Electronic device

Abstract

The embodiment of the utility model provides electronic equipment, and relates to the technical field of electronic equipment, a screen assembly and a shell assembly comprise a rear shell and a side frame, the screen assembly is connected with the side, away from the rear shell, of the side frame, a mounting cavity is defined by the rear shell and the side frame, a through hole communicated with the mounting cavity is formed in the rear shell, and a mounting frame is arranged on the rear shell and surrounds the peripheral side of the through hole; the installation frame protrudes out of the surface, back to the screen assembly, of the rear shell, the side, facing the installation cavity, of the installation frame is provided with a containing part, the containing part is communicated with the installation cavity through a through hole, a first circuit board of the circuit board assembly is arranged in the installation cavity, the first face of the first circuit board faces the rear shell, and a first electronic device is arranged on the first face in the first direction. At least a portion of the first electronic device is located within the receiving portion. According to the electronic equipment provided by the invention, the space utilization rate in the electronic equipment can be improved, the space occupation amount of the circuit board assembly in the thickness direction of the electronic equipment is reduced, and the thinning of the electronic equipment is facilitated.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] Electronic devices generally include mobile phones, tablets, computers, monitors, or in-vehicle computers. Internally, electronic devices typically include circuit board assemblies, which consist of a circuit board and various electronic components mounted on it. These electronic components can be located on the same side or both sides of the circuit board.

[0003] However, the space utilization rate inside the electronic devices in the aforementioned related technologies is low, and the circuit board assembly occupies a large dimension in the thickness direction of the electronic device, which is not conducive to the thinning of the electronic device. Utility Model Content

[0004] This application provides an electronic device that can improve the space utilization rate inside the electronic device, reduce the size of the circuit board assembly in the thickness direction of the electronic device, and help to reduce the thickness of the electronic device.

[0005] This application provides an electronic device, which includes:

[0006] Screen components;

[0007] A housing assembly connected to the screen assembly, the housing assembly having a receiving portion on the side facing the screen assembly, the receiving portion being recessed along the direction from the screen assembly to the housing assembly;

[0008] Circuit board assembly, including:

[0009] A first circuit board is disposed between the screen assembly and the housing assembly. The first circuit board is electrically connected to the screen assembly. The first circuit board includes a first surface and a second surface that are opposite each other along a first direction. The first surface faces the housing assembly.

[0010] A first electronic device is disposed on the first surface along the first direction, and at least a portion of the first electronic device is located within the receiving portion.

[0011] This application provides an electronic device, which includes a screen assembly and a housing assembly connected to each other. A mounting frame surrounds the outer periphery of a through hole in the rear housing. A receiving portion inside the mounting frame communicates with a mounting cavity through the through hole. A circuit board assembly is disposed in the mounting cavity. By placing a first electronic device on a first side of the first circuit board facing the receiving portion and positioning at least a portion of the first electronic device within the receiving portion in a first direction, the inherent space on the mounting frame can be used to accommodate the first electronic device. This avoids increasing the overall thickness of the electronic device to increase the internal space for accommodating the first electronic device. It enables the accommodation of a taller first electronic device without increasing the thickness of the electronic device, or enables the thinning of the electronic device without changing the height of the first electronic device. This improves the internal space utilization of the electronic device and reduces the dimensional occupancy of the circuit board assembly in the thickness direction of the electronic device, thus contributing to the thinning of the electronic device.

[0012] Based on the above embodiments, this application also has the following improvements:

[0013] In one possible implementation, the installation framework includes:

[0014] A frame surrounds the edge of the through hole, and the frame extends relative to the rear cover in a direction away from the first circuit board;

[0015] A bottom frame is disposed at the end of the frame facing away from the first circuit board, and the frame and the bottom frame together form a receiving portion.

[0016] In this way, the mounting frame, by including the border, can reduce the probability of the first electronic device or camera module colliding with objects outside the electronic device, thus protecting the first electronic device or camera module.

[0017] In one possible implementation, the bottom frame is provided with a reinforcing rib that protrudes toward the first circuit board, and the reinforcing rib is connected to the frame.

[0018] In this way, by setting a reinforcing rib on the side of the bottom frame facing the first circuit board, the reinforcing rib can be connected to the frame, thereby reducing the probability of frame deformation and increasing the structural strength of the frame, which in turn increases the overall structural strength of the mounting frame.

[0019] In one possible implementation, the reinforcing rib is used to support the first circuit board.

[0020] In this way, by supporting the first circuit board with reinforcing ribs, the probability of the first circuit board shaking inside the electronic device can be reduced, thereby improving the installation stability of the first circuit board in the electronic device.

[0021] In one possible implementation, the electronic device further includes a connector;

[0022] The connector is used to connect the first circuit board to the reinforcing rib.

[0023] In this way, by using connectors to connect the first circuit board to the reinforcing rib, the electronic device can prevent the first circuit board from shaking inside the electronic device and improve the installation stability of the first circuit board inside the electronic device.

[0024] In one possible implementation, the housing assembly further includes a mid-frame;

[0025] The middle frame is connected to the side frame, and the middle frame, side frame and rear shell form the mounting cavity;

[0026] The circuit board assembly is disposed on the side of the middle frame facing the rear shell, and the screen assembly is disposed on the side of the middle frame facing away from the circuit board assembly.

[0027] By connecting the back cover, screen assembly, and circuit board assembly to the mid-frame, the structural strength of the electronic device can be increased, and the assembly process can be simplified.

[0028] In one possible implementation, the circuit board assembly further includes a second circuit board;

[0029] The second circuit board is disposed within the mounting cavity and is electrically connected to the first circuit board; a second electronic device is disposed on the second circuit board.

[0030] In this way, the circuit board assembly, by including a first circuit board and a second circuit board, can place electronic devices on the first circuit board and the second circuit board, and can improve the layout flexibility of the circuit board assembly within the mounting cavity.

[0031] In one possible implementation, the first circuit board is located within the receiving portion along the first direction;

[0032] In this way, the circuit board assembly includes two circuit boards, a first circuit board and a second circuit board. In the first direction, the projection of the first circuit board is located within the receiving opening of the receiving part, so that the first circuit board can also be located within the receiving part. This ensures that the first electronic device can be completely located within the receiving part, while also accommodating the first circuit board within the receiving part. This improves the utilization rate of the internal space of the electronic device and further reduces the impact of the circuit board assembly on the thickness of the electronic device, thus helping to achieve the thinning of the electronic device.

[0033] In one possible implementation, the circuit board assembly further includes a third circuit board;

[0034] The third circuit board is located inside the mounting cavity;

[0035] The third circuit board is electrically connected to the first circuit board, and the first circuit board is located between the second circuit board and the third circuit board.

[0036] In this way, by including a third circuit board and positioning the first circuit board between the second and third circuit boards, the circuit board assembly ensures that at least a portion of the first circuit board is located within the receiving portion while maintaining the straight-line arrangement of the first, second, and third circuit boards. This allows for convenient installation of the circuit board assembly while enabling the first circuit board to be installed within the receiving portion, thereby achieving a thinner electronic device.

[0037] In one possible implementation, the circuit board assembly further includes a fourth circuit board;

[0038] One end of the fourth circuit board is electrically connected to the first circuit board, and the other end of the fourth circuit board is electrically connected to the second circuit board.

[0039] In this way, electrically connecting the first and second circuit boards via the fourth circuit board facilitates the individual disassembly, repair, and replacement of both circuit boards, reducing maintenance costs. Furthermore, connecting the first and second circuit boards using the fourth circuit board alleviates the welding stress generated during direct soldering, and the fourth circuit board provides mechanical cushioning, reducing the impact of impact stress on the solder joints.

[0040] In one possible implementation, the fourth circuit board is a flexible circuit board.

[0041] In this way, by setting the fourth circuit board as a flexible circuit board, the first and second circuit boards can be connected through the flexible circuit board. Compared with rigid circuit boards, flexible circuit boards can be bent and folded, allowing the first and second circuit boards to be connected even when they are offset from each other in the first direction, thus improving the flexibility of the first circuit board's arrangement inside the electronic device. Furthermore, flexible circuit boards are lighter than rigid circuit boards, which helps to reduce the weight of the electronic device.

[0042] In one possible implementation, the first circuit board is a flexible circuit board.

[0043] In this way, by making the first circuit board a flexible circuit board, the thickness of the first circuit board can be reduced, thereby reducing the thickness of the circuit board assembly at the corresponding location of the first electronic device, and further contributing to a reduction in the thickness of the electronic device. Furthermore, making the first circuit board a flexible circuit board also reduces the mass of the circuit board assembly, thereby contributing to a reduction in the mass of the electronic device and facilitating its lightweight design.

[0044] In one possible implementation, the first circuit board includes a rigid board portion and a flexible board portion, and the first electronic device is disposed in the flexible board portion;

[0045] The thickness of the flexible section is less than the thickness of the rigid section.

[0046] In this way, by setting the first electronic device in the flexible circuit board portion of the first circuit board, the first electronic device can be set in the thinner flexible circuit board portion while maintaining the integrated structure of the first circuit board. This reduces the thickness of the part of the circuit board assembly corresponding to the first electronic device, thereby helping to reduce the thickness of the part of the circuit board assembly corresponding to the first electronic device, reducing the space occupied by the circuit board assembly inside the electronic device, and helping to reduce the thickness of the electronic device, thus achieving the thinning of the electronic device.

[0047] In one possible implementation, a groove is formed on the first surface of the first circuit board;

[0048] The first electronic device is disposed within the groove.

[0049] In this way, by creating a groove on the first side of the first circuit board and placing the first electronic device in the groove, compared to placing the first electronic device on the ungrooved first side, the total height of the first electronic device and the first circuit board in the first direction can be reduced, thereby helping to reduce the thickness of the circuit board assembly at the corresponding part of the first electronic device, and thus reducing the space occupied by the circuit board assembly inside the electronic device, which helps to reduce the thickness of the electronic device.

[0050] In one possible implementation, the electronic device further includes a first shielding cover;

[0051] The first shielding cover is placed over the first electronic device.

[0052] In this way, by using a first shielding cover to cover the first electronic device, the electronic device can reduce the interference of external electromagnetic signals on the first electronic device, ensure the working stability of the first electronic device, and improve the working performance of the electronic device.

[0053] In one possible implementation, the first shielding cover includes:

[0054] A first shielding frame is disposed around the periphery of the first electronic device, and the first shielding frame forms a first opening;

[0055] A first shielding layer is disposed over the first opening, and the first shielding layer and the first shielding frame together form the first shielding cover;

[0056] The thickness of the first shielding layer is less than the thickness of the sidewall of the first shielding frame.

[0057] In this way, by covering the first opening with the first shielding layer, the first shielding layer and the first shielding frame form the first shielding cover. The thickness of the first shielding layer can be less than the thickness of the side wall of the first shielding frame, so that the first shielding cover formed by the first shielding layer and the first shielding frame can ensure the shielding performance and avoid the influence of the first shielding layer on the thickness of the first shielding cover along the first direction.

[0058] Furthermore, the first shielding layer can be applied to the outer side of the first shielding frame so that the first shielding layer covers the first opening from the outside of the first shielding frame, thereby allowing a portion of the first electronic device to extend into the first opening.

[0059] In one possible implementation, the electronic device further includes a first heat-conducting element;

[0060] The first heat-conducting component is disposed between the first shield and the first electronic device, and the first electronic device contacts the first shield through the first heat-conducting component.

[0061] In this way, by setting the first heat-conducting element, the heat on the first electronic device can be transferred to the first shielding cover through the first heat-conducting element, and then further dissipated to the outside by the first shielding cover, which helps to improve the heat dissipation effect of the first electronic device.

[0062] In one possible implementation, the electronic device further includes a heat dissipation layer;

[0063] A portion of the heat dissipation layer is connected to the rear shell, and another portion is disposed on the side of the first shield facing the housing assembly.

[0064] In this way, by placing the heat dissipation layer on the side of the first shield facing the rear shell, the heat dissipation layer can transfer the heat on the first shield to the rear shell, and the electronic device can transfer the heat to the outside through the rear shell, thereby further accelerating the heat dissipation efficiency of the first electronic device, improving the heat dissipation effect of the electronic device, and ensuring the working stability of the electronic device.

[0065] In one possible implementation, the circuit board assembly further includes a third electronic device;

[0066] The third electronic device is disposed on the second side of the first circuit board;

[0067] Along the first direction, the third electronic device is disposed corresponding to the first electronic device.

[0068] In this way, by placing the third electronic device on the second side of the first circuit board, the surface area of ​​the first circuit board can be utilized more effectively, improving the space utilization rate of the surface of the first circuit board, so as to install more electronic devices on the first circuit board.

[0069] In one possible implementation, the first electronic device is a system-on-a-chip (SoC).

[0070] The third electronic device is a filter element, which is used to filter the system-on-a-chip.

[0071] Thus, if the first electronic device is a system-on-a-chip (SoC) and the third electronic device is a filter element, and the third electronic device is located on the second surface of the first circuit board at a position corresponding to the SoC, vertical filtering of the SoC can be achieved through the filter element, thereby improving the filtering effect of the SoC.

[0072] In one possible implementation, the electronic device further includes a second shielding cover;

[0073] The second shielding cover is placed over the third electronic device.

[0074] In this way, by using a second shielding cover to enclose the third electronic device, the electronic device can reduce the interference of external electromagnetic signals on the third electronic device, ensure the working stability of the third electronic device, and improve the working performance of the electronic device.

[0075] In one possible implementation, the second shielding cover includes:

[0076] A second shielding frame is disposed around the periphery of the third electronic device, and the second shielding frame forms a second opening;

[0077] A second shielding layer is provided over the second opening, and the second shielding layer and the second shielding frame form the second shielding cover;

[0078] The thickness of the second shielding layer is less than the thickness of the wall of the second shielding frame.

[0079] In this way, the second shielding layer is placed over the second opening, and the second shielding layer and the second shielding frame form a second shielding cover. The thickness of the second shielding layer can be less than the thickness of the side wall of the second shielding frame, so that the second shielding cover formed by the second shielding layer and the second shielding frame can not only ensure the shielding performance, but also avoid the influence of the second shielding layer on the thickness of the second shielding cover along the first direction.

[0080] Furthermore, the second shielding layer can be disposed on the outer side of the second shielding frame so that the second shielding layer covers the second opening from the outside of the second shielding frame, thereby allowing a portion of the third electronic device to extend into the second opening.

[0081] In one possible implementation, the electronic device further includes a heat spreader;

[0082] The heat spreader is disposed on the side of the second shield facing the screen assembly.

[0083] In this way, by setting a heat dissipation plate on the side of the second shield facing the screen assembly, the heat dissipation plate can not only dissipate heat from the third electronic device, but also dissipate heat from the screen assembly, thereby improving the heat dissipation efficiency and working stability of the electronic device.

[0084] In one possible implementation, the electronic device further includes a camera module disposed within the receiving portion.

[0085] In this way, by placing the camera module inside the housing of the mounting frame, the housing can not only accommodate the first electronic device, but also further accommodate the camera module, thereby improving the space utilization of the housing of the mounting frame and reducing the space occupied by the camera module in the first direction of the mounting cavity, which helps to reduce the thickness of the electronic device.

[0086] In one possible implementation, the electronic device further includes a lifting mechanism;

[0087] The lifting mechanism is disposed within the mounting cavity;

[0088] The lifting mechanism is used to drive the first circuit board to reciprocate along the first direction;

[0089] A third opening is provided on the wall surface of the mounting frame corresponding to the receiving part, and the third opening is used to connect the interior and exterior of the electronic device.

[0090] In this way, by opening a third opening in the mounting frame to connect the inside and outside of the electronic device, and using a lifting mechanism to drive the first circuit board and the first electronic device to reciprocate along the first direction, the airflow near the first circuit board can be driven, and the heat generated by the first circuit board and the first electronic device during operation can be discharged to the outside of the electronic device through the third opening on the receiving part. This can improve the heat dissipation effect of the first circuit board and the first electronic device, and improve the heat dissipation effect of the circuit board assembly, thereby improving the heat dissipation effect of the electronic device and improving the working performance of the electronic device.

[0091] In one possible implementation, the lifting mechanism includes:

[0092] A first driving component is disposed within the mounting cavity;

[0093] The first link is used to reciprocate along a second direction under the drive of the first driving member, the second direction being perpendicular to the first direction;

[0094] A lifting block is disposed on the first circuit board. The lifting block has an inclined surface that is tilted relative to the first direction and faces the housing assembly. The end of the first connecting rod facing away from the first driving member abuts against the inclined surface.

[0095] The first link is used to drive the lifting block to move along the first direction when it reciprocates along the second direction.

[0096] In this way, the lifting mechanism, comprising a first driving member, a first connecting rod, and a lifting block, with the first driving member driving the first connecting rod to move the lifting block up and down in a first direction, thereby causing the first circuit board and the first electronic device to move up and down in the first direction, simplifies the structure of the lifting mechanism and improves the assembly efficiency of the lifting mechanism and electronic equipment. The relatively simple structure of the lifting mechanism reduces its manufacturing cost, which in turn reduces the manufacturing cost of the electronic equipment.

[0097] In one possible implementation, the lifting mechanism includes:

[0098] The second driving component is disposed within the mounting cavity;

[0099] The second link is used to reciprocate along a third direction under the drive of the second driving member, the third direction being perpendicular to the first direction;

[0100] A groove is provided on the side of the first circuit board facing the second connecting rod. The length extension direction of the groove intersects with the first direction. The end of the connecting rod facing away from the second driving member is located in the groove.

[0101] The connecting rod is used to move along the length extension direction of the slide groove when moving in the third direction, so as to drive the first circuit board to move in the first direction.

[0102] In this way, the lifting mechanism includes a second driving member and a second connecting rod. The second driving member drives the second connecting rod to reciprocate along a third direction. The end of the second connecting rod facing away from the second driving member is disposed in a slide groove. When the second connecting rod moves along the third direction, it can drive the first circuit board and the first electronic device to move along the first direction through the slide groove. The arrangement of the first driving member and the second connecting rod can reduce the number of parts in the lifting mechanism, further simplify the structure of the lifting mechanism, improve the assembly efficiency of electronic equipment, and reduce the manufacturing cost of the lifting mechanism and electronic equipment. Attached Figure Description

[0103] Figure 1 This is a cross-sectional schematic diagram of an electronic device in the related technology in the thickness direction;

[0104] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0105] Figure 3 for Figure 2 A schematic diagram of the structure of an electronic device from one perspective;

[0106] Figure 4 This is a schematic diagram of a first cross-section of an electronic device in the thickness direction, provided in an embodiment of this application.

[0107] Figure 5 This is a second cross-sectional schematic diagram of an electronic device in the thickness direction provided in an embodiment of this application;

[0108] Figure 6 This is a schematic diagram of a third cross-section of an electronic device in the thickness direction, provided in an embodiment of this application.

[0109] Figure 7 This is a fourth cross-sectional schematic diagram of an electronic device in the thickness direction provided in an embodiment of this application;

[0110] Figure 8 A schematic diagram of a circuit board assembly and a lifting mechanism for an electronic device provided in an embodiment of this application;

[0111] Figure 9 This is a schematic diagram of the circuit board assembly and lifting mechanism of an electronic device provided in an embodiment of this application, from another perspective.

[0112] Explanation of reference numerals in the attached figures:

[0113] 1-Screen assembly; 2-Circuit board assembly; 21-Circuit board; 22-System-on-a-chip; 23-Filtering component; 3-Housing assembly;

[0114] 100 - Screen components;

[0115] 200 - Housing assembly;

[0116] 210 - Rear shell; 220 - Middle frame; 230 - Side frame; 240 - Mounting cavity;

[0117] 211 - Through hole;

[0118] 300 - Circuit board assembly;

[0119] 310 - First circuit board; 320 - First electronic component; 330 - Second circuit board; 340 - Second electronic component; 350 - Third circuit board;

[0120] 360 - Fourth circuit board; 370 - Third electronic component;

[0121] 400 - First shielding cover;

[0122] 410 - First shielding frame; 420 - First shielding layer; 430 - First opening; 440 - First heat-conducting component;

[0123] 500 - Heat dissipation layer;

[0124] 600 - Second shielding cover;

[0125] 610 - Second shielding frame; 620 - Second shielding layer; 630 - Second opening; 640 - Second heat-conducting component;

[0126] 700-Popularity Plate;

[0127] 800 - Lifting mechanism;

[0128] 810 - First driving component; 820 - First connecting rod; 830 - Lifting block;

[0129] 811-First drive body; 812-First rotating shaft; 813-First drive gear; 831-Inclined surface;

[0130] 900-battery;

[0131] 1000 - Installation frame;

[0132] 1001 - Frame; 1002 - Bottom frame; 1003 - Reinforcing rib; 1004 - Connector; 1005 - Receiving part. Detailed Implementation

[0133] This application provides an electronic device, which includes, but is not limited to, mobile phones (e.g., candybar phones or foldable phones), tablet computers, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, internet TVs, televisions, in-vehicle devices, netbooks, POS machines, personal digital assistants (PDAs), wearable devices (e.g., smartwatches, smart wristbands, virtual reality devices, and other mobile or fixed terminals with display devices).

[0134] In this embodiment, a mobile phone is used as an example of the aforementioned electronic device for illustration.

[0135] Figure 1 This is a cross-sectional view of an electronic device in the thickness direction, which can be a mobile phone. The electronic device may include a screen assembly 1, a circuit board assembly 2, and a housing assembly 3. The circuit board assembly 2 may include a circuit board 21 and multiple electronic devices disposed on the circuit board 21. The multiple electronic devices may include a system-on-a-chip 22 and a filter element 23 for filtering the system-on-a-chip 22. The filter element 23 may be a filter capacitor. The system-on-a-chip 22 and other electronic devices are disposed on any side of the circuit board 21 in the thickness direction. The filter element 23 may be disposed on the other side of the circuit board 21 that is perpendicular to the system-on-a-chip 22.

[0136] Since the system-on-a-chip 22 is taller than other electronic devices on the circuit board 21, the above-mentioned arrangement of the system-on-a-chip 22 with the filter element 23 will further increase the overall thickness of the circuit board assembly 2. When the circuit board assembly 2 is installed in the electronic device, the circuit board assembly 2 will occupy a large dimension in the thickness direction of the electronic device, resulting in a large thickness of the assembled electronic device, which is not conducive to the thinning of the electronic device.

[0137] Furthermore, due to advancements in chip manufacturing processes and the application of 2.5D or 3D stacking schemes for the system-on-a-chip (SoC) 22, the height of the SoC 22 is increasing. Moreover, for mid-to-high-end products, in order to increase the double data rate (DDR) frequency, the SoC 22 and DDR adopt a package-on-package (POP) direct connection scheme, further increasing the height of the circuit board assembly 2 in the SoC 22 area. In addition, as DDR memory becomes larger, DDR devices are also gradually increasing in height, limiting the further reduction in the thickness of electronic devices.

[0138] refer to Figure 2 , Figure 3 and Figure 4 To address the aforementioned technical problems, this application provides an electronic device. The electronic device may include an interconnected screen assembly 100 and a housing assembly 200. A mounting frame 1000 surrounds the outer periphery of the through-hole 211 in the rear housing 210. A receiving portion 1005 inside the mounting frame 1000 communicates with a mounting cavity 240 through the through-hole 211. A circuit board assembly 300 is disposed within the mounting cavity 240. A first electronic device 320 is disposed on the first surface of the first circuit board 310 facing the receiving portion 1005, and at least a portion of the first electronic device 320 is positioned in the receiving portion 1005 in a first direction. This allows the inherent space on the mounting frame 1000 to accommodate the first electronic device 320, avoiding the need to increase the overall thickness of the electronic device to increase the internal space for accommodating the first electronic device 320. This enables the first electronic device 320 to be accommodated with a higher height without increasing the thickness of the electronic device, or the electronic device to be thinned without changing the height of the first electronic device 320. This improves the internal space utilization of the electronic device and reduces the dimensional occupancy of the circuit board assembly 300 in the thickness direction of the electronic device, which is conducive to the thinning of the electronic device.

[0139] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0140] refer to Figure 2 , Figure 3 and Figure 4 This application provides an electronic device, which can be a tablet computer, a mobile phone, or a laptop computer. The electronic device may include a screen assembly 100, a housing assembly 200, a mounting frame 1000, and a circuit board assembly 300.

[0141] The housing assembly 200 may include a rear housing 210 and a side frame 230. The screen assembly 100 can be connected to the side frame 230; for example, the screen assembly 100 can be connected to the end of the side frame 230 away from the rear housing 210. The side frame 230 and the rear housing 210 can form a mounting cavity 240. The circuit board assembly 300 can be electrically connected to the screen assembly 100. The housing assembly 200 and the screen assembly 100 can be detachably connected to facilitate the assembly and disassembly of the electronic device and to facilitate the installation and maintenance of the circuit board assembly 300.

[0142] In some embodiments, the circuit board assembly 300 can be disposed within the mounting cavity 240. The electronic device may also include a battery 900, which can be disposed within the mounting cavity 240.

[0143] The rear shell 210 can have a through hole 211. The mounting frame 1000 can be disposed on the outer surface of the rear shell 210, and the mounting frame 1000 can protrude from the outer surface of the rear shell 210 facing the mounting cavity 240. The mounting frame 1000 is correspondingly disposed with respect to the through hole 211 and surrounds the outer edge of the through hole 211. The mounting frame 1000 has a receiving part 1005 inside, and the receiving part 1005 can communicate with the mounting cavity 240 through the through hole 211 on the rear shell 210.

[0144] The through hole 211 can be opened at any position on the rear cover 210. For example, the through hole 211 can be opened at a position near the edge of the rear cover 210, or the through hole 211 can also be opened in a region near the middle of the rear cover 210.

[0145] The circuit board assembly 300 may include a first circuit board 310 and a first electronic device 320. The first circuit board 310 is disposed within the mounting cavity 240 and can be electrically connected to the screen assembly 100.

[0146] The first circuit board 310 may include a first surface and a second surface opposite each other along a first direction, with the first surface facing the housing assembly 200. A first electronic device 320 is disposed on the first surface of the first circuit board 310 and is disposed facing the receiving portion 1005. Along the first direction, at least a portion of the first electronic device 320 is located within the receiving portion 1005. The first electronic device 320 may be a system-on-a-chip (SoC).

[0147] In some embodiments, along the first direction, the first electronic device 320 may be partially located within the receiving portion 1005, or the first electronic device 320 may be completely located within the receiving portion 1005. Alternatively, the first circuit board 310 may also be located within the receiving portion 1005, thereby further reducing the impact of the circuit board assembly 300 on the thickness of the electronic device.

[0148] In some embodiments, the first circuit board 310 may also be provided with a plurality of electronic devices other than the first electronic device 320. The plurality of electronic devices may be disposed on a first side of the first circuit board 310, or the plurality of electronic devices may be disposed on a second side of the first circuit board 310. A portion of the plurality of electronic devices may be disposed on the first side of the first circuit board 310, and a portion of the plurality of electronic devices may be disposed on the second side of the first circuit board 310.

[0149] This application provides an electronic device, which includes a screen assembly 100 and a housing assembly 200 connected to each other. A mounting frame 1000 surrounds the outer periphery of a through hole 211 in a rear housing 210. A receiving portion 1005 inside the mounting frame 1000 communicates with a mounting cavity 240 through the through hole 211. A circuit board assembly 300 is disposed in the mounting cavity 240. By disposing a first electronic device 320 on a first surface of a first circuit board 310 facing the receiving portion 1005, and in a first direction, at least a portion of the first electronic device 320 is located within the receiving portion 1005. This allows the inherent space on the mounting frame 1000 to accommodate the first electronic device 320, avoiding the need to increase the overall thickness of the electronic device to increase the internal space for accommodating the first electronic device 320. This achieves the ability to accommodate a taller first electronic device 320 without increasing the thickness of the electronic device, or to thin the electronic device without changing the height of the first electronic device 320. This improves the internal space utilization of the electronic device and reduces the dimensional occupancy of the circuit board assembly 300 in the thickness direction of the electronic device, thus contributing to the thinning of the electronic device.

[0150] In some embodiments, the mounting frame 1000 can be detachably connected to the housing assembly 200. Alternatively, the mounting frame 1000 can also be an integral structure with the housing assembly 200. For example, the mounting frame 1000 and the rear housing 210 can be an integral structure. Alternatively, the mounting frame 1000 and the rear housing 210 can be two independent structures that can be detachably connected to each other. By detachably connecting the mounting frame 1000 to the rear housing 210, the replacement and maintenance of the mounting frame 1000 can be facilitated.

[0151] In some embodiments, the receiving portion 1005 of the mounting frame 1000 can be used to receive a camera module (not shown in the figure), or the receiving portion 1005 can also be used to receive a heat dissipation device.

[0152] For example, an electronic device may include a camera module, and the mounting frame 1000 may be a decorative frame for housing the camera module. When the camera module is in a first direction (e.g., Figure 3 When the size in the X direction is large and will occupy a large space inside the electronic device, a receiving part 1005 can be provided in a local area on the housing assembly 200, and the camera module can be placed in the receiving part 1005.

[0153] In this way, by placing the camera module inside the receiving part 1005, the receiving part 1005 can simultaneously accommodate the first electronic device 320 and the camera module, thus enriching the functions of the receiving part 1005.

[0154] Furthermore, by placing both the camera module and the first electronic device 320 within the receiving portion 1005, it is possible to avoid additional structures protruding from the outer surface of the rear cover 210 in other areas of the rear cover 210 to accommodate the camera module. This avoids the formation of multiple protruding structures on the outer surface of the rear cover 210, improving the aesthetics of the outer surface of the rear cover 210, and also helps to improve the aesthetics of the electronic device and contribute to the thinning of the electronic device.

[0155] In some embodiments, the mounting frame 1000 may be an annular structure surrounding the through hole 211. One end of the annular structure along the axial direction may extend toward the outer surface of the rear housing 210, and the other end of the mounting frame 1000 toward the outside of the electronic device may protrude beyond the outer surface of the rear housing 210, so that the mounting frame 1000 may form a receiving portion 1005 with a certain depth along the first direction, and the first electronic device 320 may be received in the receiving portion 1005 along the first direction.

[0156] refer to Figure 4 In some embodiments, the mounting frame 1000 may include a border 1001 and a bottom frame 1002.

[0157] The frame 1001 surrounds the periphery of the edge of the through hole 211 and is connected to the outer surface of the rear shell 210, and the frame 1001 extends relative to the rear shell 210 in a direction away from the first circuit board 310. In some embodiments, the frame 1001 can be an annular structure, for example, the frame 1001 can be a circular annular structure.

[0158] In this way, the mounting frame 1000, including the frame 1001, can reduce the probability of the first electronic device 320 or the camera module colliding with objects outside the electronic device, thus protecting the first electronic device 320 or the camera module.

[0159] The bottom frame 1002 is located at the end of the side frame 1001 facing away from the first circuit board 310, and the side frame 1001 and the bottom frame 1002 together form the receiving portion 1005. The first circuit board 310 can be connected to the bottom frame 1002 or the side frame 1001, which can increase the installation stability of the circuit board assembly 300 inside the electronic device.

[0160] In some embodiments, the frame 1001 and the bottom frame 1002 can be a single integrated structure, which reduces the number of components in the electronic device and simplifies the assembly process. In other embodiments, the frame 1001 and the bottom frame 1002 can also be detachably connected, which facilitates individual repair and replacement of the frame 1001 and the bottom frame 1002.

[0161] In other embodiments, if the camera module is disposed within the mounting frame 1000, the bottom frame 1002 may be a lens glass that allows light to pass through, so that the camera module can obtain external light.

[0162] refer to Figure 4 In some embodiments, the bottom frame 1002 is provided with a reinforcing rib 1003 protruding toward the first circuit board 310. The reinforcing rib 1003 is connected to the frame 1001, or the reinforcing rib 1003 can be an integral structure with the frame 1001.

[0163] In this way, by providing a reinforcing rib 1003 on the side of the bottom frame 1002 facing the first circuit board 310, the reinforcing rib 1003 can be connected to the frame 1001, thereby reducing the probability of deformation of the frame 1001 and increasing the structural strength of the frame 1001, thereby increasing the overall structural strength of the mounting frame 1000.

[0164] In some embodiments, the reinforcing rib 1003 can be used to support the first circuit board 310.

[0165] In this way, by supporting the first circuit board 310 with the reinforcing rib 1003, the probability of the first circuit board 310 shaking inside the electronic device can be reduced, and the installation stability of the first circuit board 310 in the electronic device can be improved.

[0166] In some embodiments, the reinforcing rib 1003 and the bottom frame 1002 can be an integral structure. There can be multiple reinforcing ribs 1003, and the multiple reinforcing ribs 1003 can be arranged in an interlaced manner to further improve the structural strength of the mounting frame 1000.

[0167] refer to Figure 4 In some embodiments, the first circuit board 310 can also be connected to the reinforcing rib 1003 to improve the installation stability of the first circuit board 310. In some examples, the electronic device may also include a connector 1004 for connecting the first circuit board 310 to the reinforcing rib 1003.

[0168] In this way, by using connector 1004 to connect the first circuit board 310 to the reinforcing rib 1003, the electronic device can avoid the first circuit board 310 from shaking inside the electronic device and improve the installation stability of the first circuit board 310 inside the electronic device.

[0169] In some embodiments, the connector 1004 may be a bolt, screw, or snap-fit. If the connector 1004 is a screw, the first circuit board 310 may have a screw hole and the reinforcing rib 1003 may also have a threaded hole corresponding to the screw hole on the first circuit board 310. The screw passes through the screw hole and is installed in the threaded hole on the reinforcing rib 1003, so as to connect the first circuit board 310 to the reinforcing rib 1003 by screw.

[0170] refer to Figure 4 In some embodiments, the first circuit board 310 may include a rigid portion (not shown) and a flexible portion (not shown), with the first electronic device 320 disposed on the flexible portion, the thickness of which is less than the thickness of the rigid portion. Alternatively, the flexible portion may be a flexible circuit board, and its thickness may be less than the thickness of the rigid portion.

[0171] In this way, by setting the first electronic device 320 in the flexible circuit board portion of the first circuit board 310, the first electronic device 320 can be set in the thinner flexible circuit board portion while maintaining the integral structure of the first circuit board 310. This reduces the thickness of the circuit board assembly 300 at the position corresponding to the first electronic device 320, thereby helping to reduce the thickness of the circuit board assembly 300 at the position corresponding to the first electronic device 320, reducing the space occupied by the circuit board assembly 300 inside the electronic device, and helping to reduce the thickness of the electronic device, thus achieving the thinning of the electronic device.

[0172] refer to Figure 4 In some embodiments, the first circuit board 310 may be a flexible circuit board.

[0173] In this way, by setting the first circuit board 310 as a flexible circuit board, the thickness of the first circuit board 310 can be reduced, thereby reducing the thickness of the circuit board assembly 300 at the corresponding location of the first electronic device 320, and further contributing to a reduction in the thickness of the electronic device. Furthermore, setting the first circuit board 310 as a flexible circuit board also reduces the weight of the circuit board assembly 300, thereby contributing to a reduction in the weight of the electronic device and facilitating a lightweight design.

[0174] refer to Figure 4 In some embodiments, a groove (not shown in the figure) is formed on the first surface of the first circuit board 310, and the first electronic device 320 is disposed in the groove.

[0175] In this way, by creating a groove on the first surface of the first circuit board 310 and placing the first electronic device 320 in the groove, compared to placing the first electronic device 320 on the ungrooved first surface, the total height of the first electronic device 320 and the first circuit board 310 in the first direction can be reduced. This helps to reduce the thickness of the circuit board assembly 300 at the corresponding location of the first electronic device 320, thereby reducing the space occupied by the circuit board assembly 300 inside the electronic device and contributing to the thinning of the electronic device.

[0176] refer to Figure 5 In some embodiments, with Figure 4 In contrast, the housing assembly 200 may also include a middle frame 220, which is connected to the side frame 230. The middle frame 220, the side frame 230, and the rear shell 210 form a mounting cavity 240. The circuit board assembly 300 is disposed on the side of the middle frame 220 facing the rear shell 210, and the screen assembly 100 is disposed on the side of the middle frame 220 facing away from the circuit board assembly 300.

[0177] In some embodiments, the mid-frame 220 can be a metal mid-frame 220. By connecting the side frame 230, the screen assembly 100, and the circuit board assembly 300 to the mid-frame 220, the structural strength of the electronic device can be increased, and the assembly process of the electronic device can be simplified.

[0178] refer to Figure 5 In some embodiments, the electronic device may further include a first shielding cover 400, which is disposed on the first electronic device 320. The first shielding cover 400 can be mounted on the first side of the first circuit board 310, and the first shielding cover 400 may be a metal cover.

[0179] In this way, by using the first shielding cover 400 to cover the first electronic device 320, the electronic device can reduce the interference of external electromagnetic signals on the first electronic device 320, ensure the working stability of the first electronic device 320, and improve the working performance of the electronic device.

[0180] refer to Figure 5 In some embodiments, the first shielding cover 400 may include a first shielding frame 410 and a first shielding layer 420. The first shielding frame 410 surrounds the periphery of the first electronic device 320 and forms a first opening 430. The first shielding frame 410 is formed by continuous sidewalls. The first shielding frame 410 may be a metal frame. The first opening 430 is oriented toward a first surface of the first circuit board 310.

[0181] In one possible implementation, the first electronic device 320 can extend along a first direction into the first opening 430 so that the first shield 400 can accommodate the first electronic device 320 with a larger size.

[0182] The first shielding layer 420 is disposed over the first opening 430. The first shielding layer 420 and the first shielding frame 410 form a first shielding cover 400. The thickness of the first shielding layer 420 can be less than the thickness of the sidewall of the first shielding frame 410. This allows the first shielding cover 400, composed of the first shielding layer 420 and the first shielding frame 410, to ensure shielding performance while also avoiding the influence of the first shielding layer 420 on the thickness of the first shielding cover 400 along the first direction.

[0183] In some embodiments, the first shielding layer 420 can be disposed on the outer side of the first shielding frame 410 so that the first shielding layer 420 covers the first opening 430 from the outside of the first shielding frame 410, thereby allowing a portion of the first electronic device 320 to extend into the first opening 430.

[0184] refer to Figure 5 In some embodiments, the electronic device may further include a first heat-conducting element 440, which is disposed between the first shielding cover 400 and the first electronic device 320, and the first electronic device 320 contacts the first shielding cover 400 through the first heat-conducting element 440.

[0185] In this way, by setting the first heat-conducting element 440, the heat on the first electronic device 320 can be transferred to the first shield 400 through the first heat-conducting element 440, and further dissipated to the outside by the first shield 400, which helps to improve the heat dissipation effect of the first electronic device 320.

[0186] In some embodiments, the first thermal conductive element 440 may be a thermally conductive silicone pad or thermally conductive adhesive. If the first thermal conductive element 440 is a thermally conductive silicone pad, the thermally conductive silicone pad may be disposed on the surface of the first electronic device 320 facing away from the first circuit board 310, and the surface of the first electronic device 320 facing away from the first circuit board 310 may abut against the inner surface of the first shield 400 through the thermally conductive silicone pad.

[0187] refer to Figure 5 In some embodiments, the electronic device may also include a heat dissipation layer 500, a portion of which is disposed on the outer surface of the first shield 400, and another portion which can extend to the outside of the receiving portion 1005 and fit against the wall of the rear shell 210 facing the mounting cavity 240.

[0188] In this way, by placing a portion of the heat dissipation layer 500 on the outer surface of the first shield 400 and extending another portion to the outside of the receiving portion 1005 and fitting against the wall of the rear shell 210 facing the mounting cavity 240, the heat dissipation layer 500 can transfer the heat of the first shield 420 to the rear shell 210, thereby achieving heat dissipation of the first shield 400, improving the heat dissipation effect of the first electronic device 320, improving the heat dissipation effect of the electronic device, and ensuring the working stability of the electronic device.

[0189] In some embodiments, the heat dissipation layer 500 may be a graphene heat dissipation layer or a metal heat dissipation layer.

[0190] refer to Figure 5 In some embodiments, the circuit board assembly 300 may further include a third electronic device 370, which is disposed on the second side of the first circuit board 310. Along the first direction, the third electronic device 370 is disposed corresponding to the first electronic device 320.

[0191] In this way, by placing the third electronic device 370 on the second side of the first circuit board 310, the surface area of ​​the first circuit board 310 can be utilized more effectively, and the space utilization rate of the surface of the first circuit board 310 can be improved, so as to install more electronic devices on the first circuit board 310.

[0192] refer to Figure 5 In some embodiments, the first electronic device 320 is a system-on-a-chip (SoC) and the third electronic device 370 is a filter element used to filter the SoC.

[0193] Thus, if the first electronic device 320 is a system-on-a-chip (SoC) and the third electronic device 370 is a filter element, and the third electronic device 370 is disposed on the second surface of the first circuit board 310 at a position corresponding to the SoC, vertical filtering of the SoC can be achieved through the filter element, thereby improving the filtering effect of the SoC.

[0194] refer to Figure 5 In some embodiments, the electronic device may further include a second shielding cover 600, which covers the third electronic device 370. The second shielding cover 600 can be mounted on the second side of the first circuit board 310. The second shielding cover 600 can be a metal cover, which can also provide heat dissipation for the third electronic device 370 to improve the heat dissipation effect of the third electronic device 370.

[0195] In this way, by using the second shielding cover 600 to cover the third electronic device 370, the electronic device can reduce the interference of external electromagnetic signals on the third electronic device 370, ensure the working stability of the third electronic device 370, and improve the working performance of the electronic device.

[0196] refer to Figure 5 In some embodiments, the second shielding cover 600 may include a second shielding frame 610 and a second shielding layer 620. The second shielding frame 610 surrounds the periphery of the third electronic device 370 and forms a second opening 630. The second shielding frame 610 is formed by continuous sidewalls. The second shielding frame 610 may be a metal frame. The second opening 630 may face the surface of the first circuit board 310. The third electronic device 370 may extend into the second opening 630 in a first direction so that the second shielding cover 600 can accommodate a taller third electronic device 370.

[0197] The second shielding layer 620 is disposed over the second opening 630. The second shielding layer 620 and the second shielding frame 610 form a second shielding cover 600. The thickness of the second shielding layer 620 can be less than the thickness of the sidewall of the second shielding frame 610. This allows the second shielding cover 600, composed of the second shielding layer 620 and the second shielding frame 610, to ensure shielding performance while also avoiding the influence of the second shielding layer 620 on the thickness of the second shielding cover 600 along the first direction.

[0198] In some embodiments, the second shielding layer 620 can be disposed on the outer side of the second shielding frame 610 so that the second shielding layer 620 covers the second opening 630 from the outside of the second shielding frame 610, thereby allowing a portion of the third electronic device 370 to extend into the second opening 630.

[0199] In some embodiments, the electronic device may further include a second heat-conducting element 640 disposed within the second shielding cover 600. The second heat-conducting element 640 may be located between the third electronic device 370 and the inner wall of the second shielding cover 600. The second heat-conducting element 640 can increase the efficiency of heat transfer from the third electronic device 370 to the second shielding cover 600, thereby improving the heat dissipation efficiency of the third electronic device 370.

[0200] refer to Figure 5 In some embodiments, the electronic device may also include a heat spreader 700 disposed on the side of the second shield 600 facing the screen assembly 100.

[0201] In this way, by setting a heat dissipation plate 700 on the side of the second shield 600 facing the screen assembly 100, the heat dissipation plate 700 can not only dissipate heat from the third electronic device 370, but also dissipate heat from the screen assembly 100, thereby improving the heat dissipation efficiency and working stability of the electronic device.

[0202] In some embodiments, if the housing assembly 200 has a rear housing 210 and a middle frame 220, the heat spreader 700 can be disposed on the side of the middle frame 220 facing the first circuit board 310.

[0203] refer to Figure 6 and Figure 7 In some embodiments, the circuit board assembly 300 may further include a second circuit board 330 disposed within the mounting cavity 240 and electrically connected to the first circuit board 310. A second electronic device 340 is disposed on the second circuit board 330. Thus, by providing two circuit boards, the layout flexibility of the electronic device on the first circuit board 310 and the second circuit board 330 can be improved, as can the layout flexibility of the circuit board assembly 300 within the mounting cavity 240.

[0204] It should be noted that, Figure 7 and Figure 6 The difference is that when the circuit board assembly 300 has a second circuit board 330, the housing assembly 200 may also include a middle frame 220, and the first circuit board 310 can be connected to the middle frame 220.

[0205] In some embodiments, at least a portion of the first circuit board 310 can be located within the receiving portion 1005 in the first direction. For example, a portion of the first circuit board 310 can be located within the receiving portion 1005, or the first circuit board 310 can be partially and completely located within the receiving portion 1005.

[0206] In this way, the circuit board assembly 300 includes two circuit boards, a first circuit board 310 and a second circuit board 330. The size of the first circuit board 310 is smaller than that of the second circuit board 330. In the first direction, the projection of the first circuit board 310 is located within the receiving opening of the receiving portion 1005, so that the first circuit board 310 can also be located within the receiving portion 1005. Thus, while ensuring that the first electronic device 320 can be completely located within the receiving portion 1005, the first circuit board 310 can also be accommodated within the receiving portion 1005, thereby improving the utilization rate of the internal space of the electronic device and further reducing the impact of the circuit board assembly 300 on the thickness of the electronic device, which helps to achieve the thinning of the electronic device.

[0207] In some embodiments, the first circuit board 310 and the second circuit board 330 can be connected by soldering, or the first circuit board 310 and the second circuit board 330 can also be connected by an additional circuit board.

[0208] refer to Figure 6 and Figure 7In some embodiments, when the receiving portion 1005 is located in the region near the center edge of the rear housing 210, the circuit board assembly 300 may further include a third circuit board 350. The third circuit board 350 is located within the mounting cavity 240 and is electrically connected to the first circuit board 310. The first circuit board 310 is located between the second circuit board 330 and the third circuit board 350. Electronic devices may also be disposed on the third circuit board 350. The first circuit board 310, the second circuit board 330, and the third circuit board 350 may be arranged in a straight line, thereby facilitating the connection between the first circuit board 310, the second circuit board 330, and the third circuit board 350, as well as the ease of mounting electronic devices on the circuit boards.

[0209] In this way, by including a third circuit board 350 and positioning the first circuit board 310 between the second circuit board 330 and the third circuit board 350, the circuit board assembly 300 ensures that at least a portion of the first circuit board 310 is located within the receiving portion 1005 while ensuring that the first circuit board 310, the second circuit board 330, and the third circuit board 350 are arranged in a straight line. That is, it ensures that the first circuit board 310 can be installed within the receiving portion 1005 while maintaining ease of installation of the circuit board assembly 300, thereby achieving a thinner electronic device.

[0210] In some embodiments, the first circuit board 310 and the third circuit board 350 can be connected by soldering, or the first circuit board 310 and the second circuit board 330 can also be connected by an additional circuit board. For example, the first circuit board 310 and the third circuit board 350 can be connected by a flexible circuit board.

[0211] refer to Figure 6 and Figure 7 In some embodiments, the circuit board assembly 300 may further include a fourth circuit board 360, one end of which is electrically connected to the first circuit board 310, and the other end of which is electrically connected to the second circuit board 330.

[0212] In this way, electrically connecting the first circuit board 310 and the second circuit board 330 via the fourth circuit board 360 facilitates the individual disassembly, repair, and replacement of the first and second circuit boards 310 and 330, reducing maintenance costs. Furthermore, connecting the first circuit board 310 and the second circuit board 330 via the fourth circuit board 360 alleviates the welding stress generated during direct soldering of the first and second circuit boards 310 and 330, and the fourth circuit board 360 provides a certain degree of mechanical cushioning, reducing the impact of impact stress on the solder joints.

[0213] In some embodiments, the thickness of the fourth circuit board 360 can be less than the thickness of the first circuit board 310 and the second circuit board 330, thereby reducing the occupancy of the fourth circuit board 360 in the thickness direction of the electronic device and reducing the weight of the electronic device. The fourth circuit board 360 can be an ultra-thin rigid circuit board or a flexible circuit board.

[0214] refer to Figure 6 and Figure 7 In some embodiments, the fourth circuit board 360 may be a flexible circuit board.

[0215] In this way, by setting the fourth circuit board 360 as a flexible circuit board, the first circuit board 310 and the second circuit board 330 can be connected through the flexible circuit board. Compared with rigid circuit boards, flexible circuit boards can be bent and folded, enabling the connection of the first circuit board 310 and the second circuit board 330 even when they are staggered in the first direction, thus improving the flexibility of the arrangement of the first circuit board 310 inside the electronic device. Furthermore, flexible circuit boards are lighter than rigid circuit boards, which helps to reduce the weight of the electronic device.

[0216] refer to Figure 8 and Figure 9 In some embodiments, the electronic device may further include a lifting mechanism 800, which is disposed in the mounting cavity 240. The lifting mechanism 800 is used to drive the first circuit board 310 to reciprocate along a first direction. The mounting frame 1000 has a third opening, which is used to connect the inside and outside of the electronic device.

[0217] In some embodiments, if the circuit board assembly 300 includes a first circuit board 310, the lifting mechanism 800 may be disposed in the mounting cavity 240 and connected to the first circuit board 310 to drive the first circuit board 310 to move along a first direction.

[0218] If the circuit board assembly 300 includes a first circuit board 310 and a second circuit board 330, and the first circuit board 310 and the second circuit board 330 are connected by a flexible circuit board, the lifting mechanism 800 can be disposed in the mounting cavity 240, and the lifting mechanism 800 is connected to the first circuit board 310. The lifting mechanism 800 can be used to drive the first circuit board 310 to move along a first direction.

[0219] In this way, by opening a third opening in the mounting frame 250 to connect the inside and outside of the electronic device, and using the lifting mechanism 800 to drive the first circuit board 310 and the first electronic device 320 to reciprocate along the first direction, the airflow near the first circuit board 310 can be driven, and the heat generated by the first circuit board 310 and the first electronic device 320 during operation can be discharged to the outside of the electronic device through the third opening in the mounting frame 250. This can improve the heat dissipation effect of the first circuit board 310 and the first electronic device 320, and also improve the heat dissipation effect of the circuit board assembly 300, thereby improving the heat dissipation effect of the electronic device and improving the working performance of the electronic device.

[0220] refer to Figure 7 , Figure 8 and Figure 9 In some embodiments, the lifting mechanism 800 may include a first driving member 810, a first connecting rod 820, and a lifting block 830. The first driving member 810 drives the lifting block 830 to move up and down in a first direction via the first connecting rod 820. The first connecting rod 820 can support the first circuit board 310 in the first direction via the lifting block 830.

[0221] In one possible implementation, when the circuit board assembly 300 has a first circuit board 310, the first driving member 810 can be disposed within the mounting cavity 240, and the first connecting rod 820 is used to move along a second direction (e.g., under the drive of the first driving member 810) Figure 7 The device moves back and forth in the Y direction. The second direction is perpendicular to the first direction. The second direction can be coplanar with the width and length directions of the electronic device. For example, the second direction can be in the same direction as the width direction of the electronic device.

[0222] In another possible implementation, if the circuit board assembly 300 may include a first circuit board 310 and a second circuit board 330, then the first driving member 810 may be disposed on the second circuit board 330, and the first circuit board 310 and the second circuit board 330 may be connected by a flexible circuit board so that the first driving member 810 can drive the first circuit board 310 to move along a first direction.

[0223] In some embodiments, the first driving member 810 may include a first driving body 811, a first rotating shaft 812, and a first driving gear 813. The first driving body 811 may be a reciprocating motor. One end of the first rotating shaft 812 is connected to the first driving body 811, and the other end of the first rotating shaft 812 is connected to the first driving gear 813. The first driving gear 813 is connected to the first connecting rod 820. The first driving body 811 drives the first rotating shaft 812 to rotate, thereby driving the first driving gear 813 to rotate. The first connecting rod 820 reciprocates along a second direction under the drive of the first driving gear 813.

[0224] The lifting block 830 is disposed on the first circuit board 310. The lifting block 830 has an inclined surface 831 that is inclined relative to the first direction and the inclined surface 831 faces the rear shell 210 of the housing assembly 200. The end of the first connecting rod 820 facing away from the first driving member 810 abuts against the inclined surface 831. The first connecting rod 820 is used to drive the lifting block 830 to move along the first direction when it reciprocates along the second direction.

[0225] In this way, the lifting mechanism 800, comprising a first driving member 810, a first connecting rod 820, and a lifting block 830, with the first driving member 810 driving the first connecting rod 820 to drive the lifting block 830 to move up and down in a first direction, thereby causing the first circuit board 310 and the first electronic device 320 to move up and down in the first direction, simplifies the structure of the lifting mechanism 800 and improves the assembly efficiency of the lifting mechanism 800 and the electronic device. The relatively simple structure of the lifting mechanism 800 reduces its manufacturing cost, which in turn reduces the manufacturing cost of the electronic device.

[0226] refer to Figure 7 and Figure 8 In other embodiments, the lifting mechanism 800 may include a second drive member and a second link. The second drive member may be disposed on the second circuit board 330, or the second drive member may be disposed within a mounting cavity. The second link is used to move along a third direction (e.g., under the drive of the second drive member) Figure 8 The third direction moves back and forth in the Z direction, and is perpendicular to the first direction. The third direction can be coplanar with the width and length directions of the electronic device. For example, the third direction can be in the same direction as the length direction of the electronic device.

[0227] In some embodiments, the second driving element may include a second driving body, a second rotating shaft, and a second driving gear. The second driving body may be a reciprocating motor. One end of the second rotating shaft is connected to the second driving body, and the other end of the second rotating shaft is connected to the second driving gear. The second driving gear is connected to a second connecting rod. The second driving body drives the second rotating shaft to rotate, thereby driving the second driving gear to rotate. The second connecting rod reciprocates along a third direction under the drive of the second driving gear.

[0228] A groove is provided on the side of the first circuit board 310 facing the second connecting rod. The length extension direction of the groove intersects with the first direction so that the groove has a certain travel distance in the first direction. The end of the connecting rod facing away from the second driving member is located in the groove. The connecting rod is used to move along the length extension direction of the groove when moving in the third direction, so as to drive the first circuit board 310 to move in the first direction.

[0229] In this way, the lifting mechanism 800 includes a second driving member and a second connecting rod. The second driving member drives the second connecting rod to reciprocate along a third direction. The end of the second connecting rod facing away from the second driving member is disposed in a slide groove. When the second connecting rod moves along the third direction, it can drive the first circuit board 310 and the first electronic device 320 to move along the first direction through the slide groove. The arrangement of the second driving member and the second connecting rod can reduce the number of parts in the lifting mechanism 800, further simplify the structure of the lifting mechanism 800, improve the assembly efficiency of electronic equipment, and reduce the manufacturing cost of the lifting mechanism 800 and electronic equipment.

[0230] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0231] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0232] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0233] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0234] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, comprising: The application relates to an electronic device. The electronic device comprises: a screen assembly (100); a housing assembly (200) comprising a back cover (210) and a side frame (230), the screen assembly (100) being connected to a side of the side frame (230) away from the back cover (210), the back cover (210) and the side frame (230) forming an installation cavity (240), and a through hole (211) being formed in the back cover (210) and communicating with the installation cavity (240); an installation frame (1000) arranged on the back cover (210) and surrounding the outer periphery of the through hole (211), the installation frame (1000) protruding from the surface of the back cover (210) away from the screen assembly (100), and one side of the installation frame (1000) facing the installation cavity (240) being provided with a receiving portion (1005), the receiving portion (1005) communicating with the installation cavity through the through hole; a circuit board assembly (300) comprising: a first circuit board (310) arranged in the installation cavity (240), the first circuit board (310) comprising a first surface and a second surface opposite to each other in a first direction, and the first surface facing the back cover (210); 2. The electronic device of claim 1, wherein, a first electronic device (320) arranged on the first surface and located in the receiving portion (1005) in the first direction. The installation frame (1000) comprises: a frame (1001) surrounding the edge of the through hole (211), and the frame (1001) extending away from the first circuit board (310) relative to the back cover (210); 3. The electronic device of claim 2, wherein, a bottom frame (1002) arranged at the end of the frame (1001) away from the first circuit board (310), and the frame (1001) and the bottom frame (1002) jointly forming the receiving portion (1005).

4. The electronic device of claim 3, wherein, The bottom frame (1002) is provided with a reinforcing rib (1003) protruding towards the first circuit board (310), and the reinforcing rib (1003) is connected to the frame (1001).

5. The electronic device of claim 4, wherein, The reinforcing rib (1003) is used for supporting the first circuit board (310). The electronic device further comprises a connecting piece (1004); 6. The electronic device of claim 1, wherein, the connecting piece (1004) is used for connecting the first circuit board (310) to the reinforcing rib (1003). The housing assembly (200) further comprises a middle frame (220); the middle frame (220) is connected to the side frame (230), the middle frame (220), the side frame (230) and the back cover (210) jointly forming the installation cavity (240); 7. The electronic device of any of claims 1-4, wherein, the circuit board assembly (300) is arranged on the side of the middle frame (220) facing the back cover (210), and the screen assembly (100) is arranged on the side of the middle frame (220) away from the circuit board assembly (300). The circuit board assembly (300) further comprises a second circuit board (330); the second circuit board (330) is arranged in the installation cavity (240), and the second circuit board (330) is electrically connected to the first circuit board (310). A second electronic device (340) is arranged on the second circuit board (330).

8. The electronic device of claim 7, wherein, In the first direction, the first circuit board (310) is located in the accommodating portion (1005).

9. The electronic device of claim 7, wherein, The circuit board assembly (300) further comprises a third circuit board (350); The third circuit board (350) is located in the mounting cavity (240); The third circuit board (350) is electrically connected with the first circuit board (310), and the first circuit board (310) is located between the second circuit board (330) and the third circuit board (350).

10. The electronic device of claim 7, wherein, The circuit board assembly (300) further comprises a fourth circuit board (360); One end of the fourth circuit board (360) is electrically connected with the first circuit board (310), and the other end of the fourth circuit board (360) is electrically connected with the second circuit board (330).

11. The electronic device of claim 10, wherein, The fourth circuit board (360) is a flexible circuit board.

12. The electronic device of any of claims 1-6, wherein, The first circuit board (310) is a flexible circuit board.

13. The electronic device of any of claims 1-6, wherein, The first circuit board (310) comprises a hard board portion and a soft board portion, and the first electronic device (320) is arranged on the soft board portion; The thickness of the soft board portion is less than the thickness of the hard board portion.

14. The electronic device of any of claims 1-6, wherein, The first surface of the first circuit board (310) is provided with a groove; The first electronic device (320) is arranged in the groove.

15. The electronic device of any of claims 1-6, wherein, The electronic device further comprises a first shielding cover (400); The first shielding cover (400) covers the first electronic device (320).

16. The electronic device of claim 15, wherein, The first shielding cover (400) comprises: A first shielding frame (410) is arranged on the side of the first electronic device (320), and the first shielding frame (410) surrounds a first opening (430); A first shielding layer (420) is arranged on the first opening (430), and the first shielding layer (420) and the first shielding frame (410) form the first shielding cover (400); The thickness of the first shielding layer (420) is less than the thickness of the side wall of the first shielding frame (410).

17. The electronic device of claim 15, wherein, The electronic device further comprises a first heat-conducting member (440); The first heat-conducting member (440) is arranged between the first shielding cover (400) and the first electronic device (320), and the first electronic device (320) is in contact with the first shielding cover (400) through the first heat-conducting member (440).

18. The electronic device of claim 15, wherein, The electronic device further comprises a heat dissipation layer (500); Part of the heat dissipation layer (500) is connected with the rear shell (210), and the other part is arranged on the outer surface of the first shielding cover (400).

19. The electronic device of claim 1, wherein, The circuit board assembly (300) further comprises a third electronic device (370); The third electronic device (370) is arranged on the second surface of the first circuit board (310); In the first direction, the third electronic device (370) is arranged correspondingly with the first electronic device (320).

20. The electronic device of claim 19, wherein, The first electronic device (320) is a system on chip; The third electronic device (370) is a filter element, and the filter element is used for filtering the system on chip.

21. The electronic device of claim 19, wherein, The electronic device further comprises a second shielding cover (600); The second shielding cover (600) covers the third electronic device (370).

22. The electronic device of claim 21, wherein, The second shielding cover (600) comprises: A second shielding frame (610) surrounds the third electronic device (370) on the side, and the second shielding frame (610) surrounds a second opening (630); A second shielding layer (620) covers the second opening (630), and the second shielding layer (620) and the second shielding frame (610) form the second shielding cover (600); The thickness of the second shielding layer (620) is less than the thickness of the wall surface of the second shielding frame (610).

23. The electronic device of claim 21, wherein, The electronic device further comprises a vapor chamber (700); The vapor chamber (700) is arranged on the side of the second shielding cover (600) facing the screen assembly (100).

24. The electronic device of claim 1, wherein, The electronic device further comprises a camera module, and the camera module is arranged in the accommodating portion (1005).

25. The electronic device of any of claims 1-6, wherein, The electronic device further comprises a lifting mechanism (800); The lifting mechanism (800) is arranged in the mounting cavity (240); The lifting mechanism (800) is used to drive the first circuit board (310) to reciprocate along the first direction; The mounting frame (1000) is provided with a third opening, and the third opening is used to communicate the inside and outside of the electronic device.

26. The electronic device of claim 25, wherein, The lifting mechanism (800) comprises: A first driving member (810) is arranged in the mounting cavity (240); A first connecting rod (820) is used to reciprocate along a second direction under the driving of the first driving member (810), and the second direction is perpendicular to the first direction; A lifting block (830) is arranged on the first circuit board (310), the lifting block (830) has an inclined surface (831) inclined relative to the first direction, and the inclined surface (831) faces the housing assembly (200), and one end of the first connecting rod (820) away from the first driving member (810) abuts against the inclined surface (831); The first connecting rod (820) is used to drive the lifting block (830) to move along the first direction when reciprocating along the second direction.

27. The electronic device of claim 25, wherein, The lifting mechanism (800) comprises: A second driving member is arranged in the mounting cavity (240); A second connecting rod is used to reciprocate along a third direction under the driving of the second driving member, and the third direction is perpendicular to the first direction; A slide groove is arranged on one side of the first circuit board (310) facing the second connecting rod, the length extension direction of the slide groove intersects the first direction, and one end of the connecting rod away from the second driving member is located in the slide groove; The connecting rod is used to drive the first circuit board (310) to move along the first direction by moving along the length extension direction of the slide groove when moving along the third direction.

Images