Cooling mechanism for deep-hole plate preparation mold

Abstract

The utility model relates to a cooling mechanism for a deep hole plate preparation mold, and belongs to the technical field of molds, one side of a lower mold is provided with a cooling box, the front surface of the cooling box is provided with a rotating motor, the inner side of the cooling box is provided with a semiconductor chilling plate, and the upper surface of the cooling box is further provided with an infusion pump; the water inlet end of the infusion pump is connected with a second connecting pipe in the cooling box, the water outlet end of the infusion pump is connected with a first connecting pipe, an exhaust fan is further installed on the upper surface of the cooling box, the air outlet end of the exhaust fan is connected with a three-way pipe, and the upper end of the three-way pipe is connected with an air outlet pipe above the upper mold. And spray heads are symmetrically arranged on the lower surface of the air outlet pipe. The cooling box is arranged outside the deep-hole plate preparation mold, so that the deep-hole plate preparation mold can be conveniently maintained, cooling water can be cooled through the semiconductor chilling plate, the purpose of efficient recycling is achieved, and practicability is good.

Description

TECHNICAL FIELD

[0001] The utility model belongs to mould technical field, specifically relates to a cooling mechanism for deep hole plate preparation mould. BACKGROUND

[0002] Deep hole plate usually refers to a kind of workpiece clamp or tooling plate for deep hole machining, mainly used for fixing workpiece in machining process, and special mould needs to be used when deep hole plate is prepared, the mould for making deep hole plate is heated quickly after injection material, which reduces production efficiency, and even tool and mould can be damaged, so cooling mould is crucial.

[0003] Chinese patent discloses a kind of quick cooling mechanism of preparation mould for deep hole plate (authorized announcement No.CN217862665U), the patent technology can quickly cool mould, and can greatly improve the surface finish of plastic product, reduce the surface mark and internal stress of plastic product, make product not shrinkage, not deformation, facilitate the demoulding of plastic product, accelerate product setting, to greatly improve the production efficiency of plastic forming machine.

[0004] However, the cooling mode of the existing deep hole plate preparation mould mostly sets cooling box in lower mould, which leads to maintenance change, and cooling cannot be carried out when circulating, so there is still heat in circulating cooling liquid, which affects cooling, such as the above-mentioned comparative document, which is set in the mode of setting cooling box in mould, when cooling box is set in mould, liquid cannot be in and out, and maintenance cannot be carried out, leading to inconvenience in use.Therefore, the cooling mechanism for deep hole plate preparation mould is provided by the person skilled in the art to solve the problems proposed in the above background. CONTENT OF THE UTILITY MODEL

[0005] The utility model aims to provide a kind of cooling mechanism for deep hole plate preparation mould, which can solve the problems proposed in the above background.

[0006] The technical scheme adopted by the utility model is as follows:

[0007] The utility model relates to a cooling mechanism for deep -hole plate preparation mould, including lower mould and setting above lower mould upper mould, the inside of lower mould is provided with heat conducting sleeve, one side of heat conducting sleeve is provided with water inlet pipe and drain pipe from top to bottom respectively, one side of lower mould is provided with cooling box, the front surface of cooling box is installed rotating motor, and the inboard of cooling box is provided with semiconductor refrigeration piece, the upper surface of cooling box still is installed pumping liquid pump, the water inlet end of pumping liquid pump is connected with second connecting pipe in the inside of cooling box, and the water outlet end of pumping liquid pump is connected with first connecting pipe, the inside of cooling box is provided with baffle still, and the side of cooling box is opened with air inlet hole above baffle, the upper surface of cooling box still is installed exhaust fan, the air outlet of exhaust fan is connected with three -way pipe, the upper end of three -way pipe is connected with air outlet pipe above upper mould, the lower surface of air outlet pipe is provided with nozzle symmetrically.

[0008] The utility model further sets up: one end of first connecting pipe corresponds with water inlet pipe, one side of cooling box is provided with backwater pipe corresponding with drain pipe, the outside of water inlet pipe and backwater pipe is provided with threaded bush sealed connection of water inlet pipe and drain pipe.

[0009] The utility model further sets up: air outlet pipe is provided with two groups symmetrically above upper mould, and the lower surface of air outlet pipe is provided with at least six nozzles symmetrically.

[0010] The utility model further sets up: one side of cooling box is opened with air inlet hole, and the air inlet of exhaust fan is provided with fixed pipe in the inside of cooling box.

[0011] The utility model further sets up: the drive end of rotating motor is connected with rotating shaft in the inside of cooling box, and the outside of rotating shaft is provided with stirring rod symmetrically.

[0012] The utility model further sets up: the hot end of semiconductor refrigeration piece is arranged at the outside of cooling box, and the cold end of semiconductor refrigeration piece is arranged at the inside of cooling box.

[0013] The utility model further sets up: the outside of cooling box is installed support, and the side of support is installed heat dissipation fan.

[0014] The utility model obtains the technical effect for:

[0015] The cooling mechanism for deep -hole plate preparation mould of the utility model sets up cooling box at the outside of deep -hole plate preparation mould, so it is convenient to maintain, the cooling liquid in the inside of cooling box can be extracted and enters heat conducting sleeve to realize the purpose of cooling by the work of pumping liquid pump, and the cooling water can be cooled by semiconductor refrigeration piece, thereby realizing the purpose of efficient circulation use, and the practicability is good.

[0016] This utility model discloses a cooling mechanism for a deep hole plate preparation mold. By operating a fan, external air is drawn into the cooling box. The cool air generated by the coolant inside the cooling box is drawn in and sprayed out through nozzles on the lower surface of the air outlet pipe. This air jet cooling is achieved, improving the forming of the deep hole plate and demonstrating good practicality. Attached Figure Description

[0017] Figure 1 A schematic diagram of a cooling mechanism used in the fabrication of a deep-hole plate mold;

[0018] Figure 2 A schematic diagram of the heat-conducting jacket in a cooling mechanism used for a mold for preparing a deep-hole plate;

[0019] Figure 3 A schematic diagram of the air outlet pipe in a cooling mechanism used for a mold for preparing a deep-hole plate;

[0020] Figure 4 This is a schematic diagram of the internal structure of the cooling box in a cooling mechanism used for preparing a deep hole plate mold.

[0021] In the diagram: 1. Lower mold; 2. Upper mold; 3. Cooling box; 31. Air inlet; 32. Semiconductor cooling chip; 33. Support; 331. Cooling fan; 4. Rotary motor; 41. Rotating shaft; 42. Stirring rod; 5. Liquid pump; 51. Heat-conducting jacket; 511. Water inlet pipe; 52. First connecting pipe; 521. Second connecting pipe; 53. Water return pipe; 6. Exhaust fan; 61. T-joint pipe; 62. Air outlet pipe; 621. Nozzle; Detailed Implementation

[0022] To make the purpose and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific implementations of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.

[0023] like Figure 1As shown, a cooling mechanism for a deep-hole plate preparation mold includes a lower mold 1 and an upper mold 2 disposed above the lower mold 1. A heat-conducting sleeve 51 is disposed inside the lower mold 1. A water inlet pipe 511 and a drain pipe are respectively disposed on one side of the heat-conducting sleeve 51 from top to bottom. A cooling box 3 is disposed on one side of the lower mold 1. A rotary motor 4 is mounted on the front surface of the cooling box 3, and a semiconductor cooling chip 32 is disposed inside the cooling box 3. A liquid pump 5 is also mounted on the upper surface of the cooling box 3. The water inlet of the liquid pump 5 is connected to a second connecting pipe 521 inside the cooling box 3, and the water outlet of the liquid pump 5 is connected to a first connecting pipe 52. A partition 34 is also disposed inside the cooling box 3, and a partition plate 34 is disposed on one side of the cooling box 3. An air inlet 31 is provided above the plate 34. An exhaust fan 6 is also installed on the upper surface of the cooling box 3. The exhaust end of the exhaust fan 6 is connected to a three-way pipe 61. The upper end of the three-way pipe 61 is connected to an exhaust pipe 62 above the upper mold 2. Spray nozzles 621 are symmetrically arranged on the lower surface of the exhaust pipe 62. The cooling box 3 is set on one side of the mold, which facilitates the maintenance of the interior of the cooling box 3. The semiconductor cooling chip 32 can be used to cool the coolant inside the cooling box 3 and achieve the purpose of recycling. The operation of the exhaust fan 6 will draw in external air and mix it with the cold air generated by the coolant inside the cooling box 3 to achieve the purpose of cooling the mold and improve the cooling effect.

[0024] like Figure 2 As shown, one end of the first connecting pipe 52 corresponds to the inlet pipe 511. A return pipe 53 corresponding to the drain pipe is provided on one side of the cooling box 3. Both the inlet pipe 511 and the return pipe 53 are provided with threaded sleeves that seal the inlet pipe 511 and the drain pipe. This arrangement uses the threaded sleeves to connect the inlet pipe 511 and the first connecting pipe 52, and also to connect the drain pipe and the return pipe 53. In this way, the coolant can be drawn into the heat-conducting jacket 51 for circulation.

[0025] like Figure 3 As shown, two sets of air outlet pipes 62 are symmetrically arranged above the upper mold 2, and at least six nozzles 621 are symmetrically arranged on the lower surface of the air outlet pipes 62. An air inlet 31 is opened on one side of the cooling box 3. The air inlet end of the exhaust fan 6 is provided with a fixed pipe inside the cooling box 3. This arrangement uses the air inlet 31 to draw external air into the interior of the cooling box 3 when the exhaust fan 6 is working, and after entering, it comes into contact with the cold air generated by the coolant. This facilitates the subsequent discharge to cool the mold and improve the preparation of the deep hole plate.

[0026] like Figure 4As shown, the drive end of the rotary motor 4 is connected to a rotating shaft 41 inside the cooling box 3. A stirring rod 42 is symmetrically arranged on the outside of the rotating shaft 41. A sealing gasket is provided at the connection between the front end of the rotating shaft 41 and the cooling box 3, which can improve its sealing performance. When the rotary motor 4 is working, the rotating shaft 41 will rotate. When rotating, the stirring rod 42 can agitate the coolant inside to achieve uniform cooling. It has good practicality.

[0027] like Figure 2 As shown, the hot end of the thermoelectric cooler 32 is located outside the cooling box 3, and the cold end of the thermoelectric cooler 32 is located inside the cooling box 3. A bracket 33 is installed on the outside of the cooling box 3, and a cooling fan 331 is installed on one side of the bracket 33. This arrangement allows the thermoelectric cooler 32 to cool the coolant inside the cooling box 3, and after cooling, the cooling fan 331 can cool the thermoelectric cooler 32, thereby improving the cooling effect of the thermoelectric cooler 32 on the cooling water inside the cooling box 3.

[0028] The working principle of this utility model is as follows: When using the cooling mechanism for the deep hole plate preparation mold, the inlet pipe 511 and the first connecting pipe 52 are first connected via a threaded sleeve. Similarly, the drain pipe and the return pipe 53 can also be connected. After connection, when cooling of the deep hole plate preparation mold is required, the pump 5 draws coolant through the second connecting pipe 521. The coolant then enters the inlet pipe 511 through the first connecting pipe 52, and finally enters the heat-conducting sleeve 51, thus achieving the purpose of cooling the mold and enabling the deep hole plate preparation work. The cooling water inside the heat-conducting sleeve 51 is then discharged through the drain pipe and the return pipe... Pipe 53 returns to the cooling box 3 for recycling, and the semiconductor cooling chip 32 can cool the coolant inside the cooling box 3. After cooling, the semiconductor cooling chip 32 can be cooled by the heat dissipation fan 331, thereby improving the cooling effect of the semiconductor cooling chip 32 on the cooling water inside the cooling box 3. At the same time, the operation of the exhaust fan 6 can draw in the outside air and enter the cooling box 3. The cold air generated by the coolant inside the cooling box 3 will be drawn in and sprayed out through the nozzle 621 on the lower surface of the exhaust pipe 62. In this way, the upper mold 2 can be cooled by air jet, which improves the forming of deep hole plate and has good practicality.

[0029] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the art.

Claims

1. A cooling mechanism for a deep well plate production mold, characterized by: The utility model relates to a cooling device for injection mould, including lower mould (1) and the upper mould (2) of setting above lower mould (1), the inside of lower mould (1) is provided with heat conducting sleeve (51), one side of heat conducting sleeve (51) is provided with water inlet pipe (511) and drain pipe from top to bottom respectively, one side of lower mould (1) is provided with cooling box (3), the front surface of cooling box (3) is installed with rotary motor (4), and the inside of cooling box (3) is provided with semiconductor refrigerating fin (32), the upper surface of cooling box (3) is also installed with liquid pumping pump (5), the water inlet end of liquid pumping pump (5) is connected with second connecting pipe (521) in the inside of cooling box (3), and the water outlet end of liquid pumping pump (5) is connected with first connecting pipe (52), the inside of cooling box (3) is also provided with baffle (34), and one side of cooling box (3) is provided with air inlet hole (31) above baffle (34), the upper surface of cooling box (3) is also installed with exhaust fan (6), the air outlet end of exhaust fan (6) is connected with three-way pipe (61), the upper end of three-way pipe (61) is connected with air outlet pipe (62) above upper mould (2), and the lower surface of air outlet pipe (62) is provided with spray head (621) symmetrically.

2. A cooling mechanism for a deep hole plate making die according to claim 1, characterized in that: One end of first connecting pipe (52) corresponds to water inlet pipe (511), one side of cooling box (3) is provided with backwater pipe (53) corresponding to drain pipe, the outside of water inlet pipe (511) and backwater pipe (53) is provided with threaded sleeve that water inlet pipe (511) and drain pipe are sealedly connected.

3. The cooling mechanism for a deep hole plate manufacturing die according to claim 1, wherein: Air outlet pipe (62) is provided with two groups symmetrically above upper mould (2), and spray head (621) is provided with at least six symmetrically on the lower surface of air outlet pipe (62).

4. The cooling mechanism for a deep hole plate manufacturing die according to claim 1, wherein: One side of cooling box (3) is provided with air inlet hole (31), and the air inlet end of exhaust fan (6) is provided with fixed pipe in the inside of cooling box (3).

5. The cooling mechanism for a deep hole plate manufacturing die according to claim 1, wherein: The driving end of rotary motor (4) is connected with rotary shaft (41) in the inside of cooling box (3), and the outside of rotary shaft (41) is provided with stirring rod (42) symmetrically.

6. The cooling mechanism for a deep hole plate manufacturing die according to claim 1, wherein: The hot end of semiconductor refrigerating fin (32) is arranged at the outside of cooling box (3), and the cold end of semiconductor refrigerating fin (32) is arranged at the inside of cooling box (3).

7. The cooling mechanism for a deep hole plate manufacturing die according to claim 1, wherein: The outside of cooling box (3) is installed with support (33), and the side of support (33) is installed with heat dissipation fan (331).

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