COB device packaging and repairing jig

Abstract

The utility model relates to the technical field of optical communication device manufacturing. More specifically, the utility model relates to a COB device packaging and repairing jig. Comprising a height adjusting mechanism; the horizontal rotating platform is in transmission connection with the height adjusting mechanism; the clamp assembly is used for fixing a printed circuit board of the COB device, and the clamp assembly is detachably connected with the horizontal rotating platform; a horizontal position adjusting mechanism; the push broach assembly is connected with the horizontal position adjusting mechanism, and a tool bit of the push broach assembly horizontally extends to the position above the clamp assembly. The utility model provides the packaging and repairing jig aiming at the repairing requirement of the existing COB packaging type optical module, the COB packaging size can be matched and used, and chips and FAs of various sizes can be repaired under the condition that other materials are not damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical communication device manufacturing technical field, more specifically, the utility model relates to a COB device package repair fixture. BACKGROUND

[0002] Under the demand of data center and AI computing power, high-speed optical modules (such as 400G / 800G / 1.6T) adopt COB (chip on board) packaging process, which has become the industry mainstream, that is, various optoelectronic chips are attached to the PCBA board. This process realizes high-density integration by directly attaching optoelectronic chips, FAs and optical elements to the PCBA board. However, local failure problems caused by poor curing of glue, alignment deviation or foreign matter pollution frequently occur during the packaging process, and the traditional repair technology faces the following bottlenecks:

[0003] 1. Equipment limitation: The traditional pusher relies on fixed mechanical arms (such as the automatic repair system disclosed in CN20XX5678D), which has a large volume (occupies ≥1.5m 2 ) and high cost (single machine ≥50 million yuan), and cannot adapt to various types of narrow pitch precision repair; the existing tool lacks multi-dimensional freedom adjustment capability, and the adjacent chips or FAs are easily damaged during the repair process, resulting in a whole board scrap rate ≥15%.

[0004] 2. Poor process compatibility: High-speed optical modules need to integrate multiple types of elements (such as LENS, TX / RX FA, SIP packaged LD chip), the existing fixture only supports single element disassembly, and needs to frequently replace tools, which is low in efficiency; the peeling force control of the cured glue layer is not accurate (deviation ±2N), which easily leads to PCBA pad falling off or substrate warping.

[0005] 3. Imbalance between cost and efficiency: Material waste caused by repair failure accounts for 20%-30% of the total cost of optical modules, especially high-end chips (such as 25Gbps DFB laser) with a unit price exceeding 1,000 yuan, which urgently needs a low-cost repair solution; the traditional repair process takes ≥30 minutes per time, which seriously affects the production line operation rate.

[0006] The cost of optical modules mainly comes from chips and packaging. For 400G, 800G and even 1.6T products, multiple chips are needed to complete packaging, but the packaging time is long and once-packaging defects are difficult to eliminate. If the entire device is scrapped because of individual chip or FA packaging failure, it will cause a lot of material waste and increase in time cost. Therefore, packaging-level repair is of great significance, which can save a lot of material cost and a lot of packaging time, and provides great significance for improving the overall gross profit margin. UTILITY MODEL CONTENT

[0007] The purpose of this invention is to provide a packaging repair fixture for optical modules with existing COB packaging, which can be used with COB packaging of this size and can repair chips and FAs of various sizes without damaging other materials.

[0008] To achieve these objectives and other advantages according to this invention, a COB device packaging rework fixture is provided, comprising:

[0009] Height adjustment mechanism;

[0010] A horizontally rotating platform, which is connected in transmission to the height adjustment mechanism;

[0011] A clamping assembly for securing a printed circuit board of a COB device, the clamping assembly being detachably connected to the horizontal rotating platform;

[0012] Horizontal position adjustment mechanism;

[0013] A pusher assembly, which is connected to the horizontal position adjustment mechanism, has its blade tip extending horizontally above the clamping assembly.

[0014] Furthermore, in the COB device packaging rework fixture, the fixture assembly includes:

[0015] The base plate has a receiving groove at its upper end that corresponds to the printed circuit board.

[0016] A flexible clamping unit is disposed on the base plate to fix the printed circuit board;

[0017] A connecting unit is provided, through which the base plate is connected to the horizontal rotating platform.

[0018] Furthermore, in the COB device packaging rework fixture, the bottom wall of the receiving groove is provided with at least two countersunk holes, and the upper end of the horizontal rotating platform is provided with threaded holes that are equal in number and correspond one-to-one with the countersunk holes. The countersunk holes are connected to the corresponding threaded holes and are fitted with positioning bolts, which constitute the connecting unit.

[0019] Furthermore, in the COB device packaging rework fixture, a positioning block is provided at the lower end of the base plate, and a positioning groove matching the positioning block is provided at the upper end of the horizontal rotating platform.

[0020] Furthermore, in the COB device packaging rework fixture, the elastic clamping unit includes:

[0021] The first clamping block has a first notch on the side wall of the receiving groove that corresponds to the limiting block. The first clamping block is slidably disposed in the first notch, and a blind hole is provided at one end away from the receiving groove.

[0022] A positioning plate, which is connected to the base plate;

[0023] A push rod that slidably passes through the positioning plate has a push block connected to one end and a connecting rod with a radius smaller than the push rod connected to the other end. The connecting rod extends into the blind hole and its end is connected to the first clamping block.

[0024] A limiting ring is slidably sleeved on the connecting rod and connected to the positioning plate;

[0025] A spring is sleeved on the connecting rod, and its two ends abut against the bottom wall of the limiting ring and the blind hole, respectively.

[0026] Furthermore, in the COB device packaging rework fixture, a second notch is provided on the side wall of the receiving groove, which is opposite to the first notch, and a second clamping block is detachably provided on the second notch.

[0027] Furthermore, the COB device packaging rework fixture also includes:

[0028] The height adjustment mechanism and the horizontal position adjustment mechanism are arranged at intervals along the X direction on the base.

[0029] Furthermore, in the COB device packaging rework fixture, the horizontal position adjustment mechanism includes:

[0030] The Y-axis moving unit is mounted on the base.

[0031] The X-axis moving unit is disposed above the Y-axis moving unit and is connected to it in a driving manner, and the pusher assembly is disposed above the X-axis moving unit and is connected to it in a driving manner.

[0032] Furthermore, in the COB device packaging rework fixture, the pusher assembly includes:

[0033] A tool holder, which is connected to the horizontal position adjustment mechanism;

[0034] The pusher blade has its end furthest from the blade head detachably connected to the blade holder.

[0035] Furthermore, in the COB device packaging rework fixture, the pusher assembly further includes:

[0036] The quick connector has a quick-connect hole at the upper end of the tool holder, a positioning hole for the quick connector to pass through on the pusher, two grooves at the upper end of the tool holder, and two protrusions at the lower end of the pusher that correspond to the two grooves respectively.

[0037] The beneficial effects of this utility model are:

[0038] 1. In the COB device packaging rework fixture of this utility model, a micrometer-manual moving platform can be used. Through high-precision micrometer positioning, the positions of the clamping assembly and pusher assembly can be precisely controlled, ensuring the accuracy and reliability of the packaging rework fixture, improving the rework success rate of COB devices, and reducing the damage rate of COB devices. In actual use, the narrow-pitch COB device rework success rate is ≥98%, an improvement of 60% compared to traditional solutions; progressive thrust control reduces the component damage rate from 15% to below 0.5%.

[0039] 2. The COB device packaging rework fixture of this utility model has low manufacturing cost and significant cost-effectiveness. In actual manufacturing, the manufacturing cost is ≤10,000 yuan, which is only 2% of that of traditional equipment; the material loss cost per rework is reduced by 80%.

[0040] 3. The COB device packaging rework fixture of this utility model adopts a modular design, the replacement time of COB device is ≤1 minute, and the rework efficiency is improved by 70%; at the same time, the operation process is visible, the visual operation is safe and reliable, and the efficiency is high.

[0041] 4. In the COB device packaging rework fixture of this utility model, both the clamping assembly and the pusher assembly are detachable and can be installed. Various types and sizes of clamping assemblies and pusher assemblies can be set for various components such as FA, LENS, and SIP chips. The corresponding clamping assembly and pusher assembly can be replaced as needed, thereby improving the scalability of the COB device packaging rework fixture.

[0042] In this COB device packaging rework fixture, both the clamping assembly and the pusher assembly are detachable and can be installed. Various types and sizes of clamping assemblies and pusher assemblies can be set for various components such as FA, LENS, and SIP chips. The corresponding clamping assembly and pusher assembly can be replaced as needed, thereby improving the scalability of the COB device packaging rework fixture.

[0043] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the COB device packaging rework fixture described in this utility model;

[0045] Figure 2 This is a top view of the COB device packaging rework fixture described in this utility model;

[0046] Figure 3 This is a schematic diagram of the structure of the clamp assembly described in this utility model;

[0047] Figure 4 This is a schematic diagram of the push rod described in this utility model;

[0048] Figure 5 This is a schematic diagram showing the connection between the quick connector and the tool holder described in this utility model.

[0049] The reference numerals in the attached figures are as follows:

[0050] Height adjustment mechanism 1; Horizontal rotating platform 2; Clamp assembly 3; Base plate 31; Receiving groove 32; Countersunk hole 33; First clamping block 34; First notch 35; Positioning plate 36; Push rod 37; Push block 38; Connecting rod 39; Limiting ring 310; Spring 311; Second clamping block 312; Y-axis moving unit 41; X-axis moving unit 42; Tool holder 51; Push tool 52; Quick connector 53; Protrusion 54; COB device 6; Base 7. Detailed Implementation

[0051] The present invention will be further described in detail below with reference to the embodiments, so that those skilled in the art can implement it based on the description.

[0052] It should be noted that, unless otherwise specified, the experimental methods described in the following embodiments are all conventional methods, and the reagents and materials described are all commercially available unless otherwise specified. In the description of this utility model, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0053] like Figures 1-2 As shown, an embodiment of this utility model provides a COB device packaging rework fixture, comprising:

[0054] Height adjustment mechanism 1;

[0055] A horizontal rotating platform 2 is connected to the height adjustment mechanism 1 via a transmission connection.

[0056] The clamping assembly 3 is used to fix the printed circuit board of the COB device 6, and the clamping assembly 3 is detachably connected to the horizontal rotating platform 2;

[0057] Horizontal position adjustment mechanism;

[0058] A pusher assembly is connected to the horizontal position adjustment mechanism, and the blade of the pusher assembly extends horizontally above the clamp assembly 3.

[0059] In this embodiment, the clamping assembly 3 and the pusher assembly can be configured in multiple sets, with different types and sizes of clamping assemblies 3 and pusher assemblies respectively set for various COB devices 6 such as FA, LENS, and SIP chips. When reworking components, the corresponding clamping assembly 3 and pusher assembly are first replaced according to the component to be reworked. The clamping assembly 3 and pusher assembly are then installed on the horizontal rotating platform 2 and the horizontal position adjustment mechanism, respectively. At this time, the blade of the pusher assembly extends horizontally above the clamping assembly 3.

[0060] The component to be repaired is mounted on the fixture assembly 3. The horizontal rotating platform 2 drives the fixture assembly 3 to rotate, adjusting the component to the optimal operating angle. Simultaneously, the height adjustment mechanism 1 adjusts the height of the component so that its upper surface is slightly lower than the cutting edge of the cutter head. Then, the horizontal position adjustment mechanism adjusts the position of the pusher assembly so that the cutter head is aligned with the edge of the target component. The height adjustment mechanism 1 is then finely adjusted so that the cutting edge of the cutter head lightly touches the surface of the component to be repaired. The horizontal position adjustment mechanism then drives the pusher assembly to move, and the cutter head moves parallel to the edge of the component to peel off the cured adhesive layer on the edge of the component. Once the component to be repaired is detached, the horizontal position adjustment mechanism stops immediately, and the failed component on the component to be repaired can be removed.

[0061] In this embodiment, the horizontal rotating platform 2 adopts an existing 360° manual rotating stage, and the height adjustment mechanism 1, the X-axis moving unit 42 and the Y-axis moving unit 41 adopt existing precision manual displacement stages, such as a micrometer manual moving platform. Through high-precision micrometer positioning, the position of the fixture assembly 3 and the pusher assembly can be accurately controlled, ensuring the accuracy and reliability of the packaging rework fixture, improving the rework success rate of COB device 6 and reducing the damage rate of COB device 6.

[0062] Preferably, as another embodiment of this utility model, such as Figures 3-4 As shown, the clamp assembly 3 includes:

[0063] The base plate 31 has a receiving groove 32 at its upper end corresponding to the printed circuit board;

[0064] An elastic clamping unit is disposed on the base plate 31 to fix the printed circuit board;

[0065] The base plate 31 is connected to the horizontal rotating platform 2 via the connecting unit.

[0066] In this embodiment, the shape of the receiving groove 32 matches the printed circuit board of the component to be repaired. The printed circuit board is placed in the receiving groove 32 and is fixed in the receiving groove 32 by the elastic clamping unit, so that it can be stably fixed in the clamping assembly 3.

[0067] Preferably, in another embodiment of the present invention, the bottom wall of the receiving groove 32 is provided with at least two countersunk holes 33, and the upper end of the horizontal rotating platform 2 is provided with threaded holes that are equal in number and correspond one-to-one with the countersunk holes 33. The countersunk holes 33 are connected to the corresponding threaded holes and are fitted with positioning bolts, which constitute the connecting unit.

[0068] In this embodiment, in order to facilitate the quick connection between the base plate 31 and the horizontal rotating platform 2, the countersunk hole 33 on the bottom wall of the receiving groove 32 is connected to the corresponding threaded hole on the horizontal rotating platform 2. Then, the positioning bolt is installed. The positioning bolt passes through the countersunk hole 33 and is threaded into the threaded hole. Tighten the positioning bolt until its head abuts against the countersunk hole 33, and the base plate 31 and the horizontal rotating platform 2 can be connected. The head of the positioning bolt is located in the countersunk hole 33.

[0069] Preferably, in another embodiment of the present invention, the lower end of the base plate 31 is provided with a positioning block, and the upper end of the horizontal rotating platform 2 is provided with a positioning groove that matches the positioning block.

[0070] In this embodiment, in order to reduce the time required to align the countersunk hole 33 and the threaded hole on the base plate 31, a positioning block is provided at the lower end of the base plate 31, and a positioning groove is provided at the upper end of the horizontal rotating platform 2. The positioning block is embedded in the positioning groove, which enables rapid positioning of the base plate 31 and the horizontal rotating platform 2.

[0071] Preferably, as another embodiment of this utility model, such as Figures 3-4 As shown, the elastic clamping unit includes:

[0072] The first clamping block 34 has a first notch 35 on the side wall of the receiving groove 32 corresponding to the limiting block. The first clamping block 34 is slidably disposed in the first notch 35, and a blind hole is provided at one end away from the receiving groove 32. Figure 3 and Figure 4 The first clamping block 34 is not shown in the drawing.

[0073] Positioning plate 36, which is connected to the base plate 31;

[0074] A push rod 37 slidably passes through the positioning plate 36. One end of the push rod 37 is connected to a push block 38, and the other end is connected to a connecting rod 39 with a radius smaller than that of the push rod. The connecting rod 39 extends into the blind hole, and its end is connected to the first clamping block 34.

[0075] A limiting ring 310 is slidably sleeved on the connecting rod 39 and connected to the positioning plate 36;

[0076] Spring 311 is sleeved on the connecting rod 39, and its two ends abut against the limiting ring 310 and the bottom wall of the blind hole, respectively.

[0077] In this embodiment, when no external force acts on the push block 38, the spring 311 is in a compressed state, applying force to the limiting ring 310 and the first clamping block 34. The limiting ring 310 is fixed on the positioning plate 36. At this time, the first clamping block 34 moves into the receiving groove 32 under the action of the spring 311, and drives the push rod 37 to move together until the push block 38 abuts against the positioning plate 36. At this time, the first clamping block 34 is in a stationary state. When the printed circuit board is placed in the receiving groove 32, the first clamping block 34 contacts one end of the printed circuit board, and the other end of the printed circuit board abuts against the inner wall of the receiving groove 32. At this time, the first clamping block 34 applies a force towards the receiving groove 32 to the printed circuit board, thereby forming a clamping position together with the inner wall of the receiving groove 32 to clamp the printed circuit board.

[0078] When it is necessary to remove the printed circuit board from the receiving slot 32, simply pull the push block 38 outward by hand, so that the push rod 37 slides away from the receiving slot 32, and drives the first clamping block 34 to slide outward together, so as to engage the clamping of the printed circuit board.

[0079] Preferably, as another embodiment of the present invention, the side wall of the receiving groove 32 is provided with a second notch opposite to the first notch 35, and the second notch is detachably provided with a second clamping block 312.

[0080] In this embodiment, a second clamping block 312 corresponding to the first clamping block 34 is provided on the side wall of the receiving groove 32, forming a clamping position between the two. In order to prevent the printed circuit board from sticking too tightly to the inner wall of the receiving groove 32 when it is removed from the receiving groove 32, the second clamping block 312 can be removed, and the printed circuit board can be quickly removed using the first notch 35 and the second notch.

[0081] Preferably, as another embodiment of the present invention, it further includes:

[0082] The height adjustment mechanism 1 and the horizontal position adjustment mechanism are arranged at intervals along the X direction on the base 7.

[0083] In this embodiment, the height adjustment mechanism 1 and the horizontal position adjustment mechanism are mounted on the base 7 to facilitate the movement of the COB device packaging rework fixture.

[0084] Preferably, in another embodiment of the present invention, the pusher assembly includes:

[0085] The tool holder 51 is connected to the horizontal position adjustment mechanism;

[0086] The pusher 52 has its end away from the cutter head detachably connected to the cutter holder 51.

[0087] In this embodiment, such asFigure 5 As shown, the pusher assembly further includes a quick connector 53. The upper end of the blade holder 51 is provided with a corresponding quick-connect hole, and the pusher 52 is provided with a positioning hole for the quick connector 53 to pass through. The upper end of the blade holder 51 is also provided with two grooves, and the lower end of the pusher 52 is provided with two protrusions 54 corresponding to the two grooves respectively. The two protrusions 54 are respectively embedded in the two grooves to achieve quick positioning of the blade holder 51 and the pusher 52. Then, the quick connector 53 is passed through the positioning hole and inserted into the quick-connect hole. After the quick connector 53 is connected to the quick-connect hole, the lower end of the quick connector 53 presses against the blade holder 51, thereby fixing the pusher 52 on the blade holder 51.

[0088] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and embodiments shown and described herein.

Claims

1. A COB device package rework fixture, characterized by, The utility model relates to a height-adjusting mechanism, a horizontal rotary platform connected with the height-adjusting mechanism, a clamp assembly for fixing a printed circuit board of a COB device, the clamp assembly being detachably connected with the horizontal rotary platform, a horizontal position-adjusting mechanism, a push-knife assembly connected with the horizontal position-adjusting mechanism, and a knife head of the push-knife assembly extending horizontally above the clamp assembly. The clamp assembly comprises a bottom plate having a receiving groove corresponding to the printed circuit board at an upper end of the bottom plate, an elastic clamping unit arranged on the bottom plate to fix the printed circuit board, and a connecting unit through which the bottom plate is connected with the horizontal rotary platform. The bottom wall of the receiving groove is provided with at least two counterbores, the upper end of the horizontal rotary platform is provided with screw holes equal in number to the counterbores and corresponding to the counterbores, the counterbores are in communication with the corresponding screw holes, and positioning bolts are arranged in the counterbores to form the connecting unit. The lower end of the bottom plate is provided with a positioning block, and the upper end of the horizontal rotary platform is provided with a positioning groove matched with the positioning block. The elastic clamping unit comprises a first clamping block, a first notch corresponding to the limiting block being arranged on the side wall of the receiving groove, the first clamping block being slidably arranged in the first notch, and a blind hole being arranged at an end of the first clamping block away from the receiving groove. The elastic clamping unit further comprises a positioning plate connected with the bottom plate, a push rod slidably penetrating through the positioning plate, a push block connected with one end of the push rod, a connecting rod with a smaller radius than the push rod being connected with the other end of the push rod, the connecting rod extending into the blind hole and being connected with the first clamping block at an end thereof, a limiting ring slidably sleeved on the connecting rod and connected with the positioning plate, and a spring sleeved on the connecting rod and abutting against the limiting ring and the bottom wall of the blind hole at two ends thereof.

2. The COB device package repair fixture of claim 1, wherein, A second notch opposite to the first notch is arranged on the side wall of the receiving groove, and a second clamping block is detachably arranged in the second notch. The utility model further comprises a base on which the height-adjusting mechanism and the horizontal position-adjusting mechanism are arranged at intervals along an X direction. The horizontal position-adjusting mechanism comprises a Y-axis moving unit arranged on the base, and an X-axis moving unit arranged above the Y-axis moving unit and connected with the Y-axis moving unit in transmission, and the push-knife assembly is arranged above the X-axis moving unit and connected with the X-axis moving unit in transmission. The push-knife assembly comprises a knife seat connected with the horizontal position-adjusting mechanism, and a push knife detachably connected with the knife seat at an end thereof away from a knife head.

3. The COB device package repair fixture of claim 2, wherein, The push-knife assembly further comprises a quick connector, a quick connector hole corresponding to the quick connector being arranged at an upper end of the knife seat, a positioning hole through which the quick connector penetrates being arranged on the push knife, and two convex blocks corresponding to two recesses of the knife seat being arranged at a lower end of the push knife.

4. The COB device package repair fixture of claim 2, wherein, ​ 5. The COB device package repair fixture of claim 2, wherein, ​ ​ ​ ​ ​ ​ 6. The COB device package repair fixture of claim 5, wherein, ​ 7. The COB device package repair fixture of claim 1, wherein, ​ ​ 8. The COB device package repair fixture of claim 7, wherein, ​ ​ ​ 9. The COB device package repair fixture of claim 1, wherein, ​ ​ ​ 10. The COB device package repair fixture of claim 9, wherein, ​ ​

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