Carrier for heat treatment

Abstract

The utility model provides a carrier for heat treatment, and relates to the field of carriers for heat treatment, the carrier for heat treatment comprises a base, the center of the base is fixedly connected with a limiting plate, the limiting plate is inserted into through holes formed in a plurality of first placing plates and a plurality of second placing plates, and the first placing plates and the second placing plates are arranged at intervals; a plurality of baffles distributed at equal intervals are fixedly connected to the periphery of the base, the periphery of the first containing plate and the periphery of the second containing plate, the gap between the two baffles is matched with the size of the baffles, inserting holes are further formed in the through holes in the first containing plate, and when the limiting plates are inserted into the inserting holes in a penetrating mode, the baffles are inserted into the inserting holes. The multiple baffles on the first placing plate can be inserted into the gaps of the multiple baffles on the base or the multiple baffles on the second placing plate, the multiple inserting holes in the first placing plate are aligned with the limiting plates to be inserted, at the moment, the multiple baffles on the first placing plate are inserted into the gaps of the multiple baffles on the periphery of the base in a penetrating mode, and storage of the device is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the carrier field of heat treatment especially relates to a carrier for heat treatment. BACKGROUND

[0002] Heat treatment is a metal processing technique that involves heating, holding, and cooling metal materials at different temperatures to change their physical and mechanical properties. This process does not change the shape or overall chemical composition of the workpiece, but rather achieves the goal by altering the microstructure. Heat treatment is widely used in the processing of steel and other alloys, with the purpose of improving properties such as hardness, strength, toughness, and wear resistance.

[0003] Here are several common heat treatment methods:

[0004] Annealing: By heating the metal to a certain temperature, holding it for a sufficient time, and then slowly cooling it (usually in a furnace), the structure of the material approaches equilibrium. This method is mainly used to improve the machinability of the material, eliminate internal stress, and prepare for subsequent heat treatment.

[0005] Normalizing: Similar to annealing, but with a faster cooling speed, usually by taking the metal out of the high-temperature zone and cooling it directly in the air. Normalizing can achieve higher strength and hardness than annealing, and the production cycle is shorter.

[0006] Quenching: Heating the metal to the austenitizing temperature and then rapidly cooling it (usually using water, oil, or salt bath) to form martensite structure, thereby greatly increasing the hardness and strength. However, the material after quenching becomes more brittle, so it usually needs to be tempered.

[0007] Tempering: Reheating the material that has been quenched to a temperature below the critical point, and then cooling it at an appropriate speed. The purpose of tempering is to reduce the internal stress and brittleness generated during quenching, and to adjust the hardness, strength, and toughness of the material.

[0008] Surface hardening: Including carburizing, nitriding, etc., aiming to produce a hardened layer only on the surface of the part, while the inside remains relatively soft, to achieve better wear resistance and fatigue resistance.

[0009] When heat treating workpieces, heat treatment carriers are needed, which are mainly used to hold heat-treated workpieces. The existing heat treatment carriers are generally multi-layer racks, each layer of which is placed with heat-treated workpieces. Since the existing multi-layer heat treatment racks are generally integrated, they have the problem of inconvenient storage and transportation.

[0010] Therefore, it is necessary to provide a new carrier for heat treatment to solve the above technical problems. UTILITY MODEL CONTENT

[0011] To solve the above-mentioned technical problems, this utility model provides a carrier for heat treatment.

[0012] The heat treatment carrier provided by this utility model includes a base, a limiting plate fixedly connected to the center of the base, the limiting plate being inserted into through holes in multiple first placement plates and multiple second placement plates, the multiple first placement plates and multiple second placement plates being spaced apart, multiple equally spaced baffles being fixedly connected around the periphery of the base, the first placement plates and the second placement plates, the gap between two baffles being adapted to the size of the baffles, and insertion holes being provided at the through holes in the first placement plates, when the limiting plate is inserted into the insertion holes, the multiple baffles on the first placement plates can be inserted into the gaps between the multiple baffles on the base or the second placement plates.

[0013] Preferably, two limiting grooves are provided on the two opposite side walls of the limiting plate, and the limiting plate is provided with limiting members for use in conjunction with the limiting grooves.

[0014] Preferably, the limiting member includes a sleeve and an insert plate. The sleeve has a U-shaped structure, and slots are provided on the two opposite inner walls of the sleeve. The two ends of the insert plate are movably inserted into the two slots.

[0015] Preferably, the insert plate has a retrieval hole.

[0016] Preferably, the limiting plate has placement grooves on its two opposite side walls, the placement grooves having a stepped structure, and the limiting plate is also provided with multiple placement plates, each of which has a central hole for the limiting plate to pass through.

[0017] Preferably, each of the two inner walls opposite to the central hole is provided with a placement hole, and each of the two placement holes is provided with a mounting plate, which is fixedly connected to the inner wall of the two placement holes respectively.

[0018] Preferably, the length of the mounting plate on the plurality of shelves gradually decreases from top to bottom, and the plurality of shelves are placed at the plurality of steps of the placement slot by the mounting plate thereon.

[0019] Preferably, when the plurality of the placement plates are respectively mounted on the plurality of steps of the placement slot, the plurality of the placement plates are respectively located within the plurality of baffles surrounding the base, the plurality of first placement plates and the plurality of second placement plates.

[0020] Compared with related technologies, the heat treatment carrier provided by this utility model has the following beneficial effects:

[0021] When storing the device, align the multiple holes on the first placement plate with the limiting plate and insert them. At this time, the multiple baffles around the outer perimeter of the first placement plate are staggered with the multiple baffles around the outer perimeter of the base. The multiple baffles on the first placement plate are inserted into the gaps between the multiple baffles around the outer perimeter of the base. Then, insert the second placement plate into the limiting plate. Next, insert the multiple baffles around the outer perimeter of the first placement plate into the gaps between the baffles around the outer perimeter of the second placement plate. After stacking in this way, insert the center holes of the multiple placement plates into the limiting plate, thus completing the stacking work for storing the device. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the heat treatment carrier provided by this utility model;

[0023] Figure 2 for Figure 1 The diagram shows the structure of the base and baffle.

[0024] Figure 3 for Figure 1 The diagram shows the structure of the first placement plate, baffle, and socket.

[0025] Figure 4 for Figure 1 The diagram shows the structure of the limiting plate.

[0026] Figure 5 for Figure 1 The diagram shown is a structural illustration of the structure when it is stored.

[0027] Figure 6 for Figure 5 The diagram shows the structure at point A.

[0028] Figure 7 for Figure 1 The diagram shows the structure of the shelf.

[0029] The following are the labels in the diagram: 1. Base; 2. Limiting plate; 3. First placement plate; 4. Second placement plate; 5. Baffle; 6. Insertion hole; 7. Limiting groove; 8. Sleeve; 9. Insert plate; 10. Retrieval hole; 11. Placement groove; 12. Storage plate; 13. Center hole; 14. Storage hole; 15. Mounting plate. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] Please refer to the following: Figures 1-7 ,in, Figure 1 This is a schematic diagram of the structure of the heat treatment carrier provided by this utility model; Figure 2 for Figure 1The diagram shows the structure of the base and baffle. Figure 3 for Figure 1 The diagram shows the structure of the first placement plate, baffle, and socket. Figure 4 for Figure 1 The diagram shows the structure of the limiting plate. Figure 5 for Figure 1 The diagram shown is a structural illustration of the structure when it is stored. Figure 6 for Figure 5 The diagram shows the structure at point A. Figure 7 for Figure 1 The diagram shows the structure of the shelf.

[0032] In the specific implementation process, such as Figures 1-7 As shown, the device includes a base 1, with a limiting plate 2 fixedly connected to the center of the base 1. The limiting plate 2 is inserted into through holes opened in multiple first placement plates 3 and multiple second placement plates 4. The multiple first placement plates 3 and multiple second placement plates 4 are spaced apart. Multiple equally spaced baffles 5 are fixedly connected around the periphery of the base 1, the first placement plates 3 and the second placement plates 4. The gap between two baffles 5 is adapted to the size of the baffles 5. Insertion holes 6 are also opened in the through holes on the first placement plates 3. When the limiting plate 2 is inserted into the insertion hole 6, the multiple baffles 5 on the first placement plates 3 can be inserted into the gaps between the multiple baffles 5 on the base 1 or the second placement plates 4. Since the multiple baffles 5 on the first placement plates 3 can be inserted into the gaps between the multiple baffles 5 on the base 1 or the second placement plates 4, it is convenient for the device to be stacked during storage.

[0033] Two limiting grooves 7 are provided on the two opposite side walls of the limiting plate 2. The limiting plate 2 is provided with limiting components for use with the limiting grooves 7. The limiting components include a sleeve 8 and an insert plate 9. The sleeve 8 has a U-shaped structure. Slots are provided on the two opposite inner walls of the sleeve 8. The two ends of the insert plate 9 are movably inserted into the two slots. The insert plate 9 has a removal hole 10. The sleeve 8 is put on the limiting plate 2 so that the opposite sides of the sleeve 8 are respectively located in the two limiting grooves 7. Then, the two ends of the insert plate 9 are moved into the two slots. At this time, the bottom of the sleeve 8 abuts against the second placement plate 4, thereby completing the stacking work when the device is used. The limiting components improve the stability of the device in use.

[0034] The limiting plate 2 has a placement groove 11 on each of its two opposite side walls. The placement groove 11 has a stepped structure. The limiting plate 2 is also provided with a plurality of placement plates 12. Each of the multiple placement plates 12 has a central hole 13 for the limiting plate 2 to pass through. Each of the two inner walls opposite to the central hole 13 has a placement hole 14. Each of the two placement holes 14 has a mounting plate 15 on its inner side. The two mounting plates 15 are fixedly connected to the inner walls of the two placement holes 14 respectively. The length of the mounting plates 15 on the multiple placement plates 12 gradually decreases from top to bottom. The multiple placement plates 12 are placed on the multiple steps of the placement groove 11 through the mounting plates 15 on them. When the multiple placement plates 12 are respectively mounted on the multiple steps of the placement groove 11, the multiple placement plates 12 are respectively located in the multiple baffles 5 around the periphery of the base 1, the multiple first placement plates 3 and the multiple second placement plates 4.

[0035] The working principle of this utility model is as follows: The workpiece is placed on the base 1. The placement hole 14 on the placement plate 12 is fitted onto the limiting plate 2. The mounting plate 15 on the placement plate 12 moves within the placement groove 11. Finally, the mounting plate 15 on the placement plate 12 rests on the steps of the placement groove 11. The placement plate 12 is located within multiple baffles 5 around the perimeter of the base 1. The workpiece is placed on the placement plate 12. Next, the first placement plate 3 is inserted through the limiting plate 2, aligning the multiple baffles 5 on the first placement plate 3 with the multiple baffles 5 on the base 1. Then, another mounting plate 15 is inserted through the limiting plate 2, resting on the steps of the placement groove 11. This process is repeated to stack the remaining second placement plate 4, first placement plate 3, and multiple mounting plates 15, facilitating the placement of the heat-treated workpiece. Finally, the sleeve 8 is fitted onto the limiting plate 2, aligning the opposite sides of the sleeve 8. Located in the two limiting slots 7 respectively, the two ends of the insert plate 9 are then moved into the two slots. At this time, the bottom of the sleeve 8 abuts against the second placement plate 4, thus completing the stacking work when using the device. When storing the device, the multiple insertion holes 6 on the first placement plate 3 are aligned with the limiting plate 2 and inserted. At this time, the multiple baffles 5 around the periphery of the first placement plate 3 are staggered with the multiple baffles 5 around the periphery of the base 1. At this time, the multiple baffles 5 on the first placement plate 3 are inserted into the gaps between the multiple baffles 5 around the periphery of the base 1. Then, the second placement plate 4 is inserted into the limiting plate 2. Then, the multiple baffles 5 around the periphery of the first placement plate 3 are inserted into the gaps between the baffles 5 around the periphery of the second placement plate 4. After stacking in this way, the center holes 13 of the multiple placement plates 12 are inserted into the limiting plate 2, thus completing the stacking work when storing the device.

[0036] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0037] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A carrier for heat treatment, characterized in that, The utility model provides a kind of multi-layered shelf, including base (1), the base (1) center is fixedly connected with limiting plate (2), limiting plate (2) is inserted in the through hole of multiple first placement plate (3) and multiple second placement plate (4) opening, multiple first placement plate (3) and multiple second placement plate (4) are arranged at intervals, the periphery of base (1), first placement plate (3) and second placement plate (4) is fixedly connected with multiple equidistant distribution baffle (5), the gap of two baffle (5) is adapted to the size of baffle (5), the through hole on first placement plate (3) is also provided with jack (6), when limiting plate (2) is inserted in jack (6), multiple baffle (5) on first placement plate (3) can be inserted in the gap of multiple baffle (5) on base (1) or second placement plate (4).

2. Carrier for heat treatment according to claim 1, characterized in that Two limiting grooves (7) are opened on the opposite two side walls of the limiting plate (2), and a limiting member is arranged on the limiting plate (2) for cooperation with the limiting grooves (7).

3. Carrier for heat treatment according to claim 2, characterized in that The limiting member includes a sleeve frame (8) and a plug plate (9), the sleeve frame (8) is in a U-shaped structure, and plug slots are opened on the opposite two inner walls of the sleeve frame (8), and the plug plate (9) is movably inserted into the two plug slots.

4. Carrier for heat treatment according to claim 3, characterized in that A taking hole (10) is opened on the plug plate (9).

5. Carrier for heat treatment according to claim 4, characterized in that A placement groove (11) is opened on the opposite two side walls of the limiting plate (2), and the placement groove (11) is in a stepped structure, a plurality of object plates (12) are further arranged on the limiting plate (2), and a central hole (13) for inserting the limiting plate (2) is opened on each of the plurality of object plates (12).

6. Carrier for heat treatment according to claim 5, characterized in that An object hole (14) is opened on the opposite two inner walls of the central hole (13), and a carrying plate (15) is arranged inside each of the two object holes (14), and the two carrying plates (15) are fixedly connected with the inner walls of the two object holes (14), respectively.

7. Carrier for heat treatment according to claim 6, characterized in that The lengths of the carrying plates (15) on the plurality of object plates (12) gradually decrease in sequence from top to bottom, and the plurality of object plates (12) are placed at the plurality of steps of the placement groove (11) through the carrying plates (15) thereon.

8. Carrier for heat treatment according to claim 7, characterized in that When the plurality of object plates (12) are carried at the plurality of steps of the placement groove (11), respectively, the plurality of object plates (12) are located in the plurality of baffle (5) around the base (1), the plurality of first placement plate (3) and the plurality of second placement plate (4), respectively.

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