Merculation 310P-based wide-temperature computing power module

Abstract

The utility model relates to the technical field of computer hardware, and discloses a mercuric chloride 310P-based wide-temperature computing power module. Comprising a processor, and the processor comprises a CPU and an AI processor; the computing power module further comprises an EMMC storage module, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module and a complex programmable logic device (CPLD) which are connected with the processor. And a functional pin of the FMC connector is connected with the processor. The elements in the computing power module are all wide-temperature elements with strong environment temperature adaptability, so that the environment adaptability of the computing power module is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of computer hardware technology, specifically a wide-temperature computing module based on Ascend 310P. Background Technology

[0002] A computing module is a dedicated module that provides computing power in an integrated hardware form. It is mainly used to support the data processing needs of artificial intelligence model training, inference, and edge computing scenarios. Its core function is to act as a computing power carrier, achieving high-efficiency, low-power distributed computing output through the integration of chips, algorithms, and communication protocols.

[0003] Computing modules typically integrate processors such as GPUs, ASICs, and FPGAs, and incorporate communication module functions to form standardized computing units that can be embedded in various terminal devices. For example, SoC array server designs based on the ARM architecture achieve flexible computing power expansion through the combination of multiple modules.

[0004] Using TOPS (trillions of operations per second) as the performance unit, energy efficiency is improved through chip architecture optimization (such as Chiplet technology) and model compression algorithms. Some intelligent modules have been adapted to specific AI models, achieving deep integration of computing power and scenarios. A high-performance AI processor designed specifically for data center and edge computing scenarios. Based on the Da Vinci Core architecture, it features 10 dedicated AI computing cores and 8 self-developed CPU cores, with a main frequency of 1.9GHz. It supports full-map execution, reducing host-device interaction overhead and improving computing efficiency.

[0005] However, the computing modules based on AI processors in related technologies have shortcomings such as low environmental adaptability to temperature and low computing power. Based on this, this utility model proposes a wide-temperature computing module based on Ascend 310P. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a wide-temperature computing module based on Ascend 310P.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wide-temperature computing module based on Ascend 310P, the computing module comprising:

[0008] Processors, including CPUs and AI processors;

[0009] The computing module also includes an EMMC storage module connected to the processor, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module, and a complex programmable logic device (CPLD).

[0010] The functional pins of the FMC connector are connected to the processor.

[0011] Preferably, the computing module further includes an Intelligent Platform Management Controller (IPMC).

[0012] Preferably, the AI ​​processor model is the Ascend 310P chip.

[0013] Preferably, the computing module further includes a power module, which is connected to the FMC connector and supplies power to the computing module through the FMC connector.

[0014] Preferably, the components used in the computing module are all within a temperature range of -40℃ to +65℃ or -55℃ to +85℃.

[0015] Preferably, the CPU has 8 cores with a main frequency of 1.9GHz, and the AI ​​processor has 10 cores with a main frequency of 1.08GHz.

[0016] Preferably, the outer shell of the computing module is provided with a honeycomb heat dissipation plate.

[0017] Preferably, the FMC connector supports the following functions:

[0018] Supports the transmission of 8-channel HCCS (Conformance Bus System) signals to the computing module;

[0019] Supports transmission of 8 PCIe signals to the computing module;

[0020] Supports transmission of 8 PCIe signals or 4 xGE signals to the computing module;

[0021] Supports transmission of 5 CAN bus signals to the computing module;

[0022] Supports transmission of 4 SPI signals to the computing module;

[0023] Supports the transmission of 4 I2C bus signals to the computing module;

[0024] Supports transmission of 4 UART signals to the computing module;

[0025] Supports the transmission of two MDIO signals to the computing module;

[0026] It supports the transmission of 7 GPIO signals to the computing module.

[0027] Compared with existing technologies, this utility model provides a wide-temperature computing module based on the Ascend 310P. It has the following advantages: The computing module includes a processor, which includes a CPU and an AI processor; the computing module also includes an EMMC storage module, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module, and a complex programmable logic device (CPLD) connected to the processor; the functional pins of the FMC connector are connected to the processor. All components used in the computing module have a temperature adaptability range of -40℃ to +65℃ or -55℃ to +85℃. The components in the computing module are all wide-temperature components with strong environmental temperature adaptability, greatly improving the environmental adaptability of the computing module. Attached Figure Description

[0028] Figure 1 This is a block diagram of the computing power module structure of this utility model;

[0029] Figure 2 This is a schematic diagram of the structure of the heat dissipation shell of this utility model;

[0030] Figure 3 This is a schematic diagram of the interconnection of the two modules of this utility model. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Example 1: Please refer to Figure 1 - Figure 3 ,

[0033] A wide-temperature computing module based on Ascend 310P, the computing module comprising:

[0034] Processors, including CPUs and AI processors;

[0035] The computing module also includes an EMMC storage module connected to the processor, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module, and a complex programmable logic device (CPLD).

[0036] The functional pins of the FMC connector are connected to the AI ​​processor.

[0037] Preferably, the computing module further includes: an intelligent platform management controller (IPMC);

[0038] FMC's preferred AI processor model is the Ascend 310P chip.

[0039] Preferably, the computing module further includes a power module, which is connected to the FMC connector and supplies power to the computing module through the FMC connector.

[0040] Preferably, the components used in the computing module are all within a temperature range of -40℃ to +65℃ or -55℃ to +85℃.

[0041] Preferably, the CPU has 8 cores with a main frequency of 1.9GHz, and the AI ​​processor has 10 cores with a main frequency of 1.08GHz.

[0042] Preferably, the outer shell of the computing module is provided with a honeycomb heat dissipation plate.

[0043] Preferably, the FMC connector supports the following functions:

[0044] Supports the transmission of 8-channel HCCS (Conformance Bus System) signals to the computing module;

[0045] Supports 8-channel PCIE signal transmission to the computing module; PCIE 4.0 x8 interface, which can be combined with M_PCIE_TX / RX[15:8] to form PCIE x16; in EP mode, the module is a PCIE slave device, and in RC mode, the module is a PCIE host; TX is the module output, and RX is the module input.

[0046] Supports transmission of 8 PCIe signals or 4 xGE signals to the computing module; PCIe 4.0 x8 interface, which can be combined with M_PCIe_TX / RX[15:8] to form PCIe x16; in EP mode, the module is a PCIe slave device, and in RC mode, the module is a PCIe host; TX is the module output, and RX is the module input. When used as a PCIe bus, a 0.22uF AC coupling capacitor needs to be added to the carrier board for the TX signal; when used as an XGE interface, a 0.01uF AC coupling capacitor needs to be added to the carrier board for the RX signal; when used as a SATA interface, a 0.01uF AC coupling capacitor needs to be added to the carrier board for both TX and RX signals.

[0047] Supports 5-channel CAN bus signal transmission to the computing module; CAN interface, enabled in RC mode, ineffective in EP mode, pay attention to level conversion during use, add CAN transceiver, CAN internally multiplexes with USB, this interface is unavailable when using USB interface.

[0048] Supports 4-channel SPI signal transmission to the computing module; the SPI interface is enabled in RC mode and disabled in EP mode.

[0049] Supports 4-way I2C bus signal transmission to the computing module; the I2C MASTER interface has been pulled up to 1.8V by a 4.7K resistor in the module, enabled in RC mode, and not effective in EP mode.

[0050] Supports transmission of 4 UART signals to the computing module; UART interface is enabled in RC mode and disabled in EP mode.

[0051] Supports two MDIO signals to be transmitted to the computing module; the MDIO interface is used to convert the XGE interface to an electrical port through the PHY chip. It is enabled in RC mode and disabled in EP mode; the MDIO interface is used to convert the XGE interface to an electrical port through the PHY chip. It is enabled in RC mode and disabled in EP mode. This signal is a reserved function.

[0052] It supports the transmission of 7 GPIO signals to the computing module.

[0053] Figure 3 This diagram illustrates the interconnection of two computing modules via HCCS signal lines. The interconnection of these modules significantly enhances the overall computing power of the computer.

[0054] The wide-temperature computing module based on the Ascend 310P can be used in AI industrial control computers. Designed for industrial deployment, the AI ​​industrial control computer features electrostatic discharge (ESD) protection on its main interfaces and utilizes a highly reliable Phytium motherboard and Huawei 310P module. All internal components are wide-temperature models.

[0055] The computing module is based on the Ascend 310P chip, with an 8-core CPU and a main frequency of 1.9GHz;

[0056] The AI ​​processor has 8 cores and a main frequency of 1.08GHz. Its computing power is no less than 140 TOPS INT8. Its main specifications are as follows:

[0057] (1) Supports 24 channels of 1080P@30fps / 3 channels of 4K@60fps H.264 / H.265 video encoding;

[0058] (2) Supports 96 channels of 1080P@30fps / 12 channels of 4K@60fps H.264 / H.265 video decoding;

[0059] (3) Supports 4K@384fps (FHD@2048fps) JPEG decoding; supports 4K@192fps (FHD@1024fps) JPEG encoding;

[0060] (4) Support up / downscaling, crop, Chromaup / downsampling, color space

[0061] Conversion (equivalent to FHD 4320FPS);

[0062] (5) Operating temperature: -40℃~85℃.

[0063] (6) Two AI processors can be interconnected via HCCS signals to achieve superposition of computing power.

[0064] (7) Dimensions: 80*140mm.

[0065] The computing module defines two sets of HCCS X4 signals, which are direct connection interface units for module interconnection, supporting low latency, high bandwidth, and high efficiency between modules.

[0066] Reliable and consistent interconnection.

[0067] The interface features are as follows:

[0068] 1. Supports interconnection of two modules to achieve superposition of computing power;

[0069] 2. HCCS physical channels cannot be split;

[0070] 3. The signal supports AC coupling mode (AC coupling capacitors are integrated inside the module);

[0071] 4. Supports 24Gbps / lane, but does not support speed reduction.

[0072] 5. Lane reversal and lane polarity reversal are not supported;

[0073] 6. 100MHz external reference clock;

[0074] The computing module includes: a processor, comprising a CPU and an AI processor; the computing module also includes an eMMC storage module, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module, and a complex programmable logic device (CPLD) connected to the processor; the functional pins of the FMC connector are connected to the processor. All components used in the computing module have a temperature adaptability range of -40℃ to +65℃ or -55℃ to +85℃. These components are all wide-temperature adaptable elements, greatly improving the environmental adaptability of the computing module.

[0075] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wide-temperature computing power module based on Ascending 310P, characterized by, The computing power module comprises: The processor comprises a CPU and an AI processor. The computing power module further comprises an EMMC storage module, a first LPDDR storage module, a second LPDDR storage module, a Flash storage module and a complex programmable logic device CPLD connected with the processor. The functional pins of the FMC connector are connected with the processor.

2. The wide-temperature computing power module based on Ascending 310P according to claim 1, wherein, The computing power module further comprises an intelligent platform management controller IPMC. The functional pins of the FMC connector are connected with the processor.

3. The wide-temperature computing power module based on Ascending 310P according to claim 1, wherein, The AI processor is a model of Ascend 310P chip.

4. The wide-temperature computing power module based on Ascending 310P according to claim 1, wherein, The computing power module further comprises a power module connected with the FMC connector, which supplies power for the computing power module through the FMC connector.

5. A wide-temperature computing module based on Ascend 310P according to claim 1, characterized in that, The elements used in the computing power module all have a temperature adaptation range of -40℃ to +65℃ or -55℃ to +85℃.

6. A wide-temperature computing module based on Ascend 310P according to claim 1, characterized in that, The CPU is an 8-core processor with a main frequency of 1.9GHz, and the AI processor is a 10-core processor with a main frequency of 1.08GHz.

7. A wide-temperature computing module based on Ascend 310P according to claim 1, characterized in that, The shell of the computing power module is provided with a honeycomb-shaped heat sink.

8. The wide-temperature computing power module based on Ascending 310P according to claim 1, wherein, The FMC connector supports the following functions: 8-way HCCS signal transmission to the computing power module; 8-way PCIE signal transmission to the computing power module; 8-way PCIE signal or 4-way xGE signal transmission to the computing power module; 5-way CAN bus signal transmission to the computing power module; 4-way SPI signal transmission to the computing power module; 4-way I2C bus signal transmission to the computing power module; 4-way UART signal transmission to the computing power module; 2-way MDIO signal transmission to the computing power module; 7-way GPIO signal transmission to the computing power module.

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