Thermoelectric separation LED module

Abstract

The utility model discloses a thermoelectric separation LED module, which comprises a radiator, an insulating layer, a PCB (printed circuit board) and an LED device, the top surface of the radiator is provided with a groove for embedding the lower part of the PCB, and the bottom surface of the radiator is provided with a plurality of radiating fins; a connecting part located above the radiator is arranged on the side face of one end of the PCB, the end of the groove is in a concave shape and is provided with a first groove section and a second groove section which are parallel, and the connecting part is located between the first groove section and the second groove section; the LED device comprises a substrate installed on the top face of the radiator, a light-emitting layer and a light conversion layer are arranged on the substrate from bottom to top, and a light blocking layer surrounds the side face of the light-emitting layer and the side face of the light conversion layer. The upper surface of the substrate is also provided with an external bonding pad, and one end, far away from the light-emitting layer, of the external bonding pad abuts against the lower surface of the step structure. The connecting part is provided with two conductive through holes, and the upper surface of the external bonding pad can seal the bottoms of the two conductive through holes; the insulating layer surrounds the side surface of the substrate. The manufacturing method of the whole structure is simple, the heat dissipation effect is good, and thermoelectric separation of the LED device and the PCB can be achieved.

Description

Technical Field

[0001] This utility model belongs to the field of LED technology, specifically relating to a thermoelectrically separated LED module. Background Technology

[0002] Currently, there are two main electrical connection methods for high-power LED modules. One is wire bonding, where wires are led from the LED wire bonding pads to the PCB pads. This method requires high-precision bonding equipment and highly reliable wire arcs, which greatly limits the mass production and use of LED modules. The other method is soldering, where solder paste connects the LED's bottom pads to the PCB pads to achieve conductivity. However, since both heat and electricity are conducted through the solder paste layer, this type of module, where heat and electricity are not separated, is prone to cracking or even breakage of the solder paste layer during long-term use.

[0003] High-power ceramic LEDs generate significant heat, and their heat dissipation limits their lumen maintenance efficiency under hot conditions. High-power ceramic LEDs typically employ separate heat dissipation and are electrically interconnected to the PCB only via external connections. For this type of thermoelectric separation module, the electrical connection between the PCB and the LED usually uses wire bonding. However, wire bonding for high-power LEDs requires high-quality bonding equipment and reliable wire bonding, making it difficult to manufacture. Furthermore, existing high-power LED modules often use the PCB as a heat dissipation and circuit conduction carrier, with the LED chips, acting as the heat source, soldered onto the PCB. However, the PCB is generally made of materials with poor heat dissipation properties, such as FR-4. The heat generated by the LED is difficult to dissipate through the PCB via heat transfer, resulting in poor heat dissipation. This leads to heat accumulation at the LED, causing light decay or even LED failure.

[0004] Therefore, a new technology is needed to solve the problems of LED modules being inconvenient to manufacture and having poor heat dissipation in existing technologies. Utility Model Content

[0005] To address the aforementioned problems in the prior art, this utility model provides a thermoelectrically separated LED module that enables separate connection between the PCB board and the LED heat source, avoiding wire bonding between the PCB board and the LED pads, thus avoiding the risk of bonding failure such as wire collapse or breakage, shortening the heat conduction path of the LED heat source, greatly reducing heat accumulation in the LED, and having a simple structure that is easy to manufacture.

[0006] The present invention adopts the following technical solution:

[0007] A thermoelectrically separated LED module includes a heat sink, a PCB board and LED devices. The top surface of the heat sink is provided with a groove for the lower part of the PCB board to be embedded, and the bottom surface is provided with a plurality of heat dissipation fins at intervals.

[0008] One end of the PCB board is provided with a horizontal connecting part, the horizontal cross section of the groove is U-shaped at this end, and the groove is provided with a first groove segment and a second groove segment that are parallel to each other at this end. The connecting part is located between the first groove segment and the second groove segment and is located above the heat sink.

[0009] The LED device is mounted on the top surface of the heat sink and one end is located below the connection portion. The LED device includes a substrate and a light-emitting layer, a light-converting layer, and a light-blocking layer disposed on the top of the substrate. The light-emitting layer is disposed at the end of the substrate away from the PCB board. The light-converting layer covers the top of the light-emitting layer. The light-blocking layer surrounds the sides of the light-emitting layer and the light-converting layer in a ring shape.

[0010] The upper surface of the substrate is also provided with an external pad, and the end of the external pad away from the light-emitting layer abuts against the lower surface of the connecting part; the connecting part is vertically provided with two conductive through holes, and the upper surface of the external pad can close the bottom openings of the two conductive through holes;

[0011] It also includes an insulating layer that surrounds the side of the substrate.

[0012] As a further improvement to the technical solution of this utility model, there is a gap between the side of the light blocking layer near the protrusion and the side surface of the protrusion.

[0013] As a further improvement to the technical solution of this utility model, the bottom surface of the substrate is provided with a bottom pad.

[0014] As a further improvement to the technical solution of this utility model, it also includes an adhesive layer, which is located between the bottom pad and the heat sink, and is used to fix the substrate and the heat sink.

[0015] As a further improvement to the technical solution of this utility model, the heat sink has a first end and a second end that are arranged opposite to each other, the LED is located between the groove and the edge of the second end, and the side of the insulating layer away from the PCB board has a gap with the edge of the second end.

[0016] As a further improvement to the technical solution of this utility model, the PCB board is provided with a first protrusion and a second protrusion corresponding to the first slot segment and the second slot segment in sequence. The upper surfaces of the first protrusion, the connecting part, and the second protrusion are flush with the top surface of the PCB board, and the lower surfaces of the first protrusion and the second protrusion are flush with the bottom surface of the PCB board. The lower part of the first protrusion is embedded in the first slot segment, and the lower part of the second protrusion is embedded in the second slot segment. The first protrusion, the connecting part, and the second protrusion are connected in sequence to form a U-shaped structure with the opening facing downward.

[0017] As a further improvement to the technical solution of this utility model, the bottom of the groove is provided with a first protrusion and a second protrusion at intervals, and the PCB board is provided with a first limiting hole and a second limiting hole corresponding to the first protrusion and the second protrusion in sequence.

[0018] As a further improvement to the technical solution of this utility model, the heat sink is further provided with a first mounting hole, which is located between the first protrusion and the second protrusion. The PCB board is provided with a second mounting hole that has the same diameter as the first mounting hole and is coaxial with it. The first protrusion is located on the side of the first mounting hole closer to the first end, and the second protrusion is located on the side of the first mounting hole closer to the second end.

[0019] Several heat dissipation fins are respectively distributed on both sides of the first mounting hole.

[0020] As a further improvement to the technical solution of this utility model, the heat sink is also provided with a first positioning hole and a second positioning hole. The first positioning hole and the second positioning hole are both close to the second end and are respectively located on both sides of the LED device. The center line of the light-emitting layer coincides with the center line of the first positioning hole and the second positioning hole.

[0021] As a further improvement to the technical solution of this utility model, the PCB board includes an FR-4 flat plate, a circuit layer, and a solder mask layer arranged sequentially from bottom to top, with the PCB board circuit located on the front side;

[0022] The solder mask layer covers the circuit layer, and the circuit layer and the FR-4 flat plate are laminated together.

[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0024] This solution features a thermoelectrically separated LED module. The PCB board is electrically connected to the LED through conductive vias on the connecting part, enabling a separate connection between the PCB board and the LED device's heat source. This avoids the wire bonding between the PCB board and the LED pads, thus preventing the risk of bonding failure such as wire collapse or breakage. The LED device is directly connected to the heat sink, shortening the heat conduction path of the LED heat source and greatly reducing heat accumulation in the LED. Furthermore, the structure is simple, the manufacturing method is easy, and it is convenient to manufacture. Attached Figure Description

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0026] Figure 1 This is a top view of the overall structure of this utility model;

[0027] Figure 2 yes Figure 1 Schematic diagram of section AA;

[0028] Figure 3 yes Figure 2 Enlarged view of a portion of the structure in section B;

[0029] Figure 4 yes Figure 1 Schematic diagram of the cross-section of section BB;

[0030] Figure 5 This is a top view of the PCB board structure;

[0031] Figure 6 This is a top view of the radiator structure;

[0032] Figure 7 yes Figure 6 Schematic diagram of section AA;

[0033] Figure 8 This is a top view of LED devices mounted on a heat sink;

[0034] Figure 9 yes Figure 8 Schematic diagram of section AA;

[0035] Figure 10 This is a top view after an insulating barrier has been erected around the LED device;

[0036] Figure 11 yes Figure 10 Schematic diagram of section AA.

[0037] Figure label:

[0038] 1-Radiator; 11-Radiator fins; 12-Groove; 121-First groove segment; 122-Second groove segment; 13-First protrusion; 14-Second protrusion; 15-First mounting hole; 16-First end; 17-Second end; 18-First positioning hole; 19-Second positioning hole; 20-Placement area;

[0039] 2-PCB board; 21-Connection part; 211-Conductive through hole; 2111-Copper layer; 22-First limiting hole; 23-Second limiting hole; 24-Second mounting hole; 25-FR-4 flat plate; 26-Circuit layer; 27-Solder mask layer; 28-First protrusion; 29-Second protrusion;

[0040] 3-LED device; 31-Light conversion layer; 32-Light emitting layer; 33-Light blocking layer; 34-Substrate; 35-External pad; 36-Bottom pad;

[0041] 4-Adhesion layer;

[0042] 5-Insulation layer. Detailed Implementation

[0043] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0044] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," and "right" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0045] Reference Figures 1 to 11 A thermoelectrically separated LED module includes a heat sink 1, a PCB board 2, and LED devices 3. The top surface of the heat sink 1 has a groove 12 for the lower part of the PCB board 2 to be embedded, and the bottom surface has a plurality of heat dissipation fins 11 protruding at intervals. One end of the PCB board 2 has a connecting part 21 protruding from its side. The horizontal cross-section of the groove 12 at this end is U-shaped. The groove 12 at this end has a first groove segment 121 and a second groove segment 122 protruding from each other. The connecting part 21 is located between the first groove segment 121 and the second groove segment 122 and is located above the heat sink 1. The top surface of the connecting part 21 is flush with the top surface of the PCB board 2, and the bottom surface is higher than the bottom surface of the PCB board 2.

[0046] The LED device 3 is mounted on the top surface of the heat sink 1, with one end located below the connecting portion 21. The LED device 3 includes a substrate 34 and a light-emitting layer 32, a light conversion layer 31, and a light-blocking layer 33 disposed on the top of the substrate 34. The light-emitting layer 32 is disposed at the end of the substrate 34 away from the PCB board 2. The light conversion layer 31 covers the top of the light-emitting layer 32. The light-blocking layer 33 is arranged in a ring around the sides of the light-emitting layer 32 and the light conversion layer 31. The sides of the light-emitting layer 32 and the lower part of the sides of the light conversion layer 31 are both wrapped by the light-blocking layer 33. Only the top or top surface of the light conversion layer 31 emits light. The upper surface of the light conversion layer 31 is higher than the top surface of the PCB board 2, and the upper surface of the light conversion layer 31 is located at the highest point of the overall structure to avoid the light being blocked by other parts. The light-emitting layer 32 is disposed on the substrate 34, and the substrate 34 of the LED is directly fixed on the heat sink 1, forming a heat dissipation path that directly dissipates heat to the heat sink 1, which shortens the heat conduction path of the LED heat source and greatly reduces the heat accumulation of the LED.

[0047] The upper surface of the substrate 34 is further provided with an external solder pad 35. One end of the external solder pad 35, away from the light-emitting layer 32, is located below the connecting portion 21 and abuts against the lower surface of the connecting portion 21. Two conductive vias 211 are vertically provided on the connecting portion 21, spaced apart and symmetrically arranged. The upper surface of the external solder pad 35 can close the bottom openings of the two conductive vias 211. Each conductive via 211 is filled with solder paste. The thermoelectrically separated LED module of this solution also includes an insulating layer 5, as shown in the reference... Figure 10 The insulating layer 5 surrounds the side of the substrate 34, and there is a gap between the substrate 34 and the side of the PCB board 2. Part of the insulating layer 5 is located between the substrate 34 and the PCB board 2 to prevent electrical leakage between the substrate 34 and the top surface of the heat sink 1. The connecting part 21 protrudes above the heat sink 1. After the connecting part 21 is pressed onto the external solder pad 35 of the LED, the PCB board 2 and the LED are soldered and fastened with solder paste and electrically connected through the conductive through-hole 211, thereby avoiding wire bonding. The LED is directly fixed to the upper surface of the heat sink 1, realizing thermoelectric separation of the LED heat source.

[0048] This thermoelectrically separated LED module design incorporates a flip-chip structure for the PCB board 2, which has a connecting portion 21. Specifically, the connecting portion 21 is flipped over the external solder pads 35 of the LED device 3. Electrical connection between the PCB board 2 and the LED device 3 is achieved through conductive vias 211 on the connecting portion 21, enabling a separate connection to the LED heat source. This avoids wire bonding between the PCB board and the LED solder pads, preventing bonding failures such as wire collapse or breakage. It simplifies the electrical connection between the PCB board 2 and the LED, using conventional surface mount technology (SMT) for soldering, which is beneficial for mass production and facilitates LED module fabrication. The LED substrate 34 is directly fixed to the heat sink 1, shortening the heat conduction path of the LED heat source and significantly reducing heat accumulation in the LED.

[0049] Specifically, there is a gap between the side of the light blocking layer 33 near the connecting portion 21 and the side of the connecting portion 21, and the side of the connecting portion 21 does not contact the light blocking layer 33.

[0050] Specifically, the bottom surface of the substrate 34 is provided with a bottom pad 36, as shown in the figure. Figure 3 The thermoelectrically separated LED module of this solution also includes an adhesive layer 4, which is located between the bottom pad 36 and the heat sink 1. The adhesive layer 4 is used to fix the substrate 34 to the heat sink 1. The adhesive layer 4 is made of thermally conductive adhesive, and the LED and the heat sink 1 are connected by thermally conductive adhesive. The thermally conductive adhesive has a high thermal conductivity, including but not limited to 6.5W / mk.

[0051] Specifically, the heat sink 1 has a first end 16 and a second end 17 disposed opposite to each other, the LED is located between the groove 12 and the edge of the second end 17, and the insulating layer 5 has a gap between the side away from the PCB board 2 and the edge of the second end 17.

[0052] Specifically, the PCB board 2 is provided with a first protrusion 28 and a second protrusion 29 corresponding sequentially to the first slot segment 121 and the second slot segment 122, respectively. Figure 4 The upper surfaces of the first protrusion 28, the connecting portion 21, and the second protrusion 29 are flush with the top surface of the PCB board 2, and the lower surfaces of the first protrusion 28 and the second protrusion 29 are flush with the bottom surface of the PCB board 2. The lower part of the first protrusion 28 is embedded in the first groove segment 121, and the lower part of the second protrusion 29 is embedded in the second groove segment 122. The vertical cross-section of the sequentially connected structure of the first protrusion, the connecting portion, and the second protrusion has an opening-downward-facing U-shaped structure.

[0053] Specifically, the bottom of the groove 12 is provided with a first protrusion 13 and a second protrusion 14 at intervals. The PCB board 2 is provided with a first limiting hole 22 and a second limiting hole 23 corresponding to the first protrusion 13 and the second protrusion 14 in sequence. The first limiting hole 22 and the second limiting hole 23 form an interference fit with the first protrusion 13 and the second protrusion 14 of the heat sink 1, respectively. The PCB board 2 mates with the first protrusion 13 and the second protrusion 14 on the heat sink 1 through the first limiting hole 22 and the second limiting hole 23, thereby achieving the positioning of the PCB board 2 and the heat sink 1 and accurately fixing the PCB board 2 into the groove 12 of the heat sink 1.

[0054] Specifically, the heat sink 1 is further provided with a first mounting hole 15, which is located between the first protrusion 13 and the second protrusion 14. The PCB board 2 is provided with a second mounting hole 24, which has the same diameter as the first mounting hole 15 and is coaxial with it. The first protrusion 13 is located on the side of the first mounting hole 15 near the first end 16, and the second protrusion 14 is located on the side of the first mounting hole 15 near the second end 17. A plurality of heat dissipation fins 11 are respectively distributed on both sides of the first mounting hole 15. The arrangement of the first mounting hole 15 and the second mounting hole 24 facilitates installation and fixation with other structures.

[0055] Specifically, the heat sink 1 is rectangular in shape, with a rectangular horizontal cross-section. The first mounting hole 15 is located at the center of the heat sink 1, and heat dissipation fins 11 are distributed on both sides of the first mounting hole 15. There are no heat dissipation fins 11 below the first mounting hole 15. The first protrusion 13 and the second protrusion 14 are distributed on both sides of the first mounting hole 15. The protrusion 13 is located on the left side near the first end 16, and the protrusion 14 is located on the right side near the second end 17. The height of the first protrusion 13 and the second protrusion 14 is not higher than the top surface of the light-emitting layer 32 of the LED device 3.

[0056] Specifically, the upper surface of the heat sink 1 is provided with an LED placement area 20 for placing LEDs. The left side of the placement area 20 is located between the first slot segment 121 and the second slot segment 122, and the right side is close to the second end 17. The placement area 20 is rectangular, and the area of ​​the placement area 20 is larger than the area of ​​the LED. The PCB board 2 and the groove 12 on the heat sink 1 are clearance fit. The depth of the groove 12 on the heat sink 1 for mounting the PCB board 2 is greater than or equal to half the thickness of the PCB board 2. The shape of the groove 12 is consistent with the PCB outline, and the horizontal dimension is wider than the PCB outline dimension, so that the PCB board 2 can be smoothly mounted in the groove 12.

[0057] Specifically, the heat sink 1 is further provided with a first positioning hole 18 and a second positioning hole 19. Both the first positioning hole 18 and the second positioning hole 19 are close to the second end 17 and are located on both sides of the LED device 3. The center line of the light-emitting layer 32 coincides with the center lines of the first positioning hole 18 and the second positioning hole 19, and is parallel to the edge of the heat sink 1 at the second end 17. Both the first positioning hole 18 and the second positioning hole 19 can be circular holes, or the first positioning hole 18 can be a circular hole and the second positioning hole 19 can be an elliptical hole. The center lines of the first positioning hole 18 and the second positioning hole 19 coincide and are symmetrically distributed on both sides of the LED placement area 20. The distance between the first positioning hole 18, the second positioning hole 19, and the edge of the heat sink 1 at the second end 17 is equal. When mounting the LED device 3, aligning the center line of the light-emitting layer 32 with the center lines of the first positioning hole 18 and the second positioning hole 19 achieves the positioning of the LED within the heat sink 1 placement area 20.

[0058] Specifically, the PCB board 2 includes, from bottom to top, an FR-4 flat plate 25, a circuit layer 26, and a solder mask layer 27, with the circuitry on the front side of the PCB board 2. The solder mask layer 27 covers the circuit layer 26, and the circuit layer 26 and the FR-4 flat plate 25 are laminated together. The circuit layer 26 has a thickness of 1 oz, and the solder mask layer 27 is made of white oil.

[0059] Specifically, the light-emitting layer 32 can be a phosphor sheet or a phosphor film, emitting light only from the top surface. The light-blocking layer 33 is composed of, but is not limited to, highly reflective materials with fluidity, such as a mixture of TiO2 powder and silicone. The plating composition of the external pad 35 and the bottom pad is consistent and can be well soldered with solder paste; its composition includes, but is not limited to, nickel-palladium-gold or nickel-gold alloys.

[0060] Specifically, the solder paste for PCB 2 and LED is consistent with that for the circuitry on the front side of the PCB. Both use medium-temperature solder paste and are mounted by spot soldering. Then, they are soldered by a reflow soldering process. The solder paste composition includes, but is not limited to, Sn3.0Ag0.5Cu or Sn0.7Cu.

[0061] Reference Figures 1 to 11 The method for manufacturing the thermoelectrically separated LED module in this solution includes the following steps:

[0062] S1. First, the LED device 3 is die-bonded using SMT die bonding, and then the LED device 3 is fixed to the top surface of the heat sink 1 using thermally conductive adhesive to form an LED heat dissipation path. The bottom pads are fixed to the LED placement area 20 on the heat sink 1 using adhesive, which can be a thermally conductive adhesive with good thermal conductivity. The heat sink 1 is made of aluminum alloy. The groove 12 and the first protrusion 13 and second protrusion 14 can be formed by stamping or casting. Each heat dissipation fin 11 is riveted or welded to the bottom of the heat sink 1. The first mounting hole 15, the first positioning hole 18, and the second positioning hole 19 can be precision drilled.

[0063] S2. An insulating layer 5 is formed by using insulating adhesive to create a dam around the LED device 3, thereby insulating the LED from the PCB board 2 and preventing solder paste from flowing into the heat sink 1 and causing leakage. After creating the dam with insulating adhesive, the insulating layer 5 is formed around the external solder pad 35, with a portion of the insulating layer 5 located within the gap between the substrate 34 and the PCB board 2.

[0064] S3. The PCB board 2 is picked up by a suction nozzle or mechanically gripped and placed in the groove 12 of the heat sink 1. Then, the bottom surface of the PCB board 2 is pressed down or riveted to firmly attach the PCB board 2 to the bottom of the groove 12, and the PCB board 2 is fastened to the first protrusion 13 and the second protrusion 14 of the heat sink 1. At the same time, the lower surface of the connecting part 21 is pressed against the upper surface of the external solder pad 35 of the LED device 3. The connecting part 21 is in the shape of a right-angle step. The side of the connecting part 21 near the second end is perpendicular to the lower surface of the connecting part 21. The connecting part 21 can be formed by a groove process. The vertical depth of the connecting part 21 is equal to the sum of the thickness of the LED substrate 34 and the depth of the groove 12. That is, the vertical distance between the lower surface of the connecting part 21 and the lower surface of the PCB is equal to the vertical distance between the upper surface of the LED substrate 34 and the bottom of the groove 12. The length of the horizontal platform surface of the connecting part 21 is greater than the length of the external LED pad 35. That is, in the direction perpendicular to the first end 16 and the second end 17, the length of the lower surface of the connecting part 21 is greater than the length of the external pad 35. At the same time, the right boundary of the connecting part 21 does not contact the LED light blocking layer 33, and the distance between the right side of the connecting part 21 and the left side of the LED light blocking layer 33 is at least 0.5mm.

[0065] The bottom surface of each conductive via 211 is directly attached to the external LED pad 35, and the diameter of each conductive via 211 is smaller than the length of the external LED pad 35. Two conductive vias 211 are arranged in a straight line, and this straight line structure is parallel to the edge of the second end 17 of the heat sink 1. The leftmost side of the hole wall of each conductive via 211 can be connected to the left boundary of the external pad 35, or the leftmost side of the hole wall of each conductive via 211 can be inside the left boundary of the external pad 35. The distance between the rightmost side of the hole wall of each conductive via 211 and the right side of the PCB board 2 is greater than 2.5mm. A copper layer 2111 is electroplated inside the conductive via 211, and the thickness of this copper layer 2111 is not less than 50um.

[0066] The external pad 35 is pressed against the lower surface of the connection part 21 on the PCB. Each conductive through hole 211 is aligned with the external pad 35. The two are electrically connected by applying solder to the conductive through holes 211 and then using a reflow soldering process. In order to prevent solder paste from flowing onto the surface of the heat sink 1, a thixotropic insulating adhesive is used to create a barrier around the LED external pad 35 before the PCB board 2 is installed on the heat sink 1.

[0067] S4. Solder paste is applied to each of the conductive vias 211 on the PCB by dispensing, and then the LED device 3 is connected to the PCB board 2 by reflow soldering or vacuum reflow soldering, so that the LED device 3 is electrically connected to the PCB. The conductive vias 211 can be formed by drilling and copper plating.

[0068] Other aspects of the thermoelectrically separated LED module described in this utility model can be found in the prior art and will not be repeated here.

[0069] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A thermoelectrically separated LED module, characterized by: The heat sink is provided with a groove on the top surface for embedding the lower part of the PCB board, and a plurality of heat dissipation fins are provided on the bottom surface at intervals. One end of the PCB board is provided with a connecting part, the horizontal section of the groove is in the shape of a Chinese character "Kou" at this end, the groove is provided with a first groove segment and a second groove segment which are parallel to each other at this end, and the connecting part is located between the first groove segment and the second groove segment and above the heat sink. The LED device is installed on the top surface of the heat sink and one end of the LED device is located below the connecting part, the LED device comprises a substrate and a light-emitting layer, a light conversion layer and a light blocking layer arranged on the top of the substrate, the light-emitting layer is arranged at one end of the substrate away from the PCB board, the light conversion layer is arranged above the light-emitting layer, and the light blocking layer is annularly arranged around the side surface of the light-emitting layer and the light conversion layer. An external pad is further arranged on the upper surface of the substrate, one end of the external pad away from the light-emitting layer abuts against the lower surface of the connecting part, two conductive through holes are vertically arranged on the connecting part, and the upper surface of the external pad can close the bottom openings of the two conductive through holes. An insulating layer is further arranged around the side surface of the substrate.

2. The thermoelectrically separated LED module of claim 1, wherein: There is a gap between the side of the light blocking layer close to the connecting part and the side surface of the connecting part.

3. The thermoelectrically separated LED module of claim 2, wherein: The bottom surface of the substrate is provided with a bottom pad.

4. The thermoelectrically separated LED module of claim 3, wherein: An adhesive layer is further arranged between the bottom pad and the heat sink, and the adhesive layer is used for fixing the substrate and the heat sink.

5. The thermoelectrically separated LED module of claim 4, wherein: The heat sink has a first end and a second end arranged oppositely, the LED is located between the groove and the edge of the second end, and the side of the insulating layer away from the PCB board has a spacing from the edge of the second end.

6. The thermoelectrically separated LED module of claim 4, wherein: The PCB board is provided with a first protrusion and a second protrusion corresponding to the first groove segment and the second groove segment in sequence, the upper surfaces of the first protrusion, the connecting part and the second protrusion are flush with the top surface of the PCB board, the lower surfaces of the first protrusion and the second protrusion are flush with the bottom surface of the PCB board, the lower part of the first protrusion is embedded in the first groove segment, the lower part of the second protrusion is embedded in the second groove segment, and the first protrusion, the connecting part and the second protrusion are connected in sequence to form a "Kou" type structure with an opening downward.

7. The thermoelectrically separated LED module of claim 5, wherein: The groove bottom is provided with a first protruding column and a second protruding column at intervals, and the PCB board is provided with a first limiting hole and a second limiting hole corresponding to the first protruding column and the second protruding column in sequence.

8. The thermoelectrically separated LED module of claim 7, wherein: The heat sink is further provided with a first mounting hole between the first protruding column and the second protruding column, the PCB board is provided with a second mounting hole with the same diameter and coaxial with the first mounting hole, the first protruding column is located on one side of the first mounting hole close to the first end, and the second protruding column is located on one side of the first mounting hole close to the second end. A plurality of heat dissipation fins are distributed on both sides of the first mounting hole.

9. The thermoelectrically separated LED module of claim 7, wherein: The heat sink is further provided with a first positioning hole and a second positioning hole, the first positioning hole and the second positioning hole are close to the second end and are respectively located on two sides of the LED device, and the center line of the light-emitting layer coincides with the center line of the first positioning hole and the second positioning hole.

10. The thermoelectrically separated LED module of claim 9, wherein: The PCB board comprises an FR-4 flat plate, a circuit layer and a solder mask layer arranged in sequence from bottom to top, and the circuit of the PCB board is located on the front surface; The solder mask layer covers the circuit layer, and the circuit layer and the FR-4 flat plate are laminated.

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