Box body structure of semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor equipment, and discloses a semiconductor equipment box structure comprising a box body, two sides of the box body are respectively provided with an air inlet and an air outlet, and two sides of the box body are respectively provided with a dedusting structure used for preventing dust from entering the box body. The dust removal structure comprises a mounting shell fixed to the right side of the box body, the air inlet is located in the mounting shell, one side of the mounting shell is of a double-layer structure, a plurality of treatment holes are formed in the double-layer side of the mounting shell, and a cleaning plate is slidably inserted into one side of the mounting shell. Through the arrangement of the dust removal structure, the air inlet fan feeds outside fresh air into the box body through the processing hole and the air hole, and the first filter screen filters dust to prevent the dust from influencing equipment operation. And after heat dissipation is finished, a first electric push rod is started, air holes and treatment holes are staggered, meanwhile, a cleaning plate shields the air holes and drives a brush plate to clean dust on the filter screen, the dust is prevented from entering the box body, and the operation safety of the equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of foundation pit protection technology, and in particular to a semiconductor equipment enclosure structure. Background Technology

[0002] Semiconductor equipment refers to the production equipment used to manufacture various semiconductor products. It is a key supporting link in the semiconductor industry chain. Semiconductor equipment is mainly used in the wafer manufacturing and packaging / testing stages of the semiconductor industry chain. Semiconductor equipment has extremely stringent environmental requirements during manufacturing, testing, and packaging. Its core components typically need to operate in an environment with high cleanliness, stable temperature and humidity, and good electromagnetic shielding. To meet these requirements, semiconductor equipment usually adopts a closed enclosure structure.

[0003] The existing high-efficiency heat dissipation semiconductor oxidation equipment enclosure (publication number: CN218523965U) has at least the following drawbacks: Although the above-mentioned device dissipates heat from the inside of the enclosure through a fan, vents and heat dissipation holes, and then covers the vents and heat dissipation holes when not in use with a baffle, the vents and heat dissipation holes are in the open state when dissipating heat, and external dust can easily enter the inside of the enclosure through the vents and heat dissipation holes, which can easily lead to dust accumulation on electronic components, thus posing a hidden danger to the long-term operation of the equipment. Therefore, we propose this utility model. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor device housing structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor device enclosure structure includes an enclosure body with an air inlet and an air outlet on each side. Both sides of the enclosure body are equipped with dust removal structures to prevent dust from entering the enclosure body. Each dust removal structure includes a mounting shell fixed to the right side of the enclosure body. The air inlet is located inside the mounting shell. One side of the mounting shell has a double-layer structure with several processing holes. A cleaning plate is slidably inserted into one side of the mounting shell. The cleaning plate also has a double-layer structure, with the inner plate of the double-layer side of the mounting shell located inside the cleaning plate. A first filter screen is fixed inside the processing holes.

[0007] As a further embodiment of this utility model, a plurality of ventilation holes are provided on one side of the cleaning plate, and the plurality of ventilation holes correspond to the positions of a plurality of processing holes respectively. A brush plate is slidably inserted on one side of the cleaning plate, and the brush bristle side of the brush plate is attached to the double-layer inner plate of the mounting shell. A first electric push rod is fixed on one side of the mounting shell, and the telescopic end of the first electric push rod is fixed to one side of the cleaning plate. A plurality of air intake fans are fixed inside the mounting shell.

[0008] As a further embodiment of this utility model, a fixed shell is fixed to the other side of the main body of the box, the air outlet is located inside the fixed shell, a number of exhaust holes are opened on one side of the fixed shell, a baffle is slidably inserted on one side of the fixed shell, a number of connecting holes are opened on one side of the baffle, the number of connecting holes correspond to the positions of the number of exhaust holes respectively, a second electric push rod is fixed to one side of the fixed shell, the telescopic end of the second electric push rod is fixed to one side of the fixed shell, and a second filter screen is fixed inside the exhaust hole.

[0009] As a further embodiment of this utility model, the brush plate is fixed to the cleaning plate by bolts, and the length of the brush plate is the same as the length of the first filter screen.

[0010] As a further embodiment of this utility model, a plurality of guide plates are fixed inside the air inlet, and the plurality of guide plates are arranged at intervals.

[0011] As a further embodiment of this utility model, the housing body is provided with an installation door via a hinge.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] This enclosure structure, through its dust removal mechanism, allows the intake fan to deliver fresh air from outside through treatment and ventilation holes into the enclosure body. A first filter filters dust, preventing it from affecting equipment operation. After heat dissipation, the first electric actuator is activated, misaligning the ventilation and treatment holes. Simultaneously, a cleaning plate blocks the ventilation holes and drives a brush plate to clean dust from the filter, preventing dust from entering the enclosure and improving equipment operational safety. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a semiconductor device housing proposed in this utility model;

[0015] Figure 2 This is a schematic diagram showing the disassembled structure of a semiconductor device housing proposed in this utility model;

[0016] Figure 3 This is a schematic diagram of the disassembled structure of the mounting shell of a semiconductor device housing structure proposed in this utility model;

[0017] Figure 4 This is a schematic diagram of the disassembled structure of the fixed shell of a semiconductor device housing structure proposed in this utility model;

[0018] Figure 5 This utility model proposes a semiconductor device housing structure. Figure 3 Enlarged structural diagram at point A in the middle.

[0019] In the diagram: 1. Main body of the enclosure; 2. Air inlet; 201. Mounting shell; 202. Processing hole; 203. Cleaning plate; 204. First filter screen; 205. Vent hole; 206. Brush plate; 207. First electric push rod; 208. Intake fan; 3. Air outlet; 301. Fixing shell; 302. Exhaust hole; 303. Baffle; 304. Connection hole; 305. Second electric push rod; 306. Second filter screen; 4. Deflector plate; 5. Mounting door. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Reference Figures 1-4 A semiconductor device enclosure structure includes an enclosure body 1. An air inlet 2 and an air outlet 3 are respectively provided on both sides of the enclosure body 1. Dust removal structures are provided on both sides of the enclosure body 1 to prevent dust from entering the enclosure body 1. The dust removal structures include a mounting shell 201 fixed to the right side of the enclosure body 1. The air inlet 2 is located inside the mounting shell 201. One side of the mounting shell 201 has a double-layer structure, and several processing holes 202 are provided on the double-layer side of the mounting shell 201. A cleaning plate 203 is slidably inserted into one side of the mounting shell 201. The cleaning plate 203 has a double-layer structure, and the inner plate of the double-layer side of the mounting shell 201 is located inside the cleaning plate 203. A first filter screen 204 is fixed in the inner hole of each processing hole 202.

[0024] In this embodiment, a plurality of ventilation holes 205 are provided on one side of the cleaning plate 203, and the ventilation holes 205 correspond to the positions of a plurality of processing holes 202. A brush plate 206 is slidably inserted into one side of the cleaning plate 203, and the bristle side of the brush plate 206 is attached to the double-layer inner side plate of the mounting shell 201. A first electric push rod 207 is fixed to one side of the mounting shell 201, and the telescopic end of the first electric push rod 207 is fixed to one side of the cleaning plate 203. A plurality of air intake fans 208 are fixed inside the mounting shell 201. Through the dust removal structure, when the user dissipates heat inside the box body 1, the air intake fans 208 are activated to send fresh air from the outside through the processing holes 202 and ventilation holes 205 into the box body 1 for heat dissipation. The fresh air passes through the processing holes 202 and ventilation holes 205 for heat dissipation. Dust from the outside carried by the vent 202 is filtered by the first filter 204, preventing it from entering the housing 1 and affecting the operation of the equipment. When the cooling process ends and dust adheres to the first filter 204, the user can activate the first electric push rod 207 to extend, causing the vent 205 to be misaligned with the treatment hole 202. This allows the cleaning plate 203 to block the vent 205. As the cleaning plate 203 moves, it drives the brush plate 206 to move, cleaning the dust on the first filter 204. At the same time, the cleaning plate 203 prevents the dust on the first filter 204 from entering the housing 1 during cleaning. By using the above methods, external dust is prevented from entering the housing 1 during the cooling and air intake process, thus improving the safety of equipment operation.

[0025] In this embodiment, a fixed shell 301 is fixed to the other side of the main body 1 of the box. The air outlet 3 is located inside the fixed shell 301. Several exhaust holes 302 are opened on one side of the fixed shell 301. A baffle 303 is slidably inserted into one side of the fixed shell 301. Several connecting holes 304 are opened on one side of the baffle 303. The several connecting holes 304 correspond to the positions of several exhaust holes 302. A second electric push rod 305 is fixed to one side of the fixed shell 301. The telescopic end of the second electric push rod 305 is fixed to one side of the fixed shell 301. A second filter screen 306 is fixed inside the exhaust hole 302. When the main body 1 of the box dissipates heat through the intake fan 208, the hot air is discharged through the exhaust hole 302. The second filter screen 306 prevents external dust from entering the interior of the main body 1 of the box through the exhaust hole 302. At the same time, the user can activate the second electric push rod 305 to extend and make the exhaust hole 302 misaligned with the connecting hole 304, so as to block the exhaust hole 302 when heat dissipation is not performed.

[0026] In this embodiment, the brush plate 206 is fixed to the cleaning plate 203 by bolts. The length of the brush plate 206 is the same as the length of the first filter screen 204. When dust adheres to the brush plate 206 after long-term cleaning, the user can replace and clean the brush plate 206 by removing the bolts.

[0027] In this embodiment, a number of guide plates 4 are fixed inside the air inlet 2. The guide plates 4 are arranged at intervals. When the air inlet 2 is cooling, the guide plates 4 guide the incoming fresh air, making it more evenly distributed when it enters the box body 1, thereby improving the heat dissipation effect.

[0028] In this embodiment, the housing body 1 is equipped with an installation door 5 that rotates via a hinge, allowing staff to debug and maintain the equipment inside the housing body 1 through the installation door 5.

[0029] Working Principle: During use, when the user is cooling the interior of the housing 1, the intake fan 208 is activated to send fresh air from outside into the housing 1 through the treatment hole 202 and the vent 205 for cooling. Dust carried by the fresh air as it passes through the treatment hole 202 is filtered by the first filter 204, preventing dust from entering the housing 1 and affecting the equipment's operation. When cooling is complete and dust adheres to the first filter 204, the user can activate the first electric actuator 207 to extend, causing the vent 205 to align with the treatment hole 202. This allows the cleaning plate 203 to block the vent 205. As the cleaning plate 203 moves, it drives the brush plate 206 to move, cleaning the dust on the first filter 204. Simultaneously, the cleaning plate 203 prevents dust from accumulating on the first filter 204. During cleaning, the equipment enters the interior of the cabinet body 1. When the cabinet body 1 dissipates heat through the intake fan 208, the hot air is discharged through the exhaust port 302. The second filter 306 prevents external dust from entering the interior of the cabinet body 1 through the exhaust port 302. At the same time, the user can activate the second electric push rod 305 to extend and misalign the exhaust port 302 with the connection hole 304, thereby blocking the exhaust port 302 when not dissipating heat. When the brush plate 206 is covered with dust after long-term cleaning, the user can replace and clean the brush plate 206 by removing the bolts. When the air inlet 2 is dissipating air, the guide plate 4 guides the incoming fresh air, making it more evenly distributed when it enters the interior of the cabinet body 1, thus improving the heat dissipation effect. The staff can use the installation door 5 to debug and repair the equipment inside the cabinet body 1.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A semiconductor device package structure comprising a package body (1), characterized by: The box body (1) is provided with an air inlet (2) and an air outlet (3) on both sides, and dust removal structures are arranged on both sides of the box body (1) to prevent dust from entering the inside of the box body (1), the dust removal structure comprises a mounting shell (201) fixed on the right side of the box body (1), the air inlet (2) is located in the inside of the mounting shell (201), one side of the mounting shell (201) is a double-layer structure, a plurality of treatment holes (202) are arranged on the double-layer side of the mounting shell (201), a cleaning plate (203) is slidably inserted into one side of the mounting shell (201), the cleaning plate (203) is a double-layer structure, the inner plate of the double-layer side of the mounting shell (201) is located in the inside of the cleaning plate (203), and the inner hole of the treatment hole (202) is fixed with a first filter screen (204).

2. The semiconductor device package structure of claim 1, wherein A plurality of air holes (205) are arranged on one side of the cleaning plate (203), the plurality of air holes (205) correspond to the plurality of treatment holes (202) in position, a brush plate (206) is slidably inserted into one side of the cleaning plate (203), the bristle side of the brush plate (206) is attached to the double-layer side inner plate of the mounting shell (201), a first electric push rod (207) is fixed on one side of the mounting shell (201), the telescopic end of the first electric push rod (207) is fixed on one side of the cleaning plate (203), and a plurality of air inlet fans (208) are fixed in the inside of the mounting shell (201).

3. The semiconductor device package structure of claim 2, wherein, The other side of the box body (1) is fixed with a fixed shell (301), the air outlet (3) is located in the inside of the fixed shell (301), a plurality of exhaust holes (302) are arranged on one side of the fixed shell (301), a baffle (303) is slidably inserted into one side of the fixed shell (301), a plurality of connecting holes (304) are arranged on one side of the baffle (303), the plurality of connecting holes (304) correspond to the plurality of exhaust holes (302) in position, a second electric push rod (305) is fixed on one side of the fixed shell (301), the telescopic end of the second electric push rod (305) is fixed on one side of the fixed shell (301), and a second filter screen (306) is fixed in the inside of the exhaust hole (302).

4. The semiconductor device package structure of claim 3, wherein, The brush plate (206) is fixed to the cleaning plate (203) by bolts, and the length of the brush plate (206) is consistent with the length of the first filter screen (204).

5. The semiconductor device package structure of claim 4, wherein, A plurality of guide plates (4) are fixed in the inside of the air inlet (2), and the plurality of guide plates (4) are arranged at intervals.

6. A semiconductor device package structure according to claim 5, wherein, The box body (1) is provided with a mounting door (5) which is rotatably arranged by a hinge.

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