Anti-interference infrared thermometer

By using a copper-headed metal shielding cavity and an insulating isolation ring in the infrared thermometer, combined with a flexible PCB integrated MCU design, the shortcomings of traditional infrared thermometers in electromagnetic interference suppression are solved, achieving higher temperature measurement accuracy and response speed, while improving the device's vibration resistance.

CN223992641UActive Publication Date: 2026-03-13SHENZHEN GUAIDE TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-07
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

Traditional infrared thermometers have significant deficiencies in electromagnetic interference suppression in their photoelectric sensor components. External high-frequency electromagnetic signals can easily penetrate the housing and interfere with the sensor signal, leading to a decrease in temperature measurement accuracy.

Method used

A copper head is used to form a metal shielding cavity, which is combined with an insulating isolation ring to cut off the electrical coupling path. The analog signal is digitized locally by integrating an MCU through a flexible PCB. The plastic skeleton and plastic cross skeleton are designed to fix the device together to reduce electromagnetic crosstalk and improve mechanical stability.

Benefits of technology

It effectively suppresses external high-frequency signal interference, improves temperature measurement accuracy and response speed, solves the problem of easy component loosening, and meets the requirements for vibration resistance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an anti-interference infrared thermometer, and relates to the technical field of measuring instruments. Comprising an infrared thermometer body, the infrared thermometer body comprises an infrared temperature sensor and an anti-interference structure, and the anti-interference structure comprises a copper head arranged outside the infrared temperature sensor in a sleeving mode and an insulating isolation ring arranged between the copper head and the infrared temperature sensor in a sleeving mode. The copper head is connected with a power source to form a metal shielding cavity, external high-frequency signal interference is blocked, an electric coupling path of an internal sensor and the copper head is cut off in combination with the insulation isolation ring, the interference suppression rate is improved, the flexible PCB integrates the MCU to achieve in-situ digitization of analog signals, noise introduced by long wire transmission is avoided, and the temperature measurement response speed is increased. The cooperative fixing design of the plastic cross skeleton and the plastic skeleton not only can effectively reduce the electromagnetic crosstalk between the adjacent wires in the signal transmission process, but also can solve the pain point that the internal components of the miniaturized equipment are easy to loosen, and meets the vibration resistance.
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Description

Technical Field

[0001] This utility model relates to the field of measuring instrument technology, specifically to an interference-resistant infrared thermometer. Background Technology

[0002] An infrared thermometer, also known as an infrared thermometer, is a device used for temperature measurement. It consists of an optical system, a photoelectric detector, a signal amplifier, signal processing, and display output. The most important component is the photoelectric detector head assembly.

[0003] Traditional infrared thermometers have significant deficiencies in electromagnetic interference suppression in their photoelectric sensor components: they lack shielding design, and external high-frequency electromagnetic signals (such as Wi-Fi and Bluetooth) can easily penetrate the casing and interfere with the sensor signal, resulting in decreased temperature measurement accuracy and unsatisfactory performance. Utility Model Content

[0004] This invention provides an interference-resistant infrared thermometer to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an anti-interference infrared thermometer, comprising an infrared thermometer body, wherein the infrared thermometer body includes an infrared temperature sensor and an anti-interference structure, wherein the anti-interference structure includes a copper head sleeved on the outside of the infrared temperature sensor and an insulating isolation ring sleeved between the copper head and the infrared temperature sensor.

[0006] Furthermore, the anti-interference structure also includes a plastic cross skeleton disposed inside the copper head.

[0007] Furthermore, the infrared temperature sensor is located on top of the plastic cross frame, and the infrared temperature sensor is provided with four wires separated by the plastic cross frame.

[0008] Furthermore, a flexible PCB is provided inside the copper head, and an MCU is integrated on the flexible PCB. One end of the flexible PCB is fixedly connected to the end of the wire away from the infrared temperature sensor.

[0009] Furthermore, a plastic skeleton is provided inside the copper head, and the flexible PCB is located inside the plastic skeleton.

[0010] Furthermore, the bottom of the plastic frame is a circular plate, and the top has two support arms, with the two support arms at the top of the plastic frame contacting the bottom ends of the plastic cross frame respectively.

[0011] Furthermore, the interior of the copper head is also equipped with a copper annular pressure plate located at the bottom of the plastic skeleton.

[0012] Furthermore, the copper head is covered with a plastic sleeve.

[0013] Compared with the prior art, this utility model provides an interference-resistant infrared thermometer, which has the following beneficial effects:

[0014] This anti-interference infrared thermometer features a copper head connected to the power supply, forming a metal shielded cavity that blocks external high-frequency signal interference. Combined with an insulating isolation ring, it cuts off the electrical coupling path between the internal sensor and the copper head, improving the interference suppression rate. The flexible PCB integrates an MCU to achieve on-site digitization of analog signals, avoiding noise introduced by long wire transmission and improving the temperature measurement response speed. The coordinated fixing design of the plastic cross frame and plastic frame not only effectively reduces electromagnetic crosstalk between adjacent wires during signal transmission but also solves the problem of easy loosening of internal components in miniaturized devices, while meeting vibration resistance requirements. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the copper annular pressure plate structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the copper head structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the anti-interference structure of this utility model;

[0019] Figure 5 This is an exploded view of the anti-interference structure of this utility model;

[0020] Figure 6 This is a cross-sectional view of the structure of this utility model.

[0021] In the diagram: 1. Infrared thermometer body; 11. Infrared temperature sensor; 111. Wire; 12. Anti-interference structure; 121. Copper head; 122. Insulating ring; 123. Plastic cross frame; 13. Flexible PCB; 14. Plastic frame; 15. Copper ring pressure plate; 16. Plastic jacket. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-6This utility model discloses an anti-interference infrared thermometer, including an infrared thermometer body 1. The infrared thermometer body 1 includes an infrared temperature sensor 11 and an anti-interference structure 12. The anti-interference structure 12 includes a copper head 121 sleeved on the outside of the infrared temperature sensor 11 and an insulating isolation ring 122 sleeved between the copper head 121 and the infrared temperature sensor 11. After the copper head 121 is connected to a power source, it will form a metal shielding cavity inside. As a conductor material, after the copper head 121 is connected to a power source (which needs to be grounded), its surface will quickly induce charges due to the external electric field. According to the principle of electrostatic balance, these charges will redistribute, making the total electric field strength inside the metal cavity approach zero, thereby shielding the influence of the external electric field on the cavity. The insulating isolation ring 122 is made of silicone rubber and the plastic is an insulating plastic.

[0024] Specifically, the anti-interference structure 12 also includes a plastic cross frame 123 disposed inside the copper head 121, the infrared temperature sensor 11 is located on the top of the plastic cross frame 123, and the infrared temperature sensor 11 is provided with four wires 111 separated by the plastic cross frame 123.

[0025] In this embodiment, the introduction of the plastic cross frame 123 achieves physical separation of the wires 111, avoiding the risk of short circuits caused by vibration or compression of multiple wires 111. The structure of the plastic cross frame 123 enhances the mechanical stability of the internal components of the copper head 121, preventing sensor displacement. After the four wires 111 are separated by the plastic cross frame 123, the electromagnetic crosstalk between adjacent wires 111 during signal transmission is effectively reduced, improving the accuracy of temperature signal acquisition. The four wires 111 are power supply, ground, signal input, and signal output, respectively.

[0026] Specifically, a flexible PCB 13 is provided inside the copper head 121, and an MCU is integrated on the flexible PCB 13. One end of the flexible PCB 13 is fixedly connected to the end of the wire 111 away from the infrared temperature sensor 11.

[0027] In this implementation scheme, the flexible PCB13 is an FPC. The design of the flexible PCB13 integrating an MCU converts analog signals into digital signals, avoiding signal attenuation caused by long-distance transmission. The internal layout of the copper head 121 is optimized to shorten the signal path and reduce the coupling probability of external high-frequency interference.

[0028] Specifically, a plastic skeleton 14 is provided inside the copper head 121, and the flexible PCB 13 is located inside the plastic skeleton 14. The bottom of the plastic skeleton 14 is a circular plate, and the top has two support arms. The two support arms at the top of the plastic skeleton 14 are in contact with the bottom ends of the plastic cross skeleton 123 respectively.

[0029] In this embodiment, two support arms are located on both sides of the flexible PCB13 to protect the flexible PCB13 and prevent the solder joints from breaking due to bending of the flexible PCB13. At the same time, they constrain the position of the flexible PCB13 to avoid contact with the inner wall of the copper head 121 and cause a short circuit. The contact design between the top support arm of the plastic frame 14 and the plastic cross frame 123 forms a layered fixing structure to ensure the three-dimensional positioning accuracy of the infrared temperature sensor 11, the wire 111 and the flexible PCB13, and improve the reliability of the assembly.

[0030] Specifically, the copper head 121 is further provided with a copper annular pressure plate 15 located at the bottom of the plastic skeleton 14, and the copper head 121 is covered with a plastic outer sleeve 16.

[0031] In this embodiment, the copper annular pressure plate 15 is interference-fitted with the copper head 121 or fixed by adhesive. The copper annular pressure plate 15 fixes the plastic skeleton 14 by pressure, which improves the overall assembly stability of the product. The plastic jacket 16 provides double insulation protection outside the copper head 121, avoiding safety hazards caused by leakage when the user touches the copper head 121, and at the same time reducing the oxidation and corrosion of the metal shielding cavity by the ambient humidity.

[0032] In summary, this anti-interference infrared thermometer features a copper head 121 connected to a power source to form a metal shielding cavity, blocking external high-frequency signal interference. Combined with an insulating isolation ring 122, it cuts off the electrical coupling path between the internal sensor and the copper head 121, improving the interference suppression rate. The flexible PCB 13 integrates an MCU to achieve on-site digitization of analog signals, avoiding noise introduced by the long wire 111 during transmission, thus improving the temperature measurement response speed. The coordinated fixing design of the plastic cross frame 123 and the plastic frame 14 not only effectively reduces electromagnetic crosstalk between adjacent wires 111 during signal transmission but also solves the problem of easy loosening of internal components in miniaturized devices, while meeting vibration resistance requirements.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-interference infrared thermometer comprising an infrared thermometer main body (1), characterized in that: The infrared thermometer body (1) comprises an infrared temperature sensor (11) and an anti-interference structure (12), the anti-interference structure (12) comprises a copper head (121) sleeved outside the infrared temperature sensor (11) and an insulating isolation ring (122) sleeved between the copper head (121) and the infrared temperature sensor (11).

2. The tamper-resistant infrared thermometer according to claim 1, wherein: The anti-interference structure (12) further comprises a plastic cross-shaped framework (123) arranged inside the copper head (121).

3. The tamper-resistant infrared thermometer according to claim 1, wherein: The infrared temperature sensor (11) is located at the top of the plastic cross-shaped framework (123), and four wires (111) separated by the plastic cross-shaped framework (123) are arranged on the infrared temperature sensor (11).

4. The tamper-resistant infrared thermometer of claim 1, wherein: A flexible PCB (13) is arranged inside the copper head (121), the flexible PCB (13) is integrated with an MCU, and one end of the flexible PCB (13) is fixedly connected with one end of the wire (111) away from the infrared temperature sensor (11).

5. The tamper-resistant infrared thermometer according to claim 4, wherein: The copper head (121) is internally provided with a plastic framework (14), and the flexible PCB (13) is located inside the plastic framework (14).

6. The tamper-resistant infrared thermometer according to claim 5, wherein: The bottom of the plastic framework (14) is a circular plate, and the top is two supporting arms, and the two supporting arms at the top of the plastic framework (14) are in contact with the bottoms of the two ends of the plastic cross-shaped framework (123), respectively.

7. The tamper-resistant infrared thermometer according to claim 1, wherein: The copper head (121) is further provided with a copper ring-shaped pressing plate (15) located at the bottom of the plastic framework (14).

8. The tamper-resistant infrared thermometer of claim 1, wherein: The outside of the copper head (121) is sleeved with a plastic outer sleeve (16).