Piezoresistive electronic skin

Abstract

The utility model relates to the technical field of simulation manipulators, and discloses a piezoresistive electronic skin which comprises a mechanical fingertip, a simulation skin layer is arranged on the outer side of the mechanical fingertip, and a sensor film for accurately capturing small pressure differences is arranged between the simulation skin layer and the mechanical fingertip. The sensor film comprises an upper layer assembly, a double-faced adhesive tape and a lower layer assembly, the upper layer assembly comprises an upper base film and an upper silver paste layer, the upper silver paste layer is adhered to the lower surface of the upper base film, an upper insulating layer is cured on the lower surface of the upper silver paste layer through UV, and an upper PCB connecting end is arranged on the lower surface of the upper silver paste layer and located at the tail end position. Through the innovative layered structure and material combination, the flexibility of the electronic skin is maintained, the cooperative work of high-precision pressure detection and temperature compensation is realized, and the multi-mode sensing capability closer to the biological skin is provided for a bionic robot.

Description

Technical Field

[0001] This utility model relates to the field of simulated robotic arm technology, and more specifically to a piezoresistive electronic skin. Background Technology

[0002] Electronic skin, as a flexible tactile sensor system that simulates a robotic hand, aims to mimic the sensory functions of human skin. With the rise of data-driven reinforcement learning methods in general grasping operations, the demand for efficient, accurate, and multi-dimensional collection of various tactile information data during the grasping process is becoming increasingly strong.

[0003] However, existing electronic skins have the following shortcomings:

[0004] 1. The pressure-sensitive layer has a simple structure, making it difficult to distinguish subtle pressure differences;

[0005] 2. Temperature changes can easily lead to measurement errors;

[0006] 3. The multi-layered structure is complex to assemble and has poor signal transmission stability. Utility Model Content

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a piezoresistive electronic skin to solve the problems existing in the background art.

[0008] This utility model provides the following technical solution: a piezoresistive electronic skin, including a mechanical fingertip, a simulated skin layer on the outer side of the mechanical fingertip, and a sensor film for accurately capturing subtle differences in pressure between the simulated skin layer and the mechanical fingertip, the sensor film including an upper component, double-sided adhesive and a lower component.

[0009] As a further embodiment of this utility model, the upper component includes an upper base film and an upper silver paste layer. The upper silver paste layer is adhered to the lower surface of the upper base film. An upper insulating layer is UV-cured on the lower surface of the upper silver paste layer. An upper PCB connection terminal is provided on the lower surface of the upper silver paste layer at the tail end position.

[0010] As a further embodiment of this utility model, a dual-temperature sensing sheet is provided on the lower surface of the upper silver paste layer at the first end position.

[0011] As a further embodiment of this utility model, the upper surface of the upper base film is provided with an upper support plate corresponding to the upper PCB connection end.

[0012] As a further embodiment of this utility model, the lower component includes a lower base film and a lower silver paste layer. The lower silver paste layer is adhered to the upper surface of the lower base film. A lower insulating layer is UV-cured on the upper surface of the lower silver paste layer. A pressure-sensing carbon-based pressure-sensitive layer is provided on the upper surface of the lower silver paste layer at the first end position.

[0013] As a further embodiment of this utility model, the carbon-based pressure-sensitive layer includes multiple horizontal carbon strips and multiple vertical carbon strips, with the multiple horizontal and vertical carbon strips distributed at equal intervals.

[0014] As a further embodiment of this utility model, a lower PCB connection end is provided on the upper surface of the lower insulating layer at the tail end position, and a lower support plate corresponding to the lower PCB connection end is provided on the lower surface of the lower base film.

[0015] The technical effects and advantages of this utility model are as follows:

[0016] 1. This utility model, through innovative layered structure and material combination, achieves high-precision pressure detection and temperature compensation in synergy while maintaining the flexibility of electronic skin, providing bionic robots with multimodal perception capabilities that are closer to biological skin.

[0017] 2. This utility model improves accuracy by more than 40% by incorporating temperature compensation.

[0018] 3. This utility model maintains conductivity even with a bending radius of ≤3mm using a PET substrate.

[0019] 4. This utility model achieves an isotropic detection error of <5% through an orthogonal carbon mesh structure.

[0020] 5. This utility model improves assembly efficiency through modular design. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the mechanical fingertip structure of this utility model.

[0022] Figure 2 This is a schematic diagram of the sensor thin film structure of this utility model.

[0023] Figure 3 This utility model Figure 2 An explosion diagram.

[0024] Figure 4 This utility model Figure 3 An explosion diagram.

[0025] The attached diagram is labeled as follows: 1. Simulated skin layer; 2. Mechanical fingertip; 3. Sensor film; 301. Upper component; 302. Double-sided adhesive; 303. Lower component; 30101. Upper support plate; 30102. Upper base film; 30103. Upper silver paste layer; 30104. Upper insulating layer; 30105. Upper PCB connection terminal; 30106. Dual temperature sensing film; 30201. Carbon-based pressure-sensitive layer; 30202. Lower PCB connection terminal; 30203. Lower insulating layer; 30204. Lower silver paste layer; 30205. Lower base film; 30206. Lower support plate. Detailed Implementation

[0026] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. This utility model is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] Reference Figures 1-4 This utility model provides a piezoresistive electronic skin, the overall structure of which includes, from the outside to the inside, the following components arranged sequentially:

[0028] Simulated skin layer 1: flexible polymer material; sensor film 3: sandwich-type pressure / temperature composite sensing structure; mechanical fingertip 2: rigid support substrate.

[0029] The sensor film 3 has a layered structure:

[0030] Upper-layer component 301:

[0031] a: Upper support plate 30101: Single-sided adhesive transparent PVC;

[0032] b: Upper base film 30102: PET material;

[0033] c: Upper silver paste layer 30103: Conductive circuit network, the silver paste layer adopts a two-stage molding process, the line width is 0.1-0.3mm, and the thickness is 20-50μm;

[0034] d: UV-cured insulating layer 30104;

[0035] e: Temperature sensing module: dual temperature sensors 30106 and upper PCB connection terminal 30105.

[0036] Lower-level component 303:

[0037] a: Lower support plate 30206: Single-sided adhesive transparent PVC;

[0038] b: Lower basement membrane 30205: PET material;

[0039] c: Lower silver paste layer 30204: Conductive circuit network, the silver paste layer adopts a two-stage molding process, the line width is 0.1-0.3mm, and the thickness is 20-50μm;

[0040] d: Carbon-based pressure-sensitive layer 30201: Orthogonally arranged carbon strip matrix, using an orthogonal grid structure, with a horizontal and vertical carbon strip spacing of 0.5-1.2mm;

[0041] e: UV-cured insulating layer 30203;

[0042] f: Lower PCB connection terminal 30202.

[0043] And double-sided adhesive 302 for bonding the upper component 301 and the lower component 303.

[0044] Pressure signal: Carbon-based pressure-sensitive layer 30201 → Lower silver paste layer 30204 → Lower PCB connector 30202 → Main control unit;

[0045] Temperature signal: Dual temperature sensor 30106 → upper silver paste layer 30103 → upper PCB connection terminal 30105 → main control unit.

[0046] Production process:

[0047] 1. Silver paste circuitry is formed on a PET substrate by screen printing;

[0048] 2. UV curing process forms an insulating layer (energy density 300-500 mJ / cm³). 2 );

[0049] 3. The carbon strip matrix is ​​bonded using a hot-pressing process (120-150℃);

[0050] 4. Vacuum bonding process for assembling each layer (vacuum degree ≤10Pa);

[0051] 5. Connect the PCB interface using conductive silver paste.

[0052] Working principle:

[0053] When external pressure is applied to the simulated skin:

[0054] S1: Pressure is transmitted to the carbon-based pressure-sensitive layer 30201 through elastic deformation;

[0055] S2: The contact area of ​​the orthogonal carbon fiber network changes;

[0056] S3: Contact resistance decreases exponentially with pressure;

[0057] S4: Conducted to the signal processing circuit through the lower silver paste layer 30204;

[0058] S5: Dual-temperature sensor 30106 monitors the contact surface temperature in real time;

[0059] S6: Temperature and pressure signals are transmitted synchronously;

[0060] S7: The processing circuit establishes a temperature-resistance correction curve;

[0061] S8: The differential algorithm is used to eliminate the effects of thermal drift.

[0062] Through innovative layered structures and material combinations, while maintaining the flexibility of electronic skin, high-precision pressure detection and temperature compensation are achieved in synergy, providing biomimetic robots with multimodal perception capabilities that are closer to biological skin.

[0063] Finally, the following points should be noted: In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change.

[0064] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

Claims

1. A piezoresistive electronic skin comprising a mechanical fingertip (2), characterized in that: The outer side of the mechanical fingertip (2) is provided with a simulated skin layer (1), and a sensor film (3) for accurately capturing subtle pressure differences is arranged between the simulated skin layer (1) and the mechanical fingertip (2).

2. The piezoresistive electronic skin according to claim 1, wherein: The upper layer assembly (301) comprises an upper base film (30102) and an upper silver paste layer (30103), the upper silver paste layer (30103) is attached to the lower surface of the upper base film (30102), the lower surface of the upper silver paste layer (30103) is provided with an upper insulating layer (30104) by UV curing, and the lower surface of the upper silver paste layer (30103) and located at the tail end position is provided with an upper PCB connecting end (30105).

3. A piezoresistive electronic skin according to claim 2, wherein: The lower surface of the upper silver paste layer (30103) and located at the head end position is provided with a double temperature sensing sheet (30106).

4. The piezoresistive electronic skin of claim 3, wherein: The upper surface of the upper base film (30102) is provided with an upper support plate (30101) corresponding to the upper PCB connecting end (30105).

5. The piezoresistive electronic skin of claim 1, wherein: The lower layer assembly (303) comprises a lower base film (30205) and a lower silver paste layer (30204), the lower silver paste layer (30204) is attached to the upper surface of the lower base film (30205), the upper surface of the lower silver paste layer (30204) is provided with a carbon-based pressure-sensitive layer (30201) for sensing pressure by UV curing of a lower insulating layer (30203), and the upper surface of the lower silver paste layer (30204) and located at the head end position is provided with a carbon-based pressure-sensitive layer (30201).

6. A piezoresistive electronic skin according to claim 5, wherein: The carbon-based pressure-sensitive layer (30201) comprises a plurality of horizontal rows of carbon strips and a plurality of vertical rows of carbon strips, and the plurality of horizontal and vertical rows of carbon strips are distributed at equal distances.

7. A piezoresistive electronic skin according to claim 6, wherein: The upper surface of the lower insulating layer (30203) and located at the tail end position is provided with a lower PCB connecting end (30202), and the lower surface of the lower base film (30205) is provided with a lower support plate (30206) corresponding to the lower PCB connecting end (30202).

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