Electroplating copper ball washing device

Abstract

The utility model discloses an electroplating copper ball washing device, which belongs to the technical field of electroplating copper ball washing and comprises an electroplating copper ball used for electroplating. The cleaning mechanism comprises a cleaning barrel arranged above the bottom plate, a first motor arranged on the cleaning barrel, a stirring shaft fixed to an output shaft of the first motor and a cleaning brush arranged on the stirring shaft, the stirring shaft is rotationally arranged in the cleaning barrel, and the cleaning brush is rotationally arranged in the cleaning barrel; the cleaning barrel is provided with a first inlet used for placing electroplating copper balls into the cleaning barrel, a second inlet used for conveying cleaning liquid into the cleaning barrel is formed in the cleaning barrel, a discharging opening is formed in the cleaning barrel, and sealing covers are arranged on the first inlet, the second inlet and the discharging opening. The electroplating copper ball washing device has the effects that the electroplating copper balls can be conveniently washed, oxides, residues and other impurities on the surfaces of the electroplating copper balls are removed, and the quality and efficiency of the electroplating copper balls are improved.

Description

Technical Field

[0001] This utility model relates to the field of electroplated copper ball washing technology, and in particular to an electroplated copper ball washing device. Background Technology

[0002] Electroplated copper balls are materials used in the electroplating process, mainly to coat the surface of other materials (usually metals or plastics) with copper to enhance the conductivity, corrosion resistance, and aesthetics of the object. Electroplated copper balls are widely used in many technical fields, such as PCB manufacturing, photovoltaic panel manufacturing, and hardware electroplating.

[0003] Copper electroplating refers to the process of using copper balls as anodes, dissolving them in an electroplating solution, and then electroplating copper onto the surface of a product through conductivity. During the electroplating process, the copper balls are consumed, and their surfaces are corroded, producing residue or passivation, which affects the electroplating quality. Therefore, it is necessary to clean the residue on the surface of the copper balls regularly.

[0004] In response to the aforementioned technologies, there is an urgent need to design and develop a copper plating ball washing device to facilitate the washing of copper plating balls, remove oxides, residues and other impurities from the surface of the copper plating balls, and improve the quality and efficiency of the copper plating balls. Utility Model Content

[0005] To facilitate the washing of electroplated copper balls, remove oxides, residues and other impurities from the surface of the electroplated copper balls, and improve the quality and efficiency of the electroplated copper balls, this application provides an electroplated copper ball washing device.

[0006] The electroplated copper ball washing device provided in this application adopts the following technical solution:

[0007] A copper plating ball washing device includes copper plating balls for electroplating. A cleaning mechanism is provided on a base plate. The cleaning mechanism includes a cleaning tank disposed above the base plate, a motor disposed on the cleaning tank, a stirring shaft fixed to the output shaft of the motor, and a cleaning brush disposed on the stirring shaft. The stirring shaft is rotatably disposed inside the cleaning tank, and the cleaning brush is rotatably disposed inside the cleaning tank. The cleaning tank is provided with a first inlet for placing the copper plating balls into the cleaning tank, a second inlet for conveying cleaning liquid into the cleaning tank, and a discharge port. Sealing caps are provided on the first inlet, the second inlet, and the discharge port.

[0008] By adopting the above technical solution, the cleaning tank is set above the base plate, the motor is set on the cleaning tank, the stirring shaft is fixed on the output shaft of the motor and rotates inside the cleaning tank, the cleaning brush is set on the stirring shaft and rotates inside the cleaning tank, the cleaning tank is provided with a first inlet, a second inlet and a discharge port, and each of the first inlet, the second inlet and the discharge port is provided with a sealing cover. When it is necessary to clean the electroplated copper balls, the cleaning solution is transported into the cleaning tank through the second inlet, and the electroplated copper balls are put into the cleaning tank through the first inlet. The motor drives the stirring shaft to rotate, and the stirring shaft drives the cleaning brush to wash the electroplated copper balls. After the washing is completed, the cleaning solution and the electroplated balls can be discharged from the cleaning tank through the discharge port, which facilitates the washing of the electroplated copper balls.

[0009] Preferably, the cleaning mechanism includes a brush ring for cleaning the electroplated copper balls, the brush ring being fixed to the inner wall of the cleaning tank, the axis of the brush ring coinciding with the axis of the cleaning tank, the cleaning brush being rotatably disposed within the brush ring, and the electroplated copper balls being disposed between the brush ring and the cleaning brush.

[0010] By adopting the above technical solution, the scrubbing ring is fixed on the inner wall of the cleaning tank, and the axis of the scrubbing ring coincides with the axis of the cleaning tank. The cleaning brush is rotatably set inside the scrubbing ring, and the electroplated copper ball is set between the scrubbing ring and the cleaning brush. The scrubbing ring and the cleaning brush can scrub the electroplated copper ball, thereby improving the cleaning efficiency.

[0011] Preferably, the base plate is provided with an adjustment mechanism, which includes a first support column on the base plate, a second support column next to the first support column, a second motor on the first support column, a first screw fixed to the output shaft of the second motor, a first slider threaded onto the first screw, a third motor on the second support column, a second screw fixed to the output shaft of the third motor, a second slider threaded onto the second screw, and a telescopic member on the second slider. The first screw is rotatably disposed within the first support column, and the first slider is vertically slidably disposed within the first support column. The cleaning tub is provided with a first connecting block, and the first slider is hinged to the first connecting block. The second screw is rotatably disposed within the second support column, and the second slider is vertically slidably disposed within the second support column. The cleaning tub is provided with a second connecting block, and the second connecting block is hinged to the telescopic member.

[0012] By adopting the above technical solution, support column one is set on the base plate, motor two is set on support column one, screw one is fixed on the output shaft of motor two and is rotatably set inside support column one, slider one is threadedly sleeved on screw one and is vertically slidable inside support column one, a connecting block one is set on the cleaning tank, and slider one is hinged to connecting block one, support column two is set beside support column one, motor three is set on support column two, screw two is fixed on the output shaft of motor three and is rotatably set inside support column two, slider two is threadedly sleeved on screw two and is vertically slidable inside support column two, and a telescopic component is set on slider two. The cleaning tank is equipped with a connecting block two, which is hinged to the telescopic component. When the angle of the cleaning tank needs to be adjusted, the drive motor one drives the screw one to rotate in the forward or reverse direction. The screw one drives the slider one to move up or down. Through the hinge relationship between the slider one and the connecting block one, the distance between one end of the cleaning tank and the bottom plate can be adjusted. The drive motor two drives the screw two to rotate in the forward or reverse direction. The screw two drives the slider two to move up or down. Through the hinge relationship between the telescopic component and the connecting block two, the distance between the other end of the cleaning tank and the bottom plate can be adjusted, thereby adjusting the angle of the cleaning tank to facilitate the subsequent discharge of cleaning liquid and electroplated copper balls.

[0013] Preferably, the telescopic component includes a connecting plate disposed on the second slider and a sliding plate slidably disposed within the connecting plate. A sliding groove is provided on the side of the connecting plate, and the sliding plate is slidably disposed within the sliding groove. A limiting groove is provided on the side wall of the sliding groove, and a limiting block is provided on the side of the sliding plate. The limiting block is slidably disposed within the limiting groove.

[0014] By adopting the above technical solution, the telescopic component includes a connecting plate disposed on the second slider and a sliding plate slidably disposed within the connecting plate. The sliding plate is hinged to the second connecting plate. A sliding groove is provided on the side of the connecting plate. The sliding plate is slidably disposed within the sliding groove. A limiting groove is provided on the side wall of the sliding groove. A limiting block is provided on the side of the sliding plate. The limiting block is slidably disposed within the limiting groove. The limiting block prevents the sliding plate from detaching from the connecting plate, thereby improving the stability of the sliding between the sliding plate and the connecting plate.

[0015] Preferably, the base plate is provided with a screening mechanism, which includes a mounting column rotatably mounted on the base plate, a screening pipe mounted on the mounting column, an auger rotatably mounted inside the screening pipe, a motor mounted on the mounting column, a discharge pipe connected to the screening pipe, a feed hopper for feeding material, and a recycling box for recycling electroplated copper balls that do not meet size requirements. The auger is fixed to the output shaft of the motor, the feed hopper is mounted on the screening pipe and communicates with the screening pipe, a material passage is opened on the side of the screening pipe, and the recycling box is located below the screening pipe.

[0016] By adopting the above technical solution, the mounting column is rotatably mounted on the base plate, the screening pipe is mounted on the mounting column, the discharge pipe is connected to the screening pipe, the motor is mounted on the mounting column, the auger is fixed on the output shaft of the motor and is rotatably mounted inside the screening pipe, the feed hopper is mounted on the screening pipe and is connected to the screening pipe, the side of the screening pipe has a material passage hole, and the recycling box is located below the screening pipe. Before cleaning the electroplated copper balls, the mounting column is rotated to drive the discharge pipe to be inserted into the first inlet. The electroplated copper balls to be cleaned are poured into the screening pipe through the feed hopper. The motor drives the auger to rotate, and the auger pushes the electroplated copper balls closer to the discharge pipe. At this time, the electroplated copper balls that do not meet the size requirements fall into the recycling box through the material passage hole, which facilitates the screening of electroplated copper balls that do not meet the size requirements.

[0017] Preferably, a mounting groove is provided on the top surface of the base plate, a motor is installed in the mounting groove, and the mounting column is fixed on the output shaft of the motor.

[0018] By adopting the above technical solution, an installation groove is provided on the top surface of the base plate, and a motor is installed in the installation groove. The installation column is fixed on the output shaft of the motor. When it is necessary to drive the installation column to rotate the discharge pipe, the motor drives the installation column to rotate, which facilitates the adjustment of the position of the discharge pipe.

[0019] Preferably, the screening mechanism includes a protective tube sleeved on the outside of the screening tube, the protective tube being mounted on the mounting column, the feed hopper being mounted on the protective tube, and a discharge hopper being mounted on the protective tube, the discharge hopper being located directly above the recycling box.

[0020] By adopting the above technical solution, the protective pipe is sleeved on the outside of the screening pipe, the protective pipe is set on the mounting column, the feed hopper is set on the protective pipe, and the discharge hopper is set on the protective pipe. The discharge hopper is located directly above the recycling box. Through the setting of the protective pipe, the discharge hopper and the recycling box, it is convenient to centrally recycle electroplated copper balls of unqualified size.

[0021] Preferably, the protective tube is provided with a hook, and the recycling bin is provided with a hanging rope, which is hung on the hook.

[0022] By adopting the above technical solution, a hook is installed on the protective pipe and a hanging rope is installed on the recycling bin. The hanging rope is hung on the hook, which makes it easy to pick up and put down the recycling bin.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. The cleaning tank is located above the base plate. Motor 1 is mounted on the cleaning tank. The stirring shaft is fixed to the output shaft of Motor 1 and rotates inside the cleaning tank. The cleaning brush is mounted on the stirring shaft and rotates inside the cleaning tank. The cleaning tank has a first inlet, a second inlet, and a discharge port. Each of the first inlet, second inlet, and discharge port is equipped with a sealing cap. When cleaning the electroplated copper balls is required, the cleaning solution is delivered into the cleaning tank through the second inlet, and the electroplated copper balls are placed into the cleaning tank through the first inlet. Motor 1 drives the stirring shaft to rotate, and the stirring shaft drives the cleaning brush to wash the electroplated copper balls. After washing, the cleaning solution and electroplated balls can be discharged from the cleaning tank through the discharge port, which facilitates the washing of the electroplated copper balls, removes oxides, residues, and other impurities from the surface of the electroplated copper balls, and improves the quality and efficiency of the electroplated copper balls.

[0025] 2. Support column one is mounted on the base plate, motor two is mounted on support column one, screw one is fixed to the output shaft of motor two and rotatably mounted inside support column one, slider one is threaded onto screw one and slides vertically inside support column one, connecting block one is mounted on the cleaning tub, slider one is hinged to connecting block one, support column two is mounted beside support column one, motor three is mounted on support column two, screw two is fixed to the output shaft of motor three and rotatably mounted inside support column two, slider two is threaded onto screw two and slides vertically inside support column two, telescopic component is mounted on slider two, cleaning tub. A second connecting block is provided on the top, which is hinged to the telescopic component. When it is necessary to adjust the angle of the cleaning tank, the first drive motor drives the first screw to rotate in the forward or reverse direction. The first screw drives the first slider to move up or down. Through the hinge relationship between the first slider and the first connecting block, the distance between one end of the cleaning tank and the bottom plate can be adjusted. The second drive motor drives the second screw to rotate in the forward or reverse direction. The second screw drives the second slider to move up or down. Through the hinge relationship between the telescopic component and the second connecting block, the distance between the other end of the cleaning tank and the bottom plate can be adjusted, thereby adjusting the angle of the cleaning tank, which facilitates the subsequent discharge of cleaning liquid and electroplated copper balls.

[0026] 3. The mounting column is rotatably mounted on the base plate, the screening pipe is mounted on the mounting column, the discharge pipe is connected to the screening pipe, the motor is mounted on the mounting column, the auger is fixed to the output shaft of the motor and is rotatably mounted inside the screening pipe, the feed hopper is mounted on the screening pipe and is connected to the screening pipe, the side of the screening pipe has a material passage hole, and the recycling box is located below the screening pipe. Before cleaning the electroplated copper balls, the mounting column is rotated to drive the discharge pipe to be inserted into the first inlet, and the electroplated copper balls to be cleaned are poured into the screening pipe through the feed hopper. The motor drives the auger to rotate, and the auger pushes the electroplated copper balls closer to the discharge pipe. At this time, the electroplated copper balls that do not meet the size requirements fall into the recycling box through the material passage hole, which facilitates the screening of the electroplated copper balls that do not meet the size requirements. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of an electroplated copper ball washing device according to an embodiment of this application.

[0028] Figure 2 This is a cross-sectional view of the cleaning tub and bottom plate in an embodiment of this application.

[0029] Figure 3 This is a cross-sectional view of the protective tube and the base plate in an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Base plate; 11. Mounting groove; 2. Cleaning mechanism; 21. Cleaning tank; 211. First inlet; 212. Second inlet; 213. Discharge port; 22. Motor 1; 23. Stirring shaft; 24. Cleaning brush; 25. Washing ring; 3. Adjusting mechanism; 31. Support column 1; 32. Support column 2; 33. Motor 2; 34. Screw 1; 35. Slider 1; 36. Motor 3; 37. Screw 2; 38. Slider 2; 39. Telescopic component; 391. Connecting plate; 392. Sliding plate; 4. Screening mechanism; 41. Mounting column; 42. Screening pipe; 43. Screw; 44. Motor 4; 45. Discharge pipe; 46. Feed hopper; 47. Recycling box; 49. Protective pipe; 491. Discharge hopper; 492. Hook; 5. Sealing cover; 6. Motor 5. Detailed Implementation

[0032] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0033] This application discloses an electroplated copper ball washing device, referring to... Figure 1 As shown, an electroplated copper ball washing device includes a base plate 1, electroplated copper balls, a cleaning mechanism 2, an adjusting mechanism 3, and a sieving mechanism 4. The base plate 1 is horizontally arranged, and its length direction is parallel to the ground.

[0034] Reference Figure 1 and Figure 2 As shown, the cleaning mechanism 2 includes a cleaning tank 21, a motor 22, a stirring shaft 23, a cleaning brush 24, and a brush ring 25. The cleaning tank 21 is located above the base plate 1, the motor 22 is located on the cleaning tank 21, and the stirring shaft 23 is fixed on the output shaft of the motor 22. The stirring shaft 23 is rotatably located inside the cleaning tank 21, and the axis of the stirring shaft 23 coincides with the axis of the cleaning tank 21.

[0035] Reference Figure 1 and Figure 2As shown, the cleaning brush 24 is mounted on the stirring shaft 23, and the axis of the cleaning brush 24 coincides with the axis of the stirring shaft 23. The cleaning brush 24 is rotatably mounted inside the cleaning tank 21. The cleaning tank is provided with a first inlet 211, a second inlet 212 and a discharge port 213. Each of the first inlet 211, the second inlet 212 and the discharge port 213 is provided with a sealing cover 5.

[0036] Reference Figure 1 and Figure 2 As shown, when it is necessary to clean the electroplated copper balls, the cleaning solution is delivered into the cleaning tank 21 through the second inlet 212, and the electroplated copper balls are placed into the cleaning tank 21 through the first inlet 211. The drive motor 22 drives the stirring shaft 23 to rotate, and the stirring shaft 23 drives the cleaning brush 24 to wash the electroplated copper balls. After the washing is completed, the cleaning solution and the electroplated balls can be discharged from the cleaning tank 21 through the discharge port 213, which facilitates the washing of the electroplated copper balls.

[0037] Reference Figure 1 and Figure 2 As shown, the scrubbing ring 25 is fixed to the inner wall of the cleaning tank 21, and the axis of the scrubbing ring 25 coincides with the axis of the cleaning tank 21. The cleaning brush 24 is rotatably disposed inside the scrubbing ring 25, and the electroplated copper ball is disposed between the scrubbing ring 25 and the cleaning brush 24. The scrubbing ring 25 and the cleaning brush 24 can scrub the electroplated copper ball, thereby improving the cleaning efficiency.

[0038] Reference Figure 1 and Figure 2 As shown, the adjustment mechanism 3 includes a first support column 31, a second support column 32, a second motor 33, a first screw 34, a first slider 35, a third motor 36, a second screw 37, a second slider 38, and a telescopic component 39. The first support column 31 is mounted on the base plate 1, and the length direction of the first support column 31 is perpendicular to the top surface of the base plate 1. The second motor 33 is mounted on the first support column 31. The first screw 34 is fixed to the output shaft of the second motor 33 and is rotatably mounted inside the first support column 31. The length direction of the first screw 34 is the same as the length direction of the first support column 31.

[0039] Reference Figure 1 and Figure 2 As shown, slider 35 is threaded onto screw 34 and slides vertically inside support 31. A connecting block is provided on the cleaning tub 21. Slider 35 is hinged to connecting block 34. Support 32 is located next to support 31 and on the base plate 1. The length direction of support 32 is the same as that of support 31.

[0040] Reference Figure 1 and Figure 2As shown, motor 36 is mounted on support column 2 32, screw 2 37 is fixed on the output shaft of motor 36, screw 2 37 is rotatably mounted inside support column 2 32, the length direction of screw 2 37 is the same as the length direction of support column 2 32, slider 2 38 is threaded onto screw 2 37, and slider 2 38 is vertically slidably mounted inside support column 2 32.

[0041] Reference Figure 1 and Figure 2 As shown, the telescopic component 39 includes a connecting plate 391 disposed on the second slider 38 and a sliding plate 392 slidably disposed within the connecting plate 391. The sliding plate 392 is hinged to the second connecting block. A sliding groove is provided on the side of the connecting plate 391. The sliding plate 392 is slidably disposed within the sliding groove. A limiting groove is provided on the side wall of the sliding groove. A limiting block is provided on the side of the sliding plate 392. The limiting block is slidably disposed within the limiting groove. The limiting block prevents the sliding plate 392 from detaching from the connecting plate 391, thereby improving the stability of the sliding between the sliding plate 392 and the connecting plate 391.

[0042] Reference Figure 1 and Figure 2 As shown, when it is necessary to adjust the angle of the cleaning tank 21, the drive motor 22 drives the screw 34 to rotate in the forward or reverse direction. The screw 34 drives the slider 35 to move up or down. Through the hinge relationship between the slider 35 and the connecting block 1, the distance between one end of the cleaning tank 21 and the base plate 1 can be adjusted. The drive motor 33 drives the screw 37 to rotate in the forward or reverse direction. The screw 37 drives the slider 38 to move up or down. Through the hinge relationship between the telescopic member 39 and the connecting block 2, the distance between the other end of the cleaning tank 21 and the base plate 1 can be adjusted, thereby adjusting the angle of the cleaning tank 21, which facilitates the subsequent discharge of cleaning liquid and electroplated copper balls.

[0043] Reference Figure 1 and Figure 3 As shown, the screening mechanism 4 includes a mounting column 41, a screening pipe 42, an auger 43, a motor 44, a discharge pipe 45, a feed hopper 46, a recovery box 47, and a protective pipe 49. A mounting groove 11 is provided on the top surface of the base plate 1, and a motor 6 is installed in the mounting groove 11. The mounting column 41 is fixed on the output shaft of the motor 6. The length direction of the mounting column 41 is the same as the length direction of the support column 31. The screening pipe 42 is installed on the mounting column 41. The length direction of the screening pipe 42 is the same as the length direction of the base plate 1. The discharge pipe 45 is connected to the screening pipe 42. When it is necessary to drive the mounting column 41 to drive the discharge pipe 45 to rotate, the motor 6 drives the mounting column 41 to rotate, which facilitates the adjustment of the position of the discharge pipe 45.

[0044] Reference Figure 1 and Figure 3As shown, motor 44 is mounted on mounting column 41, auger 43 is fixed on the output shaft of motor 44, auger 43 is rotatably mounted inside screening pipe 42, feed hopper 46 is mounted on screening pipe 42 and is connected to screening pipe 42, feed hole is opened on the side of screening pipe 42, and recovery box 47 is located below screening pipe 42, the length direction of recovery box 47 is the same as the length direction of screening pipe 42.

[0045] Reference Figure 1 and Figure 3 As shown, before cleaning the electroplated copper balls, the rotating mounting column 41 drives the discharge pipe 45 to be inserted into the first inlet 211. The electroplated copper balls to be cleaned are poured into the screening pipe 42 through the feeding hopper 46. The drive motor 44 drives the auger 43 to rotate. The auger 43 pushes the electroplated copper balls closer to the discharge pipe 45. At this time, the electroplated copper balls that are not up to size fall into the recycling box 47 through the material passage hole, which is convenient for screening the electroplated copper balls that are not up to size.

[0046] Reference Figure 1 and Figure 3 As shown, the protective pipe 49 is sleeved on the outside of the screening pipe and is mounted on the mounting column 41. The feed hopper 46 is mounted on the protective pipe 49 and the discharge hopper 491 is mounted on the protective pipe 49. The discharge hopper 491 is located directly above the recycling box 47. The arrangement of the protective pipe 49, the discharge hopper 491 and the recycling box 47 facilitates the centralized recycling of electroplated copper balls of unqualified sizes.

[0047] Reference Figure 1 and Figure 3 As shown, the protective tube 49 is equipped with hooks 492, and there are two hooks 492. The recycling bin 47 is equipped with two hanging ropes. The two hanging ropes are symmetrical about the center line of the length direction of the bottom surface of the recycling bin 47. The hanging ropes correspond one-to-one with the hooks 492. The hanging ropes are hung on the hooks 492 for easy access to the recycling bin 47.

[0048] The implementation principle of the electroplated copper ball washing device in this application embodiment is as follows:

[0049] When cleaning of the electroplated copper balls is required, the cleaning solution is delivered into the cleaning tank 21 through the second inlet 212, and the electroplated copper balls are placed into the cleaning tank 21 through the first inlet 211. The drive motor 22 drives the stirring shaft 23 to rotate, and the stirring shaft 23 drives the cleaning brush 24 to wash the electroplated copper balls. After washing is completed, the cleaning solution and electroplated balls can be discharged from the cleaning tank 21 through the discharge port 213, which facilitates the washing of the electroplated copper balls, removes oxides, residues and other impurities from the surface of the electroplated copper balls, and improves the quality and efficiency of the electroplated copper balls.

[0050] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A plating copper ball washing device comprising a plating copper ball for plating use, characterized by: A cleaning mechanism (2) is arranged on the bottom plate (1), the cleaning mechanism (2) comprises a cleaning barrel (21) arranged above the bottom plate (1), a motor I (22) arranged on the cleaning barrel (21), a stirring shaft (23) fixed on the output shaft of the motor I (22), and a cleaning brush (24) arranged on the stirring shaft (23), the stirring shaft (23) is rotatably arranged in the cleaning barrel (21), the cleaning brush (24) is rotatably arranged in the cleaning barrel (21), a first inlet (211) for putting the electroplated copper ball into the cleaning barrel (21) is arranged on the cleaning barrel, a second inlet (212) for conveying cleaning liquid into the cleaning barrel (21) is arranged on the cleaning barrel, and a discharge port (213) is arranged on the cleaning barrel, and sealing covers (5) are arranged on the first inlet (211), the second inlet (212) and the discharge port (213).

2. The electroplated copper ball washing device according to claim 1, characterized in that: The cleaning mechanism (2) comprises a washing ring (25) for cleaning the electroplated copper ball, the washing ring (25) is fixed on the inner wall of the cleaning barrel (21), the axis direction of the washing ring (25) coincides with the axis direction of the cleaning barrel (21), the cleaning brush (24) is rotatably arranged in the washing ring (25), and the electroplated copper ball is arranged between the washing ring (25) and the cleaning brush (24).

3. The electroplated copper ball washing device according to claim 1, wherein: An adjusting mechanism (3) is arranged on the bottom plate (1), the adjusting mechanism (3) comprises a support I (31) arranged on the bottom plate (1), a support II (32) arranged beside the support I (31), a motor II (33) arranged on the support I (31), a screw rod I (34) fixed on the output shaft of the motor II (33), a sliding block I (35) threadedly sleeved on the screw rod I (34), a motor III (36) arranged on the support II (32), a screw rod II (37) fixed on the output shaft of the motor III (36), a sliding block II (38) threadedly sleeved on the screw rod II (37), and an extension piece (39) arranged on the sliding block II (38), the screw rod I (34) is rotatably arranged in the support I (31), the sliding block I (35) is vertically slidably arranged in the support I (31), the cleaning barrel (21) is provided with a connecting block I, the sliding block I (35) is hingedly connected with the connecting block I, the screw rod II (37) is rotatably arranged in the support II (32), the sliding block II (38) is vertically slidably arranged in the support II (32), the cleaning barrel (21) is provided with a connecting block II, and the connecting block II is hingedly connected with the extension piece (39).

4. The electroplated copper ball washing device according to claim 3, characterized in that: The telescopic part (39) comprises a connecting plate (391) arranged on the slider (38) and a sliding plate (392) slidingly arranged in the connecting plate (391), the sliding plate (392) is hinged with the connecting block two, a sliding groove is arranged on the side surface of the connecting plate (391), the sliding plate (392) is slidingly arranged in the sliding groove, a limiting groove is arranged on the side wall of the sliding groove, a limiting block is arranged on the side surface of the sliding plate (392), and the limiting block is slidingly arranged in the limiting groove.

5. The electroplated copper ball washing device of claim 1, wherein: The bottom plate (1) is provided with a screening mechanism (4), the screening mechanism (4) comprises a mounting column (41) rotatably arranged on the bottom plate (1), a screening pipe (42) arranged on the mounting column (41), an auger (43) rotatably arranged in the screening pipe (42), a motor four (44) arranged on the mounting column (41), a discharge pipe (45) connected with the screening pipe (42), a feeding hopper (46) for feeding and a recovery box (47) for recovering copper-plated balls of unqualified size, the auger (43) is fixed on the output shaft of the motor four (44), the feeding hopper (46) is arranged on the screening pipe (42), the feeding hopper (46) is in communication with the screening pipe (42), a material passing hole is arranged on the side surface of the screening pipe (42), and the recovery box (47) is arranged below the screening pipe (42).

6. The electroplated copper ball washing device according to claim 5, characterized in that: A mounting groove (11) is arranged on the top surface of the bottom plate (1), a motor five (6) is arranged in the mounting groove (11), and the mounting column (41) is fixed on the output shaft of the motor five (6).

7. The copper electroplating ball washing apparatus of claim 5, wherein: The screening mechanism (4) comprises a protective pipe (49) sleeved outside the screening pipe, the protective pipe (49) is arranged on the mounting column (41), the feeding hopper (46) is arranged on the protective pipe (49), and a discharge hopper (491) is arranged on the protective pipe (49) and located directly above the recovery box (47).

8. The copper electroplating ball washing apparatus of claim 7, wherein: A hook (492) is arranged on the protective pipe (49), and a hanging rope is arranged on the recovery box (47) and hung on the hook (492).

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