Device structure of semiconductor memory

Abstract

The utility model relates to the technical field of semiconductor memories, in particular to a device structure of a semiconductor memory, which comprises a semiconductor memory shell, a groove arranged on one side of the semiconductor memory shell and a baffle plate connected in an inner cavity of the groove in a sliding mode. A heat conduction plate is arranged on one side of the heat dissipation plate. The detachable heat dissipation box integrating the heat dissipation fan, the heat conduction plate and the clamping assembly is arranged, the heat dissipation plate makes direct contact with a heat source, heat is rapidly conducted to the whole heat dissipation box body through the heat conduction plate and is taken away through forced convection of the heat dissipation fan, the heat dissipation efficiency is remarkably improved, stable operation of the memory at the high temperature is guaranteed, and the clamping assembly is designed, so that the heat dissipation efficiency is improved. The clamping blocks on the two sides can be synchronously separated through pressing operation, so that the whole heat dissipation module can be rapidly and safely taken down to be cleaned or replaced, and the maintenance process is greatly simplified.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor memory technology, and in particular to a device structure for a semiconductor memory. Background Technology

[0002] Semiconductor memory is a type of memory that uses semiconductor circuits as the storage medium. With the rapid development of information technology, the storage density and read / write speed of semiconductor memory are constantly improving, and the heat generated during its operation is also increasing significantly. Excessively high operating temperatures can seriously affect the performance stability and lifespan of memory devices. Therefore, efficient and reliable heat dissipation solutions have become a key aspect of semiconductor memory design.

[0003] Current common heat dissipation solutions mostly involve adding fixed heat sinks or fans to the outside of the memory casing. These solutions have significant drawbacks: the heat dissipation module is typically secured to the memory body with screws, making disassembly and maintenance cumbersome and inconvenient for cleaning or replacement. Therefore, there is an urgent need for a new device structure that combines efficient heat dissipation with easy assembly and disassembly. Utility Model Content

[0004] The purpose of this invention is to provide a device structure for a semiconductor memory, which solves the problem of inconvenient heat sink maintenance in existing semiconductor memories by using a combination of a heat-conducting plate and a snap-fit ​​assembly.

[0005] The technical solution of this utility model is as follows: a device structure for a semiconductor memory, including a semiconductor memory housing, a groove formed on one side of the semiconductor memory housing, a shield plate slidably connected to the inner cavity of the groove, a heat sink plate fixedly connected to the inner cavity of the groove, a heat conduction plate provided on one side of the heat sink plate, a heat sink box fixedly connected to one side of the heat conduction plate, a snap-fit ​​assembly provided in the inner cavity of the heat sink box, fixing grooves provided on both sides of the heat sink box, and a locking block provided in the inner cavity of the fixing groove.

[0006] Preferably, the snap-fit ​​assembly includes a drive block disposed in the inner cavity of the heat sink, a slide rod fixedly connected to one side of the drive block, and a spring sleeved on the surface of the slide rod.

[0007] Preferably, one end of the spring is fixedly connected to the inner cavity of the heat sink, the other end of the spring is fixedly connected to one side of the drive block, and one end of the slide rod is fixedly connected to one side of the locking block.

[0008] Preferably, the card block is L-shaped, and the heat sink has slots on both sides that are adapted to the card block.

[0009] Preferably, the heat sink is provided with pressing grooves on both sides, and a pressing plate is provided in the inner cavity of the pressing groove. A drive wheel is fixedly connected to one side of the pressing plate.

[0010] Preferably, the heat sink is equipped with a cooling fan inside the heat sink cavity and a grille is provided on the surface of the heat sink.

[0011] Preferably, a protrusion is provided on one side of the shielding plate, and the depth of the groove is greater than the thickness of the heat sink.

[0012] Preferably, the size of the heat-conducting plate is the same as that of the heat sink.

[0013] The beneficial effects of this utility model are as follows: By setting up a detachable heat dissipation box that integrates a heat dissipation fan, a heat conduction plate, and a snap-fit ​​component, the heat dissipation plate directly contacts the heat source, and the heat is quickly conducted to the entire heat dissipation box through the heat conduction plate and carried away by forced convection by the heat dissipation fan, which significantly improves the heat dissipation efficiency and ensures the stable operation of the memory at high temperatures. The snap-fit ​​component design allows the two side snap-fit ​​blocks to be released simultaneously by pressing, thereby enabling the entire heat dissipation module to be quickly and safely removed for cleaning or replacement, greatly simplifying the maintenance process. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0015] Figure 1 This is a three-dimensional diagram of the device structure of a semiconductor memory.

[0016] Figure 2 An exploded view of the device structure of a semiconductor memory.

[0017] Figure 3 This is a diagram showing the fit between a shield and a bump in the device structure of a semiconductor memory.

[0018] Figure 4 This is a cross-sectional view of a heat sink in the device structure of a semiconductor memory.

[0019] Figure 5 This is a schematic diagram of a snap-fit ​​component in the device structure of a semiconductor memory.

[0020] Explanation of reference numerals in the attached drawings: 1. Semiconductor memory housing; 2. Groove; 3. Shielding plate; 4. Heat sink; 5. Heat conduction plate; 6. Heat sink box; 7. Snap-fit ​​assembly; 71. Drive block; 72. Slide rod; 73. Spring; 8. Fixing groove; 9. Locking block; 10. Locking slot; 11. Pressing groove; 12. Pressing plate; 13. Drive wheel; 14. Cooling fan; 15. Grille; 16. Protrusion. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, and not all embodiments. Example 1

[0022] Please see Figures 1-3 This is the first embodiment of the present invention. This embodiment provides a device structure for a semiconductor memory, including a semiconductor memory housing 1, a groove 2 formed on one side of the semiconductor memory housing 1, a shielding plate 3 slidably connected to the inner cavity of the groove 2, a heat sink 4 fixedly connected to the inner cavity of the groove 2, a heat conduction plate 5 provided on one side of the heat sink 4, a heat sink box 6 fixedly connected to one side of the heat conduction plate 5, a snap-fit ​​assembly 7 provided in the inner cavity of the heat sink box 6, fixing grooves 8 provided on both sides of the heat sink box 6, and a locking block 9 provided in the inner cavity of the fixing groove 8.

[0023] During operation, the heat generated by the semiconductor memory is conducted to the heat sink 4 fixed in the recess 2 of the housing, and then rapidly diffused to the entire housing 6 of the heat sink 6 through the closely contacting heat conduction plate 5. When the cooling fan 14 inside the heat sink 6 is started, air is forced to flow over the housing and the surface of the heat conduction plate 5, and is discharged at high speed from the grille 15, thereby continuously and efficiently removing heat and achieving active heat dissipation. Example 2

[0024] Please see Figures 2-5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0025] Specifically, the snap-fit ​​assembly 7 includes a drive block 71 disposed in the inner cavity of the heat sink 6, a slide rod 72 fixedly connected to one side of the drive block 71, a spring 73 sleeved on the surface of the slide rod 72, pressing grooves 11 provided on both sides of the heat sink 6, pressing plates 12 provided in the inner cavity of the pressing grooves 11, a drive wheel 13 fixedly connected to one side of the pressing plate 12, a heat dissipation fan 14 provided in the inner cavity of the heat sink 6, a grille 15 provided on the surface of the heat sink 6, one end of the spring 73 fixedly connected to the inner cavity of the heat sink 6, the other end of the spring 73 fixedly connected to one side of the drive block 71, one end of the slide rod 72 fixedly connected to one side of the snap-fit ​​block 9, the snap-fit ​​block 9 being L-shaped, and snap-fit ​​grooves 10 adapted to the snap-fit ​​block 9 being provided on both sides of the heat sink 4.

[0026] When maintenance of the heat dissipation module is required, press the pressing plates 12 on both sides of the heat dissipation box 6 inward with both hands. The pressing plates 12 drive the drive wheel 13 to move towards the center. The inclined surface of the drive wheel 13 presses against both sides of the drive block 71, forcing the drive block 71 to slide outward against the elastic force of the spring 73. The drive block 71 drives the two sliding rods 72 to expand outward in sync. The L-shaped locking blocks 9 at the ends of the sliding rods 72 then completely disengage from the locking slots 10 on both sides of the heat dissipation plate 4. At this time, the heat dissipation box 6 and the heat conduction plate 5 fixed to it can be removed vertically from the heat dissipation plate 4 as a whole for cleaning or replacement. The preload of the spring 73 ensures the reliability of the locking. The integrated design of the drive block 71 allows the locking blocks 9 on both sides to move synchronously, ensuring uniform force and structural stability during disassembly and installation. Example 3

[0027] Please see Figure 3 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0028] Specifically, a protrusion 16 is provided on one side of the shielding plate 3, the depth of the groove 2 is greater than the thickness of the heat sink 4, and the size of the heat conduction plate 5 is the same as that of the heat sink 4.

[0029] The depth of the groove 2 is greater than the thickness of the heat sink 4, ensuring that the surface of the heat sink 4 does not exceed the opening plane of the groove 2 after the heat sink module is disassembled, thus reserving space for the sliding closure of the shield 3. The size of the heat conduction plate 5 is the same as that of the heat sink 4, ensuring that the contact area between the two is maximized and improving the heat conduction efficiency. When active heat dissipation is not required or dust prevention is required, the protrusion 16 on the shield 3 can be pushed to make the shield 3 slide along the groove 2 and completely cover the heat sink 4.

[0030] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A device structure of a semiconductor memory, comprising a semiconductor memory shell (1), a groove (2) opened in one side of the semiconductor memory shell (1), and a shielding plate (3) slidingly connected in the inner cavity of the groove (2), characterized in that: The recess (2) is fixedly connected with a heat dissipation plate (4), one side of the heat dissipation plate (4) is provided with a heat conduction plate (5), one side of the heat conduction plate (5) is fixedly connected with a heat dissipation box (6), the heat dissipation box (6) is provided with a clamping assembly (7) in the inner cavity, both sides of the heat dissipation box (6) are provided with a fixed groove (8), and the fixed groove (8) is provided with a clamping block (9) in the inner cavity.

2. A device structure for a semiconductor memory according to claim 1, wherein: The clamping assembly (7) comprises a driving block (71) arranged in the inner cavity of the heat dissipation box (6), a sliding rod (72) fixedly connected with one side of the driving block (71), and a spring (73) sleeved on the surface of the sliding rod (72).

3. A device structure for a semiconductor memory according to claim 2, wherein: One end of the spring (73) is fixedly connected with the inner cavity of the heat dissipation box (6), and the other end of the spring (73) is fixedly connected with one side of the driving block (71).

4. The device structure of a semiconductor memory according to claim 1, wherein: One end of the sliding rod (72) is fixedly connected with one side of the clamping block (9).

5. The device structure of a semiconductor memory according to claim 1, characterized in that: The clamping block (9) is L-shaped, and the heat dissipation plate (4) is provided with a clamping groove (10) on both sides, which is matched with the clamping block (9).

6. The device structure of a semiconductor memory according to claim 1, wherein: Both sides of the heat dissipation box (6) are provided with a pressing groove (11), the pressing groove (11) is provided with a pressing plate (12) in the inner cavity, and one side of the pressing plate (12) is fixedly connected with a driving wheel (13).

7. The device structure of a semiconductor memory according to claim 1, wherein: The inner cavity of the heat dissipation box (6) is provided with a heat dissipation fan (14), and the surface of the heat dissipation box (6) is provided with a grille (15).

8. The device structure of a semiconductor memory according to claim 1, wherein: One side of the shielding plate (3) is provided with a protruding block (16), and the depth of the recess (2) is greater than the thickness of the heat dissipation plate (4). The size of the heat conduction plate (5) is the same as that of the heat dissipation plate (4).

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