Quartz piece rapid cooling device for semiconductor material manufacturing

Abstract

The utility model relates to the technical field of quartz piece cooling, in particular to a quartz piece rapid cooling device for semiconductor material manufacturing, which comprises a cooling cylinder, the top end of the cooling cylinder is fixedly connected with an upper ring seat, the surface of the upper ring seat is movably connected with a sealing cover, and the bottom end of the cooling cylinder is fixedly connected with a lower ring seat. A conveying spiral roller is arranged in the cooling cylinder, and cooling side pipes are fixedly connected to the four sides of the side face of the cooling cylinder. Through the arrangement of the cooling cylinder, the upper ring base, the sealing cover, the lower ring base, the conveying spiral roller, the cooling side pipe, the upper flow dividing cover, the lower flow dividing cover, the flow dividing base, the cooling groove, the feeding grating and the discharging grating, the quartz piece raw material cooling device can rapidly cool quartz piece raw materials for semiconductor material manufacturing. A worker firstly puts a quartz piece raw material for semiconductor material manufacturing into a cooling groove of a cooling cylinder, and then seals a sealing cover on the surface of an upper ring seat.

Description

Technical Field

[0001] This utility model relates to the field of quartz cooling technology, specifically a rapid cooling device for quartz components used in semiconductor material manufacturing. Background Technology

[0002] Quartz is one of the major rock-forming minerals, generally referring to low-temperature quartz, which is the most widely distributed mineral in the quartz group. In a broader sense, quartz also includes high-temperature quartz and coesite, etc. Its main component is SiO2, which is colorless and transparent. It often contains a small amount of impurities, which can turn it into translucent or opaque crystals. It is hard in texture. Quartz is a mineral resource with very stable physical and chemical properties. Its crystals are oxide minerals belonging to the trigonal crystal system. Quartz blocks are also known as silica, and are mainly used as raw materials for the production of quartz sand. They are also raw materials for quartz refractories and ferrosilicon.

[0003] For example, patent document CN 212512519 U discloses a rapid cooling device for cooling fused silica, including a cooling box and a feed hopper installed on the top of the cooling box. The bottom and one side of the cooling box are respectively provided with a water inlet and a water outlet. A drive motor is fixedly connected to the bottom of the cooling box. A rotating drum is fixedly connected to the drive end of the output shaft of the drive motor inside the cooling box. A cover plate is rotatably connected to the bottom of the feed hopper. Driven by the drive motor, the rotating drum is driven to rotate. The fused silica inside the rotating drum is rapidly cooled by the condensate in the cooling box. While the drive motor drives the rotating drum to rotate, the cover plate is continuously opened and closed to gradually feed the inside of the rotating drum. During the process of the fused silica falling into the rotating drum, the fan can provide air cooling for the fused silica, forming a preliminary cooling of the fused silica. The fused silica entering the rotating drum is then cooled again by rotating with the condensate.

[0004] However, in actual use, due to its structural limitations, this structure can only be cooled by simple water-cooling and stirring of quartz sand. The quartz sand in the tank cannot be fully mixed with the cold water, resulting in uneven cooling of the quartz sand and affecting the overall cooling efficiency. At the same time, the equipment cannot achieve sufficient contact between the cold water and the quartz sand raw material, which cannot meet the needs of daily use. Therefore, it is urgent to design a rapid cooling device for quartz parts used in semiconductor material manufacturing to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a rapid cooling device for quartz parts used in semiconductor material manufacturing, in order to solve the problem mentioned in the background art. In actual use, due to the limitations of its own structure, the existing structure can only adopt a simple water-cooling and stirring operation of quartz sand. The quartz sand in the tank cannot be fully mixed with the cold water, which leads to uneven cooling of the quartz sand and affects the overall cooling efficiency. At the same time, the equipment cannot fully contact the cold water with the quartz sand raw material, which cannot meet the needs of daily use.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a rapid cooling device for quartz parts used in semiconductor material manufacturing, comprising a cooling cylinder, an upper ring seat fixedly connected to the top of the cooling cylinder, a sealing cover movably connected to the surface of the upper ring seat, a lower ring seat fixedly connected to the bottom of the cooling cylinder, and a conveying spiral roller disposed inside the cooling cylinder.

[0007] The cooling side pipe is fixedly connected to the four sides of the side of the cooling cylinder. The top end of the cooling side pipe is fixedly connected to the upper flow divider, and the bottom end of the cooling side pipe is fixedly connected to the lower flow divider.

[0008] Preferably, the upper and lower flow dividers are provided with flow divider seats at their four internal corners, and one end of each flow divider seat is provided with a flow mesh groove.

[0009] Preferably, a flow divider ring seat is fitted on the outer surface of the upper flow divider shroud, and an inlet valve is fixedly connected to the side of the flow divider ring seat.

[0010] Preferably, a manifold seat is fitted on the outer surface of the lower manifold, and an outlet valve is fixedly connected to the side of the manifold seat.

[0011] Preferably, a support base is fixedly connected to the bottom end of the lower distribution shroud, and a cooling groove is provided inside the cooling cylinder.

[0012] Preferably, the upper ring seat has a feeding grid on all four sides, and the lower ring seat has a discharging grid on all four sides.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This rapid cooling device for quartz parts used in semiconductor material manufacturing, through its components including a cooling cylinder, upper ring seat, sealing cover, lower ring seat, conveying spiral roller, cooling side tube, upper flow divider, lower flow divider, flow divider seat, cooling tank, feed grid, and discharge grid, enables the equipment to rapidly cool the raw materials for quartz parts used in semiconductor material manufacturing. In actual use, the operator first places the raw materials into the cooling tank of the cooling cylinder, then seals the upper ring seat with the sealing cover, and then starts the conveying spiral roller inside the cooling cylinder. The spiral roller drives the quartz raw material downwards, diverting it from the discharge grid on the side of the lower ring seat. It is then guided by the diversion seats on the four sides of the lower diversion hood, and finally extruded upwards along the cooling side pipe. Finally, at the diversion seats on the four sides of the upper diversion hood, it is guided back into the feed grid of the upper ring seat, returning to the cooling tank inside the cooling cylinder. Normally, simply filling the cooling cylinder with cooling water is sufficient for rapid and thorough cooling of the quartz raw material, demonstrating the practicality of the equipment design.

[0015] This rapid cooling device for quartz components used in semiconductor material manufacturing improves overall equipment performance through its components: a cooling cylinder, upper ring seat, lower ring seat, upper distribution hood, lower distribution hood, distribution seat, flow mesh groove, distribution ring seat, inlet valve, confluence ring seat, and outlet valve. During daily use, operators can inject cooling water through the inlet valve on the side of the distribution ring seat. The distribution ring seat then diverts the cooling water through the flow mesh grooves on the four sides of the upper distribution hood. Part of the cooling water enters the cooling side pipe, and part enters the cooling tank of the cooling cylinder, both flowing downwards. Finally, the water converges at the outlet valve of the confluence ring seat from the lower distribution hood. This flow is opposite to the upward-pressed quartz raw material in the cooling side pipe, ensuring sufficient contact between the cooling water and the quartz raw material. This comprehensive design demonstrates the holistic nature of the equipment. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall structure of the cooling cylinder of this utility model;

[0018] Figure 3 This is an overall schematic diagram of the cooling side pipe structure of this utility model;

[0019] Figure 4 This utility model Figure 1 An enlarged schematic diagram of the structure at point A in the middle.

[0020] In the diagram: 1. Cooling cylinder; 2. Upper ring seat; 3. Sealing cover; 4. Lower ring seat; 5. Conveying spiral roller; 6. Cooling side pipe; 7. Upper diverter hood; 8. Lower diverter hood; 9. Diverter seat; 10. Flow channel; 11. Diverter ring seat; 12. Inlet valve; 13. Combination ring seat; 14. Outlet valve; 15. Support base; 16. Cooling tank; 17. Feed grid; 18. Discharge grid. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4 One embodiment provided by this utility model:

[0023] A rapid cooling device for quartz parts used in semiconductor material manufacturing includes a cooling cylinder 1. An upper ring seat 2 is fixedly connected to the top of the cooling cylinder 1, and a sealing cover 3 is movably connected to the surface of the upper ring seat 2. A lower ring seat 4 is fixedly connected to the bottom of the cooling cylinder 1. A conveying spiral roller 5 is provided inside the cooling cylinder 1. A converging ring seat 13 is fitted on the outer surface of the lower diverter hood 8. A liquid outlet valve 14 is fixedly connected to the side of the converging ring seat 13. A support base 15 is fixedly connected to the bottom of the lower diverter hood 8. A cooling groove 16 is opened inside the cooling cylinder 1. Feed grids 17 are provided on the four sides of the upper ring seat 2. Discharge grids 18 are provided on the four sides of the lower ring seat 4. When the conveying spiral roller 5 inside the cooling cylinder 1 is activated, the quartz raw material is conveyed downward and diverted out from the discharge grid 18 on the side of the lower ring seat 4. Then, it is guided by the diverter seats 9 on the four sides of the lower diverter hood 8. Finally, the quartz raw material is squeezed and conveyed upward along the cooling side pipe 6.

[0024] Cooling side pipe 6 is fixedly connected to the four sides of the side of the cooling cylinder 1. The top of the cooling side pipe 6 is fixedly connected to the upper diversion shroud 7, and the bottom of the cooling side pipe 6 is fixedly connected to the lower diversion shroud 8. Diversion seats 9 are set at the four corners inside the upper diversion shroud 7 and the lower diversion shroud 8. One end of the diversion seat 9 is set with a flow mesh groove 10. The outer surface of the upper diversion shroud 7 is fitted with a diversion ring seat 11. The side of the diversion ring seat 11 is fixedly connected to the liquid inlet valve 12. Cooling water is poured in from the liquid inlet valve 12 on the side of the diversion ring seat 11. Then the diversion ring seat 11 diverts the cooling water from the flow mesh groove 10 of the diversion seat 9 on the four sides of the upper diversion shroud 7. At this time, part of the cooling water can enter the interior of the cooling side pipe 6 and part of it can enter the interior of the cooling tank 16 of the cooling cylinder 1. Both are transported downwards and finally converge at the lower diversion shroud 8 to the liquid outlet valve 14 of the confluence ring seat 13.

[0025] Working Principle: During operation, the user first places the quartz raw material for semiconductor manufacturing into the cooling tank 16 of the cooling cylinder 1. Then, the sealing cover 3 is placed on the surface of the upper ring seat 2. At this time, the conveying spiral roller 5 inside the cooling cylinder 1 is activated, which drives the quartz raw material downwards. It is then diverted and sent out from the discharge grid 18 on the side of the lower ring seat 4, and guided by the diversion seats 9 on the four sides of the lower diversion hood 8. The quartz raw material is then squeezed and conveyed upwards along the cooling side pipe 6, and finally guided into the feed grid 17 of the upper ring seat 2 at the diversion seats 9 on the four sides of the upper diversion hood 7, returning to the cooling tank 16 of the cooling cylinder 1. Normally, simply filling the cooling cylinder 1 with cooling water is sufficient to fully cool the quartz raw material. For rapid cooling operation, during daily use, the operator can pour cooling water in through the inlet valve 12 on the side of the distribution ring seat 11. Then, the distribution ring seat 11 diverts the cooling water in through the flow mesh groove 10 of the four-sided distribution seats 9 of the upper distribution cover 7. At this time, part of the cooling water can enter the cooling side pipe 6 and part can enter the cooling tank 16 of the cooling cylinder 1, both of which are transported downwards. Finally, the cooling water is collected at the outlet valve 14 of the confluence ring seat 13 from the lower distribution cover 8. At the same time, the cooling water in the cooling side pipe 6 flows in the opposite direction to the upwardly squeezed and transported quartz raw material, so that the cooling water can fully contact the quartz raw material and ensure that the cooling water fully cools all the quartz raw materials used in semiconductor material manufacturing. The above is the complete working principle of this utility model.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A rapid cooling device for a quartz member used in the production of a semiconductor material, comprising a cooling cylinder (1), characterized in that: The top end of the cooling cylinder (1) is fixedly connected with an upper ring seat (2), the surface of the upper ring seat (2) is movably connected with a sealing cover (3), the bottom end of the cooling cylinder (1) is fixedly connected with a lower ring seat (4), and the inside of the cooling cylinder (1) is provided with a conveying spiral roller (5). Cooling side pipes (6) are fixedly connected to the four sides of the cooling cylinder (1), the top end of the cooling side pipe (6) is fixedly connected with an upper shunt cover (7), and the bottom end of the cooling side pipe (6) is fixedly connected with a lower shunt cover (8).

2. The rapid cooling device for a quartz member for manufacturing a semiconductor material according to claim 1, characterized by: The inside of the upper shunt cover (7) and the lower shunt cover (8) is provided with a shunt seat (9) at the four corners, and one end of the shunt seat (9) is provided with a flow-through mesh groove (10).

3. The rapid cooling device for a quartz member for manufacturing a semiconductor material according to claim 1, characterized by: The outer surface of the upper shunt cover (7) is sleeved with a shunt ring seat (11), and the side surface of the shunt ring seat (11) is fixedly connected with a liquid inlet valve (12).

4. The rapid cooling device for a quartz member for manufacturing a semiconductor material according to claim 1, characterized by: The outer surface of the lower shunt cover (8) is sleeved with a confluence ring seat (13), and the side surface of the confluence ring seat (13) is fixedly connected with a liquid outlet valve (14).

5. The rapid cooling device for a quartz member for manufacturing a semiconductor material according to claim 1, characterized by: The bottom end of the lower shunt cover (8) is fixedly connected with a supporting base (15), and the inside of the cooling cylinder (1) is provided with a cooling groove (16).

6. The rapid cooling device for a quartz member for manufacturing a semiconductor material according to claim 1, characterized by: The side surface of the upper ring seat (2) is provided with a feeding grid (17) on the four sides, and the side surface of the lower ring seat (4) is provided with a discharging grid (18) on the four sides.

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