High-frequency test probe module

By introducing floating springs and adjustment components into the high-frequency test probe module, the problems of probe damage and insufficient adaptability are solved, and the durability and multi-size adaptability of the probe are realized.

CN223986157UActive Publication Date: 2026-03-10SHENZHEN HONGCE PRECISION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

Existing high-frequency test probe modules have probes that are easily damaged and are only suitable for a single product, making them unsuitable for testing products of different sizes.

Method used

A high-frequency test probe module was designed, which uses floating springs to connect the probes to reduce damage, and adjusts the probe spacing through an adjustment component to accommodate products of different sizes. The module includes components such as a guide rail, guide slider, connecting block, adjustment plate, and adjustment motor.

Benefits of technology

It improves probe lifespan and yield, and expands the testing range to accommodate products of different sizes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of test equipment, in particular to a high-frequency test probe module which comprises a back plate, a guide rail frame is fixedly arranged at the bottom of the front face of the back plate, a plurality of guide sliding blocks are arranged in the guide rail frame in a sliding mode, connecting blocks are fixedly arranged on the guide sliding blocks, test probe assemblies are fixedly arranged on the connecting blocks, and the connecting blocks are arranged on an adjusting plate in a sliding mode. The two ends of the adjusting plate are connected with adjusting assemblies installed on the back plate. The test probe assembly comprises a base fixedly connected with the connecting block, a guide cylinder is installed on the base, a floating spring is arranged in the guide cylinder, and the guide cylinder is elastically and movably connected with a probe through the floating spring; according to the high-frequency test probe module, the probes can freely float up and down for a certain distance, so that the probability that the probes poke products or are damaged during testing can be reduced, the yield of the products can be improved, the service life of the whole module can be prolonged, the distance between a plurality of test probe modules can be adjusted, the high-frequency test probe module can adapt to the testing work of the products with different sizes, and the testing efficiency is improved. And the application range is widened.
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Description

TECHNICAL FIELD

[0001] The utility model relates to test equipment technical field, concretely is a kind of high-frequency test probe module. BACKGROUND

[0002] High-frequency test probe module is an important tool in electronic test field, is widely used in integrated circuit (IC), semiconductor device and other electronic components high-frequency characteristic test. With the continuous development of communication technology and electronic product, the demand of high-frequency test probe is increasing. And the bottom probe of existing high-frequency test probe module is generally installed on test base, when probe contacts the product to be tested, since it is direct contact between the two, probe is easy to poke bad product or probe itself is bent and damaged, and since the spacing between the probe is fixed, only the product of fixed size can be tested, there is singleness, and there is also deficiency when using. UTILITY MODEL CONTENT

[0003] In view of the deficiency of prior art, the utility model provides a kind of high-frequency test probe module, solve the technical problem that probe is easy to damage and adapt product singularity.

[0004] To solve the above technical problems, the utility model provides the following technical scheme: a kind of high-frequency test probe module, including backplate, the bottom of the front of the backplate is fixed with guide rail frame, multiple guide sliding blocks are slidably arranged in guide rail frame, guide sliding block is fixedly provided with connecting block, connecting block is fixedly provided with test probe assembly, connecting block is slidably arranged on adjusting plate, the both ends of adjusting plate are connected with adjusting assembly installed on backplate;

[0005] The test probe assembly includes with the base of connecting block fixed connection, guide cylinder is installed on base, floating spring is arranged in guide cylinder and is elastically movably connected with probe by floating spring, and the outer wall of probe is fixedly provided with conductive spring leaf, the top of conductive spring leaf is slidably attached to conductive plate, and the side wall of guide cylinder is fixedly provided with conductive plate.

[0006] Preferably, one end of the top of the conductive spring leaf is arc-shaped structure.

[0007] Preferably, recess is arranged on the position of the base close to conductive spring leaf.

[0008] Preferably, adjusting hole is arranged on the position of the adjusting plate corresponding to each connecting block, and the adjusting holes on both sides are inclined.

[0009] Preferably, the adjusting assembly comprises a slide rail mounted on the back plate, a regulating motor is mounted on the top of the slide rail, an output shaft of the regulating motor is connected with one end of a linear lead screw rotatingly arranged inside the slide rail through a coupling, and an adjusting block is screw transmission connected with the outer wall of the linear lead screw and is slidingly arranged in the slide rail and fixedly connected with one end of the adjusting plate.

[0010] Preferably, a test circuit board is further mounted on the back plate, the test circuit board is connected with the top of the plurality of conductive plates through a plurality of connecting wires, and a plurality of red-green indicator lamps are further arranged on the test circuit board.

[0011] By the above technical scheme, the high-frequency test probe module has at least the following beneficial effects:

[0012] 1. The high-frequency test probe module, by arranging the test probe assembly, under the action of the floating spring, when the probe contacts the product, the probe can freely float up and down by a distance, which can reduce the probability of the probe poking the product or the probe being damaged during the test, improve the yield of the product and the service life of the whole module.

[0013] 2. The high-frequency test probe module, by arranging the adjusting plate and the adjusting assembly, the adjusting assembly is used for controlling the adjusting plate to move up and down, so that the plurality of test probe modules can adjust the spacing under the action of the adjusting hole, which can adapt to the test work of a plurality of different size products and improve the application range. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate embodiments of the present application and together with the description serve to explain the principles of the present application:

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present application;

[0016] Figure 2 It is a schematic diagram of the structure of each test probe assembly on the guide rail frame of the present application;

[0017] Figure 3 It is a schematic diagram of the structure of a single test probe assembly of the present application;

[0018] Figure 4 It is a schematic diagram of the structure of the adjusting assembly of the present application;

[0019] REFERENCE SIGNS:

[0020] 1. Backplate; 2. Guide rail frame; 3. Guide slider; 4. Connecting block; 5. Test probe assembly; 501. Base; 502. Guide cylinder; 503. Floating spring; 504. Probe; 505. Conductive spring; 506. Conductive plate; 6. Adjustment plate; 7. Adjustment assembly; 701. Slide rail; 702. Adjustment motor; 703. Linear lead screw; 704. Adjustment block; 8. Test circuit board; 9. Connecting wires; 10. Red and green indicator lights. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] High-frequency testing is primarily used to evaluate the performance of devices in high-frequency environments, such as frequency response, impedance matching, and transmission characteristics. This is crucial for the development and optimization of modern communication equipment (such as 5G base stations, RFID, and satellite communications), as these devices typically operate at frequencies in the GHz range. A high-frequency test probe 504 module typically includes the following key components: Probe 504: Responsible for contacting the test object and transmitting signals, usually made of highly conductive materials (such as gold or copper) to reduce signal loss. Module structure: Includes a support, adjustment mechanism, and insulating materials to ensure the stability and reliability of the probe 504 during testing. Connector: Used to transmit the probe 504 signal to test instruments (such as network analyzers and oscilloscopes) for data acquisition and analysis.

[0023] Example 1:

[0024] Due to the limitations of existing technology, such as the susceptibility of the 504 probe to damage and its reliance on a single product, please refer to... Figures 1-4 This utility model provides a high-frequency test probe 504 module. The probe 504 can float freely up and down a certain distance, which reduces the probability of the probe 504 puncturing the product or being damaged during testing, thereby improving the product yield and the service life of the entire module. The module includes a back plate 1, a guide rail frame 2 fixedly mounted on the bottom of the front of the back plate 1, a plurality of guide sliders 3 slidably mounted inside the guide rail frame 2, a connecting block 4 fixedly mounted on the guide slider 3, and a test probe assembly 5 fixedly mounted on the connecting block 4. In use, the entire module is installed on the testing equipment, and after the product is placed stably, the module is moved so that the test probe assembly 5 contacts the product and the testing is performed.

[0025] In existing high-frequency test probe 504 modules, the bottom probe 504 is typically mounted on the test base. When the probe 504 contacts the product under test, the direct contact makes it easy for the probe 504 to puncture the product or bend and break. For this issue, please refer to [link / reference needed]. Figure 3 The test probe assembly 5 includes a base 501 fixedly connected to the connecting block 4. A guide cylinder 502 is mounted on the base 501. A floating spring 503 is provided inside the guide cylinder 502, and a probe 504 is elastically and movably connected through the floating spring 503. A conductive spring piece 505 is fixedly provided on the outer wall of the probe 504. The top of the conductive spring piece 505 slides against a conductive plate 506, which is fixed on the side wall of the guide cylinder 502. When the probe 504 contacts the product, it can float freely up and down a certain distance under the action of the floating spring 503. This reduces the probability of the probe 504 puncturing the product or being damaged during testing. At the same time, the conductive spring piece 505 is connected to the probe 504 to ensure the continuity of the test circuit.

[0026] Furthermore, to ensure stable contact between the conductive spring 505 and the conductive plate 506, one end of the top of the conductive spring 505 is made into an arc shape. This reduces the distance between the conductive spring 505 and the conductive plate 506. Also, because the conductive spring 505 is elastic, even if there is wear on the conductive spring 505 after sliding for a long time, it will not affect the contact between the conductive spring 505 and the conductive plate 506.

[0027] Furthermore, a groove is provided on the base 501 near the conductive spring 505; since the conductive spring 505 needs to contact the conductive plate 506, in order to reduce the influence of the base 501 on the conductive spring 505, a groove is provided on the base 501, thereby ensuring that the conductive spring 505 can move in the groove.

[0028] During testing, to facilitate the viewing of test results by staff, a test circuit board 8 is also installed on the back panel 1. The test circuit board 8 is connected to the top of multiple conductive plates 506 via multiple connecting wires 9. The test circuit board 8 is also equipped with multiple red and green indicator lights 10. When the test passes, the red and green indicator lights 10 on the test circuit board 8 will light up and display a green light under the action of the connecting wires 9. Conversely, when the test fails, the red and green indicator lights 10 on the test circuit board 8 will light up and display a red light.

[0029] Example 2:

[0030] Since the spacing between the probes 504 is fixed, it can only be used to test products of fixed size, which limits its application range. Therefore, the connecting block 4 is slidably set on the adjustment plate 6, and both ends of the adjustment plate 6 are connected to the adjustment components 7 installed on the back plate 1. The adjustment components 7 are used to control the adjustment plate 6 to move up and down, so that the spacing of multiple test probe 504 modules can be adjusted under the action of the adjustment holes. This can adapt to the testing of products of various sizes and improve the application range.

[0031] Furthermore, since the spacing between multiple test probe assemblies 5 must remain consistent when adjusting the spacing, adjustment holes are provided on the adjustment plate 6 at the positions of each connecting block 4, and the adjustment holes on both sides are inclined. When the adjustment plate 6 moves, the test probe assembly 5 in the middle remains the same, while the test probe assemblies 5 on both sides move different distances, thus ensuring that the spacing between each test probe assembly 5 is consistent.

[0032] Furthermore, to achieve movement control of the adjustment plate 6, please refer to... Figure 4 The adjustment assembly 7 includes a slide rail 701 mounted on the back plate 1. An adjustment motor 702 is mounted on the top of the slide rail 701. The output shaft of the adjustment motor 702 is connected to one end of a linear screw 703 rotatably mounted inside the slide rail 701 via a coupling. An adjustment block 704 is screwed onto the outer wall of the linear screw 703. The adjustment block 704 is slidably mounted inside the slide rail 701 and fixed to one end of the adjustment plate 6. The adjustment motor 702 drives the linear screw 703 to rotate. The linear screw 703, through the screw drive with the adjustment block 704, causes the adjustment plate 6 to move up and down in the vertical direction.

[0033] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high frequency test probe module comprising a backplane (1), characterized in that: The bottom of the front surface of the back plate (1) is fixed with a guide rail frame (2), a plurality of guide sliding blocks (3) are slidingly arranged in the guide rail frame (2), a connecting block (4) is fixedly arranged on the guide sliding block (3), a test probe assembly (5) is fixedly arranged on the connecting block (4), the connecting block (4) is slidingly arranged on an adjusting plate (6), and the two ends of the adjusting plate (6) are connected with adjusting assemblies (7) mounted on the back plate (1); The test probe assembly (5) comprises a base (501) fixedly connected with the connecting block (4), a guide cylinder (502) is mounted on the base (501), a floating spring (503) is arranged in the guide cylinder (502), and a probe (504) is elastically movably connected through the floating spring (503), a conductive spring piece (505) is fixedly arranged on the outer wall of the probe (504), the top of the conductive spring piece (505) is slidingly attached to a conductive plate (506), and the conductive plate (506) is fixedly arranged on the side wall of the guide cylinder (502).

2. The high-frequency test probe module according to claim 1, wherein: The top of the conductive spring piece (505) is arc-shaped.

3. The high-frequency test probe module of claim 1, wherein: The base (501) is provided with a groove near the position of the conductive spring piece (505).

4. The high-frequency test probe module of claim 1, wherein: The adjusting plate (6) is provided with adjusting holes corresponding to the positions of the connecting blocks (4), and the adjusting holes on the two sides are inclined.

5. The high-frequency test probe module of claim 1, wherein: The adjusting assembly (7) comprises a sliding rail (701) mounted on the back plate (1), an adjusting motor (702) mounted on the top of the sliding rail (701), an output shaft of the adjusting motor (702) connected with one end of a linear lead screw (703) rotatably arranged on the inner side of the sliding rail (701) through a shaft coupling, an adjusting block (704) screwingly and drivably connected with the outer wall of the linear lead screw (703), and the adjusting block (704) is slidingly arranged in the sliding rail (701) and fixedly connected with one end of the adjusting plate (6).

6. The high-frequency test probe module of claim 1, wherein: The back plate (1) is further provided with a test circuit board (8), the test circuit board (8) is connected with the top of the plurality of conductive plates (506) through a plurality of connecting wires (9), and the test circuit board (8) is further provided with a plurality of red-green indicator lamps (10).