Gas diffusion device and photoresist removing equipment
By using a gas diffusion device with a flow divider block and flow divider pipe in the glue removal equipment, the problems of uneven gas flow and high equipment cost are solved, achieving efficient and low-cost glue removal processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-03-13
AI Technical Summary
In existing adhesive removal equipment, uneven gas flow affects the adhesive removal effect when multiple processing chambers share a set of pipelines, while configuring separate pipelines for each processing chamber leads to increased equipment costs.
A gas diffusion device is used to evenly distribute the mixed gas to multiple processing chambers through a splitter block and a splitter pipe. The gas is evenly diffused by using the principle of fluid mechanics, reducing the need for separate piping.
It achieves uniform gas diffusion within multiple processing chambers, improving adhesive removal efficiency and reducing equipment costs.
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Figure CN223993872U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a gas diffusion device and a glue removal device. Background Technology
[0002] The resist removal process requires the use of both process gas and inert gas. After the two gases are mixed, they are diffused into the processing chamber through a diffusion structure to remove the resist from the semiconductor material.
[0003] In the prior art, in order to improve work efficiency, multiple independent processing chambers are set up in the resist removal equipment. Multiple processing chambers can operate simultaneously, so that multiple semiconductor materials can be removed at the same time, thereby improving work efficiency.
[0004] However, if multiple processing chambers share a single gas supply line, the gas can easily concentrate in some of the chambers, affecting the degumming process in the remaining chambers. On the other hand, if each processing chamber is equipped with its own gas supply line, the overall equipment cost will increase. Utility Model Content
[0005] The purpose of this invention is to provide a gas diffusion device and a glue removal device, which solves the problems in the prior art where, when multiple processing chambers share a set of pipelines, the gas flow is uneven, affecting the glue removal effect. On the other hand, when each processing chamber is equipped with a separate pipeline, the equipment cost increases.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] In a first aspect, this utility model provides a gas diffusion device, which includes:
[0008] Gas pipeline, used to introduce mixed gas;
[0009] A flow divider block is disposed at the exhaust port of the gas supply pipe. The flow divider block has an intake channel and a flow divider channel. The flow divider channel is perpendicular to the extension direction of the intake channel. Both ends of the flow divider channel are connected to flow divider pipes. Each flow divider pipe is connected to at least one diffusion component. The diffusion component is located in the processing chamber to uniformly diffuse the mixed gas into the processing chamber for removing the adhesive from the semiconductor material.
[0010] Optionally, the gas pipeline includes:
[0011] A mixing pipe is connected to the air intake channel;
[0012] A first intake pipe is connected to the mixing pipe for conveying a first gas;
[0013] The second intake pipe is connected to the mixing pipe for conveying the second gas;
[0014] The diameter of the mixing pipe is less than or equal to the diameter of the first intake pipe or the diameter of the second intake pipe.
[0015] Optionally, the shunt pipe includes:
[0016] A diversion branch, one end of which is connected to the diversion channel;
[0017] A connecting branch is connected to the other end of the flow guiding branch and to the diffusion component, wherein the angle β between the extension direction of the connecting branch and the extension direction of the flow guiding branch is greater than 90°.
[0018] Optionally, the diffusion component includes:
[0019] A ventilation section is provided in the processing chamber and has an air passage communicating with the diversion pipe;
[0020] A diffuser is disposed in the venting section and located within the processing chamber. A buffer chamber for containing the mixed gas is formed between the diffuser and the venting section. A plurality of diffuser holes communicating with the buffer chamber are distributed around the sidewall of the diffuser.
[0021] Optionally, the diffusion section includes:
[0022] The air distribution column is connected to the ventilation section at one end. The air distribution column has a buffer flow channel that communicates with the air passage. The side of the air distribution column is provided with a plurality of air distribution holes that communicate with the buffer flow channel.
[0023] A diffuser is disposed on the air distribution column and sealed to the air vent. The diffuser and the air vent form a buffer cavity, which is connected to the air distribution hole.
[0024] Optionally, the spacing between two adjacent diffusion holes is between 4 mm and 7 mm.
[0025] And / or, the aperture of the diffuser hole is between 2-3 mm.
[0026] Optionally, the edges of the diffusion holes are all rounded.
[0027] Optionally, the diffuser can slide in a direction close to or away from the vent, and the gas diffusion device further includes:
[0028] An adjustment section is provided through the ventilation section and is movably connected to the ventilation section. One end of the adjustment section passes through the ventilation section and is connected to the diffuser section to drive the diffuser section to slide or lock the diffuser section.
[0029] Optionally, the gas diffusion device further includes:
[0030] A filter is installed in the gas supply pipe.
[0031] Secondly, this utility model also provides a glue-removing device, which includes:
[0032] Gas holders are used to supply various gases;
[0033] The housing has multiple independent processing chambers.
[0034] The gas diffusion device as described in any one of the first aspects is connected to the gas holder and the plurality of processing chambers respectively.
[0035] The beneficial effects of this utility model are:
[0036] Firstly, by setting up a flow divider, after the mixed gas is input into the gas supply pipe, the mixed gas can flow from the inlet channel to the flow divider channel. At the connection between the inlet channel and the flow divider channel, the mixed gas will collide with the inner wall of the flow divider channel. According to the principle of mass conservation in fluid mechanics, the mixed gas after the collision can be evenly divided into two and flow into the two flow dividers respectively. When both flow dividers are directly connected to the diffusion components, the mixed gas can enter the diffusion components and diffuse evenly into the processing chamber, so that the two processing chambers can perform the degumming operation with equal efficiency. When flow dividers and flow divider branches are set up at the outlet of the flow divider, the mixed gas can be further evenly divided and guided into more diffusion components, so that the mixed gas can be evenly diffused into more processing chambers, thus enabling the degumming operation of multiple processing chambers to be completed quickly. When this gas diffusion device is in use, the mixed gas can share a portion of the pipeline for delivery. With the help of the diverter block, the mixed gas can be evenly divided into multiple portions, so that the mixed gas can flow into each processing chamber evenly. This ensures that each processing chamber can remove glue quickly and efficiently. Increasing the number of processing chambers only requires setting up a short section of pipeline and diverter block. The overall structure is simple and the cost is low, resulting in a lower overall equipment cost.
[0037] Secondly, when in use, the adhesive removal equipment can mix the various gases supplied by the gas tank through a gas diffusion device, then divide them into multiple portions and guide them to the corresponding processing chambers for diffusion, so as to ensure that the gas content in each processing chamber is uniform. This allows multiple processing chambers to perform adhesive removal operations at high speed, effectively improving the overall operating efficiency. At the same time, it does not require a separate gas supply module for each processing chamber, thus making the overall cost of the adhesive removal equipment lower. Attached Figure Description
[0038] Figure 1This is a schematic diagram of the structure of the gas diffusion device, including the gas delivery pipe, the diversion block, and the processing chamber, in an embodiment of this utility model.
[0039] Figure 2 This is a schematic diagram of the structure of the mixing tube, the flow divider block, and the flow divider in the gas diffusion device of this utility model embodiment;
[0040] Figure 3 This is a schematic diagram of the structure of the diffusion component in the gas diffusion device in this embodiment of the present invention;
[0041] Figure 4 This is a schematic diagram of the ventilation section in the gas diffusion device in this embodiment of the present invention;
[0042] Figure 5 This is a schematic diagram of the diffusion section in the gas diffusion device in this embodiment of the present invention;
[0043] Figure 6 This is a cross-sectional view of the diffusion component in the gas diffusion device in this embodiment of the present invention;
[0044] Figure 7 This is a cross-sectional view of the diffusion assembly in the gas diffusion device of this utility model when the position of the diffusion section is adjustable.
[0045] In the picture:
[0046] 1. Gas supply pipe; 11. Mixing pipe; 12. First air inlet pipe; 13. Second air inlet pipe;
[0047] 2. Diverter block;
[0048] 3. Diversion pipe; 31. Guide branch; 32. Connecting branch;
[0049] 4. Diffusion assembly; 41. Ventilation section; 411. Air passage; 412. Adjustment section; 413. Slot; 42. Diffusion section; 421. Buffer chamber; 422. Diffusion hole; 423. Air distribution column; 424. Diffusion plate; 425. Buffer flow channel; 426. Air distribution hole; 427. Protrusion;
[0050] 5. Filter;
[0051] 6. Processing cavity. Detailed Implementation
[0052] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0053] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0054] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0055] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0056] This utility model discloses a gas diffusion device and a glue removal device.
[0057] Reference Figure 1 and Figure 2 The gas diffusion device includes a gas supply pipe 1 and a flow divider block 2. The gas supply pipe 1 is used to input the mixed gas; the flow divider block 2 is located at the exhaust port of the gas supply pipe 1. The flow divider block 2 has an intake channel and a flow divider channel. The flow divider channel is perpendicular to the extension direction of the intake channel. Both ends of the flow divider channel are connected to flow divider pipes 3. Each flow divider pipe 3 is connected to at least one diffusion component 4. The diffusion component 4 is located in the processing chamber 6 to uniformly diffuse the mixed gas into the processing chamber 6 for removing the adhesive from the semiconductor material.
[0058] Specifically, gas supply pipe 1 is connected to the gas holder. The gas holder can input both process gas and inert gas into the inlet channel of the splitter block 2 through gas supply pipe 1. The extension direction of the splitter channel is perpendicular to the inlet channel, that is, the two channels are T-shaped and have the same inner diameter. When the mixed gas flows to the connection between the inlet channel and the splitter channel, the mixed gas will collide with the inner wall of the splitter channel. According to the law of conservation of energy in fluid dynamics gas flow, the mixed gas can be evenly split into two after the collision, flowing into the two splitter channels respectively, and the velocity after splitting remains unchanged. Then it enters the splitter pipe 3 through the splitter channel.
[0059] The other end of the split pipe 3 can be directly connected to the diffusion component 4, or a split block 2 and two split branch pipes can be added to split the mixed gas in two again. In this case, the split branch pipes are connected to the diffusion component 4, so that each split pipe 3 can connect to at least one diffusion component 4. In this embodiment, two processing chambers 6 are provided, that is, the split pipes 3 are directly connected to the diffusion components 4. The diffusion component 4 can contain the mixed gas and then uniformly diffuse the mixed gas into the processing chamber 6 to achieve the removal of the adhesive from the semiconductor material in the processing chamber 6. The dashed arrows in the figure indicate the flow direction of the mixed gas.
[0060] By setting up a flow divider 2, after the mixed gas is input into the gas supply pipe 1, the mixed gas can flow from the inlet channel to the flow divider channel. At the connection between the inlet channel and the flow divider channel, the mixed gas will collide with the inner wall of the flow divider channel. According to the principle of mass conservation in fluid mechanics, the mixed gas after the collision can be evenly divided into two and flow into two flow dividers 3 respectively. When both flow dividers 3 are directly connected to the diffusion components 4, the mixed gas can enter the diffusion components 4 and diffuse evenly into the processing chamber 6, so that the two processing chambers 6 can perform the degumming operation with the same efficiency. When a flow divider 2 and a flow divider branch are set at the outlet of the flow divider 3, the mixed gas can be further evenly divided and guided into more diffusion components 4, so that the mixed gas can be evenly diffused into more processing chambers 6, thus enabling the degumming operation of multiple processing chambers 6 to be completed quickly. Therefore, when this gas diffusion device is in use, the mixed gas can share a part of the pipeline for transportation. With the help of the diverter block 2, the mixed gas can be evenly divided into multiple parts, so that the mixed gas can flow into each processing chamber 6 evenly. This ensures that each processing chamber 6 can remove glue quickly and efficiently. Increasing the number of processing chambers 6 only requires setting up a short section of pipeline and diverter block 2. The overall structure is simple and the cost is low, thus reducing the overall equipment cost.
[0061] Optionally, the gas supply pipe 1 includes a mixing pipe 11, a first air inlet pipe 12, and a second air inlet pipe 13. The mixing pipe 11 is connected to the air inlet channel; the first air inlet pipe 12 is connected to the mixing pipe 11 to transport a first gas; the second air inlet pipe 13 is connected to the mixing pipe 11 to transport a second gas; wherein the diameter of the mixing pipe 11 is less than or equal to the diameter of the first air inlet pipe 12 or the diameter of the second air inlet pipe 13.
[0062] Specifically, both the first inlet pipe 12 and the second inlet pipe 13 are connected to the gas holder for the dedicated transport of inert gases and process gases. One end of the mixing pipe 11 is connected to the first inlet pipe 12 and the second inlet pipe 13 via a tee connector. Both the first inlet pipe 12 and the mixing pipe 11 can be quarter-length pipes, while the second inlet pipe 13 can be a half-length pipe. The mixing pipe 11 is relatively short, with a total length between 20mm and 40mm. It should be understood that the diameter and purpose of the three types of pipes can be determined based on the actual installation space and gas transport requirements; this invention does not impose any limitations on this.
[0063] By setting the diameter of the mixing pipe 11 to be less than or equal to the diameter of the first intake pipe 12 or the diameter of the second intake pipe 13, the flow rate of the mixed gas can be increased when the two gases are injected into the mixing pipe 11 for mixing. By setting the length of the mixing pipe 11 to be smaller, the mixed gas only needs to travel a short time and a short distance to enter the diverter block 2, thereby minimizing the energy loss of the mixed gas before entering the diverter block 2, and thus improving the impact diversion effect of the mixed gas at the connection between the intake channel and the diverter channel.
[0064] Optionally, the gas diffusion device also includes a filter 5. The filter 5 is disposed in the gas supply pipe 1.
[0065] Specifically, the air inlet of filter 5 is connected to the first air inlet pipe 12 and the second air inlet pipe 13, while the air outlet of filter 5 is connected to the mixing pipe 11. This prevents backflow of gas, thereby avoiding impurities in the processing chamber 6 from entering the gas holder and contaminating the gas source during the degumming process. The specific type of filter 5 can be found in existing technology, and will not be elaborated upon here.
[0066] Optionally, the diversion pipe 3 includes a flow guiding branch 31 and a connecting branch 32. One end of the flow guiding branch 31 is connected to the diversion channel; the connecting branch 32 is connected to the other end of the flow guiding branch 31 and is connected to the diffusion component 4, and the angle β between the extension direction of the connecting branch 32 and the extension direction of the flow guiding branch 31 is greater than 90°.
[0067] Specifically, the location of the diffuser assembly 4 needs to be adjusted according to the location of the processing chamber 6. Therefore, it is difficult to establish a straight-line correspondence between the inlet of the diffuser assembly 4 and the diverter pipe 3. The diverter pipe 3 is divided into a guide branch 31 and a connecting branch 32, which are connected by an adapter so that the angle β at their connection point is greater than 90°. This reduces energy loss due to collisions when the mixed gas flows within the diverter pipe 3, prevents residual mixed gas at corners, and facilitates connection between the diverter pipe 3 and the diffuser assembly 4. In this embodiment, the angle β between the extension direction of the connecting branch 32 and the extension direction of the guide branch 31 is 145°. It should be understood that when the diverter pipe 3 continues to connect with the diverter block 2 and the diverter branch, only the diverter branch can be configured as two sections: the guide branch 31 and the connecting branch 32. The diverter pipe 3 can remain straight, and the specific design can be based on the actual location of the processing chamber 6.
[0068] Reference Figures 3 to 6 Optionally, the diffusion assembly 4 includes a venting section 41 and a diffusion section 42. The venting section 41 is disposed in the processing chamber 6 and has an air passage 411 communicating with the diverter pipe 3; the diffusion section 42 is disposed in the venting section 41 and located inside the processing chamber 6, and a buffer chamber 421 for containing the mixed gas is formed between the diffusion section 42 and the venting section 41. The sidewall of the diffusion section 42 is provided with a plurality of diffusion holes 422 communicating with the buffer chamber 421.
[0069] Specifically, the processing chamber 6 is cylindrical to prevent gas residue at corners, and the venting section 41 is also disc-shaped, covering the top wall of the processing chamber 6 to seal it. An air passage 411 is formed inside the venting section 41, which is sealed and connected to the distribution pipe 3. An air hole communicating with the air passage 411 is provided at the center of the bottom wall of the venting section 41. A diffuser 42 is provided on the bottom wall of the venting section 41. The diffuser 42 is hollow and located at the center of the venting section 41, forming a buffer chamber 421 with the venting section 41. The buffer chamber 421 communicates with the air passage 411 through the air hole. The diffuser 42 can be integral with the venting section 41 to ensure that gas can only enter the buffer chamber 421 through the air distribution hole 426, while the gas in the buffer chamber 421 can only enter the processing chamber 6 through the diffuser hole 422. The diffuser 42 and the vent 41 can also be adjusted relative to each other in the vertical direction. While ensuring good sealing, the height of the diffuser hole 422 can be adjusted. The specific design can be based on the actual gas diffusion conditions.
[0070] By setting up a buffer chamber 421, when the mixed gas enters the processing chamber 6 through the splitter pipe 3 and the gas passage 411, the gas does not immediately diffuse. Instead, it first accumulates inside the buffer chamber 421 and then diffuses into the processing chamber 6 through multiple diffusion holes 422 on the side of the diffuser section 42. This avoids the situation where gases with larger molecular weights rush downwards directly, allowing the mixed gas to diffuse more effectively within the processing chamber 6. The distribution and shape of the diffusion holes 422 can be designed according to the actual diffusion requirements. For example, the diffusion holes 422 can be cylindrical through holes or conical holes, etc.
[0071] Optionally, the inner and outer edges of the diffuser hole 422 are rounded to prevent the mixed gas from colliding with the edge tips when passing through the diffuser hole 422, thereby reducing the possibility of gas loss or rebound.
[0072] Optionally, the spacing between two adjacent diffuser holes 422 is between 4mm and 7mm, and the diameter of the diffuser holes 422 is between 2 and 3mm.
[0073] Specifically, the number of diffusion holes 422 can be designed according to the size of the diffusion section 42. The spacing and diameter between two adjacent diffusion holes 422 should not be too large. The spacing can be between 4mm and 7mm, and the diameter can be between 2mm and 3mm, so that multiple diffusion holes 422 can be arranged in a dense and small manner on the diffusion section 42, thereby ensuring that the mixed gas can be diffused evenly. At the same time, each diffusion hole 422 can be easily processed without damaging the strength of the diffusion section 42 itself.
[0074] Optionally, the diffuser 42 includes a gas distribution column 423 and a diffuser plate 424. One end of the gas distribution column 423 is connected to the ventilation section 41. The gas distribution column 423 has a buffer flow channel 425 communicating with the air passage 411. The side of the gas distribution column 423 is provided with a plurality of gas distribution holes 426 communicating with the buffer flow channel 425. The diffuser plate 424 is disposed on the gas distribution column 423 and is sealed to the ventilation section 41. The diffuser plate 424 and the ventilation section 41 enclose a buffer cavity 421, and the buffer cavity 421 communicates with the gas distribution holes 426.
[0075] Specifically, the air distribution column 423 extends vertically, with its upper end inserted into the air hole of the ventilation section 41. The air distribution column 423 is cylindrical, with its upper end open to communicate with the air passage 411, and its lower end closed and fixed to the middle of the diffuser plate 424. An integral diffuser ring is formed around the diffuser plate 424, and the top wall of the diffuser ring can be fixedly connected to the bottom wall of the ventilation section 41. This fixed connection can be welding, bonding, or integral molding. The diffuser plate 424 and the ventilation section 41 enclose a buffer cavity 421, and multiple air distribution holes 426 are arranged around the side wall of the air distribution column 423. In this embodiment, four air distribution holes 426 are distributed around the perimeter.
[0076] By setting up the gas distribution column 423 and the diffuser plate 424, the mixed gas will first enter the buffer flow channel 425 of the gas distribution column 423 before flowing into the buffer chamber 421 through the gas channel 411, and then flow into the interior of the buffer chamber 421 through the surrounding gas distribution holes 426, so that the mixed gas can be evenly distributed inside the buffer chamber 421, thereby further ensuring that the mixed gas can be evenly diffused into the processing chamber 6 through the diffuser holes 422.
[0077] Reference Figure 7 Optionally, in one embodiment, the diffuser 42 can slide in a direction close to or away from the vent 41, and the gas diffusion device further includes an adjustment part 412. The adjustment part 412 passes through the vent 41 and is movably connected to the vent 41. One end of the adjustment part 412 passing through the vent 41 is connected to the diffuser 42 to drive the diffuser 42 to slide or lock the diffuser 42.
[0078] Specifically, the diffuser 42 includes a diffuser disc 424 and a gas distribution column 423. The gas distribution column 423 can be telescopic, for example, it can be a sleeve structure. An annular slot 413 is formed on the bottom wall of the venting section 41. The diffuser ring of the diffuser disc 424 is inserted into the slot 413 and slidably connected to it. A protrusion 427 is provided on the outer side of the diffuser disc 424. The adjusting part 412 can be a stud. The stud passes through the venting section 41 and is threadedly connected to it. One end of the stud passing through the venting section 41 forms a rotatable connection with the protrusion 427.
[0079] When it is necessary to adjust the height of the diffuser hole 422 within the processing chamber 6, the adjusting part 412 can be rotated and raised / lowered relative to the venting part 41 by turning it. This allows the adjusting part 412 to synchronously raise and lower the diffuser plate 424. Using a stud as the adjusting part 412, the threaded connection ensures a seal at the connection between the venting part 41 and the adjusting part 412, preventing air leakage. Furthermore, when the adjusting stud is not turned, the height of the diffuser plate 424 can be locked using the thread. This simple structure allows for adjustment of the diffuser hole 422's position, saving costs while further improving the adhesive removal effect. It should be understood that the adjusting part 412 can also be implemented using other structures, such as an adjusting rod, with a corresponding sealing structure to ensure a tight seal. This invention does not limit the specific configuration of the adjusting part 412.
[0080] The adhesive removal equipment includes a gas holder and a housing, as described above, and a gas diffusion device. The gas holder is used to supply various gases; the housing has multiple independent processing chambers 6; the gas diffusion device is connected to the gas holder and the multiple processing chambers 6 respectively.
[0081] When in use, this adhesive removal equipment can mix various gases supplied by the gas holder through a gas diffusion device, then divide them into multiple portions and guide them to the corresponding processing chambers 6 for diffusion, so as to ensure that the gas content in each processing chamber 6 is uniform. This allows multiple processing chambers 6 to perform adhesive removal operations at high speed, effectively improving the overall operating efficiency. At the same time, it does not require a separate gas supply module for each processing chamber 6, thus making the overall cost of the adhesive removal equipment lower.
[0082] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A gas diffusion device, characterized by, The utility model relates to a gas diffusion device for semiconductor material degumming treatment, comprising: a gas inlet pipe (1) for inputting mixed gas; a flow divider (2) arranged at the gas outlet of the gas inlet pipe (1), the flow divider (2) having a gas inlet channel and a flow divider channel, the flow divider channel being perpendicular to the extension direction of the gas inlet channel, both ends of the flow divider channel being connected with a flow divider pipe (3), each flow divider pipe (3) being connected with at least one diffusion assembly (4) for uniformly diffusing mixed gas into a processing cavity (6) to perform degumming treatment on semiconductor material.
2. The gas diffusion device according to claim 1, wherein The gas inlet pipe (1) comprises: a mixing pipe (11) connected with the gas inlet channel; a first gas inlet pipe (12) connected with the mixing pipe (11) for conveying first gas; a second gas inlet pipe (13) connected with the mixing pipe (11) for conveying second gas; wherein the diameter of the mixing pipe (11) is less than or equal to the diameter of the first gas inlet pipe (12) or the diameter of the second gas inlet pipe (13).
3. The gas diffusion device according to claim 1, wherein The flow divider pipe (3) comprises: a flow guide branch (31) connected with one end of the flow divider channel; a connecting branch (32) connected with the other end of the flow guide branch (31) and connected with the diffusion assembly (4), the included angle β between the extension direction of the connecting branch (32) and the extension direction of the flow guide branch (31) being greater than 90°.
4. The gas diffusion device according to claim 1, wherein The diffusion assembly (4) comprises: an air inlet part (41) arranged in the processing cavity (6) and having an air passage (411) connected with the flow divider pipe (3); a diffusion part (42) arranged in the air inlet part (41) and located in the processing cavity (6), the diffusion part (42) and the air inlet part (41) forming a buffer cavity (421) containing mixed gas, the side wall of the diffusion part (42) being provided with a plurality of diffusion holes (422) connected with the buffer cavity (421).
5. The gas diffusion device according to claim 4, wherein The diffusion part (42) comprises: a gas distribution column (423) connected with one end of the air inlet part (41), the gas distribution column (423) having a buffer flow channel (425) connected with the air passage (411) therein, the side surface of the gas distribution column (423) being provided with a plurality of gas distribution holes (426) connected with the buffer flow channel (425); a diffusion disc (424) arranged in the gas distribution column (423) and sealingly connected with the air inlet part (41), the diffusion disc (424) and the air inlet part (41) forming the buffer cavity (421) therebetween, the buffer cavity (421) being connected with the gas distribution holes (426).
6. The gas diffusion device according to claim 4, wherein The distance between adjacent two diffusion holes (422) is between 4 mm and 7 mm; and / or, the diameter of the diffusion hole (422) is between 2 mm and 3 mm.
7. The gas diffusion device according to claim 4, wherein The edges of the diffusion hole (422) are rounded.
8. The gas diffusion device according to claim 4, wherein The diffusion part (42) can slide in the direction of approaching or moving away from the air inlet part (41), and the gas diffusion device further comprises: An adjusting part (412) is arranged in the ventilation part (41) and is movably connected with the ventilation part (41), one end of the adjusting part (412) is connected with the diffusion part (42) through the ventilation part (41) to drive the diffusion part (42) to slide or lock the diffusion part (42).
9. The gas diffusion device according to any one of claims 1 to 8, characterized by, The gas diffusion device further comprises: A filter (5) is arranged in the gas conveying pipe (1).
10. A de-bonding apparatus characterized by, Comprise: A gas cabinet for supplying various gases; A casing, the casing has a plurality of independent processing cavities (6) therein; The gas diffusion device according to any one of claims 1 to 9, in communication with the gas cabinet and the plurality of processing cavities (6) respectively.