Composite seed crystal bonding device

Abstract

The utility model relates to a composite seed crystal bonding device, which comprises a base, a first seed crystal bonding mechanism, a second seed crystal bonding mechanism and a transposition assembly, the first seed crystal bonding mechanism comprises a first carrying table and a first pressure head assembly, and the first pressure head assembly comprises a first pressure applying driving piece and a rigid pressure head; the second seed crystal bonding mechanism comprises a second carrying table and a second pressure head assembly; the second pressure head assembly comprises a second pressure applying driving piece and a flexible pressure head; the transposition assembly is connected to the first pressing head assembly and the second pressing head assembly and used for exchanging the positions of the first pressing head assembly and the second pressing head assembly. According to the utility model, the rigid pressure head and the flexible pressure head are simultaneously arranged on the base, and the position of the rigid pressure head and the position of the flexible pressure head are intermodulated through the transposition assembly, so that flexible preliminary pressing and final rigid pressing of the seed crystal seat assembly can be continuously carried out under the condition that the seed crystal seat assembly is not moved, the working efficiency is higher, and the production cost is reduced. And secondary installation of the seed crystal seat assembly is not needed.

Description

Technical Field

[0001] This utility model relates to the field of artificial crystal growth technology, specifically to a composite seed crystal bonding device. Background Technology

[0002] In the silicon carbide single crystal growth process, the bonding quality between the silicon carbide seed and the seed holder directly affects the growth quality of the silicon carbide single crystal. To ensure the bonding quality between the silicon carbide seed and the seed holder, a two-step bonding method is usually adopted: first, low-temperature venting and pressing, and then high-temperature pressing. Low-temperature venting and pressing involves using a flexible airbag indenter to initially press the seed crystal. Specifically, under low-temperature conditions, pressure is applied to the seed crystal through the flexible airbag indenter to expel air from the bonding layer, ensuring the uniformity and density of the bonding layer. High-temperature pressing bonding involves removing the initially bonded seed crystal and placing it under a rigid indenter, applying pressure at high temperatures (generally 300℃~600℃) to complete the final bonding.

[0003] The above method requires manually removing the pre-pressed seed crystal and placing it in another rigid pressing head for high-temperature pressing. This necessitates repositioning and reinstallation, which is not only time-consuming but also prone to installation position deviations, affecting bonding quality. Furthermore, it suffers from long production times and low work efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a composite seed crystal bonding device with high working efficiency and good bonding quality.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] This utility model provides a composite seed crystal bonding device, comprising:

[0007] Base;

[0008] The first seed crystal bonding mechanism is mounted on a base and includes a first platform that can be heated and used to support the seed crystal seat assembly and a first pressure head assembly that is movably disposed above the first platform. The first pressure head assembly includes a first pressure driving member and a rigid pressure head connected to the first pressure driving member. Controlled by the first pressure driving member, the rigid pressure head can move in the vertical direction to press the seed crystal seat assembly located below it.

[0009] A second seed crystal bonding mechanism, mounted on a base, includes a heatable second platform for supporting a seed crystal assembly and a second pressure head assembly movably disposed above the second platform. The second pressure head assembly includes a second pressure-applying drive member and a flexible pressure head connected to the second pressure-applying drive member. Controlled by the second pressure-applying drive member, the flexible pressure head is capable of vertical movement to press the seed crystal assembly located below it.

[0010] A switching component is connected to the first pressure head assembly and the second pressure head assembly, and is used to swap the positions of the first pressure head assembly and the second pressure head assembly.

[0011] This invention simultaneously sets a first seed crystal bonding mechanism with a rigid pressure head and a second seed crystal bonding mechanism with a flexible pressure head on the base, and uses a displacement component to interchange the positions of the rigid and flexible pressure heads. This enables the uninterrupted and continuous preliminary flexible pressing and final rigid pressing of the seed crystal base assembly without moving the seed crystal base assembly, resulting in higher work efficiency and eliminating the need for secondary installation of the seed crystal base assembly.

[0012] Preferably, the switching assembly includes a connecting arm and a switching drive connected to the connecting arm. The first pressure head assembly and the second pressure head assembly are connected to the connecting arm, and the switching drive is configured to enable the connecting arm to move vertically and rotate about vertically. The connecting arm moves the pressure head assemblies (first and second pressure head assemblies) upwards, raising them from the working position to the switching position. Further rotation of the connecting arm swaps the positions of the first and second pressure head assemblies. Then, the connecting arm moves downwards, lowering the pressure head assemblies from the switching position back to the working position, which is very convenient.

[0013] In some embodiments, the displacement drive is a telescopic rotary motor.

[0014] Preferably, the connecting arm includes a first arm connected to the first pressure head assembly and a second arm connected to the second pressure head assembly, wherein the distance from the connection point of the first arm to the first pressure head assembly to the rotation axis of the connecting arm is equal to the distance from the connection point of the second arm to the second pressure head assembly to the rotation axis of the connecting arm.

[0015] More preferably, the first arm and the second arm each have one or more components that correspond one-to-one with the first pressure head assembly and the second pressure head assembly.

[0016] Preferably, the first seed crystal bonding mechanism has one or more sets, and the number of the second seed crystal bonding mechanism is the same as that of the first seed crystal bonding mechanism.

[0017] In some embodiments, the first seed crystal bonding mechanism and the second seed crystal bonding mechanism are both a set and arranged side by side.

[0018] In some embodiments, the first seed crystal bonding mechanism and the second seed crystal bonding mechanism are each provided in multiple sets, and the multiple sets of the first seed crystal bonding mechanism and the second seed crystal bonding mechanism are arranged alternately around the rotation axis of the transposition component.

[0019] Preferably, the first seed crystal bonding mechanism further includes a first barrier member surrounding the periphery of the first stage and a first connecting seat connected to the first pressure head assembly. The first connecting seat can cover the first barrier member and form a sealed cavity with the first barrier member.

[0020] Preferably, the second seed crystal bonding mechanism further includes a second barrier member surrounding the periphery of the second stage and a second connecting seat connected to the second pressure head assembly. The second connecting seat can cover the second barrier member and form a sealed cavity with the second barrier member.

[0021] More preferably, the first barrier and the second barrier have the same shape and are equal in size.

[0022] In some embodiments, the first barrier and the second barrier are cylindrical, such as cylindrical or square.

[0023] Preferably, the flexible pressure head includes a pressure head body and a flexible member disposed at the bottom of the pressure head body and protruding downward.

[0024] Preferably, the seed crystal assembly includes a seed crystal base, a seed crystal wafer, and an adhesive located between the two, wherein the seed crystal wafer is a silicon carbide seed crystal wafer.

[0025] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0026] The composite seed crystal bonding device of this utility model includes a first seed crystal bonding mechanism, a second seed crystal bonding mechanism, and a repositioning component. The first seed crystal bonding mechanism has a rigid pressure head, and the second seed crystal bonding mechanism has a flexible pressure head. The rigid pressure head and the flexible pressure head can be swapped under the action of the repositioning component, so that the flexible pressing and rigid pressing processes of the seed crystal seat assembly can be carried out continuously without moving the seed crystal seat assembly. This results in higher work efficiency, eliminates the need for secondary installation of the seed crystal seat assembly, and makes the process more convenient. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the composite seed crystal bonding device in Example 1 before the position is switched;

[0028] Figure 2 This is a schematic diagram of the composite seed crystal bonding device in Example 1 during the position switching process;

[0029] Figure 3 This is a schematic diagram of the composite seed crystal bonding device after switching positions in Example 1;

[0030] Among them, 1. base;

[0031] 2. First seed crystal bonding mechanism; 21. First stage; 22. First pressure head assembly; 221. Rigid pressure head; 222. First pressure driving component; 23. First connecting seat; 24. First barrier component;

[0032] 3. Second seed crystal bonding mechanism; 31. Second stage; 32. Second pressure head assembly; 321. Pressure head body; 322. Flexible component; 323. Second pressure driving component; 33. Second connecting seat; 34. Second barrier component;

[0033] 4. Transposition assembly; 41. First arm; 42. Second arm; 43. Transposition drive unit;

[0034] 5. Seed crystal base assembly. Detailed Implementation

[0035] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0036] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0037] In the description of the embodiments of this utility model, it should be understood that the terms "upper" and "lower," etc., indicate the orientation or positional relationship as described above. Figure 1 The orientations shown are defined as follows: the orientation of the pressure-applying drive component is "upper" and the orientation of the base 1 is "lower". This is only for the purpose of describing the embodiments of this utility model and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] In this embodiment of the invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0041] Example 1

[0042] A composite seed crystal bonding device, such as Figures 1 to 3 As shown, it includes a base 1, a first seed crystal bonding mechanism 2, a second seed crystal bonding mechanism 3, and a transposition component 4.

[0043] The first seed crystal bonding mechanism 2 is mounted on the base 1 and includes a first stage 21 and a first pressure head assembly 22. The first stage 21 is used to support the seed crystal assembly 5 and is heatable. The seed crystal assembly 5 includes a seed crystal base, a seed wafer, and an adhesive between the two. The seed wafer can be a silicon carbide seed wafer, and the adhesive is based on existing technology and is not specifically limited. The first pressure head assembly 22 is movably disposed above the first stage 21 and includes a first pressure driving member 222 and a rigid pressure head 221 connected to the first pressure driving member 222. Controlled by the first pressure driving member 222, the rigid pressure head 221 can move in the vertical direction to press the seed crystal assembly 5 located below it. The first pressure driving member 222 and the rigid pressure head 221 are based on existing technology.

[0044] Preferably, the first seed crystal bonding mechanism 2 further includes a first barrier 24 surrounding the first stage 21 and a first connecting seat 23 connected to the first pressure head assembly 22 (specifically, it can be connected to the first pressure driving member 222). The first connecting seat 23 can cover the first barrier 24 and form a sealed cavity with the first barrier 24. The first barrier 24 is preferably cylindrical.

[0045] The second seed crystal bonding mechanism 3 is mounted on the base 1 and includes a second stage 31 and a second pressure head assembly 32. The second stage 31 supports the seed crystal assembly 5 and can also be heated. The second pressure head assembly 32 is movably disposed above the second stage 31 and includes a second pressure driving member 323 and a flexible pressure head connected to the second pressure driving member 323. Controlled by the second pressure driving member 323, the flexible pressure head can move in the vertical direction to press the seed crystal assembly 5 located below it. The flexible pressure head includes a pressure head body 321 and a flexible member 322 disposed at the bottom of the pressure head body 321 and protruding downward, as can be referred to in the prior art. The second pressure driving member 323 may be the same as or different from the first pressure driving member 222, and its specific structure can also be referred to in the prior art.

[0046] Preferably, the second seed crystal bonding mechanism 3 further includes a second barrier 34 surrounding the second stage 31 and a second connecting seat 33 connected to the second pressure head assembly 32 (specifically, it can be connected to the second pressure driving member 323). The second connecting seat 33 can cover the second barrier 34 and form a sealed cavity with the second barrier 34. The second barrier 34 has the same shape and size as the first barrier 24.

[0047] The number of the second seed crystal bonding mechanism 3 is equal to the number of the first seed crystal bonding mechanism 2.

[0048] The switching component 4 is connected to the first pressure head assembly 22 and the second pressure head assembly 32, and is used to swap the positions of the first pressure head assembly 22 and the second pressure head assembly 32.

[0049] Specifically, the shifting assembly 4 includes a connecting arm and a shifting drive 43 connected to the connecting arm. The first pressure head assembly 22 and the second pressure head assembly 32 are connected to the connecting arm. The shifting drive 43 is configured to enable the connecting arm to move in the vertical direction and rotate around the vertical direction, thereby realizing the shifting of the pressure head assembly by lifting and rotating. Preferably, the shifting drive 43 is a telescopic rotary motor.

[0050] More specifically, the connecting arm includes a first arm 41 connected to the first pressure head assembly 22 and a second arm 42 connected to the second pressure head assembly 32. The first arm 41 and the second arm 42 are respectively configured in a one-to-one correspondence with the first pressure head assembly 22 and the second pressure head assembly 32. That is, when there is only one first pressure head assembly 22 and one second pressure head assembly 32, there is also only one first arm 41 and one second arm 42; when there are multiple first pressure head assemblies 22 and multiple second pressure head assemblies 32, there are also multiple first arms 41 and multiple second arms 42, the same number as the number of first pressure head assemblies 22 and multiple second pressure head assemblies 32. In this embodiment, there is only one first arm 41 and one second arm 42, and the distance from the connection point of the first arm 41 to the first pressure head assembly 22 to the rotation axis of the connecting arm is equal to the distance from the connection point of the second arm 42 to the second pressure head assembly 32 to the rotation axis of the connecting arm. In some other embodiments, the first seed crystal bonding mechanism 2 and the second seed crystal bonding mechanism 3 are each in multiple sets. The multiple sets of the first seed crystal bonding mechanism 2 and the second seed crystal bonding mechanism 3 are arranged alternately around the rotation axis of the switching component 4, that is, arranged in a circle with the rotation axis as the center. The distance from the connection point of each first support arm 41 and the first pressure head assembly 22 to the rotation axis of the connecting arm is equal to the distance from the connection point of each second support arm 42 and the second pressure head assembly 32 to the rotation axis of the connecting arm.

[0051] Working principle:

[0052] The seed crystal assembly 5 is mounted on the first stage 21 and the second stage 31 respectively. The second pressure head assembly 32 is activated, and the flexible pressure head moves downward under the drive of the second pressure driving member 323 to flexibly press the seed crystal assembly 5 on the second stage 31. After pressing, the second pressure driving member 323 drives the flexible pressure head to move back to its original position. Then, the switching assembly 4 is activated, and the telescopic rod of the switching driving member 43 extends upward to simultaneously lift the first pressure head assembly 22 and the second pressure head assembly 32. The first pressure head assembly 22 and the second pressure head assembly 32 move from their working positions ( Figure 1 (As shown) Switch to the conversion position ( Figure 2 As shown), the telescopic rod of the shifting drive 43 rotates in a controlled manner, causing the positions of the first pressure head assembly 22 and the second pressure head assembly 32 to be interchanged. Then the telescopic rod retracts, and the first pressure head assembly 22 and the second pressure head assembly 32 move down to the working position. Figure 3 As shown in the diagram, the first pressure head assembly 22, originally located directly above the first stage 21, is switched to be directly above the second stage 31, and the second pressure head assembly 32, originally located directly above the second stage 31, is switched to be directly above the first stage 21. Finally, by activating the first pressure head assembly 22 and the second pressure head assembly 32 respectively, rigid pressing can be performed on the seed crystal seat assembly 5 on the second stage 31, and flexible pressing can be performed on the seed crystal seat assembly 5 on the first stage 21, without the need for secondary installation of the seed crystal seat assembly 5.

[0053] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A composite seed crystal bonding apparatus, characterized by comprising: a seed crystal bonding device; a seed crystal holding device; a seed crystal transfer device; and a seed crystal transfer mechanism. It comprises: a base (1); a first seed crystal bonding mechanism (2) mounted on the base (1), which comprises a first carrier (21) capable of being heated and used for carrying a seed crystal holder assembly (5) and a first pressure head assembly (22) movably arranged above the first carrier (21), the first pressure head assembly (22) comprising a first pressure applying driving member (222) and a rigid pressure head (221) connected to the first pressure applying driving member (222), controlled by the first pressure applying driving member (222), the rigid pressure head (221) being capable of moving in the up-down direction to press the seed crystal holder assembly (5) located below it; a second seed crystal bonding mechanism (3) mounted on the base (1), which comprises a second carrier (31) capable of being heated and used for carrying a seed crystal holder assembly (5) and a second pressure head assembly (32) movably arranged above the second carrier (31), the second pressure head assembly (32) comprising a second pressure applying driving member (323) and a flexible pressure head connected to the second pressure applying driving member (323), controlled by the second pressure applying driving member (323), the flexible pressure head being capable of moving in the up-down direction to press the seed crystal holder assembly (5) located below it; and a transposition assembly (4) connected to the first pressure head assembly (22) and the second pressure head assembly (32), used for transposing the positions of the first pressure head assembly (22) and the second pressure head assembly (32).

2. The composite seed bonding apparatus according to claim 1, wherein The transposition assembly (4) comprises a connecting arm and a transposition driving member (43) connected to the connecting arm, the first pressure head assembly (22) and the second pressure head assembly (32) being connected to the connecting arm, and the transposition driving member (43) being configured to enable the connecting arm to move in the up-down direction and rotate around the up-down direction.

3. The composite seed bonding apparatus according to claim 2, wherein The connecting arm comprises a first branch arm (41) connected to the first pressure head assembly (22) and a second branch arm (42) connected to the second pressure head assembly (32), and the distance from the connection point of the first branch arm (41) to the rotating axis center line of the connecting arm is equal to the distance from the connection point of the second branch arm (42) to the rotating axis center line of the connecting arm.

4. The composite seed bonding apparatus according to claim 3, wherein The first branch arm (41) and the second branch arm (42) each have one or more corresponding to the first pressure head assembly (22) and the second pressure head assembly (32).

5. The composite seed bonding apparatus of claim 1, wherein The first seed crystal bonding mechanism (2) has one or more groups, and the second seed crystal bonding mechanism (3) has the same number as the first seed crystal bonding mechanism (2).

6. The composite seed bonding apparatus according to claim 5, wherein The first seed crystal bonding mechanism (2) and the second seed crystal bonding mechanism (3) each have one group and are arranged side by side.

7. The composite seed crystal bonding apparatus according to claim 5, wherein The first seed crystal bonding mechanism (2) and the second seed crystal bonding mechanism (3) each have multiple groups, and the multiple groups of the first seed crystal bonding mechanism (2) and the second seed crystal bonding mechanism (3) are arranged alternately around the rotating axis center line of the transposition assembly (4).

8. The composite seed bonding apparatus of claim 1, wherein The first seed crystal bonding mechanism (2) further comprises a first barrier (24) surrounding the first carrier (21) and a first connecting seat (23) connected to the first pressure applying driving member (222), the first connecting seat (23) can be arranged on the first barrier (24) and forms a sealed cavity with the first barrier (24); and / or, The second seed crystal bonding mechanism (3) further comprises a second barrier (34) surrounding the second carrier (31) and a second connecting seat (33) connected to the second pressure applying driving member (323), the second connecting seat (33) can be arranged on the second barrier (34) and forms a sealed cavity with the second barrier (34).

9. The composite seed bonding apparatus of claim 1, wherein The flexible pressure head comprises a pressure head body (321) and a flexible member (322) arranged at the bottom of the pressure head body (321) and protruding downward.

10. The composite seed bonding apparatus of claim 1, wherein The seed crystal seat assembly (5) comprises a seed crystal seat, a seed crystal wafer and an adhesive located therebetween, the seed crystal wafer is a silicon carbide seed crystal wafer.

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