Wafer cleaning equipment

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses wafer cleaning equipment which comprises a cleaning machine body, a base and a protection assembly, and a cleaning assembly, a collecting assembly and a positioning assembly are installed in the base. According to the wafer cleaning equipment, wafers of different sizes can be positioned through the positioning assembly, follow-up cleaning work is facilitated, the wafers of different sizes can be cleaned through the cleaning assembly, waste generated in the cleaning process can be sucked through the collecting assembly, and the cleaning efficiency is improved. And the arranged protection assembly can directly solve the problem that chippings splash outwards during cleaning, in the cleaning process, the splashed chippings can be directly blocked by a prefabricated baffle, a protection cover and a cover plate, normal operation of other equipment is prevented from being affected, meanwhile, the cover plate can be controlled to move up and down by starting a first servo motor, and the service life of the equipment is prolonged. The cover plate can be contained in the reserved groove and can also move upwards from the reserved groove.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning technology, specifically to a wafer cleaning device. Background Technology

[0002] In current semiconductor manufacturing, cylindrical single-crystal silicon is often cut into multiple wafers from a circular cross-section. The wafers are then cut and polished at the edges to remove burrs, allowing them to be diced and separated into multiple wafer particles. These particles are then processed through electroplating and other procedures to become a semiconductor chip.

[0003] After wafer dicing and polishing, many silicon crystal debris often remains on the wafer. Currently, high-pressure gas and high-pressure water jets are commonly used to clean the diced wafers. However, when rinsing the wafers with high-pressure gas or water jets, the water and gas jets can cause the silicon crystal debris on the wafers to splash, affecting the normal operation of other equipment. To reduce the probability of debris splashing out during the cleaning process, a wafer cleaning device is proposed. Utility Model Content

[0004] To address the shortcomings of existing technologies, this application provides a wafer cleaning device that can directly prevent debris from splashing outwards during cleaning, effectively ensuring the normal progress of cleaning.

[0005] To achieve the above objectives, this application provides the following technical solution: a wafer cleaning device, comprising a cleaning machine body, a base, and a protective assembly. The base contains a cleaning assembly, a collection assembly, and a positioning assembly. The protective assembly includes a prefabricated baffle fixedly connected to the upper surface of the base and a protective cover fixedly connected to the upper surface of the prefabricated baffle. The base has a reserved groove and a sliding groove inside, which are connected. A cover plate is slidably connected to the inner wall of the reserved groove. A connecting block is fixedly connected to the inner side of the cover plate and slidably sleeved on the inner wall of the sliding groove. A first servo motor is fixedly connected to the inner bottom wall of the base. A lead screw is fixedly connected to the output shaft end of the first servo motor, and the outer surface of the lead screw is threadedly connected to the inner wall of the connecting block.

[0006] The above solution utilizes a positioning component to locate wafers of different sizes, facilitating subsequent cleaning. A cleaning component allows for the cleaning of wafers of varying sizes, while a collection component removes waste generated during the cleaning process. The protective component directly addresses the issue of debris splashing during cleaning. During the cleaning process, splashing debris is blocked by pre-fabricated baffles, protective covers, and a cover plate, preventing interference with other equipment. Simultaneously, activating the first servo motor controls the cover plate's up-and-down movement, allowing it to retract into or move upwards from the pre-reserved slot, thus opening or closing the protective cover. This facilitates wafer handling and prevents debris from splashing.

[0007] Furthermore, a guide rod is fixedly connected to the inner bottom wall of the base, the connecting block is slidably sleeved on the outer surface of the guide rod, and the top end of the lead screw is rotatably sleeved on the bottom of the prefabricated baffle.

[0008] The above solution, with the guide rod, makes the connecting block more stable when moving, which facilitates the stable adjustment of the cover plate position and is beneficial for wafer loading and unloading.

[0009] Furthermore, a sealing strip is fixedly connected to the inner side of the protective cover, and the size of the cover plate is larger than the size of the sealing strip.

[0010] The above solution improves the sealing effect between the cover and the protective cover by using a sealing strip, thereby reducing the probability of leakage.

[0011] Furthermore, the cleaning assembly includes an infusion pump installed on the inner wall of the base, with an infusion tube connected to the top of the infusion pump. The outer surface of the infusion tube is hinged to the inner wall of the infusion pump, and a rinsing nozzle is installed at the output end of the infusion tube.

[0012] With the above method, when the infusion pump is started, the cleaning fluid stored inside the cleaning machine body can be delivered to the infusion tube, and then the wafer can be cleaned through the rinsing nozzle.

[0013] Furthermore, a worm gear is fixedly connected to the outer surface of the infusion tube, a worm is installed on the inner wall of the base, the worm meshes with the worm gear, and a second servo motor is fixedly connected to the back of the base, with the output shaft end of the second servo motor fixedly connected to the rotating shaft end of the worm.

[0014] With the above solution, when the second servo motor starts, it will drive the worm gear to rotate. The rotation of the worm gear will cause the worm wheel to rotate, thereby adjusting the position of the rinsing nozzle, making it easier to approach or move away from the wafer and ensuring the cleaning effect.

[0015] Furthermore, the collection assembly includes a collection tube embedded in the inner wall of the base and a collection box fixedly connected to the back of the cleaning machine body, and a filter screen is fixedly connected to the inner wall of one end of the collection tube.

[0016] The above solution prevents large particles from entering the collection pipe by setting up a filter, thus reducing the probability of blockage. The collection box can store debris and waste liquid generated during the cleaning process.

[0017] Furthermore, a liquid pump is installed on the top of the collection box, and the input end of the liquid pump is connected to the collection pipe through a pipeline. A drain port is installed at the bottom of the collection box.

[0018] With the above solution, when the liquid pump is started, the debris generated during the cleaning process can be absorbed and treated through the collection pipe, reducing the probability of debris splashing and making it more practical. The mixture collected inside the collection tank can be discharged through the drainage port, making it convenient for reuse.

[0019] Furthermore, the positioning component includes a rotating cleaning disc installed inside the base, a vacuum pump installed inside the rotating cleaning disc, an air extraction hood installed at the output end of the vacuum pump, and uniformly distributed adsorption holes on the upper surface of the rotating cleaning disc, with multiple adsorption holes communicating with the air extraction hood. An annular sleeve is fixedly connected to the inner bottom wall of the base, and the rotating cleaning disc is located inside the annular sleeve.

[0020] With the above solution, when the vacuum pump is started, the wafer to be cleaned can be adsorbed and positioned on the upper surface of the rotating cleaning disc through the suction hood and suction holes, which is beneficial to stabilizing the cleaning process. The ring sleeve can further reduce the probability of waste splashing randomly.

[0021] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0022] This wafer cleaning equipment features a positioning component that can locate wafers of different sizes, facilitating subsequent cleaning. The cleaning component can clean wafers of varying sizes, while the collection component can collect waste generated during the cleaning process. The protective component directly addresses the issue of debris splashing during cleaning. During the cleaning process, splashing debris is blocked by pre-fabricated baffles, protective covers, and a cover plate, preventing interference with the normal operation of other equipment. Simultaneously, activating the first servo motor controls the up-and-down movement of the cover plate, allowing it to retract into or move upwards from the pre-reserved slot, thus opening or closing the protective cover. This facilitates wafer handling and prevents debris from splashing. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall front view of the structure of this application;

[0024] Figure 2 This is a partial top view of the structure of this application;

[0025] Figure 3 This is a partial front view schematic diagram of the structure of this application;

[0026] Figure 4 This is a first partial sectional view of the structure of this application;

[0027] Figure 5 This is a schematic diagram of the second partial cross-sectional structure of the present application.

[0028] In the picture:

[0029] 1. Cleaning machine body; 2. Base; 3. Protective components; 301. Prefabricated baffle; 302. Protective cover; 303. Reserved groove; 304. Slide groove; 305. Cover plate; 306. Connecting block; 307. First servo motor; 308. Lead screw; 309. Guide rod; 310. Sealing strip; 4. Cleaning components; 401. Infusion pump; 402. Infusion pipe; 403. Rinsing nozzle; 404. Worm gear; 405. Worm; 406. Second servo motor; 5. Collection components; 501. Collection pipe; 502. Collection box; 503. Liquid pump; 504. Drain port; 505. Filter screen; 6. Positioning components; 601. Rotating cleaning disc; 602. Vacuum pump; 603. Evacuation hood; 604. Adsorption hole; 605. Annular sleeve. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Please see Figure 2 , Figure 3 and Figure 5This embodiment of a wafer cleaning device includes a cleaning machine body 1, a base 2, and a protective assembly 3. The base 2 is installed on top of the cleaning machine body 1. A cleaning assembly 4, a collection assembly 5, and a positioning assembly 6 are installed inside the base 2. The positioning assembly 6 includes a rotating cleaning disc 601 installed inside the base 2. The rotating cleaning disc 601 can rotate within the base 2. The cleaning machine body 1 has a cleaning tank for cleaning and an assembly for driving the rotating cleaning disc 601 to rotate inside. Since the assembly for driving the rotating cleaning disc 601 is not the subject of this application, it is not marked. The assembly for driving the rotating cleaning disc 601 can be installed on the base 2. The bottom of the base 2 or inside the main body 1 of the cleaning machine is equipped with a vacuum pump 602. The output end of the vacuum pump 602 is equipped with an extraction hood 603. The upper surface of the rotating cleaning disc 601 is provided with evenly distributed adsorption holes 604. All adsorption holes 604 are connected to the extraction hood 603. The inner bottom wall of the base 2 is fixedly connected with an annular sleeve 605. The rotating cleaning disc 601 is located inside the annular sleeve 605. When the vacuum pump 602 is started, the wafer to be cleaned can be adsorbed and positioned on the upper surface of the rotating cleaning disc 601 through the extraction hood 603 and the adsorption holes 604, which is beneficial to stabilizing the cleaning work. The annular sleeve 605 can further reduce the probability of waste splashing randomly.

[0032] Please see Figure 2 , Figure 3 and Figure 4The protective component 3 includes a prefabricated baffle 301 fixedly connected to the upper surface of the base 2 and a protective cover 302 fixedly connected to the upper surface of the prefabricated baffle 301. The base 2 has a reserved groove 303 and a sliding groove 304 inside, which are connected. A cover plate 305 is slidably connected to the inner wall of the reserved groove 303. The cover plate 305 can seal the opening of the protective cover 302, thereby blocking splashing debris generated during the cleaning process through the prefabricated baffle 301, the protective cover 302, and the cover plate 305, preventing interference with the operation of other equipment. A sealing strip 310 is fixedly connected to the inner side of the protective cover 302. The size of the cover plate 305 is larger than the size of the sealing strip 310. The sealing strip 310 improves the sealing effect between the cover plate 305 and the protective cover 302, thereby reducing the probability of leakage. The inner side of the cover plate 305 is fixed... A connecting block 306 is connected and slidably sleeved on the inner wall of the slide groove 304. A first servo motor 307 is fixedly connected to the inner bottom wall of the base 2. A lead screw 308 is fixedly connected to the output shaft end of the first servo motor 307. The outer surface of the lead screw 308 is threadedly connected to the inner wall of the connecting block 306. When the first servo motor 307 is started, it can drive the lead screw 308 to rotate. When the lead screw 308 rotates, the cover plate 305 can be moved in the reserved groove 303 through the connecting block 306. A guide rod 309 is fixedly connected to the inner bottom wall of the base 2. The connecting block 306 is slidably sleeved on the outer surface of the guide rod 309. The top end of the lead screw 308 is rotatably sleeved on the bottom of the prefabricated baffle 301. The guide rod 309 can make the connecting block 306 more stable when moving, thereby facilitating the stable adjustment of the position of the cover plate 305, which is beneficial to the placement and removal of wafers.

[0033] Please see Figure 1 , Figure 2 and Figure 3 The cleaning assembly 4 includes an infusion pump 401 mounted on the inner wall of the base 2. An infusion tube 402 is connected to the top of the infusion pump 401. The outer surface of the infusion tube 402 is hinged to the inner wall of the infusion pump 401. A rinsing nozzle 403 is installed at the output end of the infusion tube 402. When the infusion pump 401 is started, it can deliver the cleaning fluid stored inside the cleaning machine body 1 to the infusion tube 402, and then clean the wafer through the rinsing nozzle 403. A worm gear 404 is fixedly connected to the outer surface of the infusion tube 402. A worm gear 405 is installed on the inner wall of the base 2, and the worm gear 405 meshes with the worm wheel 404. A second servo motor 406 is fixedly connected to the back of the base 2. The output shaft end of the second servo motor 406 is fixedly connected to the rotating shaft end of the worm gear 405. When the second servo motor 406 is started, it will drive the worm gear 405 to rotate. The rotation of the worm gear 405 will cause the worm wheel 404 to drive the infusion tube 402 to rotate, thereby adjusting the position of the rinsing nozzle 403, so as to facilitate approaching or moving away from the wafer and ensure the cleaning effect.

[0034] Please see Figure 1 , Figure 2 and Figure 3 The collection component 5 includes a collection pipe 501 embedded in the inner wall of the base 2 and a collection box 502 fixedly connected to the back of the cleaning machine body 1. A filter screen 505 is fixedly connected to the inner wall of one end of the collection pipe 501. By setting the filter screen 505, large particles of foreign matter can be prevented from entering the interior of the collection pipe 501, thereby reducing the probability of the collection pipe 501 being blocked. The collection box 502 can store the debris and waste liquid generated during the cleaning process. A liquid pump 503 is installed on the top of the collection box 502. The input end of the liquid pump 503 is connected to the collection pipe 501 through a pipeline. A drain port 504 is installed at the bottom of the collection box 502. When the liquid pump 503 is started, the debris generated during the cleaning process can be absorbed and treated through the collection pipe 501, reducing the probability of debris splashing and making it more practical. The mixture collected inside the collection box 502 can be discharged through the drain port 504 for easy reuse.

[0035] In this embodiment, a wafer cleaning device can position wafers of different sizes using a positioning component 6, facilitating subsequent cleaning. A cleaning component 4 can clean wafers of different sizes, and a collection component 5 can collect waste generated during the cleaning process. A protective component 3 directly addresses the issue of debris splashing during cleaning. During the cleaning process, splashed debris is blocked by a pre-fabricated baffle 301, a protective cover 302, and a cover plate 305, preventing interference with the normal operation of other equipment. Simultaneously, activating the first servo motor 307 controls the cover plate 305 to move up and down, allowing it to retract into or move upwards from the reserved slot 303, thus opening or closing the protective cover 302. This facilitates wafer handling and prevents debris from splashing.

[0036] The working principle of the above embodiment is as follows: When cleaning the wafer, the first servo motor 307 is started to drive the lead screw 308 to rotate. The rotation of the lead screw 308 causes the connecting block 306 to move the cover plate 305 down inside the reserved groove 303, thus opening the protective cover 302. The wafer to be cleaned is then placed on the upper surface of the rotating cleaning tray 601 through the opening of the protective cover 302. When the vacuum pump 602 is started, the wafer can be adsorbed and positioned on the upper surface of the rotating cleaning tray 601 through the suction hood 603 and the suction hole 604. Then, the second servo motor 406 is started to adjust the position of the rinsing nozzle 403. When the second servo motor 406 is started, it drives the worm gear 405 to rotate. The rotation of the worm gear 405 causes the worm wheel 404 to drive the infusion tube 402 to rotate, thereby enabling... After adjusting the position of the rinsing nozzle 403, the lead screw 308 can be activated to move the cover plate 305 upward from the reserved groove 303 until the top of the cover plate 305 contacts the inner top wall of the protective cover 302. At this time, the cover plate 305 also contacts the sealing strip 310, achieving the effect of closing the opening of the protective cover 302. Then, the wafer can be cleaned inside the base 2 through the cleaning component 4 and the positioning component 6. During the cleaning process, the splashing debris will be directly blocked by the prefabricated baffle 301, the protective cover 302 and the cover plate 305. At the same time, the liquid pump 503 can be activated to collect the generated debris and waste liquid. When the liquid pump 503 is activated, the waste inside the base 2 can be sucked into the collection box 502 through the collection pipe 501 and the filter screen 505, which is more practical.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning apparatus comprising a cleaning machine body (1), a base (2) and a protection assembly (3), characterized in that: The inside of the base (2) is internally mounted with a cleaning assembly (4), a collection assembly (5) and a positioning assembly (6), the protection assembly (3) comprises a prefabricated baffle (301) fixedly connected to the upper surface of the base (2) and a protective cover (302) fixedly connected to the upper surface of the prefabricated baffle (301), the inside of the base (2) is provided with a reserved groove (303) and a sliding groove (304), the reserved groove (303) and the sliding groove (304) are communicated, the inner wall of the reserved groove (303) is slidably connected with a cover plate (305), the inner side of the cover plate (305) is fixedly connected with a connecting block (306), the connecting block (306) is slidably sleeved on the inner wall of the sliding groove (304), the inner bottom wall of the base (2) is fixedly connected with a first servo motor (307), the output shaft end of the first servo motor (307) is fixedly connected with a lead screw (308), the outer surface of the lead screw (308) is threadedly connected with the inner wall of the connecting block (306).

2. The wafer cleaning apparatus of claim 1, wherein: The inner bottom wall of the base (2) is fixedly connected with a guide rod (309), the connecting block (306) is slidably sleeved on the outer surface of the guide rod (309), and the top end of the lead screw (308) is rotatably sleeved on the bottom of the prefabricated baffle (301).

3. The wafer cleaning apparatus of claim 1, wherein: The inner side of the protective cover (302) is fixedly connected with a sealing strip (310), and the size value of the cover plate (305) is greater than that of the sealing strip (310).

4. The wafer cleaning apparatus of claim 1, wherein: The cleaning assembly (4) comprises a liquid infusion pump (401) mounted on the inner wall of the base (2), the top of the liquid infusion pump (401) is communicated with a liquid infusion tube (402), the outer surface of the liquid infusion tube (402) is hinged to the inner wall of the liquid infusion pump (401), and the output end of the liquid infusion tube (402) is provided with a flushing nozzle (403).

5. The wafer cleaning apparatus of claim 4, wherein: The outer surface of the liquid infusion tube (402) is fixedly connected with a worm gear (404), the inner wall of the base (2) is provided with a worm (405), the worm (405) is engaged with the worm gear (404), the back of the base (2) is fixedly connected with a second servo motor (406), and the output shaft end of the second servo motor (406) is fixedly connected with the rotating shaft end of the worm (405).

6. The wafer cleaning apparatus of claim 1, wherein: The collection assembly (5) comprises a collection tube (501) inlaid in the inner wall of the base (2) and a collection box (502) fixedly connected to the back of the cleaning machine body (1), and the inner wall of one end of the collection tube (501) is fixedly connected with a filter screen (505).

7. The wafer cleaning apparatus of claim 6, wherein: The top of the collection box (502) is provided with a liquid suction pump (503), the input end of the liquid suction pump (503) is communicated with the collection tube (501) through a pipeline, and the bottom of the collection box (502) is provided with a liquid discharge port (504).

8. The wafer cleaning apparatus of claim 1, wherein: The positioning assembly (6) comprises a rotating cleaning disc (601) installed inside the base (2), the inside of the rotating cleaning disc (601) is internally provided with a vacuum pump (602), the output end of the vacuum pump (602) is provided with an air exhaust cover (603), the upper surface of the rotating cleaning disc (601) is provided with uniformly distributed adsorption holes (604), a plurality of adsorption holes (604) are in communication with the air exhaust cover (603), and the inner bottom wall of the base (2) is fixedly connected with an annular sleeve (605); the rotating cleaning disc (601) is located inside the annular sleeve (605).

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