Printed circuit board for high-power data chain and data chain equipment
By designing a dedicated placement area and heat dissipation structure on the printed circuit board, the problem of poor heat dissipation caused by the disordered arrangement of high-power devices is solved, achieving efficient heat dissipation and stable connection, and improving the performance and lifespan of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-03-13
AI Technical Summary
In existing technologies, the disordered arrangement of high-power devices on printed circuit boards leads to poor heat dissipation, affecting equipment performance and stability, and shortening service life.
Design a high-power data link printed circuit board, including a circuit board body, a first placement area, a second placement area and a heat dissipation layer. The power amplifier device is placed in the second placement area, and the heat dissipation layer is placed on the other side of the circuit board. Heat is dissipated through the heat dissipation layer, heat dissipation through holes and heat dissipation pillars. Radio frequency and power components are fixed by solder blocks. Circuit isolation cavities separate different circuit modules.
It improves heat dissipation efficiency, reduces the operating temperature of power amplifier components, enhances connection reliability, improves the stability and lifespan of the circuit board, simplifies the structure, and saves space.
Smart Images
Figure CN223993761U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a printed circuit board and data link device for high-power data links. Background Technology
[0002] Printed circuit boards (PCBs) are the support structures for electronic components and the carriers for electrical connections, providing support for functions such as digital and analog signal transmission, power supply, and radio frequency microwave signal transmission and reception in electronic devices.
[0003] In current printed circuit board (PCB) design, heat dissipation design is one of the important factors affecting the performance and reliability of electronic devices. Heat dissipation design is closely related to the layout of components on the PCB. Currently, high-power components are randomly arranged on both sides of the PCB without fully considering their heat dissipation requirements. This results in heat accumulating on the board and not being effectively dissipated, causing the equipment to overheat. This problem not only affects the performance and stability of the equipment but may also shorten its lifespan. Utility Model Content
[0004] Based on the above analysis, the present invention aims to provide a printed circuit board and data link device for high-power data links, in order to solve the technical problem of poor heat dissipation caused by the disordered arrangement of high-power devices in the prior art.
[0005] The objective of this utility model is mainly achieved through the following technical solutions:
[0006] In a first aspect, a printed circuit board for a high-power data link is provided, comprising a circuit board body, a first placement area, a second placement area, and a heat dissipation layer. The first placement area is used to place non-power amplifier devices, the second placement area is disposed on a first surface of the circuit board body to place power amplifier devices, and the heat dissipation layer is disposed on a second surface of the circuit board body, the heat dissipation layer is directly opposite the second placement area, and the heat dissipation layer is connected to the second placement area.
[0007] Furthermore, the high-power data link printed circuit board also includes a first solder block, which is fixedly disposed on the circuit board body for fixing radio frequency components.
[0008] Furthermore, the high-power data link printed circuit board also includes a second solder block, which is fixedly disposed on the circuit board body for fixing power supply and communication components.
[0009] Furthermore, the high-power data link printed circuit board also includes heat dissipation vias, which are disposed on the circuit board body to conduct the heat of the power amplifier device to the heat dissipation layer.
[0010] Furthermore, the high-power data link printed circuit board also includes heat sinks, which are disposed within the heat dissipation through-holes, and the two ends of the heat sinks are respectively connected to the second placement area and the heat dissipation layer.
[0011] Furthermore, the second placement area is provided with multiple circuit isolation cavities to separate different circuit modules.
[0012] Furthermore, the circuit isolation cavity includes a power amplifier transmitting cavity, an RF receiving cavity, a power supply cavity, an RF cavity, and a baseband cavity. The power amplifier transmitting cavity is used to isolate the power amplifier transmitting circuit, the RF receiving cavity is used to isolate the RF receiving circuit, the power supply cavity is used to isolate the power supply circuit, the RF cavity is used to isolate the RF circuit, and the baseband cavity is used to isolate the baseband circuit.
[0013] Furthermore, the circuit isolation cavity also includes a clock circuit isolation cavity, which is used to isolate the clock circuit.
[0014] Furthermore, the area of the heat dissipation layer is larger than the area of the second placement area.
[0015] Furthermore, the first placement area is disposed on the first surface of the circuit board body and / or the second surface of the circuit board body.
[0016] In a second aspect, a data link device is provided, including a heat sink and a printed circuit board for a high-power data link as described in the first aspect, wherein the heat sink abuts against the heat dissipation layer to dissipate the heat of the power amplifier device into the environment.
[0017] The technical solution of this utility model can achieve at least one of the following effects:
[0018] (1) The high-power data link printed circuit board of the present invention includes a circuit board body, a first placement area, a second placement area and a heat dissipation layer. The power amplifier device is placed in the second placement area and a heat dissipation layer is placed opposite the second placement area. The heat dissipation layer dissipates the heat generated by the power amplifier device. The heat dissipation components and heat dissipation functional structures are opposite to each other and are respectively arranged on both sides of the circuit board body, which is conducive to improving heat dissipation efficiency, reducing the operating temperature of the power amplifier device, and improving the working stability and service life of the circuit board body.
[0019] (2) The high-power data link printed circuit board of the present invention also includes a first solder block. Through the first solder block, the radio frequency component can be soldered to the circuit board body, eliminating the need for a connector. Thus, when the external antenna is screwed into the radio frequency component, there is no situation where the connector breaks, improving the reliability of the connection and simplifying the structure of the printed circuit board.
[0020] (3) The high-power data link printed circuit board of the present invention also includes a second welding block. The power supply and communication components can be fixed on the circuit board body by welding through the second welding block, ensuring the stability and reliability of the power supply and communication components on the circuit board body, reducing displacement or loosening caused by vibration or external force. In addition, the second welding block makes the connection of the power supply and communication components more compact, saving space on the circuit board body.
[0021] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages will become apparent from the description or be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained from the description and accompanying drawings, which are particularly pointed out. Attached Figure Description
[0022] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Throughout the drawings, the same reference numerals denote the same parts.
[0023] Figure 1 This is a schematic diagram of the first side of the printed circuit board for the high-power data link in Embodiment 1 of this utility model;
[0024] Figure 2 This is a schematic diagram of the second side of the printed circuit board for the high-power data link in Embodiment 1 of this utility model;
[0025] Figure 3 This is a cross-sectional schematic diagram of the heat dissipation through hole in Embodiment 1 of this utility model;
[0026] Figure 4 This is a schematic diagram of the circuit isolation cavity in Embodiment 1 of this utility model;
[0027] Figure 5 This is a cross-sectional schematic diagram of the data link device in Embodiment 2 of this utility model.
[0028] Figure label:
[0029] 1-Circuit board body, 2-First placement area, 3-Second placement area, 4-Heat dissipation layer, 5-Heat dissipation through hole, 6-Heat dissipation pillar, 8-First solder block, 9-RF component, 10-Second solder block, 11-Power supply and communication component, 12-Circuit isolation cavity, 121-Power amplifier transmitting cavity, 122-RF receiving cavity, 123-Power supply cavity, 124-RF cavity, 125-Baseband cavity, 126-Clock circuit isolation cavity, 100-Heat sink. Detailed Implementation
[0030] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.
[0031] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments.
[0032] Example 1
[0033] like Figure 1 As shown, this utility model embodiment provides a printed circuit board for a high-power data link, including a circuit board body 1, a first placement area 2, a second placement area 3, and a heat dissipation layer 4. The first placement area 2 is used to place non-power amplifier devices, the second placement area 3 is disposed on the first surface of the circuit board body 1 to place power amplifier devices, and the heat dissipation layer 4 is disposed on the second surface of the circuit board body 1, facing the second placement area 3 and connected to the second placement area 3 to dissipate heat from the power amplifier devices. The first surface and the second surface are the two surfaces of the circuit board body 1, respectively.
[0034] The first placement area 2 is used to house non-power amplifier devices, grouping together electronic components with low heat dissipation requirements. For example, non-power amplifier devices can be one or more of resistors, capacitors, inductors, diodes, and ordinary transistors. The second placement area 3 is used to house power amplifier devices, which are devices with high heat dissipation requirements. Concentrating power amplifier devices in a specific area facilitates centralized management and heat dissipation. Power amplifier devices refer to electronic components on a printed circuit board used to amplify signals. For example, power amplifier devices can be one or more of bipolar transistors, field-effect transistors, and integrated circuit power amplifier chips. The heat dissipation layer 4 is opposite to the second placement area 3 and dissipates heat from the power amplifier devices by using thermally conductive materials or structural design to dissipate the heat generated during operation. The heat is conducted and dissipated. For example, the heat dissipation layer 4 can be a bright copper layer. The area of the heat dissipation layer 4 occupies 1 / 3 to 1 / 2 of the total area of the second side of the entire circuit board body 1. The heat dissipation layer 4 can be located at the top, bottom or middle of the second side of the circuit board body 1. The power amplifier device will generate a lot of heat during operation. In this embodiment, the power amplifier device is placed in the second placement area 3 and the heat dissipation layer 4 is placed opposite it. The heat dissipation layer 4 dissipates the heat generated by the power amplifier device. The heat dissipation components and heat dissipation functional structures are opposite each other and are respectively arranged on both sides of the circuit board body 1, which is conducive to improving heat dissipation efficiency, reducing the operating temperature of the power amplifier device, improving the working stability and service life of the circuit board body 1, and solving the technical problem of poor heat dissipation caused by the disordered arrangement of high-power devices in the prior art.
[0035] For example, in this embodiment of the present invention, a high-power data link can refer to one with an overall power consumption greater than 20W.
[0036] A preferred embodiment of this utility model is as follows: Figure 3 As shown, as a specific way in which the heat dissipation layer 4 connects to the second placement area 3, the printed circuit board also includes heat dissipation vias 5. The heat dissipation vias 5 are disposed on the circuit board body 1 to conduct the heat of the power amplifier device to the heat dissipation layer 4. The heat dissipation vias 5 conduct the heat generated by the power amplifier device from the power amplifier device to the heat dissipation layer 4, and realize rapid heat conduction by using the hole structure. The heat dissipation vias 5 can be arranged in a honeycomb array on the circuit board body 1. It should be noted that the depth of the heat dissipation vias 5 is not less than the thickness of the circuit board body 1. The diameter of the heat dissipation vias 5 can be determined according to the heat generation and heat dissipation requirements of the power amplifier device. For example, the diameter of the heat dissipation vias 5 is 0.3-1.0mm. The heat dissipation vias 5 reduce the heat conduction path in the circuit board, reduce the thermal resistance, and enable the heat to be transferred to the heat dissipation layer 4 more smoothly. By cooperating in setting the heat dissipation vias 5 and the heat dissipation layer 4, the reliability of heat dissipation of the printed circuit board is enhanced.
[0037] Based on this, as another specific way to connect the heat dissipation layer 4 to the second placement area 3, the printed circuit board also includes heat dissipation pillars 6. The heat dissipation pillars 6 pass through the heat dissipation vias 5, and the two ends of the heat dissipation pillars 6 are respectively connected to the second placement area 3 and the heat dissipation layer 4. For example, the heat dissipation pillars 6 can be made of the same material as the bright copper layer. The heat dissipation pillars 6 and the heat dissipation layer 4 of the same material have the same thermal conductivity, which can achieve efficient heat conduction and heat dissipation. Moreover, the thermal expansion coefficients of the same material are similar, which can reduce the mechanical stress caused by the difference in thermal expansion and improve the stability and reliability of the heat dissipation structure. The heat dissipation pillars 6 pass through the heat dissipation vias 5, and their filling rate in the heat dissipation vias 5 is 100%, forming a continuous and complete filling structure inside the heat dissipation vias 5. Through the heat dissipation pillars 6, the heat generated by the power amplifier device is conducted from the power amplifier device to the heat dissipation layer 4. The high thermal conductivity of copper is used to achieve rapid heat conduction. The heat dissipation pillars 6 further reduce the heat conduction path in the circuit board, reduce the thermal resistance, and allow the heat to be transferred to the heat dissipation layer 4 more smoothly.
[0038] In a preferred embodiment of this utility model, as another specific way in which the heat dissipation layer 4 connects to the second placement area 3, an opening is made inside the second placement area 3. For example, the area of the opening occupies 3 / 4-4 / 5 of the area of the second placement area 3. An integral heat dissipation block is embedded in the opening. For example, the heat dissipation block is made of copper. The coordinated arrangement of the heat dissipation layer 4, the heat dissipation block and the opening helps to distribute heat evenly, avoid local overheating, and improve the thermal stability of the entire circuit board body 1.
[0039] A preferred embodiment of this utility model is as follows: Figure 1 and Figure 2As shown, the printed circuit board for the high-power data link also includes a first solder block 8, which is fixedly disposed on the circuit board body 1 for fixing the radio frequency component 9. Through the first solder block 8, the radio frequency component 9 can be fixedly disposed on the circuit board body 1 by soldering. For example, the radio frequency component 9 may include a signal transmitting circuit and a signal receiving circuit. In the prior art, the radio frequency component 9 is soldered to the circuit board body 1 through a connector to fix the radio frequency component 9. When the external antenna is screwed into the radio frequency component 9, the connector will break. In this embodiment, the radio frequency component 9 is directly soldered to the circuit board body 1 through the first solder block 8, omitting the radio frequency connector on the board, and the radio frequency component is mounted on the heat sink in the form of a flange, detached from the PCB board. Therefore, when the external antenna is screwed into the radio frequency component, the radio frequency connector component will not break.
[0040] A preferred embodiment of this utility model is as follows: Figure 1 and Figure 2 As shown, the printed circuit board for the high-power data link also includes a second solder block 10, which is fixedly disposed on the circuit board body 1 for fixing the power supply and communication components 11. In the prior art, the power supply and communication components 11 are fixed to the circuit board body 1 by means of wire splicing. Generally, wire splicing connection relies on manual operation, which is prone to problems such as poor contact and cold solder joints. Especially in environments with large vibration or temperature changes, the reliability of the connection will be further reduced. Moreover, the wire splicing connection method has multiple connection points, which takes up space. With the second solder block 10, the power supply and communication components 11 can be fixed to the circuit board body 1 by soldering, ensuring the stability and reliability of the power supply and communication components 11 on the circuit board body 1, and reducing displacement or loosening caused by vibration or external force. In addition, the second solder block 10 makes the connection of the power supply and communication components 11 more compact, saving space on the circuit board body 1. Furthermore, the second solder block 10 may include different solder block units, which are respectively connected to the power supply component and the communication component.
[0041] A preferred embodiment of this utility model is as follows: Figure 4 As shown, the second placement area 3 is provided with multiple circuit isolation cavities 12 to separate different circuit modules. The circuit isolation cavities 12 can physically isolate different circuit modules, reducing electromagnetic interference between different circuit modules. At the same time, the independent circuit isolation cavities 12 make the circuit module layout more compact and orderly, improving space utilization. For example, the circuit isolation cavities 12 can be made of aluminum alloy. In this embodiment, the device spacing in the circuit isolation cavity 12 is adjusted. The device distance is changed from 1mm to 0.5mm, the distance between the device and the side wall of the circuit isolation cavity 12 is changed from 1mm to 0.5mm, and the metal partition of the circuit isolation cavity 12 is changed from 1.5mm to 1mm. As a result, space can be freed up to place the devices.
[0042] Specifically, the circuit isolation cavity 12 includes a power amplifier transmitting cavity 121, an RF receiving cavity 122, a power supply cavity 123, an RF cavity 124, and a baseband cavity 125. The power amplifier transmitting cavity 121 is used to isolate the power amplifier transmitting circuit, the RF receiving cavity 122 is used to isolate the RF receiving circuit, the power supply cavity 123 is used to isolate the power supply circuit, the RF cavity 124 is used to isolate the RF circuit, and the baseband cavity 125 is used to isolate the baseband circuit.
[0043] A preferred embodiment of this utility model is as follows: Figure 4 As shown, the circuit isolation cavity 12 also includes a clock circuit isolation cavity 126 to isolate the clock circuit. Generally, the clock circuit usually generates high-frequency signals, which can cause electromagnetic interference to other circuit modules. By setting the clock circuit isolation cavity 126, the clock circuit can be physically isolated from other circuit modules, reducing the radiation and conduction interference of high-frequency signals and protecting other interference-sensitive circuit modules to work normally. In addition, the clock circuit isolation cavity 126 can effectively establish isolation between the clock circuit area and the input / output interface lines, avoiding crosstalk between the clock signal and other signals and ensuring the accuracy of signal transmission.
[0044] A preferred embodiment of this utility model is as follows: Figure 2 As shown, the area of the heat dissipation layer 4 is larger than that of the second placement area 3. The larger area of the heat dissipation layer 4 can more efficiently transfer the heat of the power amplifier device to the surrounding environment, accelerate the heat dissipation speed, and reduce the operating temperature of the power amplifier device.
[0045] A preferred embodiment of this utility model is as follows: Figure 1 and Figure 2 As shown, the first placement area 2 can be set on the first side and / or the second side of the circuit board body 1. On both sides of the circuit board body 1, except for the area occupied by the second placement area 3 and the heat dissipation layer 4 opposite to the second placement area 3, the area can be used as the first placement area 2 to set non-power amplifier devices. Thus, the non-power amplifier devices and power amplifier devices are separated, which facilitates the optimization of the heat dissipation area and also helps to improve the heat dissipation efficiency of the circuit board body 1.
[0046] Example 2
[0047] This utility model embodiment provides a data link device, such as... Figure 5As shown, the device includes a heat sink 100 and a high-power data link printed circuit board as described in Embodiment 1. The heat sink 100 abuts against the heat dissipation layer 4 to dissipate the heat from the power amplifier device into the environment. The heat sink 100 is in close contact with the heat dissipation layer 4, which can transfer the heat generated by the power amplifier device from the heat dissipation layer 4 to the heat sink 100, and then dissipate the heat into the surrounding environment through the heat sink 100. For example, the heat sink 100 can be a finned heat sink, and the heat sink 100 can be made of copper or aluminum alloy. In this embodiment, the data link device, with the help of the high-power data link printed circuit board as described in Embodiment 1, is beneficial to improve heat dissipation efficiency, reduce the operating temperature of the power amplifier device, and improve the working stability and service life of the data link device.
[0048] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.
Claims
1. A printed circuit board for high power data link, characterized by, The circuit board includes a circuit board body, a first placement area, a second placement area, and a heat dissipation layer. The first placement area is used to place non-power amplifier devices. The second placement area is disposed on a first surface of the circuit board body to place power amplifier devices. The heat dissipation layer is disposed on a second surface of the circuit board body, facing the second placement area and communicating with the second placement area.
2. The high power data link printed circuit board of claim 1, wherein, The high-power data link printed circuit board also includes a first solder block, which is fixedly disposed on the circuit board body for fixing radio frequency components.
3. The high power data link printed circuit board of claim 1, wherein, The high-power data link printed circuit board also includes a second solder block, which is fixedly mounted on the circuit board body for fixing power and communication components.
4. The high power data link printed circuit board of claim 1, wherein, The high-power data link printed circuit board also includes heat dissipation vias, which are disposed on the circuit board body to conduct the heat of the power amplifier device to the heat dissipation layer.
5. The printed circuit board for high power data link according to claim 4, wherein The high-power data link printed circuit board also includes a heat sink, which passes through the heat dissipation through hole and has its two ends connected to the second placement area and the heat dissipation layer, respectively.
6. The high power data link printed circuit board of claim 1, wherein, The second placement area is provided with multiple circuit isolation cavities to separate different circuit modules.
7. The printed circuit board for high power data link according to claim 6, wherein The circuit isolation cavity includes a power amplifier transmitting cavity, an RF receiving cavity, a power supply cavity, an RF cavity, and a baseband cavity. The power amplifier transmitting cavity is used to isolate the power amplifier transmitting circuit, the RF receiving cavity is used to isolate the RF receiving circuit, the power supply cavity is used to isolate the power supply circuit, the RF cavity is used to isolate the RF circuit, and the baseband cavity is used to isolate the baseband circuit.
8. The high power data link printed circuit board of claim 6, wherein, The circuit isolation cavity also includes a clock circuit isolation cavity, which is used to isolate the clock circuit.
9. The high power data link printed circuit board of claim 1, wherein, The first placement area is disposed on the first surface of the circuit board body and / or the second surface of the circuit board body.
10. A data link device, characterized by Includes a heat sink and a printed circuit board for a high-power data link as described in any one of claims 1-9, wherein the heat sink abuts against the heat dissipation layer to dissipate heat from the power amplifier device into the environment.