Small-corner coaxial light source for high-precision wafer defect detection

Abstract

The utility model discloses a small-corner coaxial light source for high-precision wafer defect detection. The small-corner coaxial light source comprises a main shell, a spectroscope, a diffusion plate and a circuit board, the main shell is of a hollow frame structure with an upper opening and a lower opening, and an inclined groove face is formed in the upper end of the main shell. The spectroscope is arranged on the inclined groove surface, and the two edges of the spectroscope are fixedly connected with the side wall of the inclined groove surface through dispensing; lED lamp beads are arranged on the circuit board, and the circuit board is detachably fixed to the lower end of the main shell, so that the LED lamp beads are arranged in the main shell and right face the spectroscope; and the diffusion plate is arranged between the circuit board and the spectroscope. According to the utility model, the structures of the main shell, the spectroscope and the diffusion plate are improved, so that the imaging requirement of high-precision wafer defect detection is met.

Description

Technical Field

[0001] This utility model relates to the field of detection light source technology, and in particular to a small-angle coaxial light source for high-precision wafer defect detection. Background Technology

[0002] As semiconductor wafer manufacturing processes become increasingly demanding, so too do wafer inspection requirements. Currently, for defect detection in semiconductor wafers, given their relatively small size, most methods rely on ordinary small-angle coaxial light sources. However, these ordinary coaxial light sources offer relatively low accuracy in detecting wafer defects and edge contours, failing to meet the imaging requirements for high-precision wafer defect detection. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a small-angle coaxial light source for high-precision wafer defect detection to meet the imaging requirements of high-precision wafer defect detection.

[0004] To achieve the above objectives, this utility model provides a small-angle coaxial light source for high-precision wafer defect detection, including a main housing, a beam splitter, a diffuser plate, and a circuit board;

[0005] The main housing is a hollow frame structure with openings at the top and bottom, and the upper end of the main housing forms a sloping groove surface;

[0006] The beam splitter is mounted on the inclined groove surface, and the two sides of the beam splitter are fixedly connected to the side wall of the inclined groove surface by dispensing adhesive.

[0007] The circuit board is equipped with LED beads, and the circuit board is detachably fixed to the lower end of the main housing, so that the LED beads are placed inside the main housing and facing the beam splitter.

[0008] The diffuser plate is disposed between the circuit board and the beam splitter.

[0009] Furthermore, several adhesive application points are symmetrically arranged on both sides of the inclined groove surface. The two sides of the beam splitter abut against these adhesive application points, and adhesive is applied at these points to fix the beam splitter. Fixing the beam splitter on the plane of the inclined groove surface and applying adhesive through these six adhesive application points ensures that the lens is evenly stressed after adhesive application, avoiding stretching and deformation that would affect the imaging effect.

[0010] Furthermore, the inclined groove surface is set at a horizontal angle of 45°. This setting allows the beam splitter mounted on the inclined groove surface to be tilted at 45° with the circuit board, maximizing reflection / transmission efficiency and minimizing energy loss.

[0011] Furthermore, a first mounting groove is formed at the lower end of the main housing, and mounting ears extend outward from both ends of the diffuser plate, which are detachably connected to the wall of the first mounting groove. The first mounting groove and mounting ears work together to install the diffuser plate, and the mounting ears are embedded within the wall of the main housing. The mounting screws do not affect the operation of the diffuser plate, thereby improving its stability.

[0012] Furthermore, the diffuser plate is a high-haze diffuser plate with a haze of 97.5% to 99.5%. Using a high-haze diffuser plate material can avoid light shadows and graininess when the light source is lit, thus preventing the image from being affected by poor imaging accuracy.

[0013] Furthermore, a first auxiliary groove communicating with the first mounting groove is provided inside the main housing, and the first auxiliary groove abuts against the outer edge of the diffuser plate. By providing the first auxiliary groove, the outer edge of the diffuser plate can be supported, preventing the diffuser plate from being suspended and bent or damaged, thereby improving the stability of light propagation and improving detection accuracy.

[0014] Furthermore, a first connecting hole is provided at the lower end of the main housing, and a second connecting hole matching the first connecting hole is provided on the circuit board. The circuit board is detachably connected by screws engaging the first and second connecting holes. This detachable connection of the circuit board through the engagement of the first and second connecting holes improves the efficiency of installation and repair.

[0015] Furthermore, a gap is formed between the circuit board and the diffuser plate. This allows for sufficient light propagation space between the circuit board and the diffuser plate, which helps to increase the range of light radiation and thus improve the effective utilization of light inside the main housing, providing sufficient light source effect for detection.

[0016] Furthermore, the flatness of the inclined groove surface is ±0.05. The flatness requirement of ±0.05 for the inclined groove surface is necessary to achieve the installation accuracy of the beam splitter, thereby improving the accuracy of the detection imaging.

[0017] Furthermore, both the front and back surfaces of the beam splitter are provided with an optical coating layer, which is a coating layer made of a mixture of Ti3O5 and SiO2 through an optical coating process. By providing an optical coating layer, the reflectivity and transmittance of the beam splitter can be improved, enabling the beam splitter to form a specific spectral ratio, thereby ensuring the accuracy of detection.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] 1. By setting a high-precision inclined groove surface and controlling the flatness of the inclined groove surface within ±0.05 mm, the installation accuracy of the beam splitter can be met, its beam splitting performance can be improved, and the setting of the inclined groove surface can provide stable support for the four sides of the beam splitter. In particular, six glue dots are set on the inclined groove surface, which are evenly distributed on both sides, for glue fixation on both sides of the beam splitter. This setting of six glue dots can ensure that the lens is evenly stressed after glue application, avoid stretching and deformation, and prevent the beam splitter from loosening and affecting the imaging effect.

[0020] 2. The front and back surfaces of the beam splitter are coated with an optical coating layer made of a mixture of Ti3O5 and SiO2 materials, which enables the beam splitter to form a specific beam splitting ratio, thereby meeting the accuracy requirements for defect detection of semiconductor wafers. The beam splitter uses high-definition anti-ghosting lenses to achieve a high-definition effect.

[0021] 3. The first mounting slot and the first auxiliary slot enable more stable installation of the diffuser plate without affecting the light source emitted by the circuit board, thus providing sufficient light source effect for testing. Attached Figure Description

[0022] To more clearly illustrate the technology in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a small-angle coaxial light source for high-precision wafer defect detection according to this utility model;

[0024] Figure 2 yes Figure 1 A schematic diagram of the decomposition process;

[0025] Figure 3 yes Figure 1 A schematic cross-sectional view along line AA in the middle;

[0026] Figure 4 This is a schematic diagram of the main shell structure of this utility model;

[0027] Figure 5 This is an assembly diagram of the main housing and beam splitter of this utility model;

[0028] Figure 6 This is a cross-sectional schematic diagram of the beam splitter of this utility model;

[0029] Figure 7 This is a structural schematic diagram of the main shell of this utility model from another perspective;

[0030] Figure 8 This is a schematic diagram of the structure of the diffuser plate of this utility model.

[0031] The diagram includes:

[0032] 1. Main housing; 11. Inclined groove surface; 12. Adhesive dispensing position; 13. First connecting hole; 14. First mounting groove; 141. Third mounting hole; 15. First auxiliary groove; 16. Spacing; 2. Beam splitter; 21. Optical coating layer; 3. Diffuser plate; 31. Mounting ear; 311. Fourth mounting hole; 4. Circuit board; 41. LED beads; 42. Second connecting hole. Detailed Implementation

[0033] The technology of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second", such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0036] Please see Figures 1 to 8 The present invention provides a small-angle coaxial light source for high-precision wafer defect detection, including a main housing 1, a beam splitter 2, a diffuser 3, and a circuit board 4.

[0037] The main shell 1 is a hollow frame structure with openings at the top and bottom, such as... Figure 1The main housing 1 in this embodiment has a right-angled trapezoidal cross-section. The upper end of the main housing 1 forms a sloping groove surface 11, which is set at a horizontal inclination of 45°. This maximizes the reflection / transmission efficiency and minimizes energy loss. The two openings in the main housing 1 are respectively located on the sloping groove surface 11 and the bottom of the main housing 1. To meet the installation accuracy of the beam splitter 2 of this utility model, the flatness requirement of the sloping groove surface 11 needs to reach ±0.05. By controlling the flatness of the sloping groove surface 11, the flatness accuracy of the beam splitter 2 after installation is ensured, thereby ensuring the stability of the beam splitter 2 in terms of light reflection and transmission.

[0038] In this embodiment, the beam splitter 2 is mounted on the inclined groove surface 11. The two sides of the beam splitter 2 are fixedly connected to the sidewalls of the inclined groove surface 11 by adhesive dispensing. Specifically, a number of adhesive dispensing positions 12 are symmetrically arranged on both sides of the inclined groove surface 11, such as... Figure 4 As shown, in this embodiment, a total of six dispensing positions 12 are provided. These six dispensing positions 12 are symmetrically arranged in pairs on both sides of the inclined groove surface 11, forming three groups distributed in an upper, middle, and lower layout on both sides. When the beam splitter 2 is placed into the inclined groove surface 11, the two sides of the beam splitter 2 abut against the dispensing positions 12, and then dispensing is performed on the dispensing positions 12, as shown. Figure 5 As shown in area B, the glue is fixedly connected to the side walls of both sides of the beam splitter 2. This glue application method can prevent glue from overflowing and spreading to both sides of the beam splitter 2, causing stains that affect the normal operation of the beam splitter 2. At the same time, it can ensure that the lens is evenly stressed after glue application, avoiding stretching and deformation, which would affect the imaging effect.

[0039] Furthermore, in this embodiment, the main body of the beam splitter 2 uses a high-definition anti-ghosting lens, such as... Figure 6 As shown, optical coating layers 21 are provided on both the front and back sides of the beam splitter 2. Specifically, the optical coating layer 21 is a coating layer made of a mixture of Ti3O5 and SiO2 through an optical coating process. The total thickness of the optical coating layer 21 is set to 2600nm. By setting the optical coating layer 21, the reflectivity and transmittance of the beam splitter 2 can be improved. The optical coating layer 21 enables the beam splitter 2 to form a specific beam splitting ratio of 8:2, that is, the reflectivity of the beam splitter is 80% and the transmittance is 20%, thereby ensuring the accuracy of detection.

[0040] LED beads 41 are mounted on circuit board 4. Circuit board 4 is detachably fixed to the lower end of main housing 1, so that LED beads 41 are placed inside main housing 1 and directly facing beam splitter 2. Specifically, as shown... Figure 7 As shown, the lower end of the main housing 1 is provided with a first connection hole 13, and the circuit board 4 is provided with a second connection hole 42 that matches the first connection hole 13. The circuit board 4 is detachably connected by screws that engage the first connection hole 13 and the second connection hole 42.

[0041] The diffuser plate 3 is disposed between the circuit board 4 and the beam splitter 2. In this embodiment, the diffuser plate 3 is also fixed inside the main housing 1 using a detachable connection method, specifically as follows: Figure 7 and Figure 8 As shown, a first mounting groove 14 is formed at the lower end of the main housing 1, and mounting ears 31 are formed by extending outwards from both ends of the diffuser plate 3. A third mounting hole 141 is provided on the first mounting groove 14, and a fourth mounting hole 311 is provided on the mounting ear 31 to match the third mounting hole 141. The mounting ear 31 and the fourth mounting hole 311 are engaged to make the mounting ear 31 and the first mounting groove 14 detachably connected by screws. Preferably, a first auxiliary groove 15 communicating with the first mounting groove 14 is also provided inside the main housing 1. The first auxiliary groove 15 abuts against the outer edge of the diffuser plate 3. By providing the first auxiliary groove 15, the outer edge of the diffuser plate 3 can be supported, avoiding the diffuser plate 3 from being suspended and bent or damaged, thereby improving the stability of light propagation and improving the detection accuracy.

[0042] To achieve better lighting effect, the diffuser plate 3 in this embodiment is a high-haze diffuser plate 3 with a haze of 97.5% to 99.5%. Using a high-haze diffuser plate 3 can avoid the light shadow and graininess caused when the light source is lit, which would affect the imaging accuracy.

[0043] like Figure 3 As shown, in this embodiment, a spacing of 16 is formed between the circuit board 4 and the diffuser plate 3, which allows for sufficient light propagation space between the circuit board 4 and the diffuser plate 3, which is beneficial to increasing the range of light radiation and thus improving the effective utilization of light inside the main housing 1, providing sufficient light source effect for detection.

[0044] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A small corner coaxial light source for high-precision wafer defect detection, characterized in that, The main shell (1), the light splitter (2), the diffusion plate (3) and the circuit board (4) are included. The main shell (1) is a hollow frame structure with an upper opening and a lower opening, and an upper end of the main shell (1) is formed with an inclined groove surface (11). The light splitter (2) is arranged on the inclined groove surface (11), and two side edges of the light splitter (2) are fixedly connected with side walls of the inclined groove surface (11) by means of glue dispensing. The circuit board (4) is provided with LED lamp beads (41), and the circuit board (4) can be detachably fixed to a lower end of the main shell (1), so that the LED lamp beads (41) are arranged inside the main shell (1) and face the light splitter (2). The diffusion plate (3) is arranged between the circuit board (4) and the light splitter (2).

2. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, A plurality of glue dispensing positions (12) are symmetrically arranged on both sides of the inclined groove surface (11), the two side edges of the light splitter (2) abut against the glue dispensing positions (12), and the light splitter (2) is fixed by glue dispensing at the glue dispensing positions (12).

3. The small angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, The inclined groove surface (11) is horizontally inclined by 45 degrees.

4. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, A first mounting groove (14) is formed at a lower end of the main shell (1), two ends of the diffusion plate (3) extend outward to form mounting ears (31), and the mounting ears (31) are detachably connected with walls of the first mounting groove (14).

5. The small-angle coaxial light source for high-precision wafer defect detection according to claim 4, characterized in that, The diffusion plate (3) is a high-haze diffusion plate (3) with a haze of 97.5% to 99.5%.

6. The small-angle coaxial light source for high-precision wafer defect detection according to claim 4, characterized in that, A first auxiliary groove (15) is further arranged in the main shell (1) and communicates with the first mounting groove (14), and the first auxiliary groove (15) abuts against an outer edge of the diffusion plate (3).

7. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, A first connecting hole (13) is arranged at a lower end of the main shell (1), a second connecting hole (42) matched with the first connecting hole (13) is arranged on the circuit board (4), and the circuit board (4) is detachably connected by screwing the first connecting hole (13) and the second connecting hole (42).

8. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, A spacing (16) is formed between the circuit board (4) and the diffusion plate (3).

9. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that, The flatness of the inclined groove surface (11) is plus or minus 0.

05.

10. The small-angle coaxial light source for high-precision wafer defect detection according to claim 1, characterized in that Optical coating layers (21) are arranged on front and back surfaces of the light splitter (2), the optical coating layers (21) are coating layers made of a mixture of TI3O5 and SIO2 by an optical coating process.

Images