Multi-chip integrated packaging structure

Abstract

The utility model discloses a multi-chip integrated packaging structure, relates to the technical field of chip packaging, and provides the following scheme for solving the problems proposed in the background technology: the multi-chip integrated packaging structure comprises a bottom frame and a packaging cover, the inner bottom wall of the bottom frame is fixedly connected with a circuit board, and the upper surface of the circuit board is fixedly connected with a plurality of chip bodies; the front face and the back face of the bottom frame are fixedly connected with limiting assemblies. According to the utility model, through the arrangement of the limiting assembly and the voltage stabilizing assembly, the packaging cover and the bottom frame can be locked during use, and the silica gel protection pad is driven by the adjusting screw rod to descend and the chip body is pressed on the circuit board. The chip body can be ensured not to be separated from the circuit board even if the chip body is impacted and vibrated in the transportation process, the stability is higher, and the protective pad made of silica gel can provide a certain buffer space for the chip body by using the deformability of the protective pad, so that the packaging and protecting effects on the chip body are better.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a multi-chip integrated packaging structure. Background Technology

[0002] Multi-chip modules are general electronic components in which multiple integrated circuits, semiconductor dies and other discrete components are integrated and usually placed on a unified circuit board substrate so that they can be regarded as a single component when in use. Since multiple chips are set on a single circuit board, it is necessary to ensure the stable effect between multiple chips and the circuit board during packaging.

[0003] A search revealed that patent CN218526504U discloses a multi-chip integrated circuit packaging structure. By using a connecting cylinder, connecting rod, compression spring, and U-shaped fixing bracket installed inside the packaging shell, the chip integrated on the circuit board surface is limited and fixed during the packaging process. This effectively ensures the stability of the integrated chip and avoids the need for frequent maintenance and reduced service life due to the chip loosening from the circuit board during handling or impact.

[0004] This patent utilizes a U-shaped fixing bracket and a compression spring to press the chip firmly onto the circuit board, thereby ensuring the stability of the integrated chip. However, during transportation, since the chip is already held in place by the compression spring, the spring may deform during vibrations, causing the U-shaped fixing bracket to shake. At this point, since the chip is already held in place, the shaking will directly affect the chip, causing it to loosen on the circuit board. This makes it impossible to guarantee a continuous pressing effect on the chip, indicating room for improvement. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a multi-chip integrated packaging structure.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A multi-chip integrated packaging structure includes a bottom frame and a package cover. A circuit board is fixedly connected to the inner bottom wall of the bottom frame, and a plurality of chip bodies are fixedly connected to the upper surface of the circuit board. A plurality of pins are fixedly connected to both the left and right sides of the bottom frame. Limiting components are fixedly connected to both the front and back sides of the bottom frame. A rectangular hole is opened on the upper surface of the package cover, and a voltage regulator component is fixedly connected to the inner wall of the rectangular hole.

[0008] The limiting component is used to limit and lock the package cover, and the voltage stabilizing component is used to ensure the stability between the chip body and the circuit board.

[0009] Preferably, the limiting component includes strip plates, and strip insert plates are fixedly connected to the upper surfaces of the two strip plates. Two threaded holes are opened on the upper surfaces of the two strip insert plates, and locking bolts are threadedly connected to the inner walls of the threaded holes.

[0010] Preferably, the lower surface of the encapsulation cover has two limiting slots adapted to the strip insert, and the upper surface of the encapsulation cover has two circular through holes adapted to the locking bolts at positions corresponding to the limiting slots.

[0011] Preferably, the voltage stabilizing component includes a positioning plate, an adjusting screw threadedly connected to the upper surface of the positioning plate, and sliding grooves provided on the front and rear inner walls of the encapsulation cover. Positioning rods are fixedly connected to the inner bottom walls of the two sliding grooves, and movable plates are slidably connected to the inner walls of the two sliding grooves. The movable plates are slidably connected to the surfaces of the two positioning rods respectively, and the bottom end of the adjusting screw is rotatably connected to the upper surface of the movable plate.

[0012] Preferably, two push rods are fixedly connected to the lower surface of the movable plate, and a pressure stabilizing plate is fixedly connected to the bottom end of the two push rods. A silicone protective pad is fixedly connected to the lower surface of the pressure stabilizing plate.

[0013] Preferably, the upper surface of the positioning plate is provided with a plurality of heat dissipation holes, and the inner wall of the heat dissipation holes is fixedly connected with a dustproof mesh.

[0014] The beneficial effects of this utility model are as follows:

[0015] 1. By setting up limit components and voltage stabilizing components, the package cover and the bottom frame can be locked during use. After locking, the adjusting screw drives the silicone protective pad to descend and press the chip body firmly onto the circuit board. This ensures that the chip body will not separate from the circuit board even if it is impacted or vibrated during transportation, resulting in higher stability. In addition, the silicone protective pad can provide a certain buffer space for the chip body by utilizing its own deformation ability, resulting in better packaging and protection of the chip body.

[0016] 2. With the installation of positioning plate, heat dissipation holes and dustproof mesh, the heat emitted by the circuit board and chip body can be quickly discharged through the heat dissipation holes during use, thereby increasing the heat dissipation effect on the circuit board and chip body. At the same time, the dustproof mesh can ensure that dust does not enter the interior and affect the circuit board and chip body, thus improving the protection effect on the circuit board and chip body. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a multi-chip integrated packaging structure proposed in this utility model;

[0018] Figure 2 This is a front-section diagram of the packaging cover of a multi-chip integrated packaging structure proposed in this utility model;

[0019] Figure 3 This is a three-dimensional disassembled structural diagram of a voltage regulator component with a multi-chip integrated packaging structure proposed in this utility model.

[0020] In the diagram: 1. Base frame; 2. Encapsulation cover; 3. Circuit board; 4. Chip body; 5. Pins; 6. Strip plate; 7. Strip insert plate; 8. Locking bolt; 9. Limit slot; 10. Positioning plate; 11. Adjusting screw; 12. Positioning rod; 13. Movable plate; 14. Top rod; 15. Voltage stabilizer plate; 16. Silicone protective pad; 17. Heat dissipation hole; 18. Dustproof mesh. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Example 1, referring to Figure 1-3 A multi-chip integrated packaging structure includes a bottom frame 1 and a packaging cover 2. A circuit board 3 is fixedly connected to the inner bottom wall of the bottom frame 1. Several chip bodies 4 are fixedly connected to the upper surface of the circuit board 3. Several pins 5 are fixedly connected to both the left and right sides of the bottom frame 1. Limiting components are fixedly connected to both the front and back of the bottom frame 1. A rectangular hole is opened on the upper surface of the packaging cover 2. A voltage regulator component is fixedly connected to the inner wall of the rectangular hole.

[0023] The limiting component is used to limit and lock the package cover 2, and the voltage regulating component is used to ensure the stability between the chip body 4 and the circuit board 3.

[0024] The limiting component includes strip plates 6, and strip insert plates 7 are fixedly connected to the upper surfaces of the two strip plates 6. Two threaded holes are opened on the upper surfaces of the two strip insert plates 7, and locking bolts 8 are threadedly connected to the inner walls of the threaded holes.

[0025] The lower surface of the encapsulation cover 2 has two limiting slots 9 that are adapted to the strip insert 7, and the upper surface of the encapsulation cover 2 has two circular through holes that are adapted to the locking bolts 8 at the corresponding positions of the limiting slots 9. By passing the locking bolts 8 through the circular through holes and inserting them into the threaded holes, the encapsulation cover 2 and the bottom frame 1 can be locked to ensure the stability of the encapsulation.

[0026] The voltage stabilizing assembly includes a positioning plate 10, with an adjusting screw 11 threadedly connected to the upper surface of the positioning plate 10. The front and rear inner walls of the encapsulation cover 2 are provided with sliding grooves, and positioning rods 12 are fixedly connected to the inner bottom walls of the two sliding grooves. Movable plates 13 are slidably connected to the inner walls of the two sliding grooves. The movable plates 13 are slidably connected to the surfaces of the two positioning rods 12 respectively, and the bottom end of the adjusting screw 11 is rotatably connected to the upper surface of the movable plates 13. Rotating the adjusting screw 11 can drive the movable plates 13 to move downward on the surfaces of the two positioning rods 12. Since the movable plates 13 are limited by the two positioning rods 12, the movable plates 13 can ensure vertical lifting and lowering without any deviation.

[0027] Two push rods 14 are fixedly connected to the lower surface of the movable plate 13. A voltage stabilizing plate 15 is fixedly connected to the bottom end of the two push rods 14. A silicone protective pad 16 is fixedly connected to the lower surface of the voltage stabilizing plate 15. The movable plate 13 drives the voltage stabilizing plate 15 to descend through the push rods 14. The voltage stabilizing plate 15 can drive the silicone protective pad 16 to contact the surface of each chip body 4 and press the chip body 4 firmly onto the circuit board 3, ensuring that the chip body 4 will not separate from the circuit board 3 during transportation. In addition, the silicone protective pad can provide a certain buffer space for the chip body 4, and the protection effect of the chip body 4 is good.

[0028] The upper surface of the positioning plate 10 is provided with several heat dissipation holes 17, and the inner wall of the heat dissipation holes 17 is fixedly connected with a dustproof mesh 18. The heat emitted by the circuit board 3 and the chip body 4 during use can be discharged through the heat dissipation holes 17, and the dustproof mesh 18 inside the heat dissipation holes 17 can ensure that dust will not enter the interior and have any impact on the circuit board 3 and the chip body 4.

[0029] Working principle: First, the circuit board 3 is fixedly installed inside the base frame 1. Then, each chip body 4 is fixed on the circuit board 3. During the packaging process, the two limiting slots 9 on the lower surface of the packaging cover 2 are aligned with the two strip-shaped inserts 7 and inserted into the limiting slots 9. At this time, four locking bolts 8 are passed through the four circular through holes on the top of the packaging cover 2 and inserted into the threaded holes. The locking bolts 8 are used to lock the packaging cover 2 to the base frame 1. Then, the adjusting screw 11 is rotated, causing the adjusting screw 11 to drive the movable plate 13 to move downward on the surface of the two positioning rods 12. The moving plate 13 drives the voltage regulator plate 15 and the silicone protective pad 16 to descend via two push rods 14 until the silicone protective pad 16 contacts the chip body 4 and the adjusting screw 11 can no longer be turned. At this time, the voltage regulator plate 15 can use the silicone protective pad 16 to press multiple chip bodies 4 onto the circuit board 3. During transportation, it can ensure that impacts and vibrations will not cause the chip body 4 to separate from the circuit board 3. At the same time, the silicone protective pad can also provide a certain buffer space for the chip body 4, which provides better protection for the chip body 4 and makes it more stable and safe to use.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A multi-chip integrated package structure comprising a base frame (1) and a package cover (2), characterized in that, The inner bottom wall of the bottom frame (1) is fixedly connected with a circuit board (3), the upper surface of the circuit board (3) is fixedly connected with a plurality of chip bodies (4), the left and right sides of the bottom frame (1) are fixedly connected with a plurality of pins (5), the front and back surfaces of the bottom frame (1) are fixedly connected with limiting assemblies, the upper surface of the packaging cover (2) is provided with a rectangular hole, and the inner wall of the rectangular hole is fixedly connected with a voltage stabilizing assembly. The limiting assembly is used for limiting and locking the packaging cover (2), and the voltage stabilizing assembly is used for guaranteeing the stability between the chip body (4) and the circuit board (3).

2. The multi-chip integrated package structure of claim 1, wherein, The limiting assembly comprises strip-shaped plates (6), the upper surfaces of the two strip-shaped plates (6) are fixedly connected with strip-shaped plug-in plates (7), the upper surfaces of the two strip-shaped plug-in plates (7) are provided with two threaded holes, and the inner walls of the threaded holes are threadedly connected with locking bolts (8).

3. The multi-chip integrated package structure of claim 1, wherein, The lower surface of the packaging cover (2) is provided with two limiting insertion grooves (9) matched with the strip-shaped plug-in plates (7), and the upper surface of the packaging cover (2) is provided with two circular through holes matched with the locking bolts (8) at positions corresponding to the limiting insertion grooves (9).

4. The multi-chip integrated package structure of claim 1, wherein, The voltage stabilizing assembly comprises a positioning plate (10), the upper surface of the positioning plate (10) is threadedly connected with an adjusting screw rod (11), the front and back inner walls of the packaging cover (2) are provided with sliding grooves, the inner bottom walls of the two sliding grooves are fixedly connected with positioning rods (12), the inner walls of the two sliding grooves are slidably connected with movable plates (13), the movable plates (13) are slidably connected with the surfaces of the two positioning rods (12) respectively, and the bottom end of the adjusting screw rod (11) is rotatably connected with the upper surface of the movable plate (13).

5. The multi-chip integrated package structure of claim 4, wherein, The lower surface of the movable plate (13) is fixedly connected with two jacks (14), the bottom ends of the two jacks (14) are fixedly connected with a voltage stabilizing plate (15), and the lower surface of the voltage stabilizing plate (15) is fixedly connected with a silica gel protective pad (16).

6. The multi-chip integrated package structure of claim 4, wherein, The upper surface of the positioning plate (10) is provided with a plurality of heat dissipation holes (17), and the inner walls of the heat dissipation holes (17) are fixedly connected with dustproof nets (18).

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