Vacuum adsorption fixing platform of wafer cutting machine

Abstract

The utility model belongs to the technical field of wafer cutting, and particularly relates to a vacuum adsorption fixing platform of a wafer cutting machine, which comprises a placing plate, a vacuum adsorption table and a groove frame are respectively arranged above the placing plate, an electric push rod is fixedly connected to the inner bottom wall of the groove frame, and a sliding column is slidably connected to the interior of the groove frame. The telescopic end of the electric push rod is fixedly connected with the bottom face of the sliding column, the bottom face of the groove frame is fixedly connected with an electromagnetic iron ring, the bottom face of the electromagnetic iron ring makes contact with the upper surface of the containing plate, and a rotating sawtooth lantern ring is arranged above the sliding column. According to the utility model, the vacuum adsorption table is arranged on the groove frame, the wafer can be adsorbed and fixed, meanwhile, the controller can be used for controlling the equipment to be started or stopped, and the electromagnetic iron ring can be fixed or unfixed on the placement plate through magnetic force through opening and closing, so that the electromagnetic iron ring can drive the groove frame and the vacuum adsorption table to move to a proper position for use.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer cutting technical field, concretely relates to a vacuum adsorption fixed platform of wafer cutting machine. BACKGROUND

[0002] The vacuum adsorption fixed platform of wafer cutting machine is a device for fixing wafer to carry out high-precision cutting on wafer cutting machine, which mainly utilizes vacuum adsorption principle, extracts air between platform and wafer by vacuum pump, forms negative pressure environment, tightly adsorbs wafer on platform surface by atmospheric pressure, realizes stable fixation of wafer, ensures that wafer keeps accurate position and posture in cutting process, and avoids affecting cutting precision due to vibration, displacement and other factors.

[0003] However, in the wafer cutting process, the flexibility of the vacuum adsorption fixed platform is crucial, however, when facing the demand of various and complex cutting layout, it cannot flexibly adjust the platform position, height and angle according to the actual processing needs, which greatly increases the positioning difficulty, prolongs the time required for positioning, leads to the substantial reduction of overall processing efficiency, and it is difficult to guarantee the precision of cutting in the cutting process, which seriously affects the product quality and production progress.

[0004] To solve the above problems, a vacuum adsorption fixed platform of wafer cutting machine is provided in the present application. UTILITY MODEL CONTENTS

[0005] To solve the above problems in the prior art, the utility model provides a vacuum adsorption fixed platform of wafer cutting machine, which has the characteristics of convenient adjustment of position, height and angle of the vacuum adsorption fixed platform.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a vacuum adsorption fixed platform of wafer cutting machine, including placing plate, the upper of placing plate is provided with vacuum adsorption platform and groove frame respectively, the inner bottom wall of groove frame is fixedly connected with electric push rod, the inside of groove frame is slidably connected with sliding column, the telescopic end of electric push rod is fixedly connected with the bottom surface of sliding column, the bottom surface of electromagnet ring is fixedly connected with the bottom surface of electromagnet ring, the bottom surface of electromagnet ring is in contact with the upper surface of placing plate, the upper of sliding column is provided with rotating sawtooth sleeve ring, the front of sliding column is provided with clutch motor, the power output end of clutch motor is fixedly connected with gear, the outer surface of gear is engaged with the outer surface of rotating sawtooth sleeve ring, the left side of placing plate is provided with controller.

[0007] As a preferred technical scheme of the utility model, the front and back of placing plate are fixedly connected with two connecting frames, and each connecting frame is clamped with a fixed pin shaft.

[0008] As a preferred embodiment of this utility model, a connecting plate is fixedly connected to the left side of the placement plate, and the upper surface of the connecting plate is fixedly connected to the bottom surface of the controller.

[0009] As a preferred embodiment of this utility model, an extension ring is fixedly connected to the outer surface of the electromagnet ring, and the bottom surface of the extension ring is in contact with the upper surface of the placement plate.

[0010] As a preferred embodiment of this utility model, a reinforcing frame is fixedly connected to the outer surface of the slot frame, and the bottom surface of the reinforcing frame is fixedly connected to the upper surface of the electromagnet ring.

[0011] As a preferred embodiment of this utility model, a fixing ring is fixedly connected to the upper surface of the rotating sawtooth collar, and the upper surface of the fixing ring is fixedly connected to the bottom surface of the vacuum adsorption stage.

[0012] As a preferred embodiment of this utility model, a connecting ring is fixedly connected to the outer surface of the rotating sawtooth collar, and the bottom surface of the connecting ring is fixedly connected to the upper surface of the sliding column.

[0013] As a preferred embodiment of this utility model, a fixed base is fixedly connected to the back of the brake motor, and the back of the fixed base is fixedly connected to the front of the sliding column.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting up a placement plate in conjunction with a vacuum adsorption stage, it can be fixed to the cutting machine and can hold the wafer in place. At the same time, the controller can control the opening and closing of the equipment, and by opening and closing the electromagnet ring, it can fix or release the wafer on the placement plate by magnetic force. This allows the electromagnet ring to move the slot frame and vacuum adsorption stage to the appropriate position for use. Simultaneously, by extending and retracting the electric push rod, it can drive the sliding column, rotating sawtooth collar, and vacuum adsorption stage to adjust their height. By rotating the brake motor in conjunction with the gear and rotating sawtooth collar, it can drive the vacuum adsorption stage to rotate, thereby allowing the height and angle of the vacuum adsorption stage to be adjusted during use, further improving the accuracy and efficiency of wafer cutting. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the vacuum adsorption stage in this utility model;

[0018] Figure 3 This is a cross-sectional view of the slot frame in this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the brake motor in this utility model;

[0020] Figure 5 This is a schematic diagram of the rotating sawtooth collar in this utility model;

[0021] In the diagram: 1. Placement plate; 2. Vacuum adsorption stage; 3. Fixing pin; 4. Connecting frame; 5. Connecting plate; 6. Controller; 7. Electromagnetic ring; 8. Extension ring; 9. Slot frame; 10. Reinforcing frame; 11. Sliding column; 12. Fixing ring; 13. Electric push rod; 14. Rotating serrated collar; 15. Connecting ring; 16. Fixing base; 17. Brake motor; 18. Gear. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0023] Please see Figures 1-5 The present invention provides the following technical solution: a vacuum adsorption fixing platform for a wafer dicing machine, comprising a placement plate 1, a vacuum adsorption stage 2 and a slot frame 9 respectively disposed above the placement plate 1, an electric push rod 13 fixedly connected to the inner bottom wall of the slot frame 9, a sliding column 11 slidably connected inside the slot frame 9, the telescopic end of the electric push rod 13 fixedly connected to the bottom surface of the sliding column 11, an electromagnet ring 7 fixedly connected to the bottom surface of the slot frame 9, the bottom surface of the electromagnet ring 7 contacting the upper surface of the placement plate 1, a rotating sawtooth collar 14 disposed above the sliding column 11, a brake motor 17 disposed on the front side of the sliding column 11, a gear 18 fixedly connected to the power output end of the brake motor 17, the outer surface of the gear 18 meshing with the outer surface of the rotating sawtooth collar 14, and a controller 6 disposed on the left side of the placement plate 1;

[0024] In this embodiment, the placement plate 1 is made of iron, which enables the electromagnet ring 7 to generate magnetic force for adsorption. The rotating sawtooth collar 14 is divided into an upper ring and a lower ring. The lower ring is fixed to the sliding column 11, while the upper ring rotates inside the lower ring. The upper ring is fixed to the vacuum adsorption stage 2. Then, the sawtooth on the surface of the upper ring meshes with the gear 18, so that the rotating sawtooth collar 14 can be driven to rotate by the forward or reverse rotation of the brake motor 17. The rotation of the rotating sawtooth collar 14 can drive the vacuum adsorption stage 2 to rotate and adjust the angle.

[0025] Specifically, two connecting brackets 4 are fixedly connected to the front and back of the placement plate 1. Each connecting bracket 4 has a fixing pin 3 inside. In this embodiment, the connecting bracket 4 can be fixed by the fixing pin 3, and the placement plate 1 can be fixed for use by fixing the connecting bracket 4.

[0026] Specifically, a connecting plate 5 is fixedly connected to the left side of the placement plate 1, and the upper surface of the connecting plate 5 is fixedly connected to the bottom surface of the controller 6. In this embodiment, the controller 6 can be fixedly used through the connecting plate 5. The controller 6 refers to the master control device that controls the starting, speed regulation, braking and reversing of the motor by changing the wiring of the main circuit or control circuit and changing the resistance value in the circuit according to a predetermined sequence.

[0027] Specifically, an extension ring 8 is fixedly connected to the outer surface of the electromagnet ring 7. The bottom surface of the extension ring 8 is in contact with the upper surface of the placement plate 1. In this embodiment, the extension ring 8 can increase the area of ​​connection between the electromagnet ring 7 and the placement plate 1. Meanwhile, the electromagnet ring 7 is a device that converts electrical energy into magnetic energy. It is usually composed of a ring-shaped iron core and a coil wrapped around the iron core.

[0028] Specifically, a reinforcing frame 10 is fixedly connected to the outer surface of the slot frame 9. The bottom surface of the reinforcing frame 10 is fixedly connected to the upper surface of the electromagnet ring 7. In this embodiment, the reinforcing frame 10 can reinforce the slot frame 9 to the electromagnet ring 7, thereby making the slot frame 9 sturdy.

[0029] Specifically, a fixing ring 12 is fixedly connected to the upper surface of the rotating sawtooth collar 14. The upper surface of the fixing ring 12 is fixedly connected to the bottom surface of the vacuum adsorption stage 2. In this embodiment, the fixing ring 12 can increase the connection area between the vacuum adsorption stage 2 and the rotating sawtooth collar 14, thereby enabling the vacuum adsorption stage 2 to be used stably.

[0030] Specifically, a connecting ring 15 is fixedly connected to the outer surface of the rotating sawtooth collar 14. The bottom surface of the connecting ring 15 is fixedly connected to the upper surface of the sliding column 11. In this embodiment, the rotating sawtooth collar 14 can be fixed to the sliding column 11 through the connecting ring 15, so that the sliding column 11 can drive the rotating sawtooth collar 14 to move.

[0031] Specifically, a fixing seat 16 is fixedly connected to the back of the brake motor 17. The back of the fixing seat 16 is fixedly connected to the front of the sliding column 11. In this embodiment, the brake motor 17 can be fixed to the sliding column 11 through the fixing seat 16. At the same time, the brake motor 17 is a motor with braking function, also known as a brake motor. It is based on an ordinary motor with an added braking device, which is usually installed at the tail of the motor.

[0032] The working principle and usage process of this utility model are as follows: First, the placement plate 1 is fixed to the wafer dicing machine using the connecting frame 4 and the fixing pin 3. Simultaneously, the vacuum adsorption stage 2, electromagnet ring 7, electric push rod 13, brake motor 17, and controller 6 are connected to the power supply via wires. The electromagnet ring 7, electric push rod 13, and brake motor 17 are also connected to the controller 6 via wires. Then, the wafer to be diced is adsorbed and fixed using the vacuum adsorption stage 2. When the position of the vacuum adsorption stage 2 needs to be adjusted for dicing, the vacuum adsorption stage 2, sliding column 11, slot frame 9, electromagnet ring 7, and extension ring 8 are moved to the appropriate position on the placement plate 1. Simultaneously, the controller 6 activates the electromagnet ring 7, generating magnetic force and fixing it to the placement plate 1. Once the position of the vacuum adsorption stage 2 is adjusted, the height of the vacuum adsorption stage 2 can be adjusted. The controller 6 opens and extends the electric push rod 13. Simultaneously, the extension and retraction of the electric push rod 13 causes the sliding column 11 to slide within the slot frame 9. The sliding of the sliding column 11 drives the brake motor 17, gear 18, and rotating sawtooth collar 14 to move up and down. The movement of the rotating sawtooth collar 14 adjusts the height of the fixed ring 12 and the vacuum adsorption table 2. When the angle of the vacuum adsorption table 2 needs adjustment, the controller 6 again opens the brake motor 17 to rotate forward or backward. The rotation of the brake motor 17 drives the gear 18 to rotate, which in turn drives the rotating sawtooth collar 14. The rotation of the sawtooth collar 14 then adjusts the angle of the fixed ring 12 and the vacuum adsorption table 2. This further improves the ease of adjustment of the vacuum adsorption table 2 during use and enhances the accuracy and efficiency of circular cutting.

[0033] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vacuum adsorption fixing platform for a wafer dicing machine, characterized in that: The utility model provides a kind of vacuum adsorption table, it is including placing plate (1), the upper surface of placing plate (1) is provided with vacuum adsorption table (2) and groove frame (9) respectively, the inner bottom wall of groove frame (9) is fixedly connected with electric push rod (13), the inside of groove frame (9) is slidably connected with sliding column (11), the bottom surface of electric push rod (13) and sliding column (11) is fixedly connected, the bottom surface of electromagnet ring (7) is fixedly connected with the bottom surface of placing plate (1), the upper surface of electromagnet ring (7) is in contact with placing plate (1), the upper surface of sliding column (11) is provided with rotating sawtooth sleeve ring (14), the front surface of sliding column (11) is provided with clutch motor (17), the output end of clutch motor (17) is fixedly connected with gear (18), the outer surface of gear (18) is engaged with the outer surface of rotating sawtooth sleeve ring (14), the left side of placing plate (1) is provided with controller (6).

2. The vacuum chucking fixing platform of a wafer cutting machine according to claim 1, wherein: The front surface and the back surface of the placing plate (1) are fixedly connected with two connecting frames (4), and the inside of each connecting frame (4) is clamped with a fixed pin shaft (3).

3. The vacuum chucking fixing platform of a wafer cutting machine according to claim 1, wherein: The left side of the placing plate (1) is fixedly connected with a connecting plate (5), and the upper surface of the connecting plate (5) is fixedly connected with the bottom surface of the controller (6).

4. The vacuum chucking fixing platform of a wafer cutting machine according to claim 1, wherein: The outer surface of the electromagnet ring (7) is fixedly connected with an extension ring (8), and the bottom surface of the extension ring (8) is in contact with the upper surface of the placing plate (1).

5. The vacuum chucking fixing platform of a wafer cutting machine according to claim 1, wherein: The outer surface of the groove frame (9) is fixedly connected with a reinforcing frame (10), and the bottom surface of the reinforcing frame (10) is fixedly connected with the upper surface of the electromagnet ring (7).

6. The vacuum chucking and fixing platform of a wafer cutting machine according to claim 1, wherein: The upper surface of the rotating sawtooth sleeve ring (14) is fixedly connected with a fixed ring (12), and the upper surface of the fixed ring (12) is fixedly connected with the bottom surface of the vacuum adsorption table (2).

7. The vacuum chucking and fixing platform of a wafer cutting machine according to claim 1, wherein: The outer surface of the rotating sawtooth sleeve ring (14) is fixedly connected with a connecting ring (15), and the bottom surface of the connecting ring (15) is fixedly connected with the upper surface of the sliding column (11).

8. The vacuum chucking and fixing platform of a wafer cutting machine according to claim 1, wherein: The back surface of the clutch motor (17) is fixedly connected with a fixed seat (16), and the back surface of the fixed seat (16) is fixedly connected with the front surface of the sliding column (11).

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