Device and system for tinning photovoltaic solder strip

Abstract

The utility model belongs to the technical field of solder strip manufacturing, and relates to a device and a system for tinning a photovoltaic solder strip. Comprising a floating die for primary sizing and an annular air knife for secondary sizing, a first tangent point of a wire pressing plate in the vertical direction and an annular air opening focus point of the annular air knife are located on the same vertical line, and the floating die is located between the first tangent point and the annular air opening focus point; a lifting tin furnace is arranged below the wire pressing plate, a photovoltaic welding strip is pressed into tin liquid in the lifting tin furnace through the wire pressing plate, the average density of the floating die is smaller than that of the tin liquid, airflow of the annular air opening does not cause splashing of a small amount of the tin liquid, die blocking, scalding and other conditions are not likely to be caused, size fluctuation is small, and production efficiency is high. The size of a finished product can be controlled, and the size consistency of the product is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of solder ribbon manufacturing technology, and relates to an apparatus and system for tin plating photovoltaic solder ribbon. Background Technology

[0002] In the photovoltaic industry, there are two main production methods for photovoltaic solder ribbons: electroplating and hot-dip plating. Electroplating is more expensive and has a smaller market share in the photovoltaic industry, while the mainstream hot-dip plating method is cheaper and simpler, giving it a significant advantage in the photovoltaic industry. In the hot-dip plating process, tin plating is the core technology; the tin plating process affects important indicators such as coating thickness, finished product size, and surface quality of the photovoltaic solder ribbon. Currently, in the production of hot-dip coated circular photovoltaic solder ribbons, the industry commonly uses the annular air knife method, which forms a uniform airflow around the entire circumference of the round copper wire, using gas to wipe and create a photovoltaic solder ribbon with a consistent coating.

[0003] In today's market, new photovoltaic module technologies are constantly emerging, with micro-fine circular solder ribbons (SMBB and OBB) becoming the mainstream. As the size of photovoltaic solder ribbons continues to decrease, major manufacturers usually compensate for lost capacity by increasing production speed. However, with increased speed, the amount of tin applied to the copper wire increases, and wiping away excess tin solution puts a lot of pressure on the existing air knife. Common problems include air knife blockage and micro-spores in the tin layer of the product, affecting product yield and finished product quality.

[0004] Furthermore, Chinese utility model patent application number 202011376698.9 and publication number CN112501534B discloses a tin-plating mold for a double-layer photovoltaic irregularly shaped solder strip, including a first annular mold sleeve, a first mold core, a second annular mold sleeve, and a second mold core; the first mold core is disposed inside the first annular mold sleeve, and the second mold core is disposed inside the second annular mold sleeve; the first annular mold sleeve is located below the second annular mold sleeve; the first annular mold sleeve and the second annular mold sleeve are fixedly connected by a plurality of connecting blocks evenly distributed along the circumference, and the adjacent connecting blocks are side-flow solder ports; a scraping hole is opened in the center of the first mold core, and a sizing hole adapted to the size and shape of the scraping hole is opened in the center of the second mold core; the first mold core is recessed inward at its bottom end to form a conical scraping area. While the mold controls the solder layer thickness, residual flux organic matter easily adheres to the area around the mold opening during the tin-plating process, causing mold blockage and a gradual reduction in the copper wire diameter, making cleaning difficult and unsuitable for long-term use. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and to propose a device and system for tin plating of photovoltaic solder strips.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] This utility model provides a device for tin plating of photovoltaic solder ribbon, including a frame, on which a pressure plate adjustment seat and an air knife adjustment seat are provided. The pressure plate adjustment seat is connected to a fixed plate, and a pressure plate is provided at the lower end of the fixed plate.

[0008] It also includes a floating mold for primary sizing and an annular air knife for secondary sizing, wherein the first tangent point of the pressure plate in the vertical direction is located on the same vertical line as the focal point of the annular air outlet of the annular air knife, and the floating mold is located between the first tangent point and the focal point of the annular air outlet.

[0009] A lifting solder furnace is provided below the pressure plate. The photovoltaic solder ribbon is pressed down into the molten solder in the lifting solder furnace through the pressure plate. The average density of the floating mold is less than the average density of the molten solder.

[0010] Furthermore, the floating mold includes an upper mold and a lower mold, the upper mold and the lower mold being screwed together; the upper mold includes a first ring, within which a conical mold core is provided, each conical mold core having a mold hole at its center, the conical mold core being connected to the inner wall of the first ring via multiple upper mold rib strips, with each pair of upper mold rib strips being hollowed out; the lower mold includes a second ring, with a central ring at its center, the central ring being connected to the inner wall of the second ring via multiple lower mold rib strips, with each pair of lower mold rib strips being hollowed out, the lower mold rib strips corresponding to the upper mold rib strips; the second ring is screwed together with the first ring.

[0011] Furthermore, let D be the angle between every two upper mold rib strips, then 45°≤D≤90°.

[0012] Furthermore, let G be the inner diameter of the upper mold hole of the conical mold core, then 1mm≤G≤2mm.

[0013] Furthermore, the inner diameter of the annular hole of the central ring is smaller than the inner diameter of the upper mold hole.

[0014] Furthermore, the upper surface of the conical mold core is a conical surface, and the lower part of the conical mold core is a conical cavity.

[0015] Furthermore, let the cone angle of the conical surface be F, and the cone angle of the conical cavity be E, then 60°≤E=F≤90°.

[0016] Furthermore, both the pressure plate adjusting seat and the air knife adjusting seat are XY platforms.

[0017] Furthermore, a lifting screw is provided below the lifting tin furnace.

[0018] This utility model also provides a system based on a device for tin plating of photovoltaic solder ribbon, including a flux support cabinet, wherein a flux storage area is provided inside the flux support cabinet, and the flux storage area is inclined.

[0019] The frame is equipped with a traction guide wheel, which is located above the annular air knife. The second tangent point of the traction guide wheel in the vertical direction is on the same vertical line as the first tangent point and the focal point of the annular air outlet of the annular air knife.

[0020] Two rows of cooling fans are provided between the traction guide wheel and the annular air knife, and the photovoltaic welding ribbon passes between the two rows of cooling fans;

[0021] The photovoltaic welding ribbon passes sequentially through the flux storage area, the pressure plate, the floating mold, the annular air knife, the cooling fan, and the guide wheel.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The floating mold limits the amount of solder applied to the photovoltaic solder ribbon surface, controlling a solder amount slightly greater than the required coating thickness. During the upward traction process, the center of the floating mold moves around the photovoltaic solder ribbon, forming a uniform solder column between the floating mold outlet and the annular air vent, preventing significant eccentricity. Simultaneously, with the solder amount limited, airflow wiping becomes easier, requiring less pressure. Products wiped by the air knife exhibit less dimensional fluctuation in coating, resulting in a smoother appearance. This facilitates dimensional control of the finished product, ensuring consistent product dimensions and guaranteeing both product quality and yield.

[0024] 2. After the solder pillar between the outlet and the annular vent of the floating mold is wiped away by the annular air knife, the excess solder flows back to the solder pot along the conical surface of the floating mold and will not accumulate on the floating mold; the airflow of the annular vent will not cause a small amount of solder to splash, and is less likely to cause mold blockage and burns.

[0025] 3. During normal production, the floating mold floats on the surface of the molten tin in the furnace. The upper surface and the conical tin outlet of the floating mold are higher than the molten tin surface. The molten tin is carried upward from the central mold hole by the copper wire through the inlet on the lower surface of the floating mold. Impurities such as tin ash floating on the surface of the molten tin in the furnace are separated and will not enter the molten tin outlet of the floating mold, which is less likely to cause mold blockage, greatly reduces the cleaning process, and improves work efficiency.

[0026] 4. When trace amounts of copper powder and flux residue remain on the surface of the photovoltaic solder ribbon pass through the floating mold, the lower mold aperture (i.e., the annular hole of the central ring) is smaller than the upper mold aperture. During the vertical upward traction process, the floating mold is in a floating state and easily moves. If the photovoltaic solder ribbon comes into contact with the floating mold, it will only contact the lower mold aperture, and the contact time is extremely short. The lower mold aperture is immersed in the molten solder and does not affect the amount of solder in the upper mold aperture. Attached Figure Description

[0027] The accompanying drawings are incorporated in and form part of this specification, and together with the description, serve to explain the principles of this invention.

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a process flow diagram for tin plating of photovoltaic solder ribbon in this utility model;

[0030] Figure 2 This is a schematic diagram of the wiring position of the photovoltaic solder ribbon tinning device in this utility model;

[0031] Figure 3 This is a schematic diagram of the working position of the photovoltaic solder ribbon tin plating device in this utility model;

[0032] Figure 4 This is a schematic diagram of the upper mold structure in this utility model;

[0033] Figure 5 This is a cross-sectional view of the upper mold structure in this utility model;

[0034] Figure 6 This is a schematic diagram of the upper mold cone angle of this utility model;

[0035] Figure 7 This is a schematic diagram of the floating mold tin dipping process in this utility model;

[0036] Figure 8 This is a schematic diagram of the overall upper mold structure in this utility model;

[0037] Figure 9 This is a schematic diagram of the overall structure of the lower mold in this utility model.

[0038] Wherein: 1 is the frame; 2 is the wire pressing plate adjustment seat; 3 is the air knife adjustment seat; 4 is the fixed plate; 5 is the annular air knife; 6 is the floating mold; 6-1 is the upper mold; 6-11 is the first ring; 6-12 is the conical mold core; 6-13 is the upper mold hole; 6-14 is the upper mold rib strip; 6-2 is the lower mold; 6-21 is the second ring; 6-22 is the central ring; 6-23 is the lower mold rib strip; 7 is the molten solder; 8 is the lifting solder furnace; 9 is the lifting screw; 10 is the traction guide wheel; 11 is the cooling fan; 12 is the photovoltaic solder ribbon; 13 is the flux storage area; 14 is the wire pressing plate; A is the second tangent point; B is the annular air outlet focusing point; C is the first tangent point; 15 is the flux support cabinet. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses consistent with some aspects of this invention as detailed in the appended claims.

[0040] Example

[0041] like Figure 1-9 As shown, an apparatus for tin plating photovoltaic solder ribbon includes a frame 1, on which a pressure plate adjusting seat 2 and an air knife adjusting seat 3 are provided. The pressure plate adjusting seat 2 is connected to a fixing plate 4, and a pressure plate 14 is provided at the lower end of the fixing plate 4.

[0042] It also includes a floating mold 6 for primary sizing and an annular air knife 5 for secondary sizing. The first tangent point of the pressure plate 14 in the vertical direction is located on the same vertical line as the annular air outlet focal point of the annular air knife 5, and the floating mold 6 is located between the first tangent point and the annular air outlet focal point.

[0043] A lifting solder furnace 8 is provided below the pressure plate 14. The photovoltaic solder ribbon 12 is pressed down into the molten solder 7 in the lifting solder furnace 8 through the pressure plate 14. The average density of the floating mold 6 is less than the average density of the molten solder 7.

[0044] In this embodiment: primary sizing refers to using a floating mold 6 to limit the amount of solder applied to the surface of the photovoltaic solder ribbon 12, with the controlled amount of solder slightly exceeding the required coating thickness. During the upward traction process, the center of the floating mold 6 moves around the photovoltaic solder ribbon 12, maintaining a uniform solder column between the outlet of the floating mold 6 and the annular vent, ensuring that the solder column never causes significant eccentricity. The photovoltaic solder ribbon 12 is made of copper wire, and the molten solder is a tin-lead alloy liquid.

[0045] Secondary sizing refers to using an annular air knife 5 to wipe the amount of tin on the surface of the photovoltaic solder ribbon 12. After the amount of tin on the surface of the photovoltaic solder ribbon 12 is limited, the airflow of the annular air knife 5 becomes easier to wipe, the required pressure is reduced, and the coating size of the product formed by wiping with the annular air knife 5 has smaller fluctuations, which is conducive to the control of the finished product size and ensures the consistency of product size.

[0046] After the tin pillar between the upper outlet of the floating mold 6 and the annular air vent is wiped away by the annular air knife 5, the excess molten tin flows back to the tin furnace along the conical surface of the floating mold 6 through the gaps between the upper mold rib strips 6-14 and the lower mold rib strips 6-23, without forming an accumulation on the floating mold 6.

[0047] During normal production, the floating mold 6 floats on the surface of the molten tin. The upper surface and the conical tin outlet of the floating mold 6 are higher than the molten tin surface. The molten tin is carried upward from the upper mold hole 6-13 by the photovoltaic solder ribbon 12 through the lower surface inlet of the floating mold 6. The tin ash and other impurities floating on the molten tin surface 7 of the molten tin are separated and will not enter the tin outlet of the floating mold 6.

[0048] Furthermore, the first tangent point of the pressure plate 14 in the vertical direction refers to Figure 1 Point C (the point where the wire guide roller and the solder strip are tangent in the vertical direction) and point B (the focal point of the combined air knife's annular nozzle) are indicated. The airflow from the annular air knife's nozzle 5 will not cause splashing of small amounts of molten solder, thus minimizing the risk of mold blockage and burns.

[0049] The floating mold is made of stainless steel. The density of a standard 6040 tin-lead alloy is approximately 8.5 g / cm³. 3 Stainless steel has a density of approximately 7.98 g / cm³. Using the two-force equilibrium method: F 浮 =G 物 , i.e., ρ 液 gv 排 =ρ 物 v 物 g. Stainless steel material v 排 / v 物 =7.93 / 8.5 = 0.935.

[0050] Further, the floating mold 6 includes an upper mold 6-1 and a lower mold 6-2, the upper mold 6-1 and the lower mold 6-2 being screwed together; the upper mold 6-1 includes a first ring 6-11, within which a conical mold core 6-12 is provided, each conical mold core 6-12 having a mold hole 6-13 at its center, the conical mold core 6-12 being connected to the inner wall of the first ring 6-11 via multiple mold rib strips 6-14, each... The two upper mold rib strips 6-14 are hollowed out; the lower mold 6-2 includes a second ring 6-21, and a central ring 6-22 is provided at the center of the second ring 6-21. The central ring 6-22 is connected to the inner wall of the second ring 6-21 through a plurality of lower mold rib strips 6-23. The two lower mold rib strips 6-23 are hollowed out, and the lower mold rib strips 6-23 correspond to the upper mold rib strips 6-14.

[0051] In this embodiment: the floating mold 6 is as follows Figure 7-9 As shown, it is composed of an upper mold 6-1 and a lower mold 6-2. The back of the floating mold 6 is equipped with a primary positioning platform and a secondary positioning platform. The primary positioning platform is used for the concentricity of the center holes of the upper and lower molds, while the secondary platform is responsible for filling the molten solder. The lower mold 6-1 has a similar structure to the upper mold 6-2, with its center hole being half the inner diameter of the center hole of the upper mold 6-1. After the two are combined, an open cavity is formed at the mating surface, as shown... Figure 5As shown, after the mold is immersed in molten solder, the molten solder fills the inner cavity of the mold through the hollow area of ​​the lower mold, submerging the upper mold rib strip 6-14. At this time, under the action of the buoyancy of the molten solder, the mold is stably suspended above the molten solder. Furthermore, the lower mold rib strip 6-23 corresponds one-to-one with the upper mold rib strip 6-14.

[0052] Furthermore, such as Figure 5-6 As shown, let D be the angle between every two upper mold rib strips 6-14, then 45°≤D≤90°.

[0053] Furthermore, if the inner diameter of the upper mold hole 6-13 of the conical mold core 6-12 is G, then 1mm≤G≤2mm.

[0054] In this embodiment: the upper mold 6-1 is hollow, and the opening angle of the hollow (i.e. the angle D between every two upper mold rib strips 6-14) is in the range of 45°≤D≤90°; the upper surface is tapered, with a cone angle of 60°≤E=F≤90°, and the center hole is 1mm≤G≤2mm, which is smaller than the inner hole size of the upper annular air knife 5.

[0055] Furthermore, the upper surface of the conical mold core 6-12 is a conical surface, and the lower part of the conical mold core 6-12 is a conical cavity.

[0056] Furthermore, the inner diameter of the annular hole of the central ring 6-22 is smaller than the inner diameter of the upper mold hole 6-13.

[0057] In this embodiment: When the trace amounts of copper powder and flux residue on the surface of the photovoltaic solder ribbon 12 pass through the floating mold 6, the lower mold hole (i.e., the annular hole of the central ring 6-22) is smaller than the upper mold hole 6-13. During the vertical upward traction process, the floating mold 6 is in a floating state and easy to move. If the photovoltaic solder ribbon 12 comes into contact with the floating mold 6, it will only contact the lower mold hole, and the contact time is extremely short. The lower mold hole is immersed in the molten solder and does not affect the amount of solder exiting the upper mold hole.

[0058] Furthermore, let the cone angle of the conical surface be F, and the cone angle of the conical cavity be E, then 60°≤E=F≤90°.

[0059] Furthermore, both the pressure plate adjusting seat 2 and the air knife adjusting seat 3 are XY platforms. The XY platform can move up and down and left and right.

[0060] Furthermore, a lifting screw 9 is provided below the lifting tin furnace 8, which enables the tin furnace 8 to be lifted up and down.

[0061] This utility model also provides a system for a device for tin plating photovoltaic solder ribbon based on any of the above claims, including a flux support cabinet 15, wherein a flux storage area 13 is provided inside the flux support cabinet 15, and the flux storage area 13 is inclined.

[0062] The frame 1 is provided with a traction guide wheel 10, which is located above the annular air knife 5. The second tangent point of the traction guide wheel 10 in the vertical direction is on the same vertical line as the first tangent point, the center of the floating mold 6, and the focal point of the annular air outlet of the annular air knife 5.

[0063] Two rows of cooling fans 11 are provided between the traction guide wheel 10 and the annular air knife 5, and the photovoltaic welding ribbon 12 passes between the two rows of cooling fans 11;

[0064] The photovoltaic welding ribbon 12 passes sequentially through the flux storage area 13, the wire pressing plate 14, the floating mold 6, the annular air knife 5, the cooling fan 11, and the traction guide wheel 10.

[0065] The photovoltaic solder ribbon 12 is pressed into the solder pot by the wire pressing plate 14 and then pulled vertically upwards. The thickness of the surface solder layer is controlled by two methods: mechanical flow restriction by the floating mold 6 and wiping with an annular air knife. After air cooling, it is pulled and conveyed backwards. Among them:

[0066] Point A: The point of vertical tangency between the drive guide wheel and the welding strip;

[0067] Point B: Focusing point of the combined air knife's annular air inlet;

[0068] Point C: The point where the pressure guide wheel and the welding strip are tangent in the vertical direction.

[0069] Points B and C are on a straight line. Points A and C are fixed. Point B is ensured to be on the line AC by means of the air knife adjustment seat.

[0070] This patent relates to a photovoltaic solder ribbon tin plating process route (such as...). Figure 1 As shown): Along the direction of the photovoltaic soldering ribbon 12, the flux storage area 13, the wire pressing plate 14, the annular air knife 5, and the guide wheel 10 are all in fixed positions. During installation, first ensure that points A and C are on the same vertical line, then adjust the air knife adjusting seat 3 to ensure that the center of the annular air knife 5 is on line AC. At this point, A, B, and C are on the same vertical line. The solder pot 8 is fixed to the lifting platform and can move up and down via the lifting screw 9. The wire threading position is at its lowest position, and the working position is at its highest position (the wire pressing plate is fully immersed in the molten solder).

[0071] During the tin plating process, the pre-coated flux photovoltaic solder ribbon 12 is pulled vertically upwards by passing over the wire clamping plate 14 and molten tin 7. A large amount of molten tin alloy adheres to the circumferential surface of the photovoltaic solder ribbon 12, forming a cone shape. The central die hole of the floating mold 6 controls the amount of tin applied to prevent a large amount of molten tin from being pulled upwards, and the originally conical molten tin is wiped into an approximately cylindrical shape at the exit of the floating mold 6. The molten tin that breaks through the central die hole continues to move upwards with the photovoltaic solder ribbon 12. When it passes through the annular air outlet in the annular air knife 5, the airflow blows away the molten tin on the surface of the copper wire. The excess small amount of molten tin flows back to the tin furnace under the action of airflow and gravity (flowing back to the tin furnace along the conical surface of the floating mold). The liquid remaining on the surface of the photovoltaic solder ribbon 12 cools and forms a uniform tin alloy coating. During the tin plating process, as the molten tin is consumed, the distance between the annular air knife and the floating mold increases. To ensure product quality stability, the lifting worm gear motor can be automatically controlled to increase the distance H based on the tin alloy consumption, ensuring that the distance between the floating mold 6 and the annular air knife 5 remains essentially constant. When H reaches its upper limit, the operator is alerted to add alloy, and the tin furnace is simultaneously lowered to a suitable position.

[0072] The above description is merely a specific embodiment of this utility model, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this utility model.

[0073] It should be understood that this utility model is not limited to the content already described above, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A device for tinning of photovoltaic solder strips comprising a frame (1), characterized in that, The rack (1) is provided with a line pressing plate adjusting seat (2) and an air knife adjusting seat (3), the line pressing plate adjusting seat (2) is connected with a fixing plate (4), and the lower end of the fixing plate (4) is provided with a line pressing plate (14); Further comprising a floating mold (6) for primary sizing and an annular air knife (5) for secondary sizing, a first tangent point of the line pressing plate (14) in the vertical direction and a ring air port focal point of the annular air knife (5) are located on the same vertical line, and the floating mold (6) is located between the first tangent point and the ring air port focal point; A lifting tin furnace (8) is arranged below the line pressing plate (14), a photovoltaic solder strip (12) is pressed by the line pressing plate (14) into tin liquid (7) in the lifting tin furnace (8), and the average density of the floating mold (6) is less than the average density of the tin liquid (7).

2. A device for tinning of photovoltaic ribbon according to claim 1, characterized in that, The floating mold (6) comprises an upper mold (6-1) and a lower mold (6-2), the upper mold (6-1) is screwed with the lower mold (6-2); the upper mold (6-1) comprises a first circular ring (6-11), a tapered mold core (6-12) is arranged in the first circular ring (6-11), a center of each tapered mold core (6-12) is provided with an upper mold hole (6-13), the tapered mold core (6-12) is connected to the inner wall of the first circular ring (6-11) through a plurality of upper mold rib strip widths (6-14), and every two upper mold rib strip widths (6-14) are hollowed out; the lower mold (6-2) comprises a second circular ring (6-21), a center circular ring (6-22) is arranged at the center of the second circular ring (6-21), and the center circular ring (6-22) is connected to the inner wall of the second circular ring (6-21) through a plurality of lower mold rib strip widths (6-23), every two lower mold rib strip widths (6-23) are hollowed out, and the lower mold rib strip widths (6-23) correspond to the upper mold rib strip widths (6-14).

3. A device for tinning of photovoltaic ribbon according to claim 2, characterized in that, Supposing that the angle between every two upper mold rib strip widths (6-14) is D, then 45°≤D≤90°.

4. A device for tinning of photovoltaic ribbon according to claim 2, characterized in that, Supposing that the inner diameter of the upper mold hole (6-13) of the tapered mold core (6-12) is G, then 1mm≤G≤2mm.

5. A device for tinning of photovoltaic solder strips according to claim 2, characterized in that The inner diameter of the ring hole of the center circular ring (6-22) is less than the inner diameter of the upper mold hole (6-13).

6. A device for tinning of photovoltaic solder strips according to claim 2, characterized in that The upper surface of the tapered mold core (6-12) is a tapered surface, and the inside of the tapered mold core (6-12) is a tapered cavity.

7. A device for tinning of photovoltaic solder strips according to claim 6, characterized in that Supposing that the taper angle of the tapered surface is F, and the taper angle of the tapered cavity is E, then 60°≤E=F≤90°.

8. A device for tinning of photovoltaic solder strips according to claim 1, characterized in that The line pressing plate adjusting seat (2) and the air knife adjusting seat (3) are both XY platforms.

9. A device for tinning of photovoltaic solder strips according to claim 1, characterized in that A lifting screw (9) is arranged below the lifting tin furnace (8).

10. A system for a device for tinning of photovoltaic solder strips according to any one of claims 1 to 9, characterized in that A flux support cabinet (15) is arranged, the flux support cabinet (15) is provided with a flux storage area (13), and the flux storage area (13) is arranged in an inclined manner. A traction guide wheel (10) is arranged on the rack (1), the traction guide wheel (10) is located above the annular air knife (5), and a second tangent point of the traction guide wheel (10) in the vertical direction, the first tangent point and the ring air port focal point of the annular air knife (5) are located on the same vertical line. Two rows of cooling fans (11) are arranged between the traction guide wheel (10) and the annular air knife (5), and the photovoltaic solder strip (12) passes between the two rows of cooling fans (11); The photovoltaic solder strip (12) sequentially passes through the flux storage area (13), the wire pressing plate (14), the floating mold (6), the annular air knife (5), the cooling fan (11), and the traction guide wheel (10).

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