Semiconductor cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor cleaning, in particular to semiconductor cleaning equipment which comprises a cleaning box used for containing cleaning liquid, a fixing structure used for fixing a semiconductor, a cleaning structure used for spraying the cleaning liquid to the semiconductor, a wiping structure used for wiping the surface of the semiconductor and a drying structure used for drying. The semiconductor is placed in the fixing structure, the cleaning structure sprays cleaning liquid to the fixing structure, the wiping structure works to wipe the surface of the semiconductor and remove pollutants on the semiconductor, the spraying structure sprays clear water to the fixing structure, after spraying is completed, the drying mechanism dries the semiconductor, and finally the semiconductor is taken out to complete cleaning. Wiping is not needed, and the workload of operators is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, and in particular to a semiconductor cleaning device. Background Technology

[0002] Semiconductor cleaning is a process used to clean semiconductor devices and components, aiming to remove surface contaminants, organic and inorganic substances to ensure the quality and performance of semiconductor devices. Semiconductor cleaning plays an important role in the semiconductor manufacturing process and helps to improve the reliability and stability of devices.

[0003] However, existing cleaning equipment still has some problems in use. For example, when cleaning semiconductors, they are usually placed in a cleaning tank and soaked in the cleaning solution. Current semiconductor cleaning methods cannot wipe the surface of the semiconductor, and contaminants on the semiconductor surface may not be completely removed. Some contaminants remain after cleaning, which affects the subsequent use of the semiconductor. Utility Model Content

[0004] To improve the completeness of contaminant removal during semiconductor cleaning, this invention provides a semiconductor cleaning device.

[0005] This utility model provides a semiconductor cleaning device, which adopts the following technical solution:

[0006] A semiconductor cleaning device includes a cleaning tank, a fixing structure, a cleaning structure, and a wiping structure. The cleaning tank has a cleaning fluid placement chamber. The fixing structure is fixedly connected to the upper surface of the cleaning tank and contains at least one cleaning tank. The cleaning structure includes a first cleaning tube with its outlet located at the upper part of the fixing structure. The wiping structure includes a driving component and at least one wiping element, which is located on both sides of the cleaning tank within the fixing structure and slidably connected to the fixing structure. With this configuration, a semiconductor is placed in the cleaning tank within the fixing structure. The first cleaning tube sprays cleaning fluid onto the upper part of the fixing structure. The driving component operates, causing the wiping element to reciprocate within the fixing structure, wiping the sides of the semiconductor. This effectively cleans contaminants from the semiconductor surface, facilitating its subsequent use.

[0007] Furthermore, the water inlet of the first cleaning tube is located inside the cleaning fluid placement chamber.

[0008] Furthermore, the cleaning tank is also equipped with a waste liquid collection chamber and a clean water placement chamber. The cleaning structure also includes a second cleaning pipe, with the water outlet of the second cleaning pipe located on the upper part of the fixed structure and the water inlet of the second cleaning pipe located in the clean water placement chamber.

[0009] Furthermore, a first pump body is provided on the first cleaning pipe, and a second pump body is provided on the second cleaning pipe.

[0010] Furthermore, an outer shell is provided at the upper edge of the cleaning tank, the upper surface of the cleaning tank is inclined, and a collection port is provided at the lowest point of the upper surface of the cleaning tank, which is connected to the waste liquid collection tank.

[0011] Furthermore, the cleaning tank is provided with clamping components, which are symmetrically arranged on both sides of the edge of the cleaning tank, and the clamping components are made of soft material.

[0012] Furthermore, wiping channels are provided on both sides of the cleaning tank, and a sliding groove is provided at the bottom of the wiping channel. The wiping component is disposed in the wiping channel, and a slider is fixedly connected to the bottom of the wiping component. The slider is adapted to the sliding groove, and the slider is disposed in the sliding groove, with one side of the slider extending out of the sliding groove.

[0013] Furthermore, the drive assembly includes a motor, an eccentric wheel, and a connecting rod. The motor is fixedly connected to the upper surface of the cleaning tank. A support frame is also provided on the upper surface of the cleaning tank. A bearing is provided inside the support frame. The output shaft of the motor passes through the support frame and is rotatably connected to the support frame. The eccentric wheel is fixedly connected to the output shaft of the motor. A connecting shaft is provided on the side of the eccentric wheel away from the motor. The connecting shaft is located at a non-central position of the eccentric wheel. One end of the connecting rod is rotatably connected to the connecting shaft, and the other end of the connecting rod is rotatably connected to the slider.

[0014] Furthermore, a drying structure is also provided on the upper part of the fixed structure. The drying structure includes a fixing component, a fan, and a heating wire. The fixing component is fixedly connected to the cleaning box, and an air duct is provided on the fixing component. The fan is located on the upper part of the air duct, and the heating wire is fixedly connected inside the air duct.

[0015] In summary, this utility model has at least one of the following beneficial technical effects:

[0016] 1. By setting up a wiping structure, the semiconductor is placed in a cleaning tank within a fixed structure. The first cleaning tube sprays cleaning fluid from the upper part of the fixed structure, driving the component to work and causing the wiping component to reciprocate within the fixed structure to wipe the sides of the semiconductor. This can completely clean the contaminants on the semiconductor surface, which is beneficial for the subsequent use of the semiconductor.

[0017] 2. By setting up a waste liquid collection chamber, after the semiconductor is cleaned, the waste liquid can flow into the waste liquid collection chamber through the collection port, preventing the cleaning liquid from flowing out and polluting the environment, which is beneficial to the collection and treatment of waste liquid.

[0018] 3. With the drying structure in place, after cleaning, the fan and heating wire work to blow hot air to dry the semiconductor, eliminating the need for wiping and saving the operator's workload. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this application;

[0020] Figure 2 This is a schematic diagram of the entire structure of this application without its outer shell;

[0021] Figure 3 This is a cross-sectional structural diagram of the entire application;

[0022] Figure 4 This is a first-view structural schematic diagram of the wiping component of this application;

[0023] Figure 5 This is a structural schematic diagram of the wiping component from a second perspective;

[0024] Figure 6 This is a cross-sectional structural diagram of the fixed structure of this application;

[0025] Figure 7 This is a schematic diagram of the drying structure of this application;

[0026] Reference numerals: 100, cleaning tank; 110, cleaning fluid placement chamber; 120, waste liquid collection chamber; 130, clean water placement chamber; 140, outer shell; 150, collection port; 200, fixing structure; 210, cleaning tank; 220, clamping component; 230, wiping channel; 240, sliding groove; 300, cleaning structure; 310, first cleaning pipe; 320, second cleaning pipe; 400, wiping structure; 410, drive assembly; 411, motor; 412, eccentric wheel; 413, connecting rod; 414, connecting shaft; 420, wiping component; 430, slider; 500, drying structure; 510, fixing component; 520, fan; 530, heating wire. Detailed Implementation

[0027] The technical solutions of this utility model are clearly and completely described below through specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] The following combination Figures 1-7 The present invention will be described in further detail below.

[0029] This embodiment discloses a semiconductor cleaning device, referring to... Figures 1-7 The system includes a cleaning tank 100 for holding cleaning fluid, a fixing structure 200 for fixing semiconductors, a cleaning structure 300 for spraying cleaning fluid onto the semiconductors, a wiping structure 400 for wiping the surface of the semiconductors, and a drying structure 500 for drying. In use, the semiconductors are placed in the fixing structure 200, the cleaning structure 300 sprays cleaning fluid onto the fixing structure 200, the wiping structure 400 wipes the surface of the semiconductors to remove contaminants, the spraying structure sprays clean water onto the fixing structure 200, and after spraying, the drying mechanism dries the semiconductors. Finally, the semiconductors are removed to complete the cleaning process, eliminating the need for further drying and saving operators' workload.

[0030] Reference Figures 1-3 The cleaning tank 100 is a cuboid in shape. Inside the cleaning tank 100, there is a cleaning fluid placement chamber 110, a waste liquid collection chamber 120, and a clean water placement chamber 130. The waste liquid collection chamber is located on the far left, the cleaning fluid placement chamber 110 is located in the middle, and the clean water placement chamber 130 is located on the right. The upper edge of the cleaning tank 100 is provided with an outer shell 140. The upper surface of the cleaning tank 100 is inclined. The lowest point of the upper surface of the cleaning tank 100 is provided with a collection port 150, which is connected to the waste liquid collection chamber.

[0031] Thus, after cleaning the semiconductor, the waste liquid flows along the inclined direction on the upper surface of the cleaning tank 100 and flows into the collection port 150 at the lowest point. The waste liquid can flow into the waste liquid collection chamber 120 through the collection port 150, preventing the cleaning liquid from flowing out and polluting the environment, which is beneficial to the collection and treatment of waste liquid.

[0032] Reference Figures 1-3 , Figure 6 This embodiment adds the following technical features (the following specific settings are made for the fixing structure 200): the fixing structure 200 is fixedly connected to the upper surface of the cleaning tank 100, the fixing structure 200 is provided with at least one cleaning tank 210, the cleaning tank 210 is provided with a clamping member 220, the clamping members 220 are symmetrically arranged on both sides of the edge of the cleaning tank 210, the clamping member 220 is made of soft material, and the cleaning tank 210 is also provided with a water outlet.

[0033] Thus, when the semiconductor is placed in the cleaning tank 210, the clamping member 220 is elastic and can fix the semiconductor in the cleaning tank 210. When cleaning the semiconductor, the liquid can flow out through the water outlet of the cleaning tank 210.

[0034] Reference Figures 1-3 This embodiment adds the following technical features (the cleaning structure 300 is specifically configured as follows): the cleaning structure 300 includes a first cleaning pipe 310 and a second cleaning pipe 320. The water outlet of the first cleaning pipe 310 is located on the upper part of the fixed structure 200, and the water inlet of the first cleaning pipe 310 is located in the cleaning liquid placement chamber 110. The water outlet of the second cleaning pipe 320 is located on the upper part of the fixed structure 200, and the water inlet of the second cleaning pipe 320 is located in the clean water placement chamber 130. A first pump body is provided on the first cleaning pipe 310, and a second pump body is provided on the second cleaning pipe 320.

[0035] Thus, after the semiconductor is fixed in the cleaning tank 210, the first pump on the first cleaning tube 310 operates, the first cleaning tube 310 draws the cleaning liquid in the cleaning liquid placement chamber 110 and sprays it into the cleaning tank 210. After cleaning is completed, the second pump on the second cleaning tube 320 operates, the second cleaning tube 320 draws the clean water in the clean water placement chamber 130 to rinse the semiconductor and remove the cleaning liquid from the semiconductor.

[0036] Reference Figures 1-5 This embodiment adds the following technical features (specifically, the wiping structure 400 is configured as follows): The wiping structure 400 includes a driving assembly 410 and at least one wiping element 420. The wiping element 420 is disposed on both sides of the cleaning tank 210 within the fixed structure 200. The wiping element 420 is slidably connected to the fixed structure 200. Wiping channels 230 are provided on both sides of the cleaning tank 210. A sliding groove 240 is provided at the lower part of the wiping channel 230. The wiping element 420 is disposed within the wiping channel 230. A slider 430 is fixedly connected to the part. The slider 430 is adapted to the slide groove 240 and is disposed in the slide groove 240. One side of the slider 430 extends out of the slide groove 240. Multiple sliders 430 are connected by a connector, which is a rectangular rod. A rectangular opening is provided between the multiple slide grooves 240. The connector is located in the rectangular opening. When the wiping member 420 slides, the connector can slide in the rectangular opening. Sponges are provided on the adjacent sides of adjacent wiping members 420. The sponges can contact the semiconductor side.

[0037] Reference Figure 2The drive assembly 410 includes a motor 411, an eccentric wheel 412, and a connecting rod 413. The motor 411 is fixedly connected to the upper surface of the cleaning tank 100. A support frame is also provided on the upper surface of the cleaning tank 100. A bearing is provided inside the support frame. The output shaft of the motor 411 passes through the support frame and is rotatably connected to the support frame. The eccentric wheel 412 is fixedly connected to the output shaft of the motor 411. A connecting shaft 414 is provided on the side of the eccentric wheel 412 away from the motor 411. The connecting shaft 414 is located at a non-central position of the eccentric wheel 412. One end of the connecting rod 413 is rotatably connected to the connecting shaft 414, and the other end of the connecting rod 413 is rotatably connected to the slider 430.

[0038] Thus, during the spraying of cleaning fluid, the motor 411 operates, driving the eccentric wheel 412 to rotate. The eccentric wheel 412 drives the wiping component 420 to reciprocate on both sides of the cleaning tank 210, wiping away contaminants on the semiconductor. This ensures that the contaminants on the semiconductor surface are completely cleaned, which is beneficial for the subsequent use of the semiconductor.

[0039] Reference Figures 1-3 , Figure 7 This embodiment adds the following technical features (the drying structure 500 is specifically configured as follows): the upper part of the fixed structure 200 is also provided with a drying structure 500, the drying structure 500 includes a fixing member 510, a fan 520 and a heating wire 530, the fixing member 510 is fixedly connected to the cleaning box 100, the fixing member 510 is provided with an air duct, the fan 520 is located at the upper part of the air duct, and the heating wire 530 is fixedly connected inside the air duct.

[0040] Thus, after cleaning, the fan 520 and heating wire 530 work to blow hot air to dry the semiconductor, eliminating the need for wiping and saving the operator's workload.

[0041] The implementation principle of this embodiment is as follows:

[0042] The semiconductor is placed in the cleaning tank 210 within the fixing structure 200. The clamping member 220 is elastic and can fix the semiconductor in the cleaning tank 210. After the semiconductor is fixed in the cleaning tank 210, the first pump on the first cleaning tube 310 operates, and the first cleaning tube 310 draws cleaning fluid from the cleaning fluid placement chamber 110 and sprays it into the cleaning tank 210. During the spraying of cleaning fluid, the motor 411 operates, driving the eccentric wheel 412 to rotate. The eccentric wheel 412 drives the wiping member 420 to reciprocate on both sides of the cleaning tank 210, wiping away contaminants on the semiconductor. This can completely clean the contaminants on the semiconductor surface, which is beneficial for the later use of the semiconductor. After cleaning is completed, the second pump on the second cleaning tube 320 operates, and the second cleaning tube 320 draws clean water from the clean water placement chamber 130 to rinse the semiconductor and remove the cleaning fluid from the semiconductor.

[0043] After cleaning the semiconductor, the waste liquid flows along the inclined direction on the upper surface of the cleaning tank 100 and flows into the collection port 150 at the lowest point. The waste liquid can flow into the waste liquid collection chamber 120 through the collection port 150, preventing the cleaning liquid from flowing out and polluting the environment, which is beneficial to the collection and treatment of waste liquid.

[0044] After cleaning, the blower 520 and heating wire 530 work to blow hot air to dry the semiconductor. After drying, the semiconductor is removed to complete the cleaning operation. There is no need to wipe it again, which saves the operator's workload.

[0045] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A semiconductor cleaning apparatus characterized by comprising: Including the cleaning tank, fixed structure, cleaning structure and wiping structure, the cleaning tank is provided with cleaning liquid placing cavity, the fixed structure is fixedly connected to the upper surface of the cleaning tank, at least one cleaning tank is arranged in the fixed structure, the cleaning structure includes first cleaning pipe, the water outlet end of the first cleaning pipe is arranged in the upper part of the fixed structure, the wiping structure includes driving assembly and at least one wiping piece, the wiping piece is arranged in the both sides of the cleaning tank in the fixed structure, and the wiping piece is slidably connected with the fixed structure.

2. The semiconductor cleaning apparatus according to claim 1, wherein The water inlet end of the first cleaning pipe is arranged in the cleaning liquid placing cavity.

3. The semiconductor cleaning apparatus according to claim 1, wherein The cleaning tank is also provided with waste liquid collecting cavity and clean water placing cavity, the cleaning structure further includes second cleaning pipe, the water outlet end of the second cleaning pipe is arranged in the upper part of the fixed structure, and the water inlet end of the second cleaning pipe is arranged in the clean water placing cavity.

4. The semiconductor cleaning apparatus according to claim 3, wherein The first pump body is arranged on the first cleaning pipe, and the second pump body is arranged on the second cleaning pipe.

5. The semiconductor cleaning apparatus according to claim 3, wherein The upper edge of the cleaning tank is provided with a shell, the upper surface of the cleaning tank is inclinedly arranged, the lowest part of the upper surface of the cleaning tank is provided with a collecting port, and the collecting port is communicated with the waste liquid collecting tank.

6. The semiconductor cleaning apparatus according to claim 1, wherein The clamping piece is arranged in the cleaning tank, the clamping piece is symmetrically arranged on both sides of the edge of the cleaning tank, and the clamping piece is made of soft material.

7. The semiconductor cleaning apparatus according to claim 1, wherein The wiping channel is arranged on both sides of the cleaning tank, the lower part of the wiping channel is provided with a sliding groove, the wiping piece is arranged in the wiping channel, the lower part of the wiping piece is fixedly connected with a sliding block, the sliding block is matched with the sliding groove, the sliding block is arranged in the sliding groove, and one side of the sliding block extends out of the sliding groove.

8. The semiconductor cleaning apparatus according to claim 7, wherein The driving assembly includes a motor, an eccentric wheel and a connecting rod, the motor is fixedly connected to the upper surface of the cleaning tank, the upper surface of the cleaning tank is also provided with a support frame, the support frame is provided with a bearing, the output shaft of the motor penetrates through the support frame, and the output shaft is rotatably connected with the support frame, the eccentric wheel is fixedly connected with the output shaft of the motor, one side of the eccentric wheel away from the motor is provided with a connecting shaft, the connecting shaft is arranged at a non-central position of the eccentric wheel, one end of the connecting rod is rotatably connected with the connecting shaft, and the other end of the connecting rod is rotatably connected with the sliding block.

9. The semiconductor cleaning apparatus according to claim 1, wherein The upper part of the fixed structure is also provided with a drying structure, the drying structure includes a fixed part, a fan and a heating wire, the fixed part is fixedly connected to the cleaning tank, the fixed part is provided with an air duct, the fan is arranged on the upper part of the air duct, and the heating wire is fixedly connected in the air duct.

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