Cushion pad of chip mounter
By designing a buffer pad structure consisting of an upper tray, a core damping pad, and a lower tray, the problems of poor shock absorption and noise reduction, as well as deviation and detachment of the buffer pad in the pick-and-place machine, were solved, achieving better shock absorption, noise reduction, and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-03-10
AI Technical Summary
The existing pick-and-place machine's buffer pads have poor shock absorption and noise reduction effects and are prone to deviation and detachment.
Design a buffer pad structure including an upper tray, a core damping pad and a lower tray. The core damping pad is recessed in the middle and fits against the raised surface of the upper tray. Its edge rigidity is higher than the contact part of the raised part of the upper tray. It is combined with a second and a third damping pad to enhance stability.
It effectively reduces vibration and noise during high-speed placement of components by the pick-and-place machine, prevents the buffer structure from deviating, misaligning, or detaching, and improves stability.
Smart Images
Figure CN223987239U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model discloses a buffer pad of chip mounter. BACKGROUND
[0002] Chip mounter is a kind of equipment that is accurately placed on PCB pad by moving mounting head in production line.
[0003] Vibration and noise are generated in the high-speed patching process of chip mounter.The existing solution is generally to pad a rubber pad under the foot.However, such accessory structure is too simple, and the shock-absorbing and noise-reducing effect is not good, and it is easy to deviate and separate.
[0004] Therefore, we design a kind of buffer pad of chip mounter. CONTENT OF THE UTILITY MODEL
[0005] In view of the problems existing in the prior art, the utility model provides a kind of buffer pad of chip mounter, to solve the problems of poor shock-absorbing and noise-reducing effect of existing buffer pad and easy deviation and separation.
[0006] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows: a kind of buffer pad of chip mounter, including upper tray, core damping pad and lower tray, the middle of the upper tray is equipped with supporting groove, and the convex surface of the reverse face is along the edge;The lower tray is equipped with supporting groove, and the core damping pad is attached to the bottom surface and side wall of the supporting groove of the lower tray, and the core damping pad is equipped with along the edge and is placed on the edge of the lower tray;The middle of the core damping pad is recessed and is attached to the convex surface and side surface of the reverse face of the upper tray;The rigidity of the edge of the core damping pad is higher than the contact part of the convex of the upper tray.
[0007] Preferably, the surface of the upper tray groove is attached with the second damping pad.
[0008] Preferably, the bottom of the lower tray is equipped with the third damping pad.
[0009] Preferably, the contact part of the core damping pad and the convex of the upper tray is of soft structure with fluidity.
[0010] The utility model has the advantages of effectively reducing the vibration and noise generated in the high-speed patching process of chip mounter, and the buffer structure will not deviate and dislocate between the foot and the ground, so as to cause separation. DRAWINGS
[0011] Figure 1 It is the structure schematic diagram of the utility model.
[0012] Figure 2 It is the structure schematic diagram of the upper tray and the lower tray of the utility model. DETAILED DESCRIPTION
[0013] As Figure 1 ,2 As shown in the figure, a patch machine buffer pad is composed of an upper tray 1, a core damping pad 2 and a lower tray 3, the upper tray 1 is provided with a supporting groove in the middle and a convex surface on the edge and the back, the lower tray 3 is provided with a supporting groove, the core damping pad 2 is attached to the bottom surface and the side wall of the supporting groove of the lower tray 3, and the core damping pad 2 is provided with an edge which is attached to the edge of the lower tray 3, the middle of the core damping pad 2 is recessed and attached to the convex surface and the side surface of the back of the upper tray 1, and the edge of the core damping pad 2 has higher rigidity than the contact part of the upper tray 1.
[0014] The upper tray 1 is provided with a second damping pad 4 attached to the groove surface, and the lower tray 3 is provided with a third damping pad attached to the bottom.
[0015] The contact part of the core damping pad 2 and the upper tray 1 is provided with a soft structure with fluidity (existing technology), which can effectively reduce noise and shock.
[0016] The lower tray 3 mainly functions to support the foot of the patch machine and increase the supporting surface of the foot of the patch machine, the upper tray 1 and the second damping pad 4 can effectively reduce the horizontal amplitude of the patch machine in the X-Y direction, and the third damping pad attached to the bottom of the lower tray 3 can prevent relative sliding with the ground.
[0017] In addition, the edge of the core damping pad 2 has higher rigidity than the contact part of the upper tray 1, which can make the overall structure stable, and the central buffer structure will not deviate and dislocate from the foot and the ground.
[0018] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement or improvement within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims
1. A patch placement machine cushion, characterized by, It comprises an upper tray (1), a core damping pad (2) and a lower tray (3), the upper tray (1) is provided with a supporting groove in the middle and a convex surface on the edge and the reverse side; the lower tray (3) is provided with a supporting groove, the core damping pad (2) is attached to the bottom surface and the side wall of the supporting groove of the lower tray (3), and the core damping pad (2) is provided with an edge which is attached to the edge of the lower tray (3); the core damping pad (2) is recessed in the middle and is attached to the convex surface and the side surface of the reverse side of the upper tray (1); the edge of the core damping pad (2) is solid and is in contact with the convex contact part of the upper tray (1).
2. The cushion for a chip mounter according to claim 1, wherein The surface of the groove of the upper tray (1) is attached with a second damping pad (4).
3. The cushion for a chip mounter according to claim 1, wherein The bottom of the lower tray (3) is provided with a third damping pad.
4. The cushion for a chip mounter according to claim 1, wherein The contact part of the core damping pad (2) and the upper tray (1) is provided with a soft structure with fluidity.