Multi-layer stacked chip packaging device

Abstract

The utility model discloses a multilayer stack type chip packaging device, and relates to the chip packaging device field, the multilayer stack type chip packaging device comprises a bottom plate and a top plate arranged above the bottom plate in a sliding manner, the top end of the bottom plate is fixedly provided with support rods in a rectangular array, and the center position of the bottom plate is matched and plugged with a first positioning frame; wherein magnetic attraction mechanisms connected with the first positioning frame are fixed to the two sides of the bottom end face of the bottom plate correspondingly, a second positioning frame is detachably fixed to the bottom end of the top plate, positioning grooves are formed in the opposite side faces of the first positioning frame and the second positioning frame correspondingly, and a packaging shell and a base are inserted into the two positioning grooves correspondingly in a matched mode. According to the utility model, the base and the packaging shell are respectively and tightly inserted in the two positioning grooves, the pins at the bottom end of the base are embedded in the through holes, and the handle drives the second positioning frame to move downwards to enable the packaging shell to be sleeved on the multi-layer stacked chip main body, so that the packaging shell and the base are conveniently positioned, and the packaging stability of the chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging devices, specifically a multi-layer stacked chip packaging device. Background Technology

[0002] Chip packaging is the casing used for circuit chips. During the assembly process of chip packaging, a pressure device is used to apply pressure and fasten the casing and some components. The extrusion mechanism is used to reinforce the casing or some components used for chip packaging. However, the overall extrusion of components or chip casing is carried out by a pressure plate. During the extrusion process, the pressure plate may slip, resulting in poor stability of the chip packaging.

[0003] Patent application number 202322075803.0 discloses a chip packaging device, including an assembly frame and a chip shell positioning frame. The chip shell positioning frame is installed on the top surface of the bottom end of the assembly frame, and a connecting block is installed above the chip shell positioning frame. A pressing rod is provided on the bottom surface of the connecting block. A mounting plate is installed on the top surface of the connecting block, and an operating lever is provided on the top surface of the end of the mounting plate. The operating lever passes through the top frame of the assembly frame, and a pressure spring is sleeved on the outside of the operating lever, and the pressure spring is located between the mounting plate and the assembly frame.

[0004] The above technical solution uses an operating lever to drive the mounting plate to rise and fall, and positions the movement stroke of the mounting plate. However, because the mounting plate lacks positioning for the chip casing, the chip casing is prone to slippage when squeezed, resulting in poor stability of the chip packaging. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a multi-layer stacked chip packaging device to solve the technical problem of poor chip packaging stability caused by the lack of positioning of the chip shell, which leads to the chip shell sliding easily when squeezed.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multi-layer stacked chip packaging device, including a base plate and a top plate slidably disposed above the base plate. The top of the base plate is fixed with a support rod in a rectangular array, and a first positioning frame is inserted into the center of the base plate. Magnetic suction mechanisms connected to the first positioning frame are fixed on both sides of the bottom surface of the base plate. A second positioning frame is detachably fixed to the bottom of the top plate. Positioning grooves are formed on the opposing sides of the first and second positioning frames, and a packaging shell and a base are respectively inserted into the two positioning grooves.

[0007] The present invention is further configured such that the bottom ends of the two support rods on the same side pass through the base plate and are fixed with support seats, and the top ends of the multiple support rods are all fixedly sleeved with anti-detachment plates.

[0008] The present invention is further provided that a support spring sleeved on a support rod is provided between the bottom plate and the top plate, and a handle is installed at the top of the top plate.

[0009] The present invention is further configured such that both ends of the handle are rotatably connected to knobs, and the bottom end of the knobs is fixed with screws threaded into the second positioning frame.

[0010] The present invention is further configured such that the magnetic attraction mechanism includes a support plate fixed to the bottom end of the base plate and a magnet block embedded in and fixed in the support plate, wherein the top end of the magnet block is attracted and fixed to the first positioning frame.

[0011] The present invention is further provided that fastening nails are provided at equal intervals at the bottom end of the support plate, and the fastening nails are embedded and fixed in the base plate.

[0012] The present invention is further configured such that the bottom end of the first positioning frame is provided with a through hole communicating with the positioning groove, and the bottom end of the base is fixed with a pin embedded in the through hole.

[0013] The present invention is further configured such that a layer of encapsulating adhesive is provided at the top of the base, and a multi-layer stacked chip body that fits and is inserted into the encapsulation shell is embedded and fixed in the base.

[0014] In summary, this utility model has the following advantages: By fixing a first positioning frame and a second positioning frame to the base plate and top plate respectively, and providing positioning grooves on both the first and second positioning frames, when encapsulating the multi-layer stacked chip body, the base and the encapsulation shell are tightly inserted into the two positioning grooves, and the pins at the bottom of the base are embedded in the through holes. Moving the second positioning frame downwards with a handle allows the encapsulation shell to be fitted onto the multi-layer stacked chip body, and the encapsulation adhesive layer keeps the encapsulation shell fixed, facilitating the connection between the encapsulation shell and the base. The positioning system avoids misalignment of multi-layer stacked chip bodies during the packaging process, improving the stability of chip packaging. A support plate is fixed to the bottom of the base plate, which supports the first positioning frame. The support plate holds the first positioning frame in place by a magnetic suction plate. Pushing the bottom of the first positioning frame allows it to slide out of the base plate. The knob at the bottom of the handle is threaded into the second positioning frame to hold it in place. Unscrewing the knob allows the second positioning frame to be disassembled, facilitating the assembly and disassembly of the first and second positioning frames. This system is suitable for packaging and positioning different signal chips. Attached Figure Description

[0015] Figure 1This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 3 This utility model Figure 2 Enlarged schematic diagram of the structure at point A in the middle;

[0018] Figure 4 This utility model Figure 2 Enlarged schematic diagram of the structure at point B;

[0019] Figure 5 This is a schematic diagram of the disassembled structure of the base of this utility model.

[0020] In the diagram: 1. Base plate; 2. Support base; 3. First positioning frame; 4. Positioning groove; 5. Support rod; 6. Top plate; 7. Anti-detachment plate; 8. Handle; 9. Support spring; 10. Through hole; 11. Base; 12. Second positioning frame; 13. Screw; 14. Knob; 15. Fastening pin; 16. Support plate; 17. Magnet block; 18. Multi-layer stacked chip body; 19. Encapsulation shell; 20. Encapsulation adhesive layer; 21. Pin. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] A multi-layer stacked chip packaging device, such as Figure 1-5 As shown, it includes a base plate 1 and a top plate 6 slidably disposed above the base plate 1. The top of the base plate 1 is fixed with a support rod 5 in a rectangular array, and a first positioning frame 3 is inserted into the center of the base plate 1. Magnetic suction mechanisms connected to the first positioning frame 3 are fixed on both sides of the bottom end face of the base plate 1. A second positioning frame 12 is detachably fixed to the bottom end of the top plate 6. Positioning grooves 4 are formed on the opposite sides of the first positioning frame 3 and the second positioning frame 12. A package shell 19 and a base 11 are respectively inserted into the two positioning grooves 4.

[0023] The bottom ends of two support rods 5 on the same side pass through the base plate 1 and are fixed with support seats 2. Anti-detachment plates 7 are fixedly sleeved on the top ends of multiple support rods 5. Support springs 9, sleeved on the support rods 5, are provided between the base plate 1 and the top plate 6. A handle 8 is installed on the top end of the top plate 6. A through hole 10 communicating with the positioning groove 4 is opened at the bottom end of the first positioning frame 3. A pin 21 embedded in the through hole 10 is fixed at the bottom end of the base 11. An encapsulating adhesive layer 20 is provided on the top end of the base 11. 1 has a multi-layer stacked chip body 18 embedded and fixed in the package shell 19. When the multi-layer stacked chip body 18 is packaged, the base 11 and the package shell 19 are tightly inserted into the two positioning slots 4 respectively, and the pins 21 at the bottom of the base 11 are embedded in the through hole 10. The handle 8 drives the second positioning frame 12 to move downward so that the package shell 19 is sleeved on the multi-layer stacked chip body 18, and the package shell 19 is fixed by the encapsulation adhesive layer 20.

[0024] Furthermore, both ends of the handle 8 are rotatably connected to knobs 14. The bottom end of the knobs 14 is fixed with screws 13 threaded into the second positioning frame 12. The magnetic attraction mechanism includes a support plate 16 fixed to the bottom end of the base plate 1 and a magnet block 17 embedded in the support plate 16. The top end of the magnet block 17 is attracted and fixed to the first positioning frame 3. Fastening nails 15 are equidistantly arranged at the bottom end of the support plate 16. The fastening nails 15 are embedded and fixed in the base plate 1. The support plate 16 supports the first positioning frame 3, and the support plate 16 keeps the first positioning frame 3 fixed by the magnetic attraction plate. Pushing the bottom of the first positioning frame 3 makes it slide and disassemble from the base plate 1. The knobs 14 at the bottom end of the handle 8 are threaded into the second positioning frame 12 to keep it fixed. After unscrewing the knobs 14, the second positioning frame 12 can be disassembled.

[0025] The working principle of this utility model is as follows: When in use, the first positioning frame 3 is inserted into the base plate 1. The support plate 16 fixed at the bottom end of the base plate 1 supports the first positioning frame 3, and the magnetic suction plate on the support plate 16 keeps the first positioning frame 3 fixed. Pushing the bottom of the first positioning frame 3 makes it slide and disassemble from the base plate 1. The knob 14 at the bottom end of the handle 8 is threaded into the second positioning frame 12 to keep it fixed. When encapsulating the multi-layer stacked chip body 18, the base 11 and the encapsulation shell 19 are tightly inserted into the two positioning slots 4 respectively, and the pins 21 at the bottom end of the base 11 are embedded in the through hole 10. The handle 8 drives the second positioning frame 12 to move downward so that the encapsulation shell 19 is sleeved on the multi-layer stacked chip body 18, and the encapsulation adhesive layer 20 keeps the encapsulation shell 19 fixed, which facilitates the positioning of the encapsulation shell 19 and the base 11, avoids misalignment of the multi-layer stacked chip body 18 during the encapsulation process, and improves the stability of chip encapsulation.

[0026] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A multi-layer stacked chip package device comprising a bottom plate (1) and a top plate (6) slidingly arranged above the bottom plate (1), characterized in that: The top end of the bottom plate (1) is fixed with a support rod (5) in a rectangular array, and the center position of the bottom plate (1) is fitted with a first positioning frame (3), wherein the bottom end surface of the bottom plate (1) is fixed with a magnetic attraction mechanism connected with the first positioning frame (3) on both sides, the bottom end of the top plate (6) is detachably fixed with a second positioning frame (12), and the side surface of the first positioning frame (3) and the second positioning frame (12) facing each other is provided with a positioning groove (4), and the two positioning grooves (4) are respectively fitted with an encapsulation shell (19) and a base (11).

2. The multi-tier stacked chip package device of claim 1, wherein: The bottom end of the two support rods (5) on the same side is fixed with a support seat (2) through the bottom plate (1), and the top end of the plurality of support rods (5) is fixed with a anti-drop plate (7).

3. The multi-tier stacked chip package device of claim 2, wherein: The bottom plate (1) and the top plate (6) are provided with a support spring (9) sleeved on the support rod (5), and the top end of the top plate (6) is provided with a handle (8).

4. The multi-tier stacked chip package device of claim 3, wherein: Both ends of the handle (8) are rotatably inserted with a knob (14), and the bottom end of the knob (14) is fixed with a screw rod (13) screwed into the second positioning frame (12).

5. The multi-tier stacked chip package device of claim 1, wherein: The magnetic attraction mechanism comprises a support plate (16) fixed at the bottom end of the bottom plate (1) and a magnet block (17) embeddedly fixed in the support plate (16), and the top end of the magnet block (17) is fixedly attracted to the first positioning frame (3).

6. The multi-tier stacked chip package device of claim 5, wherein: The bottom end of the support plate (16) is provided with a fastening nail (15) at equal intervals, and the fastening nail (15) is embeddedly fixed in the bottom plate (1).

7. The multi-tier stacked chip package device of claim 1, wherein: The bottom end of the first positioning frame (3) is provided with a through hole (10) communicating with the positioning groove (4), and the bottom end of the base (11) is fixed with a pin (21) embedded in the through hole (10).

8. The multi-tier stacked chip package device of claim 7, wherein: The top end of the base (11) is provided with an encapsulation glue layer (20), and the base (11) is embeddedly fixed with a multilayer stacked chip body (18) fitted in the encapsulation shell (19).

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