Mounting seat and test equipment assembly

Abstract

The utility model provides a mounting seat and a test equipment assembly, the mounting seat comprises a base, a magnetic attraction part and a buffer part, the base comprises a mounting surface, a magnetic attraction surface and a side connecting surface, the mounting surface and the magnetic attraction surface are arranged oppositely, the side connecting surface is connected with the mounting surface and the magnetic attraction surface, and the mounting surface is used for mounting test equipment; the magnetic attraction part is embedded in the base, and the magnetic attraction surface is magnetically attracted to a magnetically attracted object through the magnetic attraction part; one end of the buffer piece is connected with the side connecting face, the buffer piece extends in the direction away from the side connecting face so as to protrude out of the magnetic attraction face in the direction away from the mounting face, the projection of the buffer piece in the direction perpendicular to the magnetic attraction face does not coincide with the magnetic attraction face, and the projection of the buffer piece in the direction perpendicular to the side connecting face partially coincide with the side connecting face. According to the embodiment, the base is magnetically attracted to the magnetically attracted object through the magnetic attraction piece, one end of the buffer piece is connected to the side connecting face, the other end of the buffer piece obliquely protrudes out of the magnetic attraction face and the side connecting face, the buffer piece plays a role in buffering test equipment, and the risk that the test equipment is damaged is reduced.

Description

Technical Field

[0001] This application relates to the field of sensor mounting technology, and in particular to a mounting base and test equipment assembly. Background Technology

[0002] To determine whether a car's body structure meets the requirements, the body structure needs to be tested. When performing modal and dynamic stiffness tests on structural components such as the car body, an accelerometer is used for measurement. The accelerometer is mounted on a magnetic base, which is magnetically fixed to the test point to test the object being tested.

[0003] However, when the magnetic base is magnetically attached to the test point, it has a significant impact on the sensor, which can damage the accelerometer sensor with long-term use. Utility Model Content

[0004] The main objective of this application is to provide a mounting base and test equipment assembly, which aims to solve the aforementioned technical problems existing in the prior art.

[0005] To address the aforementioned problems, this application provides a mounting base comprising a base, a magnetic attractor, and a buffer. The base includes a mounting surface, a magnetic attractor surface, and a side connecting surface. The mounting surface and the magnetic attractor surface are arranged opposite to each other, and the side connecting surface connects to both the mounting surface and the magnetic attractor surface. The mounting surface is used to mount testing equipment. The magnetic attractor is embedded within the base, and the magnetic attractor surface magnetically attracts the magnetically attracted object through the magnetic attractor. One end of the buffer is connected to the side connecting surface, and the buffer extends in a direction away from the side connecting surface to protrude from the magnetic attractor surface in a direction away from the mounting surface. The projection of the buffer in the direction perpendicular to the magnetic attractor surface does not coincide with the magnetic attractor surface, but its projection in the direction perpendicular to the side connecting surface partially coincides with the side connecting surface.

[0006] In some embodiments, the buffer includes at least a pair of opposing buffer portions, one end of the buffer portion away from the side connecting surface extends in a direction away from the side connecting surface to protrude from the magnetic surface in a direction away from the mounting surface, the projection of the buffer portion in a direction perpendicular to the magnetic surface does not coincide with the magnetic surface, and the projection of the buffer portion in a direction perpendicular to the side connecting surface does not coincide with a portion of the side connecting surface.

[0007] In some embodiments, the buffer is annular and is disposed around the side connection surface. The buffer includes a buffer portion. One end of the buffer portion away from the side connection surface extends in a direction away from the side connection surface to protrude from the magnetic attraction surface in a direction away from the mounting surface. The projection of the buffer portion in the direction perpendicular to the magnetic attraction surface does not coincide with the magnetic attraction surface, and the projection of the buffer portion in the direction perpendicular to the side connection surface does not coincide with a portion of the side connection surface.

[0008] In some embodiments, the buffer portion includes a guide surface located on the side of the buffer portion away from the magnetic surface in a direction perpendicular to the magnetic surface, and one end of the guide surface near the magnetic surface is in contact with the magnetic surface in a direction perpendicular to the side connection surface.

[0009] In some embodiments, the buffer includes a reinforcement located at one end of the buffer near the side connection surface, the reinforcement being perpendicular to the side connection surface and connected to the side connection surface.

[0010] In some embodiments, the buffer includes an insert portion, and the base includes a connecting groove. The insert portion is located at one end of the buffer near the side connecting surface, and the connecting groove is disposed on the side connecting surface along the circumference of the base. The insert portion is embedded in the connecting groove.

[0011] In some embodiments, the connecting groove is spaced apart from the magnetic surface in a direction perpendicular to the magnetic surface, and the radial dimension of the embedded part is smaller than the radial dimension of the end of the buffer member near the side connecting surface.

[0012] In some embodiments, the buffer portion includes a buffer surface, the buffer surface and the guide surface are located on the same side of the buffer portion, the buffer surface and the guide surface are disposed adjacent to each other, the buffer surface is connected to the end of the guide surface away from the side connection surface, and the buffer surface is parallel to the magnetic attraction surface.

[0013] In some embodiments, the base includes a magnetic mounting groove disposed on the magnetic surface, a magnetic member is located in the magnetic mounting groove, and the side of the magnetic member away from the mounting surface is parallel to the magnetic surface.

[0014] To address the aforementioned issues, this application provides a test equipment assembly, which includes the aforementioned mounting base and test equipment, with the test equipment mounted on the mounting surface of the mounting base.

[0015] Compared with the prior art, this application provides a mounting base comprising a base, a magnetic attractor, and a buffer. The base includes a mounting surface, a magnetic attractor surface, and a side connecting surface. The mounting surface and the magnetic attractor surface are arranged opposite to each other, and the side connecting surface connects to both the mounting surface and the magnetic attractor surface. The mounting surface is used to mount testing equipment. The magnetic attractor is embedded in the base, and the magnetic attractor surface is magnetically attracted to the magnetically attracted object via the magnetic attractor. One end of the buffer is connected to the side connecting surface, and the buffer extends away from the side connecting surface to protrude from the magnetic attractor surface in a direction away from the mounting surface. The projection of the buffer in the direction perpendicular to the magnetic attractor surface does not coincide with the magnetic attractor surface, but its projection in the direction perpendicular to the side connecting surface partially coincides with the side connecting surface. Through the above embodiment, the base is magnetically attracted to the magnetically attracted object via the magnetic attractor, and one end of the buffer is connected to the side connecting surface, while the other end protrudes obliquely from the magnetic attractor surface and the side connecting surface, so that the buffer plays a buffering role for the testing equipment, reducing the risk of damage to the testing equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the mounting base provided in this application;

[0018] Figure 2 This is a schematic diagram of the structure of the second embodiment of the mounting base provided in this application;

[0019] Figure 3 yes Figure 2 A schematic diagram of the mounting bracket from another perspective;

[0020] Figure 4 yes Figure 3 The mounting base shown is a cross-sectional view along the AA direction;

[0021] Figure 5 yes Figure 4 An enlarged structural diagram of the circular frame;

[0022] Figure 6 This is a cross-sectional view along the AA direction of the third embodiment of the mounting base provided in this application;

[0023] Figure 7 yes Figure 6 An enlarged structural diagram of the circular frame.

[0024] Reference numerals: Mounting base 10; Base 100; Mounting surface 110; Magnetic surface 120; Magnetic mounting groove 121; Side connecting surface 130; Connecting groove 131; Magnetic component 200; Buffer component 300; Buffer part 310; Guide surface 311; Buffer surface 312; Reinforcing part 320; Embedding part 330. Detailed Implementation

[0025] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0027] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0030] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0031] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0032] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0033] To determine whether a car's body structure meets requirements, it is necessary to test the body structure. Modal and dynamic stiffness tests on structural components such as the car body require the use of accelerometers. The accelerometer is mounted on a magnetic base, which is magnetically fixed to the test point for measurement. However, the magnetic base exerts a significant impact on the sensor when it is magnetically attracted to the test point, which can damage the accelerometer over time.

[0034] To address the related technical problems, this application provides a test equipment assembly, which includes a mounting base and a test device, wherein the test device is mounted on the mounting surface of the mounting base.

[0035] To address the related technical problems, this application provides a mounting base, see [link to relevant documentation]. Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the mounting base provided in this application. Figure 2 This is a structural schematic diagram of the second embodiment of the mounting base provided in this application. Figure 3 yes Figure 2 A schematic diagram of the mounting base from another perspective.

[0036] The mounting base 10 includes a base 100, a magnetic suction element 200, and a buffer element 300. The base 100 includes a mounting surface 110, a magnetic suction surface 120, and a side connecting surface 130. The mounting surface 110 and the magnetic suction surface 120 are arranged opposite to each other. The side connecting surface 130 connects the mounting surface 110 and the magnetic suction surface 120 respectively. The mounting surface 110 is used to mount the test equipment. The magnetic suction element 200 is embedded in the base 100. The magnetic suction surface 120 is magnetically attracted to the magnetically attracted object through the magnetic suction element 200. One end of the buffer element 300 is connected to the side connecting surface 130. The buffer element 300 extends away from the side connecting surface 130 to protrude from the magnetic suction surface 120 in a direction away from the mounting surface 110. The projection of the buffer element 300 in the direction perpendicular to the magnetic suction surface 120 does not coincide with the magnetic suction surface 120, but its projection in the direction perpendicular to the side connecting surface 130 partially coincides with the side connecting surface 130.

[0037] The base 100 can be a polygon, cuboid, cube, or cylinder. The base 100 includes a mounting surface 110 and a magnetic surface 120, with the mounting surface 110 and magnetic surface 120 positioned opposite each other. That is, one side of the base 100 has the mounting surface 110, and the opposite side has the magnetic surface 120. The mounting surface 110 is used to mount the test equipment, and the magnetic surface 120 contacts the object being magnetically attracted. For example, the mounting surface 110 may have a threaded mounting hole, allowing the test equipment to be fixed to the base 100 with bolts. Alternatively, the mounting surface 110 may have a threaded stud, and the test equipment may have a mounting hole that mates with the stud. This allows the test equipment to be mounted on the base 100. The mounting base 10 also includes a magnetic suction element 200, which is embedded within the base 100. The base 100 uses the magnetic suction element 200 to attract the magnetic suction surface 120 to the magnetically attracted object, thereby fixing the test equipment to the magnetically attracted object, which can be understood as the test point. The test equipment can be an accelerometer or other test equipment. The base 100 also includes a side connecting surface 130, the two ends of which are connected to the mounting surface 110 and the magnetic suction surface 120, respectively. The side connecting surface 130 can be understood as the outer wall of the base 100 circumferentially located away from the inner magnetic suction element 200.

[0038] A buffer 300 is disposed on the base 100 and can be used to reduce the impact force of the testing equipment on the magnetically attracted object when the mounting base 10 is magnetically attracted to the magnetically attracted object. Specifically, one end of the buffer 300 is connected to the side connecting surface 130, and the other end of the buffer 300 extends away from the side connecting surface 130, so that the end of the buffer 300 away from the base 100 protrudes from the magnetic attraction surface 120 in the direction of the mounting surface 110. That is to say, the end of the buffer 300 away from the base 100 protrudes from both the mounting surface 110 and the side connecting surface 130. This makes the projection of the buffer 300 in the direction perpendicular to the magnetic attraction surface 120 not coincide with the magnetic attraction surface 120, and the projection of the buffer 300 in the direction perpendicular to the side connecting surface 130 partially coincide with the side connecting surface 130, so that the buffer 300 protrudes obliquely from the base 100. This allows the end of the buffer member 300 away from the base 100 to deform in a direction perpendicular to both the side connector and the mounting surface 110 when the base 100 is magnetically attracted to the object. This provides cushioning for the testing equipment and also allows the mounting surface 110 to fit snugly against the surface of the object, making the connection between the mounting base 10 and the object more secure. The buffer member 300 can be bonded to the side connector 130 using an adhesive material. The buffer member 300 can be made of materials such as rubber, polyurea elastomer, or thermoplastic elastomer (e.g., styrene, olefin, or polyurethane). Furthermore, by providing a buffer 300, during the process of the mounting surface 110 contacting the magnetically attracted object, that is, during the process of the mounting base 10 being magnetically attracted to the magnetically attracted object, the reaction force of the buffer 300 on the base 100 in the direction perpendicular to the mounting surface 110 will gradually decrease, so that when the mounting base 10 is magnetically attracted to the magnetically attracted object, the reaction force of the buffer 300 on the base 100 is smaller, which is more conducive to the magnetic fixation of the mounting base 10.

[0039] Through the above implementation method, the base 100 is magnetically attracted to the magnetically attracted object by the magnetic attractor 200, one end of the buffer 300 is connected to the side connection surface 130, and the other end protrudes obliquely from the magnetic attractor surface 120 and the side connection surface 130, so that the buffer 300 plays a buffering role for the test equipment and reduces the risk of damage to the test equipment.

[0040] In some embodiments, the buffer 300 includes at least a pair of opposing buffer portions 310, one end of the buffer portion 310 extending in a direction away from the side connection surface 130 to protrude from the magnetic attraction surface 120 in a direction away from the mounting surface 110, the projection of the buffer portion 310 in a direction perpendicular to the magnetic attraction surface 120 does not coincide with the magnetic attraction surface 120, and the projection of the buffer portion 310 in a direction perpendicular to the side connection surface 130 does not coincide with the side connection surface 130. The buffer 300 may include a buffer portion 310, and there may be two buffer portions 310. The two buffer portions 310 form a pair, and the pair of buffer portions 310 are disposed opposite to each other on the side connecting surface 130. The end of the buffer portion 310 away from the side connecting surface 130 extends in a direction away from the side connecting surface 130, so that the buffer portion 310 protrudes from the magnetic attraction surface 120 in a direction away from the mounting surface 110. The projection of the buffer portion 310 in the direction perpendicular to the magnetic attraction surface 120 does not coincide with the magnetic attraction surface 120, and the projection in the direction perpendicular to the side connecting surface 130 does not coincide with the side connecting surface 130. This allows the buffer portion 310 to bend and deform within the range of the angle between the direction perpendicular to the mounting surface 110 and the direction perpendicular to the side connecting surface 130. As a result, when the mounting base 10 is magnetically attracted to the magnetically attracted object, the momentum of the test equipment can be reduced, that is, the impact force from the magnetically attracted object on the test equipment can be reduced. The number of buffer portions 310 can be multiple pairs, such as one, two, three, or four pairs, or even more. The number of buffer portions 310 can be adjusted according to the actual situation, and this application does not limit it. One or more pairs of buffer portions 310 can increase the contact area between the buffer member 300 and the magnetically attracted object, thereby further reducing the impact force of the magnetically attracted object on the testing equipment and reducing the risk of damage to the testing equipment.

[0041] In other embodiments, the buffer 300 is annular and is disposed around the side connection surface 130. The buffer 300 includes a buffer portion 310. One end of the buffer portion 310 away from the side connection surface 130 extends in a direction away from the side connection surface 130 to protrude from the magnetic attraction surface 120 in a direction away from the mounting surface 110. The projection of the buffer portion 310 in the direction perpendicular to the magnetic attraction surface 120 does not coincide with the magnetic attraction surface 120, and the projection in the direction perpendicular to the side connection surface 130 does not coincide with a portion of the side connection surface 130. The buffer 300 can be ring-shaped, meaning the buffer 300 can be considered as multiple pairs of buffer portions 310 arranged sequentially around the side connecting surface 130 and connected to each other in the circumferential direction to form a ring-shaped structure. The buffer 300 includes a ring-shaped buffer portion 310. The end of the ring-shaped buffer portion 310 away from the side connecting surface 130 extends in a direction away from the side connecting surface 130, so that the buffer portion 310 protrudes from the magnetic attraction surface 120 in a direction away from the mounting surface 110. The projection of the buffer portion 310 in the direction perpendicular to the magnetic attraction surface 120 does not coincide with the magnetic attraction surface 120, and the projection in the direction perpendicular to the side connecting surface 130 does not coincide with the side connecting surface 130. Since the buffer portion 310 is annular, one end of the buffer member 300 is connected to the side connecting surface 130, and the buffer portion 310 of the buffer member 300 away from the side connecting surface 130 is wrapped around the side connecting surface 130, the contact area between the buffer member 300 and the magnetically attracted object can be further increased, thereby further reducing the impact force on the test equipment. In addition, the annular buffer portion 310 can also cooperate with the base 100 to form a sealed space between the mounting surface 110 and the magnetically attracted object. The buffer member 300 has a tendency to return to its deformed state, so that the air pressure in the sealed space is lower than the external air pressure, thereby improving the stability of the connection between the mounting base 10 and the magnetically attracted object.

[0042] See Figure 4 and Figure 5 , Figure 4 yes Figure 3 The mounting base shown is a cross-sectional view along the AA direction. Figure 5 yes Figure 4 An enlarged structural diagram of the circular frame.

[0043] In some embodiments, the buffer portion 310 includes a guide surface 311, which is located on the side of the buffer portion 310 away from the magnetic surface 120 in a direction perpendicular to the magnetic surface 120. One end of the guide surface 311 near the magnetic surface 120 abuts against the magnetic surface 120 in a direction perpendicular to the side connection surface 130. The guide surface 311 can be understood as the side of the buffer portion 310 that contacts the magnetically attracted object. Before the buffer member 300 is deformed, or before the mounting base 10 is magnetically attracted to the magnetically attracted object, the angle between the guide surface 311 of the buffer portion 310 and the magnetic surface 120 is an obtuse angle, and the angle with the surface of the magnetically attracted object is an acute angle. One end of the guide surface 311 near the magnetic surface 120 is aligned with the magnetic surface 120 in a direction perpendicular to the side connection surface 130. That is, the end of the guide surface 311 away from the magnetically attracted object is aligned with the end of the magnetic surface 120 near the side connection surface 130, so that the buffer 300 can be tightly connected to the side connection surface 130 and connected to the end of the side connection surface 130 near the mounting surface 110 in a direction perpendicular to the mounting surface 110. Thus, when the mounting base 10 is magnetically attracted to the magnetically attracted object, the gap between the mounting surface 110 base 100 and the magnetically attracted object can be further reduced, so as to further improve the sealing between the base 100 and the magnetically attracted object by utilizing the buffer 300, increase the pressure difference between the gap between the buffer 300 and the magnetically attracted object and the outside of the gap, and thus further improve the stability of the connection between the mounting base 10 and the magnetically attracted object.

[0044] In some embodiments, the buffer 300 includes a reinforcing portion 320 located at one end of the buffer 300 near the side connecting surface 130. The reinforcing portion 320 is perpendicular to and connected to the side connecting surface 130. The buffer 300 also includes a reinforcing portion 320 located at one end of the buffer 300 near the side connecting surface 130. The buffer 300 can be connected to the side connecting surface 130 via the reinforcing portion 320. The reinforcing portion 320 is perpendicular to the side connecting surface 130, thereby increasing the dimension of the buffer 300 in the direction perpendicular to the side connecting surface 130, i.e., increasing the thickness of the buffer 300 in the direction perpendicular to the side connecting surface 130. The reinforcing portion 320 can provide support for the buffer 300. The buffer portion 310 is connected to the reinforcing portion 320, thereby increasing the force required for the deformation of the buffer portion 310, and further appropriately improving the buffering capacity of the buffer 300 for the testing equipment. When the number of buffer portions 310 of the buffer member 300 is one or more pairs, the number of reinforcing portions 320 is equal to the number of buffer portions 310; when the buffer member 300 and its buffer portions 310 are annular, the reinforcing portions 320 are also annular.

[0045] See Figure 6 and Figure 7 , Figure 6This is a cross-sectional view along the AA direction of the third embodiment of the mounting base provided in this application. Figure 7 yes Figure 6 An enlarged structural diagram of the circular frame.

[0046] In some embodiments, the buffer 300 includes an insert portion 330, and the base 100 includes a connecting groove 131. The insert portion 330 is located at one end of the buffer 300 near the side connecting surface 130. The connecting groove 131 is disposed on the side connecting surface 130 along the circumference of the base 100, and the insert portion 330 is embedded in the connecting groove 131. The buffer 300 may include an insert portion 330, which is located at one end of the buffer 300 near the side connecting surface 130. The insert portion 330 is circumferentially disposed on the base 100. The insert portion 330 may be annular or multiple, and are spaced apart in the circumferential direction at one end of the buffer 300 near the side connecting surface 130. The side connecting surface 130 of the base 100 is provided with a connecting groove 131, and the insert portion 330 is embedded in the connecting groove 131, thereby limiting the buffer 300 by the connecting groove 131 of the base 100. In addition, during the process of the mounting base 10 being magnetically attracted to the magnetic object, the side wall of the connecting groove 131 near the mounting surface 110 can abut against the buffer 300 in a direction perpendicular to the magnetic surface 120, reducing the risk of the buffer 300 falling off when subjected to the reaction force from the magnetic object.

[0047] Based on the previous embodiment, the embedding part 330 can also be located at one end of the reinforcing part 320 near the base 100. The embedding part 330 is also embedded in the connecting groove 131 of the side connecting surface 130, thereby improving the buffering capacity of the buffer 300 while reducing the risk of the buffer 300 falling off.

[0048] In some embodiments, the connecting groove 131 is spaced apart from the magnetic surface 120 in a direction perpendicular to the magnetic surface 120, and the radial dimension of the insert 330 is smaller than the radial dimension of the end of the buffer 300 near the side connecting surface 130. The connecting groove 131 is spaced apart from the magnetic surface 120 in a direction perpendicular to the magnetic surface 120. Furthermore, the radial dimension of the insert 330 is smaller than the radial dimension of the portion of the buffer 300 near the insert 330. That is, the radial dimension of the portion between the insert 330 and the buffer 310 of the buffer 300 is larger than the radial dimension of the insert 330. This means that when the insert 330 of the buffer 300 is inserted into the connecting groove 131, the portion between the insert 330 and the buffer 310 also connects to the side connecting surface 130 between the connecting groove 131 and the magnetic surface 120. This reduces the gap between the buffer 300 and the base 100, thereby increasing the pressure difference between the gap between the mounting base 10 and the magnetically attracted object and the outside of the gap. This, in turn, increases the vacuum attraction force between the mounting base 10 and the magnetically attracted object.

[0049] In some embodiments, the buffer portion 310 includes a buffer surface 312, which is located on the same side of the buffer portion 310 as the guide surface 311. The buffer surface 312 is adjacent to the guide surface 311 and connected to the end of the guide surface 311 away from the side connection surface 130. The buffer surface 312 is parallel to the magnetic attraction surface 120. The buffer portion 310 also includes a buffer surface 312, which, like the guide surface 311, is located on the side of the buffer portion 310 closer to the magnetically attracted object. The buffer surface 312 is adjacent to the guide surface 311 in a direction perpendicular to the side connection surface 130, and is located at the end of the guide surface 311 away from the side connection surface 130. The buffer surface 312 is planar with the magnetic attraction surface 120. Of course, the buffer surface 312 may not be parallel to the magnetic attraction surface 120, as long as the angle between the buffer surface 312 and the surface of the magnetically attracted object is smaller than the angle between the guide surface 311 and the surface of the magnetically attracted object. This allows the buffer surface 312 to preferentially contact the magnetically attracted object during the magnetic attraction process of the mounting base 10. Furthermore, in the initial stage of contact with the magnetically attracted object, the buffer surface 312 appropriately increases the contact area between the buffer member 300 and the object, thereby increasing the frictional force between them. Since the momentum of the mounting base 10 is relatively large in the initial stage, increasing the frictional force between the buffer member 300 and the object further reduces the impact force experienced by the testing equipment in the initial phase. After the buffer surface 312 contacts the object, the guide surface 311 continues to contact the surface of the magnetically attracted object, thus achieving multi-stage frictional force changes and improving the buffering capacity of the buffer member 300 for the testing equipment. Optionally, the buffer surface 312 can be parallel to the magnetic surface 120 to ensure a larger frictional force between the buffer surface 312 and the object in the initial stage, resulting in a better buffering effect on the testing equipment. The dimensions of the buffer surface 312 in the direction of the vertical side connection surface 130 and the dimensions of the guide surface 311 can be obtained through a limited number of tests or calculations, and are not limited herein.

[0050] In some embodiments, the base 100 includes a magnetic mounting groove 121 disposed on the magnetic surface 120. A magnetic member 200 is located within the magnetic mounting groove 121, with the side of the magnetic member 200 away from the mounting surface 110 parallel to the magnetic surface 120. The base 100 includes the magnetic mounting groove 121 for accommodating the magnetic member 200. The magnetic mounting groove 121 can be located on the magnetic surface 120; that is, the magnetic surface 120 is recessed towards the mounting surface 110 in a direction perpendicular to the magnetic surface 120 to form the magnetic mounting groove 121. The side of the magnetic member 200 away from the mounting surface 110 is parallel to the magnetic surface 120, thereby allowing the magnetic member 200 to be closer to the magnetically attracted object when the mounting base 10 is magnetically attracted to it, resulting in a better magnetic attraction effect and a more secure magnetic attraction of the mounting base 10. The magnetic mounting slot 121 can be located at the center of the magnetic surface 120 so that the force on the buffer 300 is more uniform during the process of the mounting base 10 magnetically attracting the magnetically attracted object, the buffering effect on the test equipment is more balanced, and the buffering effect is better.

[0051] In summary, the base 100 is magnetically attracted to the magnetically attracted object by the magnetic attractor 200, and one end of the buffer 300 is connected to the side connection surface 130, while the other end protrudes obliquely from the magnetic attractor surface 120 and the side connection surface 130, so that the buffer 300 plays a buffering role for the test equipment and reduces the risk of damage to the test equipment.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A mounting base, characterized by, The mounting base comprises: a base comprising a mounting surface, a magnetic surface and a side connecting surface, the mounting surface and the magnetic surface being oppositely arranged, the side connecting surface connecting the mounting surface and the magnetic surface respectively, the mounting surface being used for mounting a testing device; a magnetic member embedded in the base, the magnetic surface being magnetically attracted to a magnetic object by the magnetic member; a buffer member having one end connected to the side connecting surface, the buffer member extending away from the side connecting surface to protrude from the magnetic surface in a direction away from the mounting surface, a projection of the buffer member in a direction perpendicular to the magnetic surface not coinciding with the magnetic surface, and a projection of the buffer member in a direction perpendicular to the side connecting surface partially coinciding with the side connecting surface.

2. The mount of claim 1, wherein The buffer member comprises at least one pair of oppositely arranged buffer portions, one end of each buffer portion away from the side connecting surface extending away from the side connecting surface to protrude from the magnetic surface in a direction away from the mounting surface, a projection of each buffer portion in a direction perpendicular to the magnetic surface not coinciding with the magnetic surface, and a projection of each buffer portion in a direction perpendicular to the side connecting surface not partially coinciding with the side connecting surface.

3. The mount of claim 1, wherein The buffer member is annular, the buffer member being arranged around the side connecting surface, the buffer member comprising a buffer portion, one end of the buffer portion away from the side connecting surface extending away from the side connecting surface to protrude from the magnetic surface in a direction away from the mounting surface, a projection of the buffer portion in a direction perpendicular to the magnetic surface not coinciding with the magnetic surface, and a projection of the buffer portion in a direction perpendicular to the side connecting surface not partially coinciding with the side connecting surface.

4. A mount according to claim 2 or 3, wherein, The buffer portion comprises a guide surface, the guide surface being located on a side of the buffer portion away from the magnetic surface in a direction perpendicular to the magnetic surface, one end of the guide surface close to the magnetic surface abutting the magnetic surface in a direction perpendicular to the side connecting surface.

5. The mount of claim 4, wherein The buffer member comprises a reinforcing portion, the reinforcing portion being located at one end of the buffer member close to the side connecting surface, the reinforcing portion being perpendicular to the side connecting surface and connected to the side connecting surface.

6. The mount of claim 4, wherein The buffer member comprises an embedded portion, the base comprising a connecting groove, the embedded portion being located at one end of the buffer member close to the side connecting surface, the connecting groove being arranged on the side connecting surface along a circumferential direction of the base, the embedded portion being embedded in the connecting groove.

7. The mount of claim 6, wherein The connecting groove is arranged in a direction perpendicular to the magnetic surface and spaced apart from the magnetic surface, a radial dimension of the embedded portion being smaller than a radial dimension of one end of the buffer member close to the side connecting surface.

8. The mount of claim 4, wherein The buffer portion comprises a buffer surface, the buffer surface being located on the same side of the buffer portion as the guide surface, the buffer surface being arranged adjacent to the guide surface, the buffer surface being connected to one end of the guide surface away from the side connecting surface, the buffer surface being parallel to the magnetic surface.

9. The mount of claim 1, wherein The base comprises a magnetic mounting groove, the magnetic mounting groove being arranged on the magnetic surface, the magnetic member being located in the magnetic mounting groove, one side of the magnetic member away from the mounting surface being parallel to the magnetic surface.

10. A test equipment assembly characterized by, The test equipment assembly includes a mounting base as claimed in any one of claims 1 to 9 and test equipment mounted to the mounting face of the mounting base.

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