Novel antioxidant contact

By coating a silver conductive layer with a ruthenium-based resistive paste to form a parallel structure, the problem of silver's easy oxidation is solved, enabling cost-effective mass production of conductive contacts.

CN223987217UActive Publication Date: 2026-03-10ADVANCED PLATINUM TECH
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

In existing technologies, gold and silver are expensive or easily oxidized as conductive contact materials, resulting in high costs and making them unsuitable for mass production.

Method used

A silver conductive layer is used and covered with a ruthenium-based resistive paste as a resistive layer to form a parallel structure to isolate the silver from air. The oxidation resistance and strong acid corrosion resistance of the ruthenium-based resistive paste are utilized to reduce the possibility of silver oxidation and reduce resistivity.

Benefits of technology

This reduces the likelihood of oxidation of the silver conductive layer, lowers production costs, and makes it suitable for mass production while maintaining good conductivity.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223987217U_ABST
    Figure CN223987217U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of conductive contact manufacturing, in particular to a novel anti-oxidation contact which comprises a silver conductive layer arranged on a circuit board base material, and the silver conductive layer is covered with a resistance layer with anti-oxidation performance. And the resistance layer is made of ruthenium resistance paste. The conductive contact has the advantage that the production cost of the conductive contact is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the field of conductive contact manufacturing, in particular to a novel oxidation-resistant contact. BACKGROUND

[0002] The conductive contact refers to the contact point between two or more electrical components in the electronic industry, which is used for electrical connection.

[0003] In the related art, gold or silver is usually used as the contact material on the circuit board substrate. Although the conductive properties of gold and silver are both excellent, gold is relatively expensive, and silver is easily oxidized, so there are obvious deficiencies in using these two materials as contacts. CONTENT OF THE UTILITY MODEL

[0004] In order to improve the problem of obvious defects of gold or silver as a contact, the present application provides a novel oxidation-resistant contact.

[0005] The novel oxidation-resistant contact provided by the present application adopts the following technical solution:

[0006] The novel oxidation-resistant contact comprises a silver conductive layer arranged on a circuit board substrate, and the silver conductive layer is covered with a resistance layer having oxidation resistance.

[0007] By adopting the above technical solution, the resistance layer isolates the contact between the silver conductive layer and the air, reducing the possibility of oxidation of the silver. Compared with using gold as a contact, silver is relatively inexpensive, so it is suitable for mass production of conductive contacts.

[0008] Optionally, the resistance layer is made of a ruthenium-based resistance paste.

[0009] By adopting the above technical solution, the ruthenium-based resistance paste has strong oxidation resistance and strong acid corrosion resistance, stable structure and low price.

[0010] In summary, the present application includes at least one of the following beneficial technical effects:

[0011] 1. The resistance layer isolates the contact between the silver conductive layer and the air, reducing the possibility of oxidation of the silver conductive layer. Compared with using gold as a contact, silver is relatively inexpensive, so it is suitable for mass production of conductive contacts.

[0012] 2. Since the ruthenium-based resistance paste has conductivity and is covered on the silver conductive layer, the two form a parallel connection therebetween, thereby reducing the resistance and making the ruthenium-based resistance paste with high resistivity suitable for use as a conductive material for the contact. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a structural schematic diagram of an embodiment of the present application.

[0014] Figure 2 is a sectional view of the positional relationship among the circuit board substrate, the silver conductive layer and the resistance layer in the embodiment of the present application.

[0015] Mark explanation: 1, circuit board substrate; 2, silver conductive layer; 3, resistance layer. DETAILED DESCRIPTION

[0016] The following will be described in detail in combination with the accompanying drawings. Figures 1-2 The present application will be further described in detail.

[0017] The embodiment of the present application discloses a novel oxidation-resistant contact.

[0018] Referring to Figure 1 and Figure 2 The novel oxidation-resistant contact comprises a silver conductive layer 2 arranged on a circuit board substrate 1 and made of metal silver, and a resistance layer 3 covering the silver conductive layer 2, the resistance layer 3 having strong oxidation resistance.

[0019] Referring to Figure 2 The resistance layer 3 isolates the contact between silver and air, and reduces the possibility of oxidation of silver. Compared with gold as the contact, silver is relatively cheap in price, and thus is suitable for mass production of conductive contacts.

[0020] Referring to Figure 2 In the production process, the resistance layer 3 is made of a ruthenium-based resistance paste, the ruthenium-based resistance paste has stable structure, strong oxidation resistance and strong resistance to strong acid corrosion, is suitable for mass production of conductive contacts, and greatly reduces the production cost of the conductive contacts.

[0021] However, the prior art usually does not use the ruthenium-based resistance paste as a conductive material, because the resistivity of the ruthenium-based resistance paste is high, on the one hand, the power consumption is large, and on the other hand, a large amount of heat is usually generated during work.

[0022] Referring to Figure 2 In the present application, the ruthenium-based resistance paste covers the silver conductive layer 2, and the two are in parallel, which reduces the resistance of the whole contact, and thus makes the ruthenium-based resistance paste meet the requirement of being a conductive material.

[0023] As can be seen, in the present application, the ruthenium-based resistance paste is used as a conductive material for the contact, which breaks through the thought barrier in the prior art and expands the application of the ruthenium-based resistance paste in the field of conductive contacts.

[0024] The implementation principle of the novel oxidation-resistant contact in the embodiment of the present application is as follows:

[0025] The ruthenium-based resistance paste has stable structure, strong oxidation resistance and strong resistance to strong acid corrosion, the covering effect of the ruthenium-based resistance paste on silver isolates the contact between silver and air, and reduces the possibility of oxidation of silver.

[0026] The covering effect of the ruthenium resistance paste on silver makes the two form parallel connection, and thus the overall resistance of the contact is reduced, so that the ruthenium resistance paste meets the requirement of conductive material, and the prices of silver and the ruthenium resistance paste are relatively low, the production cost of the conductive contact is reduced, and the conductive contact is suitable for mass production.

[0027] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A novel antioxidant contact, characterized by: The application relates to a silver conductive layer (2) arranged on a circuit board substrate (1), wherein the silver conductive layer (2) is covered with a resistance layer (3) having oxidation resistance, and the resistance layer (3) is made of a ruthenium resistance paste, and the silver conductive layer (2) and the resistance layer (3) are in parallel connection.