Magnet device for magnetron sputtering coating

Abstract

The utility model discloses a magnet device for magnetron sputtering coating, which belongs to the technical field of magnetron sputtering coating, and comprises a back plate, a magnetic bar base and magnetic bars, the magnetic bar base is connected onto the back plate through a plurality of adjusting bolts, the magnetic bar base is provided with three horizontal clamping grooves for correspondingly placing the magnetic bars, the magnetic bars comprise square tubes, and the square tubes are arranged in the clamping grooves. The magnets are arranged in the square tubes, and the magnetic poles of the magnets arranged in the adjacent square tubes face opposite directions. A fixing position is provided through the effect of the back plate, the generated peripheral magnetic field intensity is changed by adjusting the distance between the magnetic rod base and the back plate, the collision ionization effect is changed, the thickness of the film layer is adjusted accordingly, and the production application range is wide; the magnet device adopts the stainless steel square tube to package the magnet, effectively prevents the magnet assembly from being damped and corroded, ensures the position stability of the magnet, avoids the influence of position change on the magnetic field effect, and improves the stability and reliability of the device; and the magnet is convenient to disassemble and assemble and can be reused, so that the production cost is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of magnetron sputtering coating technology, specifically relating to a magnet device for magnetron sputtering coating. Background Technology

[0002] In the magnetron sputtering coating process, the magnet device serves to create a magnetic field, extending the path of electrons generated by the ionization of the process gas and enhancing the collisional ionization effect. Existing magnet devices use magnets directly attached to a backplate and secured with screws, which has the following drawbacks:

[0003] 1. The distance between the magnet and the back plate is fixed and cannot be adjusted, the strength of the external magnetic field cannot be adjusted, the thickness of the coating layer cannot be adjusted, and it cannot meet more production needs.

[0004] 2. The magnet device is not waterproof, the magnet components are easily corroded, the magnetic field is unstable, and the overall magnetic field effect is affected;

[0005] 3. Difficult to disassemble and assemble, and the magnets are hard to reuse. Summary of the Invention

[0006] To address the aforementioned problems, this utility model discloses a magnet device for magnetron sputtering coating. The back plate provides a fixed position, and the distance between the magnet rod base and the back plate is adjusted to change the strength of the generated external magnetic field, altering the collision ionization effect and thus adjusting the film thickness. This device has a wide range of applications. The magnet device uses stainless steel square tubing to encapsulate the magnets, effectively preventing moisture corrosion and ensuring stable magnet positioning. This avoids changes in position affecting the magnetic field effect, improving the stability and reliability of the device. Furthermore, the magnets are easy to assemble and disassemble, and can be reused, reducing production costs and improving work efficiency.

[0007] To achieve the above objectives, the specific technical solution of this application is as follows:

[0008] A magnet device for magnetron sputtering coating includes a back plate, a magnet rod base, and a magnet rod. The magnet rod base is connected to the back plate by several adjusting bolts. The magnet rod base has three horizontal slots for corresponding placement of the magnet rod. The magnet rod includes a square tube, an internal magnet, and fixing plugs at both ends of the square tube. The magnetic poles of the internal magnets in adjacent square tubes face opposite directions.

[0009] Based on the above technical features, furthermore, the back plate is provided with several threaded holes, the magnetic rod base is provided with several corresponding connection holes, and the adjusting bolt passes through the washer, the back plate, and the nut in sequence, and is then screwed into the connection hole on the magnetic rod base to achieve a fixed connection between the magnetic rod base and the bolt.

[0010] Based on the above technical features, furthermore, the same square tube is provided with multiple magnets that are evenly arranged perpendicular to the magnetic rod base and have the same magnetic pole orientation, that is, the N pole of the magnet in the middle magnetic rod faces outward and the S poles on both sides face outward, or the S pole of the magnet in the middle magnetic rod faces outward and the N poles on both sides face outward.

[0011] Based on the above technical features, furthermore, the size of the middle of the card slot is larger than the size of the two sides, and the magnetic rod in the middle is larger than the magnetic rods on both sides.

[0012] Based on the above technical features, furthermore, the length of the fixing plug should exceed 1 / 2 of the distance from the top of the inner magnet to the opening of the square tube after the magnet is inserted into the square tube.

[0013] Based on the above technical features, preferably, the square tube is made of stainless steel.

[0014] Compared with the prior art, the beneficial effects of this application are as follows:

[0015] The purpose of this application is to provide a fixed position through the back plate. By adjusting the distance between the magnetic rod base and the back plate, the strength of the generated external magnetic field can be changed, thereby altering the collision ionization effect and adjusting the film thickness. This makes it suitable for a wide range of production applications.

[0016] The magnet device uses stainless steel square tubes to encapsulate the magnets, effectively preventing the magnet components from getting damp and corroded, extending their service life, ensuring the magnets are in a stable position, avoiding the magnetic field effect from being affected by positional changes, and improving the stability and reliability of the device; in addition, the magnets are easy to assemble and disassemble, and can be reused, reducing production costs and improving work efficiency.

[0017] By rationally designing the arrangement and orientation of the magnets, a more uniform and stable magnetic field is formed, which increases the electron movement path and collision ionization effect, thereby improving the efficiency and quality of magnetron sputtering coating.

[0018] Stainless steel square tubes have good mechanical strength and corrosion resistance, and can adapt to the harsh environment in the magnetron sputtering coating process, ensuring long-term stable operation of the equipment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a magnet device for magnetron sputtering coating according to the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of a magnetic rod base according to the present invention;

[0021] List of identifiers in attached diagrams:

[0022] 1. Back plate; 2. Magnetic rod base; 3. Slot; 4. Magnetic rod; 5. Square tube; 6. Magnet; 7. Adjusting bolt; 8. Washer; 9. Nut; 10. Fixing plug. Detailed Implementation

[0023] The present invention will be further illustrated below with reference to the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are for illustrative purposes only and are not intended to limit the scope of the invention.

[0024] It should be noted that the terms "upper," "lower," "left," "right," "front," and "rear" used in the following description refer to the directions shown in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively. Furthermore, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] like Figure 1 and Figure 2 As shown, a magnet device for magnetron sputtering coating includes a back plate 1, a magnetic rod base 2, and a magnetic rod 4. The magnetic rod base 2 is connected to the back plate 1 by several adjusting bolts 7. By adjusting the distance between the magnetic rod base and the back plate, the strength of the generated peripheral magnetic field is changed, thereby altering the collision ionization effect and adjusting the film thickness. This device has a wide range of applications in production.

[0026] The magnetic rod base 2 has three horizontal slots 3 for placing magnetic rods 4 to provide a stable magnetic field. Preferably, the middle slot 3 is larger than the two side slots, and the middle magnetic rod 4 is larger than the two side magnetic rods 4.

[0027] The magnetic rod 4 includes a square tube 5, an internal magnet 6, and fixing plugs 8 at both ends of the square tube 6. The magnetic poles of the internal magnets 6 in adjacent square tubes 5 face opposite directions. The back plate 1 has several threaded holes, and the magnetic rod base 2 has several corresponding connecting holes. Adjusting bolts 7 pass through washers 8, the back plate 1, and nuts 9 in sequence, and are then screwed into the connecting holes on the magnetic rod base 2 to achieve a fixed connection between the magnetic rod base 2 and the bolts. Rotating the bolts can adjust the distance between the base and the back plate, changing the intensity of the generated external magnetic field and altering the collision ionization effect, thereby adjusting the film thickness. This design has a wide range of applications in production.

[0028] Multiple magnets 7 are arranged uniformly perpendicular to the magnetic rod base 2 within the same square tube 6, with their magnetic poles facing the same direction. Specifically, the N pole of the magnet in the middle magnetic rod faces outwards, and the S poles on both sides face outwards, or the S pole of the magnet in the middle magnetic rod faces outwards, and the N poles on both sides face outwards. This arrangement of magnets and their magnetic pole orientation creates a more uniform and stable magnetic field, increasing the electron travel distance and collision ionization effect, thereby improving the efficiency and quality of magnetron sputtering coating.

[0029] The length of the fixed plug 10 should exceed half the distance from the top of the internal magnet to the opening of the square tube after the magnets are inserted. The movable plug 10 prevents the magnets inside the square tube from being ejected due to repulsion and reduces the distance between the magnets, making the magnets inside the square tube more tightly arranged and more stable.

[0030] Preferably, the square tube 6 is made of stainless steel, which has good corrosion resistance and extends service life.

[0031] During installation, the magnetic rod base 2 is first fixed to the back plate 1 using adjusting bolts 4; magnets are placed into the square tube according to the rules, and the prepared magnetic rods 3 are sequentially placed into the slots 5 of the magnetic rod base 2, ensuring that the magnetic poles of adjacent magnetic rods face opposite directions. During use, this magnet device extends the path of electrons generated by the ionization of process gas through the magnetic field produced by the magnets, deepening the collisional ionization effect, thereby improving the quality and efficiency of magnetron sputtering coating.

[0032] Working principle:

[0033] In the magnetron sputtering coating process, this magnet device uses the magnetic field generated by the magnets to constrain and guide electrons produced by the ionization of the process gas. Specifically, under the influence of the magnetic field, the electrons' movement path is lengthened, increasing the chance of collision and ionization with gas molecules, thereby generating more ions and electrons. These high-energy ions, under the influence of the electric field, accelerate and bombard the target surface, causing target atoms to be sputtered and deposited on the substrate to form a thin film. The arrangement of the magnets and the orientation of the magnetic poles in this device create a more uniform and stable magnetic field, ensuring optimal electron movement paths within the magnetic field, improving the collision ionization effect, and thus enhancing the efficiency and quality of magnetron sputtering coating. Simultaneously, the stainless steel square tube encapsulation of the magnets effectively prevents moisture corrosion, ensuring long-term stable operation of the device and reducing maintenance costs.

[0034] It should be noted that the accompanying drawings merely illustrate the technical concept of the present invention and should not be used to limit the scope of protection of the present invention. For those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and all such improvements and modifications fall within the scope of protection of the claims of the present invention.

Claims

1. A magnet arrangement for magnetron sputter coating, characterized in that: The utility model relates to a magnetic rod fixing device, which comprises a back plate, a magnetic rod base and a magnetic rod, the magnetic rod base is connected to the back plate through several adjusting bolts, the magnetic rod base is provided with three horizontal clamping grooves for placing the magnetic rod, the magnetic rod comprises a square tube, built-in magnets and fixed plugs at both ends of the square tube, and the magnetic poles of the built-in magnets of adjacent square tubes face opposite directions.

2. The magnet device for magnetron sputtering coating according to claim 1, characterized in that: The back plate is provided with several threaded holes, the magnetic rod base is provided with several corresponding connecting holes, the adjusting bolts pass through gaskets, the back plate and nuts in sequence, and are screwed into the connecting holes of the magnetic rod base to realize fixed connection of the magnetic rod base and the bolts.

3. The magnet device for magnetron sputtering coating according to claim 1, characterized in that: The same square tube is provided with multiple magnets which are arranged perpendicularly to the magnetic rod base and have the same magnetic pole direction, that is, the N poles of the magnets of the middle magnetic rod face outward, the S poles of the magnets of the two sides face outward, or the S poles of the magnets of the middle magnetic rod face outward, and the N poles of the magnets of the two sides face outward.

4. The magnet device for magnetron sputtering coating according to claim 1, characterized in that: The size of the clamping groove in the middle is larger than that of the two sides, and the magnetic rod in the middle is larger than the magnetic rods on the two sides.

5. The magnet device for magnetron sputtering coating according to claim 1, characterized in that: The length of the fixed plug should exceed 1 / 2 of the length from the top end of the internal magnet to the mouth of the square tube after the square tube is plugged with the magnet.

6. The magnet device for magnetron sputtering coating according to claim 1, characterized in that: The square tube is made of stainless steel.

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