Silicon carbide chip packaging structure

Abstract

The utility model discloses a silicon carbide chip packaging structure which comprises a first heat dissipation plate, a silicon carbide chip body is fixed on the top of the first heat dissipation plate through a heat conduction glue layer, a heat conduction stand column is fixed at the bottom of the first heat dissipation plate, and a second heat dissipation plate is fixed at the bottom of the heat conduction stand column. The first heat dissipation plate, the heat conduction stand column, the second heat dissipation plate, the first heat dissipation fins and the second heat dissipation fins are all made of aluminum, the first heat dissipation fins are designed to be of an S-shaped structure, the multiple first heat dissipation fins are arranged at the bottom of the first heat dissipation plate and the top of the second heat dissipation plate, and the second heat dissipation fins are designed to be of an arc-shaped structure. And meanwhile, the second radiating fins are distributed at equal angles relative to the central axis of the heat-conducting upright post, so that the contact area between the outside of the silicon carbide chip packaging structure and outside air is increased, and the radiating performance of the silicon carbide chip body is jointly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically a silicon carbide chip packaging structure. Background Technology

[0002] Silicon carbide is an inorganic material that is smelted at high temperatures in an electric resistance furnace from raw materials such as quartz sand, petroleum coke, and sawdust. Silicon carbide is a very common material in chip manufacturing, and after silicon carbide chips are manufactured, they need to be packaged in an encapsulation shell.

[0003] However, most existing silicon carbide chip packaging structures rely on simple heat sinks for heat dissipation, resulting in a small contact area with the outside air, poor heat dissipation, and reduced chip lifespan.

[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on the existing silicon carbide chip packaging structure. Utility Model Content

[0005] The purpose of this invention is to provide a silicon carbide chip packaging structure to solve the problems mentioned in the background.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a silicon carbide chip packaging structure, including a first heat sink, a silicon carbide chip body fixed to the top of the first heat sink by a thermally conductive adhesive layer, a thermally conductive pillar fixed to the bottom of the first heat sink, a second heat sink fixed to the bottom of the thermally conductive pillar, a first heat sink fin fixed to the bottom of the first heat sink and the top of the second heat sink, and a second heat sink fin fixed to the outer wall of the thermally conductive pillar.

[0007] Preferably, the top of the first heat sink is fixed with a protective cover outside the silicon carbide chip body by a sealant layer. A pin is fixed through the top of the protective cover, a wire is provided at the bottom of the pin, an electrode post is provided at the lower end of the wire, and the bottom of the electrode post is located on the top of the silicon carbide chip body.

[0008] Preferably, mounting holes are provided at the four corners of the first and second heat sinks.

[0009] Preferably, four groups of heat-conducting columns are arranged at equal intervals between the first heat dissipation plate and the second heat dissipation plate, and each group of heat-conducting columns has four columns.

[0010] Preferably, the first heat sink is designed with an "S" shaped structure, and several first heat sinks are provided at the bottom of the first heat sink and the top of the second heat sink.

[0011] Preferably, the second heat sink is designed as an arc-shaped structure, and the second heat sink is distributed at equal angles about the central axis of the heat-conducting column.

[0012] Preferably, a support plate is fixed inside the protective cover, and the support plate is designed with an arc-shaped structure, and the top of the support plate abuts against the top inside the protective cover.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In this silicon carbide chip packaging structure, the first heat sink, the heat-conducting pillar, the second heat sink, the first heat sink fin, and the second heat sink fin are all made of aluminum. The first heat sink fin is designed with an "S"-shaped structure, and several first heat sink fins are provided at the bottom of the first heat sink and the top of the second heat sink. The second heat sink fin is designed with an arc-shaped structure and is distributed at equal angles with respect to the central axis of the heat-conducting pillar. Therefore, the contact area between the outside of the silicon carbide chip packaging structure and the outside air is increased, which together improves the heat dissipation performance of the silicon carbide chip body.

[0014] The protective cover has a fixed support plate inside, and the support plate is designed with an arc structure. The top of the support plate abuts against the top of the protective cover. The design of the support plate increases the pressure resistance of the protective cover and plays a good protective role for the silicon carbide chip body. Attached Figure Description

[0015] Figure 1 This is a frontal cross-sectional view of the present invention.

[0016] Figure 2 This is a top view cross-sectional structural diagram of the heat-conducting column of this utility model;

[0017] Figure 3 This is a top view sectional diagram of the protective cover of this utility model;

[0018] Figure 4 This is a schematic diagram of the first heat sink structure of this utility model.

[0019] In the diagram: 1. First heat sink; 2. Thermally conductive adhesive layer; 3. Silicon carbide chip body; 4. Thermally conductive pillar; 5. Second heat sink; 6. First heat sink; 7. Second heat sink; 8. Sealant layer; 9. Protective cover; 10. Electrode pillar; 11. Pin; 12. Wire; 13. Mounting hole; 14. Support plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution: a silicon carbide chip packaging structure, including a first heat sink 1, a silicon carbide chip body 3 fixed to the top of the first heat sink 1 by a thermally conductive adhesive layer 2, a thermally conductive pillar 4 fixed to the bottom of the first heat sink 1, a second heat sink 5 fixed to the bottom of the thermally conductive pillar 4, a first heat sink 6 fixed to the bottom of the first heat sink 1 and the top of the second heat sink 5, and a second heat sink 7 fixed to the outer wall of the thermally conductive pillar 4. The first heat sink 1 and the second heat sink 5 are both made of copper. Due to the high thermal conductivity and fast heat transfer of copper, the heat dissipation performance of the silicon carbide chip body 3 is improved.

[0022] The top of the first heat sink 1 is located outside the silicon carbide chip body 3 and is fixed with a protective cover 9 by a sealing layer 8. A pin 11 is fixed through the top of the protective cover 9. A wire 12 is provided at the bottom of the pin 11. An electrode post 10 is provided at the lower end of the wire 12. The bottom of the electrode post 10 is located on the top of the silicon carbide chip body 3. The protective cover 9 is made of aluminum alloy. Aluminum alloy has the characteristics of light weight, high strength and good heat dissipation performance. It can provide reliable mechanical protection for the silicon carbide chip body 3 and also assist in heat dissipation.

[0023] Mounting holes 13 are provided at the four corners of the first heat sink 1 and the second heat sink 5. The silicon carbide chip package structure can be fixed on the device through the mounting holes 13 and screws.

[0024] Four sets of heat-conducting pillars 4 are equally spaced between the first heat sink 1 and the second heat sink 5, and each set of heat-conducting pillars 4 has four pillars. The heat-conducting pillars 4 are made of copper. Due to the high thermal conductivity and fast heat transfer of copper, the contact area between the heat-conducting pillars 4 and the outside air is increased, which together improves the heat dissipation performance of the silicon carbide chip body 3.

[0025] The first heat sink 6 is designed with an "S" shape, and several of the first heat sink 6 are provided at the bottom of the first heat sink 1 and the top of the second heat sink 5. The first heat sink 6 is made of copper, which increases the contact area between the first heat sink 6 and the outside air, thus improving the heat dissipation performance of the silicon carbide chip body 3.

[0026] The second heat sink 7 is designed with an arc-shaped structure, and the second heat sink 7 is distributed at equal angles with respect to the central axis of the heat-conducting pillar 4. The material of the second heat sink 7 is copper, which increases the contact area between the second heat sink 7 and the outside air, and together improves the heat dissipation performance of the silicon carbide chip body 3.

[0027] The protective cover 9 has a support plate 14 fixed inside. The support plate 14 is designed with an arc structure, and the top of the support plate 14 abuts against the top inside the protective cover 9. The design of the support plate 14 increases the pressure resistance of the protective cover 9 and plays a good protective role for the silicon carbide chip body 3.

[0028] Working principle: When using this silicon carbide chip packaging structure, the heat generated by the silicon carbide chip body 3 during operation is conducted to the outside through the thermally conductive adhesive layer 2, the first heat sink 1, the thermally conductive pillar 4, the second heat sink 5, the first heat sink 6, and the second heat sink 7. Since the first heat sink 6 is designed with an "S" shape and the second heat sink 7 is designed with an arc shape, the contact area between the first heat sink 6 and the second heat sink 7 and the outside air is increased, which together improves the heat dissipation performance of the silicon carbide chip body 3, plays a good protective role for the silicon carbide chip body 3, and extends the service life of the silicon carbide chip body 3. When the protective cover 9 is pressed, the support plate 14 plays a supporting role, reducing the probability of deformation of the protective cover 9, and playing a good protective role for the silicon carbide chip body 3.

[0029] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A silicon carbide chip package structure comprising a first heat sink (1), characterized in that: The top of the first heat dissipation plate (1) is fixed with a silicon carbide chip body (3) through a heat-conducting adhesive layer (2), the bottom of the first heat dissipation plate (1) is fixed with a heat-conducting column (4), the bottom of the heat-conducting column (4) is fixed with a second heat dissipation plate (5), the bottom of the first heat dissipation plate (1) and the top of the second heat dissipation plate (5) are both fixed with a first heat dissipation fin (6), and the outer wall of the heat-conducting column (4) is fixed with a second heat dissipation fin (7).

2. The silicon carbide chip package structure of claim 1, wherein: The top of the first heat dissipation plate (1) is fixed with a protective cover (9) outside the silicon carbide chip body (3) through a sealing adhesive layer (8), the top of the protective cover (9) is fixed with a pin (11) penetrating through, the bottom of the pin (11) is provided with a wire (12), the lower end of the wire (12) is provided with an electrode column (10), and the bottom of the electrode column (10) is arranged at the top of the silicon carbide chip body (3).

3. The silicon carbide chip package structure of Claim 1, wherein: The first heat dissipation plate (1) and the second heat dissipation plate (5) are both provided with mounting holes (13) at four corners.

4. The silicon carbide chip package structure of Claim 1, wherein: The heat-conducting column (4) is provided with four groups between the first heat dissipation plate (1) and the second heat dissipation plate (5) at equal intervals, and each group of the heat-conducting column (4) is provided with four.

5. The silicon carbide chip package structure of Claim 1, wherein: The first heat dissipation fin (6) is designed as an "S" type structure, and a plurality of first heat dissipation fins (6) are arranged on the bottom of the first heat dissipation plate (1) and the top of the second heat dissipation plate (5).

6. The silicon carbide chip package structure of Claim 1, wherein: The second heat dissipation fin (7) is designed as an arc structure, and the second heat dissipation fin (7) is distributed at equal angles about the central axis of the heat-conducting column (4).

7. The silicon carbide chip package structure of Claim 2, wherein: The inside of the protective cover (9) is fixed with a support plate (14), the support plate (14) is designed as an arc structure, and the top of the support plate (14) is in abutment with the top inside the protective cover (9).

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