Heat dissipation device

Abstract

The utility model provides a heat dissipation device. The heat dissipation device comprises at least one pair of heat dissipation assemblies; each pair of heat dissipation assemblies comprises a heat dissipation fan and a fixing support. The cooling fan is assembled on the fixing support, and the fixing support is installed on the PCB. The fixing support is provided with an assembling area and a receding area which are opposite in the first direction. When the fixing support is installed on the PCB, the clearance area faces the PCB. The fixing support is provided with a positioning column, a limiting clamping hook, a first buckle, a second buckle, an expansion clamping strip and an expansion clamping groove. The positioning columns are matched with the positioning holes so as to limit the degree of freedom of the cooling fan in the first direction and the third direction; the limiting clamping hook can limit the freedom degree of the cooling fan in the second direction. Every two adjacent heat dissipation assemblies can be spliced in the mode that the expansion clamping strips of one heat dissipation assembly are matched with the expansion clamping grooves of the other heat dissipation assembly. The heat dissipation device can be rapidly and efficiently disassembled and assembled, the utilization rate of the PCB can be improved, and the heat dissipation device further has an expansion function.

Description

TECHNICAL FIELD

[0001] The utility model relates to energy storage device technical field, especially a heat dissipation device. BACKGROUND

[0002] At present, with the development and application of energy storage device, users pay more and more attention to the portability of energy storage device, therefore, energy storage device needs to have smaller limit size to have better portability.

[0003] Generally speaking, the heat dissipation device (which is usually composed of at least one set of heat dissipation fan and fixed support) in the energy storage device is installed on the PCB (Printed Circuit Board) to realize the heat dissipation function.

[0004] However, the heat dissipation fan in the traditional heat dissipation device is fixed by screw, and this fixing method needs to occupy a large space, thus leading to limited size compression of the traditional energy storage device; and because there are several electronic components on the PCB, the traditional heat dissipation device usually makes the heat dissipation fan into special shape in order to reduce the influence on the PCB layout wiring or electronic component placement, thus leading to reduced utilization and increased cost, and screw fixing or foam buffer also increases the assembly cost. SUMMARY

[0005] The heat dissipation device provided by the utility model aims to solve at least one part of defects of the existing heat dissipation device suitable for energy storage device.

[0006] The utility model provides a heat dissipation device. The heat dissipation device is applied to the energy storage device with PCB, and the heat dissipation device comprises:

[0007] At least one pair of heat dissipation components; each pair of heat dissipation components comprises a heat dissipation fan and a fixed support; the heat dissipation fan is assembled on the fixed support, and the fixed support is installed on the PCB;

[0008] The fixed support has opposite assembly area and avoidance area in the first direction; when the fixed support is installed on the PCB, the avoidance area faces the PCB, at this time, the first direction is perpendicular to the surface of the PCB;

[0009] The fixed support is provided with positioning column, limit hook, first buckle, second buckle, expansion card strip and expansion card slot; the positioning column and the limit hook are arranged inside the assembly area, and the positioning column extends along the second direction; the first buckle and the second buckle are close to the avoidance area, and are located outside the avoidance area; the expansion card strip and the expansion card slot are respectively arranged on the opposite sides of the fixed support in the third direction;

[0010] The first direction, the second direction and the third direction are perpendicular to each other; the heat dissipation fan is provided with a positioning hole, and the heat dissipation fan has opposite first and second sides in the axial direction of the positioning hole;

[0011] When the heat dissipation fan at least partially extends into the assembly area, the positioning column is inserted into the positioning hole from the first side to limit the freedom of the heat dissipation fan in the first direction and the third direction; the limiting clasp abuts against the second side to limit the freedom of the heat dissipation fan in the second direction, and at this time, the second direction is parallel to the axial direction of the positioning hole.

[0012] In some embodiments, the PCB is provided with a first clamping hole and a second clamping hole, the first clamping hole can be clamped with the first clamping hole, and the second clamping hole can be clamped with the second clamping hole, so that the heat dissipation assembly is fixedly assembled on the PCB;

[0013] The adjacent two heat dissipation assemblies can be fixedly connected through the expansion clamping strip of one heat dissipation assembly and the expansion clamping groove of the other heat dissipation assembly.

[0014] In some embodiments, the PCB is provided with a plurality of electronic elements, and the clearance area inside can cover at least a part of the electronic elements;

[0015] The clearance area has a preset target height in the first direction, and the target height is greater than the height dimension of any one electronic element covered inside the clearance area in the first direction.

[0016] In some embodiments, the heat dissipation fan comprises:

[0017] A fan housing and a fan impeller; the fan impeller is fixed inside the fan housing, and the positioning hole is opened on the fan housing;

[0018] Among them, the axial direction of the positioning hole is parallel to the axial direction of the fan impeller.

[0019] In some embodiments, the positioning column has a preset outer diameter size, and the positioning hole has a preset inner diameter size; when the positioning column is inserted into the positioning hole, the outer diameter size is matched with the inner diameter size;

[0020] The positioning column has an elastic deformation capacity to limit the outer diameter size to be smaller, so that the outer surface of the positioning column can be tightly attached to the inner surface of the positioning hole.

[0021] In some embodiments, the second buckle has a notch, and the second buckle hole has a tail slot.

[0022] When the second buckle and the second buckle hole are mutually buckled, the opening position of the notch corresponds to the opening position of the tail slot.

[0023] In some embodiments, the expansion buckle strip comprises:

[0024] A buckling part and a locking hook; the locking hook is arranged on the buckling part;

[0025] The buckling part has opposite opening ends and closed ends in the second direction, and the locking hook is located at the closed end.

[0026] In some embodiments, the expansion buckle slot comprises:

[0027] A buckling cavity and a locking cavity; the buckling cavity has a size and shape suitable for the buckling part, and the locking cavity has a size and shape suitable for the locking hook.

[0028] In some embodiments, the buckling part of one of the two adjacent fixing supports and the buckling cavity of the other fixing support can be matched with each other to limit the freedom of any one of the two adjacent fixing supports in the first direction, the second direction and the third direction.

[0029] In some embodiments, the locking hook of one of the two adjacent fixing supports and the locking cavity of the other fixing support can be matched with each other to limit any one of the two adjacent fixing supports from being separated from the other fixing support, so as to fixedly connect the two adjacent heat dissipation assemblies.

[0030] At least one beneficial effect of the heat dissipation device provided by the embodiments of the present application is that a novel on-board heat dissipation device suitable for energy storage equipment is proposed, which can replace the screw fixing mode of the traditional heat dissipation device by adding the structure design of the positioning column, the limiting hook, the first buckle, the second buckle, the expansion buckle strip and the expansion buckle slot, so that the heat dissipation device can be quickly and efficiently installed and disassembled, and also has an expansion function, that is, the splicing and assembly between multiple heat dissipation assemblies can be realized. By adding the design of the empty area, the influence on the PCB layout wiring or electronic element placement can be reduced, thereby improving the utilization rate of the PCB. BRIEF DESCRIPTION OF DRAWINGS

[0031] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0032] Figure 1 A schematic diagram of a heat dissipation device with a heat dissipation component provided in an embodiment of the present utility model;

[0033] Figure 2 A schematic diagram of a heat dissipation device with two heat dissipation components provided in an embodiment of this utility model;

[0034] Figure 3 An exploded view of the heat dissipation assembly provided in an embodiment of this utility model;

[0035] Figure 4 A partial cross-sectional view of the heat dissipation assembly provided in an embodiment of this utility model;

[0036] Figure 5 Provided for the embodiments of this utility model Figure 4 A magnified view of a portion at point A;

[0037] Figure 6 Provided for the embodiments of this utility model Figure 4 A magnified view of a portion at point B;

[0038] Figure 7 A partial cross-sectional view of the heat dissipation device provided in an embodiment of this utility model;

[0039] Figure 8 Provided for the embodiments of this utility model Figure 7 A magnified view of a portion at point C;

[0040] Figure 9 An exploded view of a heat dissipation device with a heat dissipation component provided in an embodiment of the present invention;

[0041] Figure 10 A schematic diagram of the structure of the fixed bracket provided in an embodiment of this utility model (I);

[0042] Figure 11 Provided for the embodiments of this utility model Figure 10 A magnified view of a portion at point D;

[0043] Figure 12 A schematic diagram (II) of the structure of the fixed bracket provided in the embodiment of this utility model;

[0044] Figure 13 Provided for the embodiments of this utility model Figure 12 A magnified view of a portion at point E;

[0045] Figure 14 Partial sectional view (one) of two heat dissipation assemblies in splicing condition provided by the embodiment of the utility model;

[0046] Figure 15 Partial sectional view (two) of two heat dissipation assemblies in splicing condition provided by the embodiment of the utility model; Figure 14 Partial enlarged view of at F of the utility model embodiment provides

[0047] Figure 16 Partial sectional view (two) of two heat dissipation assemblies in splicing condition provided by the embodiment of the utility model;

[0048] Figure 17 Partial enlarged view of at G of the utility model embodiment provides Figure 16 Partial enlarged view of at G of the utility model embodiment provides

[0049] Reference signs:

[0050] 100, heat dissipation assembly;1, heat dissipation fan;11, fan housing;12, fan impeller;101, first side;102, second side;111, positioning hole;1111, axial direction of positioning hole;1201, axial direction of fan impeller;2, fixed support;21, positioning column;22, limit hook;23, first buckle;24, second buckle;25, expansion card strip;26, expansion card slot;201, first direction;202, second direction;203, third direction;204, assembly area;205, empty area;241, notch;251, clamping part;252, locking hook;2501, open end;2502, closed end;261, clamping cavity;262, locking cavity;

[0051] 200, PCB board;2001, first clamping hole;2002, second clamping hole;2003, tail groove. Specific implementation

[0052] The utility model will be explained in detail in combination with specific embodiment, it should be emphasized that the following explanation is only exemplary, and is not for limiting the range of the utility model and its application.

[0053] It should be noted that, unless otherwise explicitly specified and limited, the terms "first direction", "second direction", "third direction", "insert", "opposite", "external", "internal" and the like used in the specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. The terms "mounting", "fitting", "connecting", "fixing" and the like should be understood broadly, for example, "connecting" can be fixed connection, can also be detachable connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; "fixing" can be bolted, can also be buckled, can also be glued; the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features; therefore, the features limited by "first", "second", "third" can explicitly or implicitly include one or more features; "multiple" or "several" means two and more; in addition, "and / or" includes any and all combinations of one or more related listed items; the specific meaning of the above terms in the utility model can be understood according to the specific circumstances by those skilled in the art.

[0054] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model will be described in detail below with reference to the drawings and specific embodiments.

[0055] In the embodiment, the specific shape, structure and size of the heat dissipation device are not limited, and those skilled in the art can selectively use suitable heat dissipation devices according to actual needs.

[0056] Figure 1 The structural schematic diagram of the heat dissipation device with one heat dissipation assembly provided by the embodiment of the utility model is shown. Figure 2 The structural schematic diagram of the heat dissipation device with two heat dissipation assemblies provided by the embodiment of the utility model is shown. Figure 3 The exploded schematic diagram of the heat dissipation assembly provided by the embodiment of the utility model is shown. Figure 4 The partial sectional view of the heat dissipation assembly provided by the embodiment of the utility model is shown.

[0057] Figure 5 The partial enlarged view of the heat dissipation assembly provided by the embodiment of the utility model at A is shown. Figure 4 The partial enlarged view of the heat dissipation assembly provided by the embodiment of the utility model at B is shown. Figure 6 The partial enlarged view of the heat dissipation assembly provided by the embodiment of the utility model at B is shown. Figure 4 The partial enlarged view of the heat dissipation assembly provided by the embodiment of the utility model at B is shown. Figure 7The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 8 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 7 The partial enlarged view of the heat dissipation device at C. Figure 9 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 10 The structural schematic diagram (one) of the fixing support is provided for the embodiment of the utility model. Figure 11 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 10 The partial enlarged view of the heat dissipation device at D. Figure 12 The structural schematic diagram (two) of the fixing support is provided for the embodiment of the utility model. Figure 13 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 12 The partial enlarged view of the heat dissipation device at E. Figure 14 The partial sectional view (one) of the two heat dissipation components under splicing is provided for the embodiment of the utility model. Figure 15 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 14 The partial enlarged view of the heat dissipation device at F. Figure 16 The partial sectional view (two) of the two heat dissipation components under splicing is provided for the embodiment of the utility model. Figure 17 The partial sectional view of the heat dissipation device is provided for the embodiment of the utility model. Figure 16 The partial enlarged view of the heat dissipation device at G.

[0058] Please refer to Figures 1-17 The heat dissipation device (not shown in the figure) is applied to the energy storage equipment (not shown in the figure) with the PCB board 200, and the heat dissipation device (not shown in the figure) comprises at least one pair of heat dissipation components 100.

[0059] Each pair of heat dissipation components 100 comprises a heat dissipation fan 1 and a fixing support 2.

[0060] In addition, the heat dissipation fan 1 is assembled on the fixing support 2, and the fixing support 2 is installed on the PCB board 200.

[0061] In addition, the fixing support 2 has opposite assembly areas 204 and avoidance areas 205 in the first direction 201; when the fixing support 2 is installed on the PCB board 200, the avoidance area 205 faces the PCB board 200, and at this time, the first direction 201 is perpendicular to the surface of the PCB board 200.

[0062] In the embodiment of the present application, the fixing support 2 is provided with a positioning column 21, a limiting clamping hook 22, a first clasp 23, a second clasp 24, an expansion clamping strip 25 and an expansion clamping groove 26; the positioning column 21 and the limiting clamping hook 22 are both arranged inside the assembly area 204, and the positioning column 21 extends along the second direction 202; the first clasp 23 and the second clasp 24 are both close to the avoidance area 205 and are both located outside the avoidance area 205; the expansion clamping strip 25 and the expansion clamping groove 26 are respectively arranged on opposite sides of the fixing support 2 in the third direction 203.

[0063] In the embodiment of the present application, the positioning column 21 can be two, and is symmetrically arranged along the third direction 203, so as to provide the heat dissipation fan 1 with limiting and fixing in the first direction 201 and the third direction 203; it is further explained that the limiting clamping hook 22 can also be two, and is also symmetrically arranged along the third direction 203, so as to provide the heat dissipation fan 1 with limiting and fixing in the second direction 202; and moreover, the expansion clamping strip 25 and the expansion clamping groove 26 provide connecting and fixing functions for the splicing and expansion between the two adjacent fixing supports 2.

[0064] It should be explained that the first direction 201, the second direction 202 and the third direction 203 are orthogonal to each other; the heat dissipation fan 1 is provided with a positioning hole 111, and the heat dissipation fan 1 has opposite first and second sides 101 and 102 in the axial direction 1111 of the positioning hole.

[0065] It can be understood that when the heat dissipation fan 1 at least partially extends into the inside of the assembly area 204, the positioning column 21 is inserted into the positioning hole 111 from the first side 101, so as to limit the freedom degree of the heat dissipation fan 1 in the first direction 201 and the third direction 203; the limiting clamping hook 22 abuts against the second side 102, so as to limit the freedom degree of the heat dissipation fan 1 in the second direction 202, at this time, the second direction 202 is parallel to the axial direction 1111 of the positioning hole.

[0066] Specifically, the PCB board 200 is provided with a first clamping hole 2001 and a second clamping hole 2002, the first clasp 23 can be buckled with the first clamping hole 2001, and the second clasp 24 can be buckled with the second clamping hole 2002, so that the heat dissipation assembly 100 is fixedly assembled on the PCB board 200.

[0067] It is further explained that the expansion clamping strip 25 of one of the two adjacent heat dissipation assemblies 100 and the expansion clamping groove 26 of the other heat dissipation assembly 100 can be fixedly connected by mutual cooperation.

[0068] In summary, this heat dissipation device uses a snap-fit ​​fixing method instead of the screw fixing method of traditional heat dissipation devices, which can reduce space occupation and reduce the impact on PCB layout routing or electronic component placement, thereby improving the utilization rate of PCB board 200. At the same time, this heat dissipation device can also reduce the assembly cost of screw fixing or foam cushioning. Furthermore, this heat dissipation device can achieve quick and efficient installation and disassembly, and also has expansion function, that is, it can realize the splicing and assembly of multiple heat dissipation components 100.

[0069] In some embodiments, such as Figures 1-17 As shown, a number of electronic components (not shown in the figure) are arranged on the PCB, and the clearance area 205 can cover at least a portion of the electronic components (not shown in the figure).

[0070] Specifically, the airspace 205 has a preset target height in the first direction 201, and the target height is greater than the height of any electronic component covered inside the airspace 205 in the first direction 201.

[0071] In this embodiment of the application, the target height of the clearance area 205 in the first direction 201 can be 6.5mm, so that electronic components can be placed inside the clearance area 205, thereby reducing the impact on the placement of electronic components and improving the utilization rate of the PCB board 200.

[0072] In some embodiments, combined with Figures 1-17 It can be seen that the cooling fan 1 includes: fan housing 11 and fan impeller 12.

[0073] The fan impeller 12 is fixed inside the fan housing 11, and the positioning hole 111 is opened on the fan housing 11.

[0074] In addition, the axial direction 1111 of the positioning hole is parallel to the axial direction 1201 of the fan impeller.

[0075] In some embodiments, according to Figures 1-17 It can be seen that the positioning pin 21 has a preset outer diameter and the positioning hole 111 has a preset inner diameter; when the positioning pin 21 is inserted into the positioning hole 111, the outer diameter and the inner diameter are matched.

[0076] It should be noted that the positioning post 21 has the elastic deformation capability to limit the decrease of the outer diameter size, so that the outer surface of the positioning post 21 can be closely attached to the inner surface of the positioning hole 111, thereby forming an interference fit between the positioning post 21 and the positioning hole 111.

[0077] In some embodiments, by Figures 1-17 It can be seen that the second buckle 24 has a notch 241, and the second latch 2002 has a tail groove 2003.

[0078] It is understandable that when the second latch 24 and the second latch 2002 are engaged, the opening position of the notch 241 corresponds to the opening position of the tail groove 2003.

[0079] In this embodiment of the application, there may be two first buckles 23, which are symmetrically arranged along the third direction 203; further, the first buckles 23 are fixed buckles, that is, the first buckles 23 do not have elastic deformation capability.

[0080] Specifically, the user can insert a flathead screwdriver into the end slot 2003 and apply external force to the notch 241, thereby prying the second clip 24 out of the second latch 2002.

[0081] In some embodiments, refer to Figures 1-17 It is known that the expansion clip 25 includes: a locking part 251 and a locking hook 252.

[0082] The locking hook 252 is provided on the engaging part 251.

[0083] In addition, the engaging portion 251 has an open end 2501 and a closed end 2502 in the second direction 202, and the locking hook 252 is located at the closed end 2502.

[0084] like Figure 14 and Figure 14 As shown, the engaging part 251 is T-shaped.

[0085] In some embodiments, please continue reading Figures 1-17 The expansion slot 26 includes: a engaging cavity 261 and a locking cavity 262.

[0086] Specifically, the engaging cavity 261 has a size and shape that are adapted to the engaging part 251, and the locking cavity 262 has a size and shape that are adapted to the locking hook 252.

[0087] In some embodiments, please refer to Figures 1-17 The degrees of freedom of any one of the two adjacent fixed supports 2 in the first direction 201, the second direction 202, and the third direction 203 can be restricted by the cooperation between the engaging part 251 of one fixed support 2 and the engaging cavity 261 of the other fixed support 2.

[0088] In some embodiments, such as Figures 1-17 As shown, the locking hook 252 of one fixed bracket 2 can cooperate with the locking cavity 262 of the other fixed bracket 2 to restrict any one of the two fixed brackets 2 from detaching from the other fixed bracket 2, so as to fix the two adjacent heat dissipation components 100 together.

[0089] Combination Figures 1-17 The process of installing the heat dissipation component 100 onto the PCB board 200 is described in detail below: First, the first clip 23 is inserted at an angle into the first slot 2001. Then, the heat dissipation component 100 is aligned so that the first clip 23 and the first slot 2001 are engaged with each other. Finally, the second clip 24 is engaged with the second slot 2002, thereby allowing the heat dissipation component 100 to be installed onto the PCB board 200.

[0090] Combination Figures 1-17 The process of installing the heat dissipation component 100 onto the PCB board 200 is described in detail below: First, insert a flathead screwdriver into the end slot 2003 and align it with the notch 241. Then, apply external force to disengage the second clip 24 from the second latch 2002. Finally, tilt the heat dissipation component 100 to disengage the first clip 23 from the first latch 2001, thereby removing the heat dissipation component 100 from the PCB board 200.

[0091] Combination Figures 1-17 The splicing and expansion process between the two heat dissipation components 100 is described in detail below: Align the expansion card strip 25 with the expansion card slot 26 and insert it. After hearing a "click" sound, the splicing and expansion between the two heat dissipation components 100 can be achieved.

[0092] In summary, the heat dissipation device provided by this utility model embodiment, through the structural design of incorporating positioning posts, limiting hooks, a first buckle, a second buckle, an expansion strip, and an expansion slot, can use a snap-fit ​​fixing method to replace the screw fixing method of traditional heat dissipation devices. This allows for quick and efficient installation and disassembly of the heat dissipation device. It also has an expansion function, enabling the splicing and assembly of multiple heat dissipation components. The inclusion of a clearance area design reduces the impact on PCB layout routing or electronic component placement, thereby improving PCB board utilization. Therefore, the heat dissipation device for energy storage devices provided by this utility model embodiment has a certain degree of novelty compared to traditional heat dissipation devices for energy storage devices.

[0093] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and all of these fall within the protection scope of the present invention.

Claims

1. A heat dissipation device applied to an energy storage device with a PCB board, characterized in that, The heat dissipation device comprises: at least one pair of heat dissipation assemblies; each pair of heat dissipation assemblies comprises a heat dissipation fan and a fixed support; the heat dissipation fan is assembled on the fixed support, and the fixed support is installed on the PCB board; the fixed support has opposite assembly areas and clearance areas in the first direction; when the fixed support is installed on the PCB board, the clearance areas are towards the PCB board, and at this time, the first direction is perpendicular to the surface of the PCB board; the fixed support is provided with positioning columns, limiting hooks, first buckles, second buckles, expansion card strips and expansion card slots; the positioning columns and the limiting hooks are arranged inside the assembly areas, and the positioning columns extend in the second direction; the first buckles and the second buckles are close to the clearance areas and are located outside the clearance areas; the expansion card strips and the expansion card slots are respectively arranged on opposite sides of the fixed support in the third direction; the first direction, the second direction and the third direction are orthogonal to each other; the heat dissipation fan is provided with a positioning hole, and the heat dissipation fan has opposite first and second sides in the axial direction of the positioning hole; when at least part of the heat dissipation fan extends into the assembly area, the positioning column is inserted into the positioning hole from the first side to limit the freedom of the heat dissipation fan in the first direction and the third direction; the limiting hook abuts against the second side to limit the freedom of the heat dissipation fan in the second direction, and at this time, the second direction is parallel to the axial direction of the positioning hole.

2. The heat dissipation device according to claim 1, wherein: the PCB board is provided with first and second buckles, the first buckle can be buckled with the first buckle, and the second buckle can be buckled with the second buckle, so that the heat dissipation assembly is fixedly assembled on the PCB board; adjacent two heat dissipation assemblies can be fixedly connected through the expansion card strip of one heat dissipation assembly and the expansion card slot of the other heat dissipation assembly.

3. The heat dissipation device according to claim 2, wherein: the PCB is provided with a plurality of electronic elements, and the clearance area can cover at least part of the electronic elements; the clearance area has a preset target height in the first direction, and the target height is greater than the height dimension of any one electronic element covered in the clearance area in the first direction.

4. The heat dissipating device according to claim 3, wherein The heat dissipation fan comprises: a fan shell and a fan impeller; the fan impeller is fixed inside the fan shell, and the positioning hole is formed in the fan shell; wherein the axial direction of the positioning hole is parallel to the axial direction of the fan impeller.

5. The heat dissipation device according to claim 4, wherein: the positioning column has a preset outer diameter size, and the positioning hole has a preset inner diameter size; when the positioning column is inserted into the positioning hole, the outer diameter size and the inner diameter size are matched; The positioning column has an elastic deformation capacity to limit the outer diameter size to be smaller, so that the outer surface of the positioning column can be tightly attached to the inner surface of the positioning hole.

6. The heat dissipation device of claim 2, wherein, The second buckle has a notch, and the second buckle has a tail groove; When the second buckle and the second buckle are buckled with each other, the opening position of the notch corresponds to the opening position of the tail groove.

7. The heat dissipating device according to claim 6, wherein The expansion card slot includes: The locking hook is arranged on the clamping portion; The clamping portion has opposite opening ends and closed ends in the second direction, and the locking hook is located at the closed end.

8. The heat dissipating device according to claim 7, wherein The expansion card slot includes: The clamping cavity has a size and shape suitable for the clamping portion, and the locking cavity has a size and shape suitable for the locking hook.

9. The heat dissipation device of claim 8, wherein, The clamping portion of one of the two adjacent fixing supports and the clamping cavity of the other fixing support can be matched with each other to limit the freedom of any one of the two adjacent fixing supports in the first direction, the second direction and the third direction.

10. The heat dissipation device of claim 9, wherein, The locking hook of one of the two adjacent fixing supports and the locking cavity of the other fixing support can be matched with each other to limit any one of the two adjacent fixing supports from being separated from the other fixing support, so that the two adjacent heat dissipation assemblies are fixedly connected.

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