary encapsulation of the optocoupler chip.

[0058] Then, the first electric push rod 201 is activated to push the lifting push plate 202 upward. At this time, the extrusion push block 203 and the lifting push column 2012 rise synchronously under the push of the lifting push plate 202. At this time, the positioning block 205 slides along the outer wall of the guide groove 208 under the push of the lifting push column 2012. At the same time, the limiting rotating cylinder 206 drives the turntable 1 to rotate along the inner wall of the base 10 through the guide groove 208 under the push of the positioning block 205 and the limiting rotating ring 2013. At this time, the connecting push rod 204 and the storage frame 3 are displaced under the drive of the turntable 1 until the positioning block 205 contacts the inner wall of the straight slide groove 207. At the same time, the next connecting push rod 204 is displaced above the extrusion push block 203, so that the positions of multiple storage frames 3 can be switched.

[0059] When the extrusion pusher 203 continues to rise under the push of the lifting pusher plate 202, the positioning block 205 rises along the inner wall of the straight slide groove 207 under the push of the lifting pusher plate 202 via the lifting pusher column 2012. At the same time, the extrusion pusher 203 pushes a connecting pusher 204 to rise under the push of the lifting pusher plate 202. At this time, the lower mold 11 rises along the inner wall of the storage frame 3 under the push of the connecting pusher 204. At the same time, the optocoupler chip pushes the upper mold 5 to rise synchronously under the push of the lower mold 11. In this way, the packaged optocoupler chip can be automatically pushed out of the storage frame 3, thereby further improving the packaging efficiency of the optocoupler chip.

[0060] Then, the first electric push rod 201 is activated to drive the lifting push plate 202 to reset. At this time, the positioning block 205 descends along the inner wall of the straight slide groove 207 under the drive of the lifting push plate 202 via the lifting push column 2012. When the positioning block 205 contacts the inner wall of the limiting guide groove 209, the positioning block 205 pushes the limiting baffle 2011 to slide along the inner wall of the lifting push column 2012 under the obstruction of the inner wall of the limiting guide groove 209. At the same time, the limiting baffle 2011 retracts through the sliding compression spring 2010. When the positioning block 205 separates from the inner wall of the limiting guide groove 209 under the drive of the lifting push column 2012, the spring 2010 pushes the limiting baffle 2011 by rebound, so that the positioning block 205 is inserted into the interior of the guide groove 208 and fits against the inner wall of the guide groove 208. Then, the above operation is repeated, so that multiple storage boxes 3 can be automatically displaced.

[0061] When the optocoupler chip and the upper mold 5 move to the underside of the extrusion plate 7 via the storage frame 3 and the turntable 1, the second electric push rod 9 is activated to push the extrusion plate 7 to extrude the upper surface of the upper mold 5. This allows the upper mold 5 and the lower mold 11 to press and mold the optocoupler chip, thereby effectively improving the packaging quality of the optocoupler chip.

[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging tool for processing an optical coupling chip, comprising a turntable (1), a base (10) is arranged at the bottom end of the turntable (1), a plurality of receiving frames (3) are installed at the top end of the turntable (1) in equal intervals in the circumferential direction, an upper mold (5) is arranged on the upper surface of each of the plurality of receiving frames (3), the upper mold (5) extends into the inner cavity of the receiving frame (3), a lower mold (11) is arranged inside the receiving frame (3), the lower mold (11) is in sliding connection with the receiving frame (3) in an up-down direction, a receiving groove (4) is formed at the top end of the upper mold (5), a feeding pipe (6) is arranged inside the receiving groove (4), the feeding pipe (6) penetrates through the upper mold (5), a limiting pressing plate and the inner side of the receiving frame (3), and the feeding pipe (6) is fixedly connected with the upper mold (5), characterized in that, The base (10) is provided with a pushing mechanism for driving the rotating disc (1) to rotate and automatically pushing out the packaged chip. The pushing mechanism comprises a plurality of connecting push rods (204) arranged equidistantly in the circumference and inside the base (10), the plurality of connecting push rods (204) are respectively located below the plurality of receiving frames (3), the connecting push rod (204) penetrates through the inside of the base (10), the rotating disc (1) and the receiving frame (3), the connecting push rod (204) is in sliding connection with the rotating disc (1), the receiving frame (3) and the base (10), the lower mold (11) is located at the top end of the connecting push rod (204), and the connecting push rod (204) is in fixed connection with the lower mold (11).

2. The packaging tool for optical coupling chip processing according to claim 1, characterized in that, The pushing mechanism further comprises a limiting assembly arranged on the rotating disc (1). The limiting assembly comprises a limiting rotating cylinder (206) fixedly connected to the inner wall of the rotating disc (1), the limiting rotating cylinder (206) penetrates into the inside of the base (10), the outer wall of the limiting rotating cylinder (206) is integrally formed with a limiting rotating ring (2013), and the limiting rotating cylinder (206) and the limiting rotating ring (2013) are in rotary connection with the base (10). The limiting rotating cylinder (206) is provided with a guide assembly. The base (10) is provided with a pushing assembly.

3. The packaging tool for optical coupling chip processing according to claim 2, characterized in that, The guide assembly comprises a plurality of limiting guide grooves (209) arranged equidistantly in the circumference and on the inner wall of the limiting rotating cylinder (206), the inner wall of the limiting rotating cylinder (206) is arranged with a plurality of guide inclined grooves (208) arranged equidistantly in the circumference, the plurality of guide inclined grooves (208) and the plurality of limiting guide grooves (209) are interlaced with each other, the top end inner wall of the guide inclined groove (208) and the top end inner wall of one limiting guide groove (209) penetrate each other, the bottom end inner wall of the guide inclined groove (208) and the bottom end inner wall of another limiting guide groove (209) penetrate each other, the top end of the limiting rotating cylinder (206) is arranged with a straight sliding groove (207) at the top end of each of the plurality of guide inclined grooves (208), the straight sliding groove (207) and the inner wall of the guide inclined groove (208) penetrate each other, the depth of the bottom end inner wall of the limiting guide groove (209) is shallower than the depth of the top end inner wall, and the depth of the top end inner wall of the limiting guide groove (209) is equal to the depth of the inner wall of the straight sliding groove (207) and the guide inclined groove (208).

4. The packaging tool for optical coupling chip processing according to claim 2, characterized in that, The pushing assembly comprises a first electric push rod (201) mounted at the bottom end of the base (10), the output end of the first electric push rod (201) is fixedly connected with a lifting push plate (202), the lifting push plate (202) is located inside the base (10), and the lifting push plate (202) is in up-down sliding connection with the base (10). The lifting push plate (202) is provided with a pressing assembly. The lifting push plate (202) is provided with a lifting assembly.

5. The packaging tool for optical coupling chip processing according to claim 4, characterized in that, The pressing assembly is a pressing push block (203) fixedly connected to the top end of the lifting push plate (202), and the pressing push block (203) is located below one connecting push rod (204).

6. The packaging tool for optical coupling chip processing according to claim 4, characterized in that, The lifting assembly is a lifting push column (2012) fixedly connected at the top end of a lifting push plate (202), and the limiting rotating cylinder (206) is slidingly sleeved on the outer wall of the lifting push column (2012). The lifting push column (2012) is provided with a clamping assembly.

7. The packaging tool for optical coupling chip processing according to claim 6, characterized in that, The clamping assembly comprises a plurality of limiting baffle plates (2011) circumferentially and equidistantly arranged in the lifting push column (2012), one end of each of the limiting baffle plates (2011) is fixedly connected with a positioning clamping block (205), the outer wall of the end of the positioning clamping block (205) away from the limiting baffle plate (2011) is hemispherical, the positioning clamping block (205) penetrates the lifting push column (2012) to the inside of the guide inclined chute (208), the outer wall of the positioning clamping block (205) is tightly attached to the bottom end inner wall of the guide inclined chute (208), the limiting baffle plate (2011) and the positioning clamping block (205) are slidingly connected with the lifting push column (2012), and the positioning clamping block (205) is slidingly connected with the straight-line sliding groove (207), the guide inclined chute (208) and the limiting guide groove (209). The limiting baffle plate (2011) is provided with a reset assembly.

8. The packaging tool for optical coupling chip processing according to claim 7, characterized in that, The reset assembly is a spring (2010) arranged at the end of the limiting baffle plate (2011) away from the positioning clamping block (205), one end of the spring (2010) is in contact with the outer wall of the limiting baffle plate (2011), and the other end of the spring (2010) is in contact with the inner wall of the lifting push column (2012).

9. The packaging tool for optical coupling chip processing according to claim 1, wherein, The top end of the base (10) is provided with a supporting frame (8), the top end of the supporting frame (8) is provided with a second electric push rod (9), one end of the second electric push rod (9) is fixedly connected with a pressing plate (7), the pressing plate (7) is located between the supporting frame (8) and the rotating disc (1), and the pressing plate (7) is located above one upper die (5).

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