Wafer position adjuster

Abstract

The utility model belongs to the field of semiconductors, and particularly relates to a wafer position adjuster which comprises a support, a wafer supporting frame capable of enabling a wafer to be horizontally placed is arranged on the support through a lifting device, a wafer clamping claw is arranged on the support through a rotating mechanism, and the free end of the wafer clamping claw faces upwards. The moving path of each claw toe of the wafer clamping claw is parallel to the upper surface of the support, the vertical central axis of the wafer supporting frame and the vertical central axis of the wafer clamping claw are collinear, clamping seams matched with the claw toes are reserved in the wafer supporting frame, a detection device matched with the wafer clamping claw is arranged on the support, and the wafer clamping claw is arranged on the wafer supporting frame. The detection device is in signal connection with the rotating mechanism and the lifting device; according to the wafer clamping device, the problems that the wafer is not in a horizontal state after being clamped and the clamping force for clamping the wafer is not uniform due to the fact that the wafer is directly clamped by a clamping jaw at present are solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductors, specifically a wafer position adjuster. Background Technology

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. During the loading or processing of wafers, their positional relationships follow specific standards. Typically, a wafer has a notch (such as...). Figure 1 As shown, during wafer loading, it's crucial to ensure the wafer notch is aligned with a specific position (e.g., the front or left side of the workstation) to guarantee that other processing units can accurately target the wafer. Currently, the only device for securing wafers is the gripper, which holds the wafer's circumference. Therefore, workers must hold the wafer with their hands before releasing it, which easily results in the wafer not being horizontal after being gripped, and the clamping force is uneven. Utility Model Content

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a wafer position adjuster that uses a wafer support frame that works in conjunction with wafer clamping claws. This ensures that the wafer is in a horizontal position before being clamped by the claws. Through precise detection by a detection device and precise rotation by a rotating mechanism, the problem of uneven clamping force on the wafer, which is easily caused by directly using clamping claws to hold the wafer, is solved.

[0004] To achieve the above objectives, the technical solution adopted in this application is:

[0005] A wafer position adjuster includes a support frame, on which a wafer support frame is mounted via a lifting device to allow the wafer to be placed horizontally. A wafer clamping jaw is mounted on the support frame via a rotating mechanism, with the free end of the clamping jaw facing upwards. The movement path of each toe of the clamping jaw is parallel to the upper surface of the support frame. The vertical central axis of the wafer support frame is collinear with the vertical central axis of the clamping jaw. A clamping slot is pre-formed on the wafer support frame to engage with the toes of the clamping jaw. A detection device is mounted on the support frame to engage with the clamping jaw. The detection device is signal-connected to the rotating mechanism and the lifting device.

[0006] Preferably, the wafer support frame includes a support disk and support claws. The support disk is disposed on the support frame and is parallel to the upper surface of the support frame. At least three support claws are provided on the support disk around the central axis of the support disk. The tops of all the support claws are at the same height. The lower surface of the support disk is fixedly connected to the actuator of the lifting device.

[0007] Preferably, the support plate is fixedly connected to one end of the connecting rod A, and the other end of the connecting rod A is fixedly provided with the support claw, and the connecting rod A is parallel to the upper surface of the bracket.

[0008] Preferably, the lifting device includes a first mounting plate, a lifting motor, an eccentric wheel, and a support rod. The first mounting plate and the lifting motor are both fixedly mounted inside the bracket. The first mounting plate is provided with a first slide rail perpendicular to the upper surface of the bracket. A slider is slidably mounted between the two ends of the first slide rail. The lower end of the support rod is fixedly connected to the slider. The support rod is parallel to the first slide rail. The top end of the support rod is fixedly connected to the wafer support frame. The output shaft of the lifting motor is fixedly connected to one end face of the eccentric wheel. The output shaft of the lifting motor is parallel to the upper surface of the bracket and perpendicular to the end face of the eccentric wheel. A slot is provided on the side wall of the slider parallel to the support rod. The upper side wall of the slot is slidably connected to the circumferential surface of the eccentric wheel. The length of the slot is greater than the diameter of the eccentric wheel.

[0009] Preferably, the wafer clamping claw includes a mounting plate, a linear motor, mounting rods, and claw toes. The mounting plate is rotatably mounted on the support. At least three second slide rails are provided around the center of the mounting plate. All second slide rails are parallel to the upper surface of the support. One end of each second slide rail faces the center of the mounting plate, and the other end faces outwards from the mounting plate. Each mounting rod is slidably connected to the mounting plate via a corresponding second slide rail. Correspondingly, each mounting rod is parallel to the second slide rail. Each mounting rod has a claw toe at its end facing away from the center of the mounting plate. Each mounting rod has a first pin at its end facing the center of the mounting plate. All first pins are perpendicular to the upper surface of the support. One end of each connecting rod B is rotatably connected to a corresponding first pin. The rotating plate is coaxial. The mounting plate is rotatably mounted on the mounting disk. On the upper surface of the rotating disk, second pins corresponding to each connecting rod B are evenly arranged around the center. All second pins are parallel to all first pins. The other end of each connecting rod B is rotatably connected to a second pin. A linear motor is fixedly mounted on the mounting disk. A drive rod is radially fixedly mounted on the output shaft of the linear motor. The drive rod is parallel to the upper surface of the bracket and fixedly connected to one side of one of the mounting rods. The output shaft of the linear motor is parallel to the mounting rod fixedly connected to the drive rod. All the mounting rods are circumferentially equidistantly arranged on the mounting disk. The mounting disk is coaxially fixedly connected to the output shaft of the rotating mechanism. The distance from the end of the mounting rod facing away from the center of the mounting disk to the center of the mounting disk is greater than the distance from the outer edge of the wafer support frame to the center of the mounting disk.

[0010] Preferably, a U-shaped component is provided on the side wall of the mounting rod connected to the drive rod. The projection of the U-shaped component on the mounting plate is U-shaped. The sealed end of the U-shaped component is fixedly connected to the mounting rod connected to the drive rod. One end of the drive rod facing away from the output shaft of the linear motor is located inside the U-shape of the U-shaped component. A pin is provided on the U-shaped component. The pin is parallel to the mounting rod on which the U-shaped component is provided. The drive rod is provided with a through hole whose axis is parallel to the output shaft of the linear motor. The two ends of the pin pass through the through hole. The two ends of the pin are fixed to the U-shaped component. A spring is sleeved on the pin between the side of the mounting rod on which the U-shaped component is provided facing the center of the mounting plate and the inner side wall of the U-shaped component.

[0011] Preferably, the mounting plate is provided with a first sensor, and an additional plate is provided on the side wall of part of the mounting rod. The additional plate is provided with a sensing notch that cooperates with the first sensor. The additional plate is parallel to the mounting rod on which it is set, and the first sensor signal is connected to the linear motor.

[0012] Preferably, the rotating mechanism includes a rotating motor, a first pulley, a second pulley, a second mounting plate, and a rotating shaft. The rotating shaft is rotatably mounted on the second mounting plate, and the second mounting plate is fixedly mounted on the bracket. The mounting plate is coaxially fixedly mounted on the upper end of the rotating shaft, and the second pulley is coaxially fixedly mounted on the lower end of the rotating shaft. The rotating motor is fixedly mounted on the second mounting plate, and the first pulley is fixedly mounted on the output shaft of the rotating motor. The first pulley and the second pulley are connected by a belt drive.

[0013] Compared with the prior art, this application has the following beneficial effects:

[0014] This application employs a wafer support frame with a support structure that engages with wafer clamping claws, and designs a wafer position adjuster that ensures the wafer is horizontal before being clamped by the claws. Through precise detection by a detection device and precise rotation by a rotating mechanism, this solves the problems of wafers not being horizontal after being clamped and uneven clamping force when directly clamped by claws. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the wafer structure;

[0016] Figure 2 This is a schematic diagram of the structure of this application;

[0017] Figure 3 This is a schematic diagram of the structure after the outer shell on the bracket has been removed in this application;

[0018] Figure 4 This is a diagram showing the relationship between the lifting device and the support frame in this application;

[0019] Figure 5 for Figure 4 Exploded view;

[0020] Figure 6 for Figure 5 The diagram on the left;

[0021] Figure 7 This is a diagram showing the relationship between the wafer clamping claws and the support in this application;

[0022] Figure 8 for Figure 7 Enlarged view of point A in the image;

[0023] Figure 9 Parts drawings for a linear motor, U-shaped component, spring, and pin;

[0024] Figure 10 This diagram shows the relationship between the rotating disk and the mounting rod.

[0025] Figure 11 for Figure 10 A structural diagram of the back side;

[0026] Figure 12 A diagram illustrating the relationship between the rotating mechanism and the support;

[0027] Figure 13 A schematic diagram showing the wafer placed on the support claws of this application;

[0028] Figure 14 This is a schematic diagram of the wafer clamping jaws gripping a wafer according to this application;

[0029] Figure 15 This is a schematic diagram of the supporting claw structure.

[0030] The components are as follows: 1. Bracket; 2. Claw; 3. Detection device; 4. Support plate; 5. Support claw; 5-1. Blocking protrusion; 6. Connecting rod A; 7. First mounting plate; 8. Lifting motor; 9. Eccentric wheel; 10. Support rod; 11. First slide rail; 12. Slider; 13. Groove; 14. Mounting plate; 15. Linear motor; 16. Mounting rod; 17. Second slide rail; 18. First pin; 19. Connecting rod B; 20. Second pin; 21. Drive rod; 22. U-shaped component; 23. Pin; 24. Through hole; 25. Spring; 26. First sensor; 27. Sensing notch; 28. Additional plate; 29. ​​Rotating motor; 30. Second mounting plate; 31. Rotating shaft; 32. Belt; 33. First pulley; 34. Second pulley; 35. Rotating disk; 36. Wafer; 37. Notch; 38. Second sensor; 40. PCBA circuit board. Detailed Implementation

[0031] like Figure 1-15 As shown, a wafer position adjuster includes a bracket 1. A wafer support frame, capable of horizontally placing the wafer, is mounted on the bracket 1 via a lifting device. Wafer clamping claws are mounted on the bracket 1 via a rotating mechanism, with the free ends of the clamping claws facing upwards. The movement path of each claw toe 2 is parallel to the upper surface of the bracket 1. The vertical central axis of the wafer support frame is collinear with the vertical central axis of the wafer clamping claws. A clamping slot is pre-reserved on the wafer support frame to engage with the claw toes 2. A detection device 3, cooperating with the wafer clamping claws, is mounted on the bracket 1. The detection device 3 is signal-connected to the rotating mechanism and the lifting device.

[0032] In this embodiment, the user places the wafer 36 on the wafer support frame, which supports the wafer 36 so that the wafer 36 is placed horizontally. Then, the lifting device lifts the wafer support frame, causing it to rise. The wafer gripper then grasps the wafer 36. Since the movement path of each claw 2 is parallel to the upper surface of the support frame 1, the claw 2 contacts the circumferential surface of the wafer 36 when it grasps the wafer 36, thus not obstructing the notch 37 on the wafer 36. Then, the rotating mechanism drives the wafer gripper to rotate, that is, the wafer 36 rotates around its own center point. When the wafer 36 rotates to the point where the notch 37 is located at the detection device 3, the detection device 3 can detect the notch 37 on the wafer 36, thus realizing automatic adjustment. In practical applications, a PCBA circuit board 40 is used for calculations. The PCBA circuit board 40 is fixed inside the support 1. The PCBA circuit board 40 controls the rotation mechanism, lifting device, and wafer clamping jaws. The rotation mechanism, lifting device, and wafer clamping jaws are all signal-connected to the PCBA circuit board 40. The detection device is located above the wafer clamping jaws and can detect the edge of the wafer 36 placed on the wafer support.

[0033] The wafer support frame includes a support disk 4 and support claws 5. The support disk 4 is disposed on the bracket 1 and is parallel to the upper surface of the bracket 1. At least three support claws 5 are provided on the support disk 4 around the central axis of the support disk 4. The tops of all the support claws 5 are at the same height. The lower surface of the support disk 4 is fixedly connected to the actuator of the lifting device.

[0034] With this setup, the support plate 4 is used to mount the support claws 5. The fact that the tips of all the support claws 5 are at the same height ensures that the wafer 36 is horizontal when placed on the support claws 5, facilitating subsequent operations. The gap between two adjacent support claws 5 forms a clamping slot that engages with the claw toes 2, allowing the wafer clamping claws to grip the wafer 36.

[0035] Preferably, each support claw 5 has a blocking protrusion 5-1 on the side of its upper surface facing away from the center of the support plate 4. The distance from each blocking protrusion 5-1 to the center of the support plate 4 is equal and equal to the radius of the wafer 36. The roots of all the blocking protrusions 5-1 on one side of the central axis of the support plate 4 are located on a virtual circle A, the diameter of which is equal to the diameter of the wafer. The tops of all the blocking protrusions 5-1 on one side of the central axis of the support plate 4 are located on a virtual circle B, the diameter of which is larger than the diameter of the wafer. This makes it easier for workers to place the wafer 36 on the support claw 5.

[0036] As a preferred embodiment, the support disk 4 is fixedly connected to one end of the connecting rod A6, and the other end of the connecting rod A6 is fixedly provided with the support claw 5. The connecting rod A6 is parallel to the upper surface of the bracket 1. This arrangement of the connecting rod A6 ensures that the support claw 5 is located outside the support disk 4, thus preventing the support disk 4 from interfering with the wafer clamping claw's operation during wafer gripping.

[0037] In a preferred embodiment, the lifting device includes a first mounting plate 7, a lifting motor 8, an eccentric wheel 9, and a support rod 10. The first mounting plate 7 and the lifting motor 8 are both fixedly mounted inside the bracket 1. The first mounting plate 7 is provided with a first slide rail 11 perpendicular to the upper surface of the bracket 1. A slider 12 is slidably mounted between the two ends of the first slide rail 11. The lower end of the support rod 10 is fixedly connected to the slider 12. The support rod 10 is parallel to the first slide rail 11. The top end of the support rod 10 is fixedly connected to the wafer support frame. The output shaft of the lifting motor 8 is fixedly connected to one end face of the eccentric wheel 9. The output shaft of the lifting motor 8 is parallel to the upper surface of the bracket 1 and perpendicular to the end face of the eccentric wheel 9. A slot 13 is provided on the side wall of the slider 12 parallel to the support rod 10. The upper side wall of the slot 13 is slidably connected to the circumferential surface of the eccentric wheel 9. The length of the slot 13 is greater than the diameter of the eccentric wheel 9. With this setup, after the wafer 36 is placed on the support claw 5, the lifting motor 8 rotates, thereby driving the eccentric wheel 9 to rotate. The rotation of the eccentric wheel 9 then moves the slider 12 through the slot 13. Due to the presence of the first slide rail 11, the slider 12 and the support rod 10 can only move up and down under the action of the lifting motor 8. The length of the slot 13 must be greater than the diameter of the eccentric wheel 9 to ensure that the eccentric wheel 9 is not stuck by the slot 13 during movement. The lifting motor 8 is connected to the detection device 3. If a PCBA circuit board 40 is used, the lifting motor 8 is connected to the PCBA circuit board 40.

[0038] Preferably, the support 1 is equipped with a second sensor 38, which is used to detect whether a wafer 36 is placed on the support claw 5. If a PCBA circuit board 40 is used, the second sensor 38 is connected to the PCBA circuit board 40.

[0039] In a preferred embodiment, the wafer clamping jaws include a mounting disk 14, a linear motor 15, mounting rods 16, and the toes 2. The mounting disk 14 is rotatably mounted on the support 1. At least three second slide rails 17 are provided around the center of the mounting disk 14. All second slide rails 17 are parallel to the upper surface of the support 1. One end of each second slide rail 17 faces the center of the mounting disk 14, and the other end faces outwards from the mounting disk 14. Each mounting rod 16 is connected to the wafer clamping jaws via a corresponding second slide rail 17. The mounting plate 14 is slidably connected to the mounting rods 16, which are parallel to the second slide rail 17. Each mounting rod 16 has a claw 2 at one end facing away from the center of the mounting plate 14. Each mounting rod 16 has a first pin 18 at one end facing the center of the mounting plate 14. All first pins 18 are perpendicular to the upper surface of the bracket 1. One end of each connecting rod B19 is rotatably connected to one of the first pins 18. The rotating plate 35 is coaxially rotatably mounted on the mounting plate 14. The upper surface of the rotating plate 35 is arranged around the center. A second pin 20 is evenly provided corresponding to each connecting rod B19. All second pins 20 are parallel to all first pins 18. The other end of each connecting rod B19 is rotatably connected to a second pin 20. A linear motor 15 is fixedly mounted on the mounting plate 14. A drive rod 21 is radially fixed on the output shaft of the linear motor 15. The drive rod 21 is parallel to the upper surface of the bracket 1. The drive rod 21 is fixedly connected to one side of one of the mounting rods 16. The output shaft of the linear motor 15 is parallel to the drive rod 18. The mounting rod 16 is fixedly connected to the moving rod 21. After the circumferential array is completed, when viewed from above the mounting plate 4, all the mounting rods 6 can be seen to be either clockwise or counterclockwise. This ensures that all claws 2 are driven simultaneously. All the connecting rods B19 are circumferentially and equidistantly arrayed on the mounting plate 4. The mounting plate 14 is coaxially and fixedly connected to the output shaft of the rotating mechanism. The distance from the end of the mounting rod 16 facing away from the center of the mounting plate 14 to the center of the mounting plate 14 is greater than the distance from the outer edge of the wafer support frame to the center of the mounting plate 14.

[0040] With this configuration, the mounting plate 14 is used to mount the linear motor 15, mounting rod 16, second slide rail 17, rotating plate 35, and to connect to the output shaft of the rotating mechanism. The rotating plate 35, second slide rail 17, and connecting rod B19 are primarily designed to ensure that the three claws 2 move synchronously when the linear motor 15 drives the mounting rod 16 to move axially to perform a gripping or releasing action. The distance from the end of the mounting rod 16 facing away from the center of the mounting plate 14 to the center of the mounting plate 14 is greater than the distance from the outer edge of the wafer support frame to the center of the mounting plate 14. This is to ensure that the movement of the claws 2 is not affected by the wafer support frame, especially by the support plate 4. If a PCBA circuit board 40 is used, the linear motor 15 is signal-connected to the PCBA circuit board 40, and the PCBA circuit board 40 controls the linear motor 15.

[0041] As a preferred embodiment, a U-shaped component 22 is provided on the side wall of the mounting rod 16 connected to the drive rod 21. The projection of the U-shaped component 22 on the mounting plate 14 is U-shaped. The closed end of the U-shaped component 22 is fixedly connected to the mounting rod 16 connected to the drive rod 21. One end of the drive rod 21 facing away from the output shaft of the linear motor 15 is located inside the U-shape of the U-shaped component 22. A pin 23 is provided on the U-shaped component 22. The pin 23 is parallel to the mounting rod 16 on which the U-shaped component 22 is located. The drive rod 21 is provided with a through hole 24 whose axis is parallel to the output shaft of the linear motor 15. The two ends of the pin 23 pass through the through hole 24 and are fixed to the U-shaped component 22. A spring 25 is sleeved on the pin 23 between the side of the mounting rod 16 on which the U-shaped component 22 is located facing the center of the mounting plate 14 and the inner side wall of the U-shaped component 22. With this configuration, the spring 25 acts as a buffer when all three claws 2 move towards the center of the mounting plate 14, i.e., when clamping the wafer 36, preventing damage to the wafer 36. The pin 23 and the U-shaped component 22 are for easy installation of the spring 25. The drive rod 21 is essentially an extension of the mounting rod 16, and its configuration allows the spring 25 to prevent the mounting rod 16 from moving beyond its limit.

[0042] In a preferred embodiment, the mounting plate 14 is equipped with a first sensor 26, and a supplementary plate 28 is provided on the side wall of part of the mounting rod 16. The supplementary plate 28 has a sensing notch 27 that cooperates with the first sensor 26. The supplementary plate 28 is parallel to the mounting rod 16 on which it is mounted. The first sensor 26 is signal-connected to the linear motor 15. By setting the first sensor 26, the mounting rod 16 is prevented from exceeding the necessary movement limit. For example, it is normal for the first sensor 26 not to detect any object. However, when the mounting rod 16 moves outward from the mounting plate 14 beyond a certain limit, the first sensor 26 senses one side wall of the sensing notch 27. At this time, the first sensor 26 transmits a signal to the linear motor 15, and the linear motor 15 stops working. Similarly, when the mounting rod 16 moves inward from the mounting plate 14 beyond a certain limit, the first sensor 26 senses the other side wall of the sensing notch 27. At this time, the first sensor 26 transmits a signal to the linear motor 15, and the linear motor 15 stops working.

[0043] In a preferred embodiment, the rotating mechanism includes a rotating motor 29, a first pulley 33, a second pulley 34, a second mounting plate 30, and a rotating shaft 31. The rotating shaft 31 is rotatably mounted on the second mounting plate 30, which is fixedly mounted on the bracket 1. The mounting disc 14 is coaxially fixedly mounted on the upper end of the rotating shaft 31, and the second pulley 34 is coaxially fixedly mounted on the lower end of the rotating shaft 31. The rotating motor 29 is fixedly mounted on the second mounting plate 30, and the first pulley 33 is fixedly mounted on the output shaft of the rotating motor 29. The first pulley 33 and the second pulley 34 are connected by a belt 32. With this configuration, when the rotating motor 29 rotates, it drives the first pulley 33 to rotate. The first pulley 33 drives the second pulley 33 to rotate via the belt 32. Since the second pulley 33 is coaxially and fixedly connected to the rotating 31, it drives the mounting plate 14 to rotate, which in turn drives the entire wafer clamping claw to rotate. The rotating plate 35, the mounting plate 14, the rotating shaft 31, and the second pulley 14 are all provided with through holes for the support rod 10 to pass through. This ensures that when the rotating plate 35, the mounting plate 14, the rotating shaft 31, and the second pulley 14 rotate, it does not affect the support rod 10. At the same time, when the lifting motor 8 drives the support rod 10 to move up and down, it does not affect the rotation of the entire wafer clamping claw.

[0044] Preferably, the detection device 3 includes at least a pair of detection sensors, all of which are signal-connected to the PCBA circuit board 40. There is a preset gap between the two detection sensors in the same pair. One of the detection sensors in the same pair is located below the support claw 5, and the other detection sensor is located above the support claw 5. This allows the detection sensors to detect the edge of the wafer 36 placed on the support claw 5, and to detect whether there is a wafer on the support claw 5 and to detect the notch 37 on the wafer.

Claims

1. A wafer position adjuster characterized by, The application relates to a wafer supporting device, which comprises a support frame (1) provided with a wafer supporting frame capable of horizontally placing a wafer through lifting devices, and provided with a wafer clamping claw through rotating mechanisms, the free end of the wafer clamping claw is upward, the moving path of each claw toe (2) of the wafer clamping claw is parallel to the upper surface of the support frame (1), the vertical central axis of the wafer supporting frame is collinear with the vertical central axis of the wafer clamping claw, the wafer supporting frame is provided with a clamping gap matched with the claw toe (2), the support frame (1) is provided with detection devices (3) matched with the wafer clamping claw, and the detection devices (3) are signal connected with the rotating mechanisms and the lifting devices.

2. The wafer position adjuster according to claim 1, wherein The wafer supporting frame comprises a supporting disc (4) and supporting claws (5), the supporting disc (4) is arranged on the support frame (1) and is parallel to the upper surface of the support frame (1), at least three supporting claws (5) are arranged around the central axis of the supporting disc (4), the top ends of all the supporting claws (5) are located at the same height, and the lower surface of the supporting disc (4) is fixedly connected with the executing end of the lifting devices.

3. The wafer position adjuster of claim 2, wherein One end of the connecting rod A (6) is fixedly connected with the supporting disc (4), the other end of the connecting rod A (6) is fixedly provided with the supporting claw (5), and the connecting rod A (6) is parallel to the upper surface of the support frame (1).

4. The wafer position adjuster of claim 1, wherein The lifting devices comprise a first mounting plate (7), a lifting motor (8), an eccentric wheel (9) and a supporting rod (10), the first mounting plate (7) and the lifting motor (8) are fixedly arranged in the support frame (1), the first mounting plate (7) is provided with a first sliding rail (11) perpendicular to the upper surface of the support frame (1), a sliding block (12) is slidingly arranged between the two ends of the first sliding rail (11), the lower end of the supporting rod (10) is fixedly connected with the sliding block (12), the supporting rod (10) is parallel to the first sliding rail (11), the top end of the supporting rod (10) is fixedly connected with the wafer supporting frame, one end surface of the eccentric wheel (9) is fixedly connected with the output shaft of the lifting motor (8), the output shaft of the lifting motor (8) is parallel to the upper surface of the support frame (1) and perpendicular to the end surface of the eccentric wheel (9), a notch (13) is arranged on the side wall of the sliding block (12) and parallel to the supporting rod (10), the upper side wall of the notch (13) is slidingly connected with the circumferential surface of the eccentric wheel (9), and the length of the notch (13) is greater than the diameter of the eccentric wheel (9).

5. The wafer position adjuster of claim 1, wherein The wafer clamping claw comprises a mounting disc (14), a linear motor (15), a mounting rod (16) and the claw toe (2), the mounting disc (14) is rotationally arranged on the support (1), at least three second sliding rails (17) are arranged around the center of the mounting disc (14) on the mounting disc (14), all the second sliding rails (17) are parallel to the upper surface of the support (1), one end of each second sliding rail (17) is towards the center of the mounting disc (14), the other end is towards the outside of the mounting disc (14), the two ends of each mounting rod (16) are connected with the mounting disc (14) through a second sliding rail (17), the mounting rod (16) is parallel to the second sliding rail (17), one claw toe (2) is arranged at the end of the mounting rod (16) away from the center of the mounting disc (14), a first pin shaft (18) is arranged at the end of the mounting rod (16) towards the center of the mounting disc (14), all the first pin shafts (18) are perpendicular to the upper surface of the support (1), one end of each connecting rod B (19) is rotationally connected with a first pin shaft (18), a rotating disc (35) is coaxially arranged on the mounting disc (14), a second pin shaft (20) corresponding to each connecting rod B (19) is uniformly arranged on the upper surface of the rotating disc (35), all the second pin shafts (20) are parallel to all the first pin shafts (18), the other end of the connecting rod B (19) is rotationally connected with a second pin shaft (20), the mounting disc (14) is fixedly provided with the linear motor (15), a driving rod (21) is fixedly arranged on the output shaft of the linear motor (15) in the radial direction, the driving rod (21) is parallel to the upper surface of the support (1), the driving rod (21) is fixedly connected with one side of the mounting rod (16), the output shaft of the linear motor (15) is parallel to the mounting rod (16) fixedly connected with the driving rod (21), all the mounting rods (16) are circumferentially and equidistantly arranged on the mounting disc (14), the mounting disc (14) is coaxially fixedly connected with the output shaft of the rotating mechanism, the distance from the end of the mounting rod (16) away from the center of the mounting disc (14) to the center of the mounting disc (14) is greater than the distance from the outer edge of the wafer support frame to the center of the mounting disc (14).

6. The wafer position adjuster of claim 5, wherein The side wall of the mounting rod (16) connected with the driving rod (21) is provided with a U-shaped part (22), the projection of the U-shaped part (22) on the mounting disc (14) is a U shape, the closed end of the U-shaped part (22) is fixedly connected with the mounting rod (16) connected with the driving rod (21), one end of the driving rod (21) away from the output shaft of the linear motor (15) is located in the U shape of the U-shaped part (22), the U-shaped part (22) is provided with a pin (23), the pin (23) is parallel to the mounting rod (16) on which the U-shaped part (22) is arranged, the driving rod (21) is provided with a through hole (24) whose axis is parallel to the output shaft of the linear motor (15), the through hole (24) is penetrated between the two ends of the pin (23), the two ends of the pin (23) are fixed on the U-shaped part (22), and a spring (25) is sleeved between one side of the mounting rod (16) on which the U-shaped part (22) is arranged and the inner side wall of the U-shaped part (22) towards the center of the mounting disc (14).

7. The wafer position adjuster of claim 5, wherein The mounting disc (14) is provided with a first sensor (26), and the side wall of part of the mounting rod (16) is provided with an additional plate (28), the additional plate (28) is provided with an inductive notch (27) matched with the first sensor (26), the additional plate (28) is parallel to the mounting rod (16) on which the additional plate (28) is arranged, and the first sensor (26) is signal-connected with the linear motor (15).

8. The wafer position adjuster of claim 5, wherein The rotating mechanism comprises a rotating motor (29), a first pulley (33), a second pulley (34), a second mounting plate (30) and a rotating shaft (31), the rotating shaft (31) is rotatably arranged on the second mounting plate (30), the second mounting plate (30) is fixedly arranged on the support (1), the upper end of the rotating shaft (31) is coaxially fixedly arranged with the mounting disc (14), the lower end of the rotating shaft (31) is coaxially fixedly arranged with the second pulley (34), the rotating motor (29) is fixedly arranged on the second mounting plate (30), the output shaft of the rotating motor (29) is fixedly arranged with the first pulley (33), and the first pulley (33) and the second pulley (34) are drivingly connected through a belt (32).

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