Cutter for processing silicon carbide material
By adopting a design that combines diamond cutting tips and tungsten carbide substrates with a chip removal groove structure, the lifespan and accuracy issues of existing silicon carbide cutting tools in CVD SiC material processing have been solved, achieving highly efficient material processing results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-06
- Publication Date
- 2026-03-13
AI Technical Summary
Existing silicon carbide cutting tools have problems such as uncontrollable lifespan, tool burning and breakage when machining CVD SiC materials, and low machining accuracy, making it difficult to meet high-quality requirements.
Using diamond as the cutting head material and tungsten steel as the base material, chip removal grooves are set on the end face and side to ensure hardness and rigidity. The cutting head is formed by welding and using a single-layer sintering process to improve machining accuracy and chip removal efficiency.
It improves the machining accuracy and life of cutting tools, reduces manufacturing costs, improves material surface quality and yield, and meets the high hardness machining requirements of CVD SiC materials.
Smart Images

Figure CN223989642U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon carbide parts processing equipment, and in particular to a cutting tool for processing silicon carbide materials. Background Technology
[0002] Chemical vapor deposition of silicon carbide (CVD SIC) is widely used in the semiconductor industry due to its high purity and uniformity. CVD SIC has a Mohs hardness of 9.0-9.5, while existing silicon carbide cutting tools, constrained by processing technology and structure, generally have lower Mohs hardness. This leads to problems during machining, such as uncontrollable tool life, tool burning and breakage, and substandard surface quality of the machined CVD SIC material. Furthermore, the CVD SIC growth process is complex, and the material is very expensive; therefore, the machining quality and yield significantly impact manufacturing costs. In addition, insufficient rigidity of the tool substrate can cause excessive runout and low machining accuracy. Existing silicon carbide machining tools struggle to overcome these issues. Utility Model Content
[0003] This utility model aims to solve the above problems and provides a cutting tool for machining silicon carbide materials, the technical solution of which is as follows:
[0004] A cutting tool for machining silicon carbide materials includes a base and a cutting head. Both the base and the cutting head are cylindrical structures, and the base and the cutting head are coaxially fixedly connected. The diameter of the cutting head is larger than the diameter of the base. The cutting head has a chip-removing groove formed by an inward indentation in the middle of the side away from the base. The base is made of tungsten steel, and the cutting head is made of diamond material. A chip-removing groove is provided on the cutting head.
[0005] Based on the above scheme, the chip removal groove includes an end face chip removal groove and a side face chip removal groove. The end face chip removal groove is provided through the two end faces of the cutter head, and the axis of the end face chip removal groove is parallel to the axis of the cutter head. The side face chip removal groove is provided on the side of the cutter head and is recessed in the radial direction of the cutter head towards the axis of the cutter head. The side face chip removal groove is provided through the two end faces of the cutter head.
[0006] Based on the above scheme, the cross-section of the end face chip removal groove is circular, and the end face chip removal groove has a straight cylindrical structure.
[0007] Based on the above scheme, the number of end face chip removal grooves is 6, and they are evenly distributed circumferentially on the cutter head.
[0008] Preferably, the side chip removal groove is a rectangular groove, and the extending direction of the side chip removal groove is inclined relative to the axis of the cutter head.
[0009] Based on the above scheme, the number of side chip removal grooves is 4, and they are evenly distributed circumferentially on the side of the cutter head.
[0010] Preferably, the end face of the substrate and the end face of the cutter head are connected by welding.
[0011] Preferably, the cutting head is formed by a single-layer sintering process.
[0012] The beneficial effects of this utility model are as follows: using diamond as the tool tip material and tungsten steel as the matrix material ensures that the Mohs hardness and rigidity of the tool tip and the matrix meet the processing requirements of CVD SIC, improves the processing accuracy of the tool, improves the surface processing quality of the material, increases the processing yield, and reduces manufacturing costs; the end face chip removal groove and the side chip removal groove are set to facilitate the timely removal of waste chips during the processing, reduce the contact between waste chips and the tool, and improve the tool life and material processing accuracy. Attached Figure Description
[0013] Figure 1 : A schematic diagram of the structure of this utility model;
[0014] Figure 2 : Schematic diagram of the bottom structure of the cutter head of this utility model;
[0015] Figure 3 : Schematic diagram of the end face structure of the chip removal groove of this utility model. Detailed Implementation
[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0017] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0018] In the description of this utility model, it should be understood that the terms "center," "length," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," and "inner," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0019] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0020] like Figures 1 to 3 As shown, a cutting tool for machining silicon carbide (CVD) materials includes a substrate 1 and a cutting head 2. Both the substrate 1 and the cutting head 2 are cylindrical structures, facilitating drilling and other machining operations on CVD SiC materials. The diameter of the cutting head 2 is larger than the diameter of the substrate 1, and the substrate 1 and the cutting head 2 are coaxially and fixedly connected. A chip groove is formed inwardly at the center of the side of the cutting head 2 away from the substrate 1, creating a ring-shaped structure on the outer side of the bottom of the cutting head 2. This facilitates chip removal during cutting and reduces the cross-cutting force and torque when milling using the bottom end face of the cutting head 2, thus extending the tool's service life. Preferably, the end face of the substrate 1 and the end face of the cutting head 2 are connected by welding. The substrate 1 is made of tungsten steel, and the cutting head 2 is made of diamond material to ensure that the hardness and rigidity of the substrate 1 and the cutting head 2 meet the machining requirements of CVD SiC, preventing substrate breakage or excessive tool runout that could lead to low machining accuracy, while also extending the tool's service life. Preferably, the cutting head 2 is formed by a single-layer sintering process. Compared with traditional cutting tools supported by an integral sintering process, the cutting head 2 formed by the single-layer sintering process has better roundness and flatness, thereby improving the machining accuracy of the cutting tool.
[0021] The cutting head 2 is equipped with chip removal grooves to facilitate timely chip removal, reduce contact between the cutting tool and material with the chips, and improve tool life and material machining accuracy. The chip removal grooves include end face chip removal grooves 3 and side chip removal grooves 4. The end face chip removal grooves 3 are arranged through the two end faces of the cutting head 2, and their axes are parallel to the axis of the cutting head 2. The side chip removal grooves 4 are located on the side of the cutting head 2 and are recessed radially towards the axis of the cutting head 2. The side chip removal grooves 4 are arranged through the two end faces of the cutting head 2. The chip removal grooves at different positions facilitate the removal of machining chips from the end face or side face.
[0022] The end face chip removal groove 3 has a circular cross-section and is a straight cylindrical structure. There are six end face chip removal grooves 3, evenly distributed circumferentially on the cutter head 2. The side chip removal groove 4 is a rectangular groove, and its extension direction is inclined relative to the axis of the cutter head 2, facilitating timely discharge of waste chips along the side chip removal groove 4 during the rotation of the cutter head 2. There are four side chip removal grooves 4, evenly distributed circumferentially on the side of the cutter head 2.
[0023] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.
Claims
1. A tool for machining silicon carbide material, characterized by Including base (1) and tool bit (2), base (1) and tool bit (2) are cylindrical structure, and base (1) and tool bit (2) are coaxially fixed connection, the diameter of tool bit (2) is greater than the diameter of base (1), tool bit (2) is recessed to form the chip flute in the middle of the side away from base (1);The base (1) is made of tungsten steel, and the tool bit (2) is made of diamond material;Tool bit (2) is provided with chip flute.
2. The tool according to claim 1, wherein The chip flute includes end face chip flute (3) and side face chip flute (4), the end face chip flute (3) is provided on the two end faces of tool bit (2), and the axis of end face chip flute (3) is parallel to the axis of tool bit (2);The side face chip flute (4) is arranged on the side face of tool bit (2), and is recessed along the radial direction of tool bit (2) to the axis direction of tool bit (2), and the side face chip flute (4) is provided on the two end faces of tool bit (2).
3. The tool according to claim 2, wherein The cross section of the end face chip flute (3) is circular, and the end face chip flute (3) is straight cylindrical structure.
4. The tool according to claim 3, wherein The number of end face chip flute (3) is 6, and is evenly distributed on the circumference of tool bit (2).
5. The tool according to claim 2, wherein The side face chip flute (4) is rectangular groove, and the extension direction of side face chip flute (4) is inclined compared with the axis of tool bit (2).
6. The tool according to claim 5, wherein The number of side face chip flute (4) is 4, and is evenly distributed on the circumference of tool bit (2).
7. The tool according to claim 1, wherein The end face of base (1) and the end face of tool bit (2) are connected by welding.
8. The tool according to claim 1, wherein The tool bit (2) is formed by single layer sintering process.