Wafer product anti-mixing device

Abstract

The utility model discloses a wafer product anti-mixing device, which relates to the field of industrial product processing equipment, and comprises a marble platform, a wafer detection device is arranged on the marble platform, the wafer detection device comprises a tooling plate, a mounting bottom plate is arranged at the center of the tooling plate, a connecting port is arranged on the mounting bottom plate, and the connecting port is connected with the marble platform. A supporting plate is arranged on the connecting opening, and an opening matched with the connecting opening is formed in the supporting plate. In the anti-mixing device for the wafer products, the edge correction sensors are carefully arranged on the two sides of the wafer on the tool plate, the detection piece connected above the edge correction sensors and the control rod cooperatively operate through the connecting transverse plate, and the edge correction sensors can quickly and sensitively sense subtle changes, transmit signals in time and start corresponding adjusting mechanisms, so that the wafer products are prevented from being mixed. The position of the wafer is accurately corrected, detection errors caused by position deviation are greatly reduced, a solid foundation is laid for various subsequent detection procedures, and the accuracy and reliability of detection data are powerfully guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of industrial product processing equipment, specifically a wafer product anti-mixing device. Background Technology

[0002] With the rapid development of the semiconductor industry, wafers, as the basic material for integrated circuits, require precise control over their manufacturing process and quality. In large-scale wafer production, a wide variety of products are produced, and wafers of different batches and specifications need to be accurately distinguished and managed to avoid mixing. This places extremely high demands on ensuring product quality and production efficiency, which forms the broader context for wafer anti-mixing devices.

[0003] In current wafer manufacturing, some measures have been taken to prevent mixing. Wafers are usually simply labeled and stored in separate areas on the production line. However, these methods are prone to human error or unclear labeling when faced with complex production processes and large quantities of wafers, making it difficult to completely ensure that wafers will not be mixed up.

[0004] The existing technology generally involves the following steps: First, after wafer production is completed, the wafers are manually sorted and labeled accordingly. Then, the wafers are placed in a specific storage area, relying on workers' memory and simple records to distinguish wafers of different batches and specifications. In subsequent processing or inspection stages, the identity of the wafers is also confirmed by manually checking the label information. The entire process is highly dependent on manual operation and lacks automated and accurate inspection and identification mechanisms.

[0005] Manual operation is susceptible to factors such as fatigue and negligence, leading to incorrect labeling or misreading, which can cause material mixing issues. Moreover, simple partitioned storage cannot monitor the position and status of wafers in real time. Once the wafers are moved during handling or storage, it is difficult to detect and correct them in time, which creates hidden dangers for material mixing and makes it difficult to meet the increasingly higher requirements for semiconductor production quality and efficiency. Utility Model Content

[0006] Based on this, the purpose of this utility model is to provide a wafer product anti-mixing device to solve the technical problems of easy mixing, low efficiency and poor accuracy of existing manual operation.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wafer product anti-mixing device, comprising a marble platform, a wafer detection device disposed on the marble platform, the wafer detection device comprising a tooling plate, a mounting base plate disposed at the center of the tooling plate, a connection port disposed on the mounting base plate, a support plate disposed on the connection port, an opening disposed on the support plate to match the connection port, a wafer disposed on the support plate, a pair of mounting plates disposed on the tooling plate to match the wafer, a first connecting rod slidably disposed on the mounting plate, the first connecting rod being configured in a "Y" shape, and sensing rods disposed at both ends of the first connecting rod.

[0008] By adopting the above technical solution, a pair of sensing rods limit the position of the wafer, and the first connecting rod limits the two sides of the wafer, thereby ensuring the wafer is centered and facilitating subsequent measurement of the wafer.

[0009] The present invention is further configured such that a pair of edge correction sensors are provided on the wafer on the tooling plate, a detection element is provided above the edge correction sensors, a connecting horizontal plate is provided on the top of the detection element, a connecting ring is provided at the center of the connecting horizontal plate, and a control rod is provided on one side of the detection element.

[0010] By adopting the above technical solution, the edge correction sensor is mainly used to monitor and detect the integrity of the wafer edge, ensuring the integrity of the wafer edge. The edge correction sensor is set up in conjunction with the detection device. The edge correction sensor makes the wafer edge defects obvious, and then the detection device acquires the image to realize the detection of defects on the wafer edge.

[0011] The present invention is further provided that a pair of support rods are provided on the marble platform in conjunction with the connecting horizontal plate, and the support rods are provided with mounting grooves.

[0012] By adopting the above technical solution, external lifting rods or similar parts are connected through the mounting groove on the support rod, thereby controlling the height of the connecting horizontal plate and adjusting the height of the device according to actual usage requirements.

[0013] The present invention is further configured such that the edge correction sensor includes a first mounting block and a second mounting block, the inner wall of the first mounting block is provided with a slot, the slot has a pair of grippers, a first knob is provided on one side of the grippers, and a second knob is provided between the first mounting block and the second mounting block.

[0014] By adopting the above technical solution, the first knob controls the gripper to hold the chip. In actual use, the second knob controls the distance between the first mounting block and the second mounting block, and the distance between the first mounting block and the enemy mounting block can be adjusted according to different usage requirements.

[0015] The present invention is further configured such that a pair of mounting plates are arranged from top to bottom on the tooling plate in conjunction with the wafer, a first control motor is arranged on the tooling plate in conjunction with the mounting plates, a thickness sensor is arranged on the mounting plates, a second connecting rod is arranged on the side of the pair of mounting plates near the wafer, the pair of second connecting rods extend to the upper and lower surfaces of the wafer respectively, and a detection head is arranged on the second connecting rod in conjunction with the wafer.

[0016] By adopting the above technical solution, the thickness of the wafer is measured by a thickness sensor, and the material of the crystal is detected by a pair of detection heads, thereby preventing material mixing.

[0017] The present invention is further configured such that a weighing sensor is provided on the tooling plate in conjunction with the wafer, and a guide groove is provided on the tooling plate in conjunction with the weighing sensor.

[0018] By adopting the above technical solution, the position of the weighing sensor can be adjusted through the guide groove.

[0019] The present invention is further configured such that an output tube is connected to the detection head.

[0020] By adopting the above technical solution, the detector data is output through the output tube.

[0021] In summary, the present invention has the following main advantages:

[0022] 1. This utility model, in the wafer anti-mixing device, carefully places edge correction sensors on both sides of the wafer on the tooling plate. The detection component connected above it works in coordination with the control rod through the connecting horizontal plate. When the wafer shifts position during the detection process, the edge correction sensor can quickly and sensitively detect the subtle change and transmit the signal in time to activate the corresponding adjustment mechanism, accurately correcting the wafer position. This greatly reduces the detection error caused by position deviation, lays a solid foundation for subsequent detection processes, and effectively ensures the accuracy and reliability of the detection data.

[0023] 2. This utility model achieves precise control of wafer thickness using a thickness sensor and detection head on a tooling plate. A first control motor drives the mounting plate to steadily approach the wafer, at which point the thickness sensor activates, and the detection head makes close contact with the wafer surface. This not only accurately measures the actual thickness of the wafer but also allows for the rapid screening of wafers with abnormal thickness during the inspection process. This effectively prevents defective wafers from entering subsequent production stages, thus ensuring the quality stability of wafer products, significantly improving product yield, and reducing cost losses and production delays caused by quality issues for semiconductor manufacturers. Attached Figure Description

[0024] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a partial structural schematic diagram of the present invention;

[0026] Figure 3 This is a schematic diagram of the support plate installation of this utility model;

[0027] Figure 4 This is a schematic diagram of the mounting base plate of this utility model;

[0028] Figure 5 This is a schematic diagram of the edge correction sensor structure of this utility model;

[0029] Figure 6 This is a cross-sectional view of the internal structure of the edge correction sensor of this utility model.

[0030] In the diagram: 1. Marble platform; 2. Connecting ring; 3. Detection component; 4. Control rod; 5. First control motor; 6. Mounting slot; 7. Support rod; 8. Detection head; 9. Crystal; 10. Weighing sensor; 11. Tooling plate; 12. Thickness sensor; 13. Mounting plate; 14. First connecting rod; 15. Sensing rod; 16. Opening; 17. Edge correction sensor; 18. Support plate; 19. Second connecting rod; 20. Guide slot; 21. Gripper; 22. Connection port; 23. Output pipe; 24. Slot; 25. First knob; 26. First mounting block; 27. Second mounting block; 28. Second knob; 29. ​​Mounting base plate; 30. Placement plate; 31. Connecting cross plate. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0032] The embodiments of this utility model will be described below based on its overall structure.

[0033] A wafer product anti-mixing device, such as Figure 1-6As shown, the device includes a marble platform 1, on which a wafer detection device is mounted. The wafer detection device includes a tooling plate 11, with a mounting base plate 29 at its center. The mounting base plate 29 has a connection port 22, and a support plate 18 is mounted on the connection port 22. The support plate 18 has an opening 16 that mates with the connection port 22. A wafer 9 is mounted on the support plate 18. A pair of mounting plates 30 are mounted on the tooling plate 11 to accommodate the wafer 9. A first connecting rod 14 is slidably mounted on the mounting plate 30. The first connecting rod 14 is Y-shaped, and sensing rods 15 are mounted on both ends of the first connecting rod 14. The pair of sensing rods 15 limit the position of the wafer 9. The first connecting rod 14 limits the two sides of the wafer 9, thereby ensuring the wafer is centered and facilitating subsequent measurement of the wafer.

[0034] In conjunction with this, a pair of edge correction sensors 17 are provided on the tooling plate 11 on the wafer 9. A detection element 3 is provided above the edge correction sensor 17. A connecting horizontal plate 31 is provided on the top of the detection element 3. A connecting ring 2 is provided at the center of the connecting horizontal plate 31. A control rod 4 is provided on one side of the detection element 3. The edge correction sensor 17 is mainly used to monitor and detect the integrity of the edge of the wafer 9 to ensure the integrity of the edge of the wafer 9. The edge correction sensor 17 and the detection element 3 are set together. The edge correction sensor 17 makes the edge defects of the wafer 9 obvious, and then the detection element 3 collects the image to realize the detection of edge defects of the wafer 9.

[0035] A pair of support rods 7 are provided on the marble platform 1 in conjunction with the connecting horizontal plate 31. The support rods 7 have mounting grooves 6. Correspondingly, a pair of mounting plates 13 are provided on the tooling plate 11 from top to bottom to accommodate the wafer 9. A first control motor 5 is provided on the tooling plate 11 in conjunction with the mounting plates 13. A thickness sensor 12 is provided on the mounting plates 13. The thickness sensor 12 emits a detection signal to monitor the thickness of the wafer. A second connecting rod 19 is provided on the side of the pair of mounting plates 13 near the wafer 9. The pair of second connecting rods 19 extend to the upper and lower surfaces of the wafer 9 respectively. A detection head 8 is provided on the second connecting rod 19 in conjunction with the wafer 9. The detection head 8 emits a detection signal, which contacts the wafer 9. The upper and lower detection heads 8 work together to analyze the detection results, thereby determining the material of the wafer 9.

[0036] The edge correction sensor 17 includes a first mounting block 26 and a second mounting block 27. The inner wall of the first mounting block 26 has a slot 24. The slot 24 has a pair of grippers 21. A first knob 25 is provided on one side of the grippers 21. A second knob 28 is provided between the first mounting block 26 and the second mounting block 27. The first knob 25 controls the first grippers 21 to clamp and fix the wafer 9. The second knob 28 controls the distance between the first mounting block 26 and the second mounting block 27, thereby clamping different wafers 9.

[0037] Furthermore, a load cell 10 is provided on the tooling plate 11 in conjunction with the wafer 9. The load cell 10 supports the wafer 9 and detects the quality of the wafer due to the support. At the same time, a guide groove 20 is provided on the tooling plate 11 in conjunction with the load cell 10. The position of the load cell 10 is controlled by the guide groove 20 and can be easily adjusted according to actual usage requirements.

[0038] Furthermore, the detection head 8 is connected to an output tube 23, and several cables are installed inside the output tube 23. The data generated by the detection head 8 is output through the cables to realize the monitoring of the chip data.

[0039] In actual use, first, ensure that the marble platform 1 is in a stable state, all parts are clean and free of impurities, the power connection of the device is normal, and all sensors and motors are working properly.

[0040] Carefully place the wafer 9 to be tested on the support plate 18, ensuring good contact between the wafer 9 and the support plate 18, and positioning it between a pair of mounting plates 30 on the tooling plate 11. At this time, the two sensing rods 15 of the "Y"-shaped first connecting rod 14 will initially define the position of the wafer 9, ensuring that the wafer 9 is basically centered, which facilitates subsequent accurate measurement;

[0041] Based on the size of the wafer 9, the gripper 21 in the slot 24 on the inner wall of the first mounting block 26 is adjusted by rotating the first knob 25 so that it can gently hold the wafer 9. Then, the distance between the first mounting block 26 and the second mounting block 27 is finely adjusted by rotating the second knob 28 to ensure that the edge correction sensor 17 can accurately monitor the edge of the wafer 9.

[0042] The edge correction sensor 17 is activated, which monitors and detects the edge integrity of the wafer 9. When an edge defect is detected, the defect information is transmitted to the detection component 3. The detection component 3 is stabilized by the connecting ring 2 on the connecting plate 31. After receiving the signal from the edge correction sensor 17, it acquires an image of the edge of the wafer 9, thereby realizing the detection and analysis of edge defects of the wafer 9 and ensuring that the edge integrity of the wafer 9 meets the requirements.

[0043] The first control motor 5 on the tooling plate 11 starts, driving a pair of mounting plates 13 closer to the wafer 9. The thickness sensor 12 on the mounting plate 13 emits a detection signal to monitor the thickness of the wafer 9 and transmits the thickness data to the control system.

[0044] Simultaneously, the detection head 8 on the second connecting rod 19 on the mounting plate 13 also emits a detection signal, which contacts the wafer 9. The upper and lower detection heads 8 work together to analyze the detection results, and output the generated data through the cable in the output tube 23 connected to the detection head 8, thereby determining the material of the wafer 9. This data is also recorded and stored for subsequent verification and analysis.

[0045] The chip 9 is placed on the weighing sensor 10. The weighing sensor 10 not only supports the chip 9, but also monitors the mass of the chip 9 and transmits the mass data to the control system.

[0046] If the position of the weighing sensor 10 needs to be adjusted, it can be operated through the guide groove 20 on the tooling plate 11. The position of the weighing sensor 10 can be flexibly controlled according to the actual use requirements to ensure that it can accurately measure the weight of the chip 9, while ensuring the stability of the chip 9 throughout the entire detection process.

[0047] Throughout the entire testing process, the data collected by each sensor, including information such as the position, edge integrity, thickness, material, and weight of the chip 9, will be recorded by the control system.

[0048] The control system analyzes this data and compares it with preset standard data to determine whether wafer 9 meets quality requirements and whether there is any mixing of materials. If the data is abnormal, the control system will issue an alarm, prompting operators to conduct further inspections and processing to ensure that every wafer product passes the inspection accurately, avoid mixing of materials, and guarantee product quality.

[0049] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A wafer product anti-contamination device comprising a marble platform (1), characterized in that: The marble platform (1) is provided with a wafer detection device, the wafer detection device includes a tool plate (11), the tool plate (11) is provided with a mounting base plate (29) at the center position, the mounting base plate (29) is provided with a connecting port (22), the connecting port (22) is provided with a support plate (18), the support plate (18) is provided with an opening (16) matched with the connecting port (22), the support plate (18) is provided with a wafer (9), the tool plate (11) is provided with a pair of setting plates (30) matched with the wafer (9), the first connecting rod (14) is provided in the form of "Y", and the first connecting rod (14) is provided with a sensing rod (15) at two ports.

2. A wafer product contamination prevention device according to claim 1, characterized by: A pair of edge correction sensors (17) are arranged on the tool plate (11) and above the wafer (9), a detection piece (3) is arranged above the edge correction sensor (17), a connecting horizontal plate (31) is connected to the top of the detection piece (3), a connecting ring (2) is arranged at the center position of the connecting horizontal plate (31), and a control rod (4) is arranged on one side of the detection piece (3).

3. The wafer product contamination prevention device according to claim 1, wherein: A pair of supporting rods (7) are arranged on the marble platform (1) and matched with the connecting horizontal plate (31), and a mounting groove (6) is formed in the supporting rod (7).

4. The wafer product contamination prevention device according to claim 2, wherein: The edge correction sensor (17) includes a first mounting block (26) and a second mounting block (27), a slot (24) is formed in the inner wall of the first mounting block (26), a pair of clamping jaws (21) are arranged in the slot (24), a first knob (25) is arranged on one side of the clamping jaw (21), and a second knob (28) is arranged between the first mounting block (26) and the second mounting block (27).

5. The wafer product contamination prevention device according to claim 1, wherein: A pair of mounting plates (13) are arranged on the tool plate (11) and matched with the wafer (9) from top to bottom, a first control motor (5) is arranged on the tool plate (11) and matched with the mounting plate (13), a thickness measuring sensor (12) is arranged on the mounting plate (13), a second connecting rod (19) is arranged on one side of the mounting plate (13) close to the wafer (9), and a pair of second connecting rods (19) extend to the upper and lower surfaces of the wafer (9) respectively, and a detection head (8) is arranged on the second connecting rod (19) and matched with the wafer (9).

6. The wafer product contamination prevention device according to claim 1, wherein: A weighing sensor (10) is arranged on the tool plate (11) and matched with the wafer (9), and a guide groove (20) is arranged on the tool plate (11) and matched with the weighing sensor (10).

7. A wafer product contamination prevention device according to claim 5, wherein: The detection head (8) is connected with an output pipe (23).

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