Wafer fixing platform for wafer bumping

Abstract

The present invention provides a wafer fixing platform for wafer bumping, at least comprising: a Z-axis lifting / lowering and rotating mechanism, wherein the Z-axis lifting / lowering and rotating mechanism comprises a first bottom plate, a plurality of first lifting / lowering mechanisms, a first mounting plate, and a bumping steel mesh suction plate; the bumping steel mesh suction plate is detachably fitted to the first mounting plate; the first lifting / lowering mechanisms are configured to reciprocate in the Z-axis direction to drive the first mounting plate and the bumping steel mesh suction plate to reciprocate in the Z-axis direction; the Z-axis lifting / lowering and rotating mechanism further comprises a second bottom plate, a plurality of second lifting / lowering mechanisms, a second mounting plate, and a wafer chuck; the wafer chuck is detachably fitted to the second mounting plate, and a plurality of magnet blocks are arranged in an array between the wafer chuck and the second mounting plate; the second lifting / lowering mechanisms are configured to reciprocate in the Z-axis direction to drive the second mounting plate and the wafer chuck to reciprocate in the Z-axis direction. In the present invention, during wafer bumping, the plurality of magnet blocks attract a steel mesh to the surface of a wafer, so that the wafer is smoothly fitted to the steel mesh, thereby improving the precision of water bumping.

Description

Wafer fixing platform for wafer ball mounting TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer ball mounting, and particularly relates to a wafer fixing platform for wafer ball mounting. BACKGROUND

[0002] Wafer ball mounting refers to mounting solder balls on the surface of a wafer through a steel mesh (template), for example, arranging a steel mesh (template) on the surface of a wafer and mounting solder balls (for example, tin balls, copper balls, etc.) on the surface of the wafer through the apertures of the steel mesh (template).

[0003] When wafer ball mounting is performed, a wafer and a steel mesh (template) need to be fixed through a wafer fixing platform. In the prior art, the wafer fixing platform has a structure that is not compact and has a large volume, and the replacement process of equipment parts is complicated when different sizes of wafers are replaced. Moreover, when a wafer is attached to a steel mesh (template) during wafer ball mounting by using the existing wafer fixing platform, the wafer is often not flat, thereby affecting the precision of wafer ball mounting and reducing the product quality of the wafer after ball mounting. SUMMARY

[0004] The present application provides a wafer fixing platform for wafer ball mounting to solve the technical problem that, in the prior art, when a wafer is attached to a steel mesh (template) during wafer ball mounting, the wafer is not flat, thereby affecting the precision of wafer ball mounting.

[0005] One aspect of the present application is to provide a wafer fixing platform for wafer ball mounting, which at least comprises a Z-direction lifting and rotating mechanism.

[0006] The Z-direction lifting and rotating mechanism comprises a first bottom plate, a plurality of first lifting mechanisms, a first mounting plate and a ball mounting steel mesh suction plate.

[0007] The plurality of first lifting mechanisms are fixed to the first bottom plate, the first mounting plate is fixed to the top of the plurality of first lifting mechanisms, and the ball mounting steel mesh suction plate is detachably attached to the first mounting plate.

[0008] The first lifting mechanism is configured to reciprocate along the Z direction, and drive the first mounting plate and the ball mounting steel mesh suction plate to reciprocate along the Z direction.

[0009] The Z-direction lifting and rotating mechanism further comprises a second bottom plate, a plurality of second lifting mechanisms, a second mounting plate and a wafer suction disc.

[0010] The second bottom plate is mounted on the first bottom plate, and the second bottom plate is configured to rotate around the Z direction relative to the first bottom plate.

[0011] A plurality of the second lifting mechanisms are fixed on the second bottom plate, the second mounting plate is fixed on the top of the plurality of second lifting mechanisms, the wafer chuck is detachably attached to the second mounting plate, and a plurality of magnet blocks are arranged between the wafer chuck and the second mounting plate;

[0012] The second lifting mechanism is configured to reciprocate along the Z direction to drive the second mounting plate and the wafer chuck to reciprocate along the Z direction;

[0013] The first opening of the ball mounting steel wire mesh suction plate and the second opening of the first mounting plate are provided, so that the second mounting plate and the wafer chuck pass through the first mounting plate and the ball mounting steel wire mesh suction plate;

[0014] The Z-direction lifting and rotating mechanism further comprises a plurality of suction nozzles and a power-on degaussing electromagnet mounted on the second bottom plate; the wafer chuck is provided with a suction nozzle hole for passing through the plurality of suction nozzles;

[0015] The second mounting plate is provided with a third opening, so that the plurality of suction nozzles and the power-on degaussing electromagnet pass through the second mounting plate.

[0016] In a preferred embodiment, the wafer fixing platform further comprises an X-direction linear motor module and a Y-direction linear motor module;

[0017] The first bottom plate of the Z-direction lifting and rotating mechanism is connected with the Y-direction linear motor module, and the Y-direction linear motor module is connected with the X-direction linear motor module;

[0018] The Y-direction linear motor module is used to drive the Z-direction lifting and rotating mechanism to reciprocate along the Y direction;

[0019] The X-direction linear motor module is used to drive the Y-direction linear motor module and the Z-direction lifting and rotating mechanism to reciprocate along the X direction.

[0020] In a preferred embodiment, the first bottom plate and the second bottom plate are connected by a rotating disc;

[0021] A rotating drive motor is fixed on the first bottom plate, and the rotating drive motor is connected with the second bottom plate through a rotating connecting piece;

[0022] The rotating drive motor is used to drive the rotating connecting piece to drive the second bottom plate to rotate around the Z direction relative to the first bottom plate.

[0023] In a preferred embodiment, a ball mounting steel wire mesh suction plate air port is mounted on the first mounting plate, which is used to vacuum the inside of the ball mounting steel wire mesh suction plate;

[0024] A wafer chuck air port is installed on the second mounting plate to vacuum the interior of the wafer chuck.

[0025] In a preferred embodiment, a nozzle base is fixed on the second bottom plate, and a plurality of nozzles are installed on the nozzle base.

[0026] A power demagnetization type electromagnet base is fixed on the nozzle base, and a power demagnetization type electromagnet is installed on the power demagnetization type electromagnet base.

[0027] In a preferred embodiment, a nozzle air port is arranged on the nozzle base to vacuum the interior of the nozzle.

[0028] In a preferred embodiment, a plurality of magnet grooves are arranged on the lower surface of the wafer chuck, and a plurality of magnet blocks are embedded in the magnet grooves to array a plurality of magnet blocks between the wafer chuck and the second mounting plate.

[0029] In a preferred embodiment, the ball mounting steel wire mesh suction plate is fixed to the first mounting plate through a plurality of buckles, so that the ball mounting steel wire mesh suction plate and the first mounting plate can be detachably attached.

[0030] In a preferred embodiment, the first lifting mechanism includes a first housing fixed to the first bottom plate.

[0031] A first bearing is installed in the first housing, the outer ring of the first bearing is fixed to the inner wall of the first housing, and the inner ring of the first bearing is fixed to a first belt pulley.

[0032] A first screw rod nut is embedded and fixed in the first belt pulley, a first screw rod is installed in the first screw rod nut, a first connecting block is fixed to the top of the first screw rod, and the first connecting block is fixed to the first mounting plate.

[0033] When the first belt pulley rotates, the first belt pulley drives the first screw rod nut to rotate, the first screw rod drives the first connecting block to reciprocate along the Z direction, thereby driving the first mounting plate and the ball mounting steel wire mesh suction plate to reciprocate along the Z direction.

[0034] In a preferred embodiment, the second lifting mechanism includes a second housing fixed to the second bottom plate.

[0035] A second bearing is installed in the second housing, the outer ring of the second bearing is fixed to the inner wall of the second housing, and the inner ring of the second bearing is fixed to a second belt pulley.

[0036] The second pulley is inlaidly fixed with a second screw nut, the second screw nut is internally provided with a second screw rod, the top of the second screw rod is fixed with a second connecting block, and the second connecting block is fixed with the second mounting plate;

[0037] When the second pulley rotates, the second pulley drives the second screw nut to rotate, the second screw rod drives the second connecting block to reciprocate along the Z direction, so as to drive the second mounting plate and the wafer chuck to reciprocate along the Z direction.

[0038] Compared with the prior art, the present application has the following beneficial effects:

[0039] The wafer fixing platform for wafer ball planting provided by the present application is provided with a plurality of magnet blocks between the wafer chuck and the second mounting plate, and the plurality of magnet blocks can adsorb the steel mesh to the surface of the wafer when the wafer is planted, so that the wafer is flat and adheres to the steel mesh. The wafer chuck is adsorbed by the energized degaussing electromagnet, so that the wafer chuck is more flat and stable, thereby improving the precision of wafer ball planting and the quality of the wafer after ball planting.

[0040] The wafer fixing platform for wafer ball planting provided by the present application is provided with a plurality of magnet blocks between the wafer chuck and the second mounting plate, and the plurality of magnet blocks can adsorb the steel mesh to the surface of the wafer when the wafer is planted, so that the wafer is flat and adheres to the steel mesh. The wafer chuck is adsorbed by the energized degaussing electromagnet, so that the wafer chuck is more flat and stable, thereby improving the precision of wafer ball planting and the quality of the wafer after ball planting.

[0041] The wafer fixing platform for wafer ball planting provided by the present application is provided with a plurality of magnet blocks between the wafer chuck and the second mounting plate, and the plurality of magnet blocks can adsorb the steel mesh to the surface of the wafer when the wafer is planted, so that the wafer is flat and adheres to the steel mesh. The wafer chuck is adsorbed by the energized degaussing electromagnet, so that the wafer chuck is more flat and stable, thereby improving the precision of wafer ball planting and the quality of the wafer after ball planting.

[0042] The wafer fixing platform for wafer ball planting provided by the present application is provided with a plurality of magnet blocks between the wafer chuck and the second mounting plate, and the plurality of magnet blocks can adsorb the steel mesh to the surface of the wafer when the wafer is planted, so that the wafer is flat and adheres to the steel mesh. The wafer chuck is adsorbed by the energized degaussing electromagnet, so that the wafer chuck is more flat and stable, thereby improving the precision of wafer ball planting and the quality of the wafer after ball planting. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any inventive labor.

[0044] Fig. 1 is a schematic diagram of the overall structure of a wafer fixing platform for wafer ball planting according to the present application.

[0045] Figure 2 is a schematic diagram of the Z-direction lifting and rotating mechanism of the present application.

[0046] Figure 3 is a schematic diagram of the Z-direction lifting and rotating mechanism of the present application.

[0047] Figure 4 is a schematic diagram of the Z-direction lifting and rotating mechanism of the present application in a state where the ball-planting steel mesh suction plate, the first mounting plate, and the wafer suction disc are separated.

[0048] Figure 5 is a top view of the Z-direction lifting and rotating mechanism of the present application in a state where the ball-planting steel mesh suction plate, the first mounting plate, and the wafer suction disc are removed.

[0049] Figure 6 is a sectional view of the first lifting mechanism of the present application.

[0050] Figure 7 is a top view of the wafer suction disc of the present application.

[0051] Figure 8 is a schematic diagram of the wafer suction disc of the present application in a state where a plurality of magnet grooves are formed in the lower surface array.

[0052] Figure 9 is a schematic diagram of the Z-direction lifting and rotating mechanism of the present application in a state where the ball-planting steel mesh suction plate, the first mounting plate, the wafer suction disc, and the second mounting plate are separated.

[0053] Figure 10 is a top view of the Z-direction lifting and rotating mechanism of the present application in a state where the ball-planting steel mesh suction plate, the first mounting plate, the wafer suction disc, and the second mounting plate are removed.

[0054] Figure 11 is a sectional view of the second lifting mechanism of the present application.

[0055] Figure 12 is a schematic diagram of the suction nozzle of the present application in a state of suctioning a wafer.

[0056] Figure 13 is a schematic diagram of the wafer suction disc of the present application in a state of suctioning a wafer.

[0057] Figure 14 is a schematic diagram of the ball-planting steel mesh suction plate of the present application in a state of suctioning a steel mesh.

[0058] Figure 15 is a schematic diagram of the wafer and the steel mesh of the present application in a state of being attached.

[0059] Figure 16 is a schematic diagram of the ball-planting steel mesh suction plate, the first mounting plate, the wafer suction disc, and the second mounting plate of the present application in a state of being lowered to the upper surface of the wafer suction disc and being flush with the suction nozzle.

[0060] Figure 17 is a schematic diagram of the ball-planting steel mesh suction plate, the first mounting plate, the wafer suction disc, and the second mounting plate of the present application in a state of being lowered and reset after the wafer ball-planting is completed. DETAILED DESCRIPTION

[0061] In order to make the above and other features and advantages of the present application clearer, the present application will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for illustrative purposes only and are not limiting.

[0062] In combination with FIG. 1 to FIG. 11, according to the embodiment of the present application, a wafer fixing platform for wafer ball mounting is provided, comprising: an X-direction linear motor module 1, a Y-direction linear motor module 2 and a Z-direction lifting and rotating mechanism 3.

[0063] In order to make the present application more clearly, an XYZ rectangular coordinate system is established, the direction of X-axis is X-direction, the direction of Y-axis is Y-direction, and the direction of Z-axis is Z-direction, as shown in FIG. 1.

[0064] The Z-direction lifting and rotating mechanism 3 is connected with the Y-direction linear motor module 2, and the Y-direction linear motor module 2 is connected with the X-direction linear motor module 1. The Y-direction linear motor module 2 is used for driving the Z-direction lifting and rotating mechanism 3 to reciprocate along the Y-direction, and the X-direction linear motor module 1 is used for driving the Y-direction linear motor module 2 and the Z-direction lifting and rotating mechanism 3 to reciprocate along the X-direction.

[0065] In combination with FIG. 2 to FIG. 11, according to the embodiment of the present application, the Z-direction lifting and rotating mechanism comprises a first bottom plate 301, a plurality of first lifting mechanisms 312, a first mounting plate 303 and a ball mounting steel wire mesh suction plate 302.

[0066] The plurality of first lifting mechanisms 312 are fixed on the first bottom plate 301, the first mounting plate 303 is fixed on the top of the plurality of first lifting mechanisms 312, and the ball mounting steel wire mesh suction plate 302 is detachably attached to the first mounting plate 303.

[0067] Further, the first bottom plate 301 of the Z-direction lifting and rotating mechanism 3 is connected with the Y-direction linear motor module 2. Specifically, the first bottom plate 301 is connected with the slider of the Y-direction linear motor module 2, so that the Y-direction linear motor module 2 drives the Z-direction lifting and rotating mechanism 3 to reciprocate along the Y-direction. The Y-direction linear motor module 2 is connected with the slider of the X-direction linear motor module 1, so that the X-direction linear motor module 1 drives the Y-direction linear motor module 2 and the Z-direction lifting and rotating mechanism 3 to reciprocate along the X-direction, as shown in FIG. 1.

[0068] In combination with FIG. 2, FIG. 3 and FIG. 4, further, the ball mounting steel wire mesh suction plate 302 is fixed with the first mounting plate 303 through a plurality of buckles 3031, so that the ball mounting steel wire mesh suction plate 302 is detachably attached to the first mounting plate 303. When it is needed to replace the ball mounting steel wire mesh suction plate 302, the ball mounting steel wire mesh suction plate 302 can be separated from the first mounting plate 303 by loosening the buckles 3031, so that the ball mounting steel wire mesh suction plate 302 is replaced.

[0069] In the embodiment, four buckles 3031 are provided, and in other embodiments, the number of buckles 3031 is set according to specific needs, which is not specifically limited in the present application.

[0070] According to an embodiment of the present application, the first lifting mechanism 312 is configured to drive the first mounting plate 303 and the ball-planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0071] As shown in FIG. 4 and FIG. 5, in the present embodiment, four first lifting mechanisms 312 are arranged at the four corners of the first bottom plate 301. The four first lifting mechanisms 312 drive the first mounting plate 303 and the ball-planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0072] Specifically, as shown in FIG. 6, taking one first lifting mechanism 312 as an example. The first lifting mechanism 312 comprises a first casing 3126 fixed with the first bottom plate 301. A first bearing 3124 is installed in the first casing 3126, the outer ring of the first bearing 3124 is fixed with the inner wall of the first casing 3126, and the inner ring of the first bearing 3124 is fixed with a first pulley 3123.

[0073] The first pulley 3123 is embeddedly fixed with a first screw nut 3122, the first screw nut 3122 is installed with a first screw rod 3127, the top of the first screw rod 3127 is fixed with a first connecting block 3121, and the first connecting block 3121 is fixed with the first mounting plate 303.

[0074] When the first pulley 3123 rotates, the first pulley 3123 drives the first screw nut 3122 to rotate, the first screw rod 3127 drives the first connecting block 3121 to reciprocate along the Z direction, thereby driving the first mounting plate 303 and the ball-planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0075] In a preferred embodiment, a first bearing inner ring pressing sheet 3125 is arranged at the bottom surface of the first bearing 3124 to limit the inner ring of the first bearing 3124 from moving along the Z direction.

[0076] In a further preferred embodiment, the outer wall of the first casing 3126 is fixed with a first sliding block 31210, the first sliding block 31210 is slidingly connected with a first sliding rail 3129, the first sliding rail 3129 is fixed with a first sliding rail seat 3128, and the top of the first sliding rail seat 3128 is fixed with the first mounting plate 303.

[0077] When the first screw rod 3127 drives the first connecting block 3121 to reciprocate along the Z direction, thereby driving the first mounting plate 303 and the ball-planting wire mesh suction plate 302 to reciprocate along the Z direction, the first sliding rail 3129 slides relative to the first sliding block 31210, and the first sliding rail 3129 and the first sliding rail seat 3128 reciprocate along the Z direction.

[0078] In combination with FIG. 4 and FIG. 5, in the embodiment, the first lifting motor 313 is fixed on the first bottom plate 301, and the output shaft of the first lifting motor 313 and the first pulley 3123 of the four first lifting mechanisms 312 are connected by the first belt 314. When the first lifting motor 313 works, the first belt 314 drives the first pulley 3123 of the four first lifting mechanisms 312 to rotate, so that the first connecting block 3121 of the four first lifting mechanisms 312 simultaneously reciprocates along the Z direction, thereby driving the first mounting plate 303 and the ball mounting steel wire mesh suction plate 302 to reciprocate along the Z direction.

[0079] In combination with FIG. 2 to FIG. 11, according to the embodiment of the application, the Z-direction lifting and rotating mechanism 3 further comprises a second bottom plate 306, a plurality of second lifting mechanisms 315, a second mounting plate 305 and a wafer suction disc 304.

[0080] The second bottom plate 306 is installed on the first bottom plate 301, and the second bottom plate 306 is configured to rotate relative to the first bottom plate 301 around the Z direction.

[0081] Specifically, in combination with FIG. 2, FIG. 3, FIG. 9 and FIG. 10, the first bottom plate 301 and the second bottom plate 306 are rotationally connected through the rotating disc 307, as shown in FIG. 3.

[0082] The rotating driving motor 318 is fixed on the first bottom plate 301 and connected to the second bottom plate 306 through the rotating connecting piece 319. The rotating driving motor 318 is used to drive the rotating connecting piece 319 to drive the second bottom plate 306 to rotate relative to the first bottom plate 301 around the Z direction, as shown by the arrow a in FIG. 10.

[0083] In combination with FIG. 9 and FIG. 10, according to the embodiment of the application, the plurality of second lifting mechanisms 315 are fixed on the second bottom plate 306, the second mounting plate 305 is fixed on the top of the plurality of second lifting mechanisms 315, the wafer suction disc 304 is detachably attached to the second mounting plate 305, and a plurality of magnet blocks 3041 are arranged between the wafer suction disc 304 and the second mounting plate 305.

[0084] As shown in FIG. 8, a plurality of magnet grooves 3043 are arranged on the lower surface of the wafer suction disc 304, and the plurality of magnet blocks 3041 are embedded in the plurality of magnet grooves 3043, so that the plurality of magnet blocks 3041 are arranged between the wafer suction disc 304 and the second mounting plate 305, and the plurality of magnet blocks 3041 attract the wafer suction disc 304 and the second mounting plate 305.

[0085] According to the embodiment of the application, the second lifting mechanism 315 is configured to reciprocate along the Z direction, thereby driving the second mounting plate 305 and the wafer suction disc 304 to reciprocate along the Z direction.

[0086] As shown in FIG. 9 and FIG. 10, in the embodiment, four second lifting mechanisms 315 are arranged at four corners of the second bottom plate 306. By reciprocating the four second lifting mechanisms 315 along the Z direction, the second mounting plate 305 and the wafer chuck 304 are driven to reciprocate along the Z direction.

[0087] In the embodiment, the second lifting mechanism 315 has the same structure as the first lifting mechanism 312. Specifically, as shown in FIG. 11, taking one second lifting mechanism 315 as an example. The second lifting mechanism 315 comprises a second housing 3156 fixed with the second bottom plate 306. A second bearing 3154 is installed in the second housing 3156. The outer ring of the second bearing 3154 is fixed with the inner wall of the second housing 3156, and the inner ring of the second bearing 3154 is fixed with a second pulley 3153.

[0088] The second pulley 3153 is embeddedly fixed with a second screw nut 3152, the second screw nut 3152 is installed with a second screw rod 3157, the top of the second screw rod 3157 is fixed with a second connecting block 3151, and the second connecting block 3151 is fixed with the second mounting plate 305.

[0089] When the second pulley 3153 rotates, the second pulley 3153 drives the second screw nut 3152 to rotate, the second screw rod 3157 drives the second connecting block 3151 to reciprocate along the Z direction, thereby driving the second mounting plate 305 and the wafer chuck 304 to reciprocate along the Z direction.

[0090] In a preferred embodiment, a second bearing inner ring pressing sheet 3155 is arranged at the bottom surface of the second bearing 3154 to limit the inner ring of the second bearing 3154 from moving along the Z direction.

[0091] In a further preferred embodiment, the outer wall of the second housing 3156 is fixed with a second sliding block 31510, the second sliding block 31510 is slidingly connected with a second sliding rail 3159, the second sliding rail 3159 is fixed with a second sliding rail seat 3158, and the top of the second sliding rail seat 3158 is fixed with the second mounting plate 305.

[0092] When the second screw rod 3157 drives the second connecting block 3151 to reciprocate along the Z direction, thereby driving the second mounting plate 305 and the wafer chuck 304 to reciprocate along the Z direction, the second sliding rail 3159 slides relative to the second sliding block 31510, and the second sliding rail 3159 and the second sliding rail seat 3158 reciprocate along the Z direction.

[0093] In combination with FIG. 9 and FIG. 10, in the embodiment, the second lifting motor 316 is fixed on the second bottom plate 306, the output shaft of the second lifting motor 316, and the second pulley 3153 of the four second lifting mechanisms 315 are connected by the second belt 317. When the second lifting motor 316 works, the second belt 317 drives the second pulley 3153 of the four second lifting mechanisms 315 to rotate, so that the second connecting block 3151 of the four second lifting mechanisms 315 moves along the Z direction at the same time, thereby driving the second mounting plate 305 and the wafer chuck 304 to move along the Z direction.

[0094] As shown in FIG. 9, according to the embodiment of the present application, the first opening K1 is opened in the ball mounting wire mesh suction plate 302, and the second opening K2 is opened in the first mounting plate 303, so that the second mounting plate 305 and the wafer chuck 304 pass through the first mounting plate 303 and the ball mounting wire mesh suction plate 302. That is, when the second mounting plate 305 and the wafer chuck 304 move along the Z direction, the second mounting plate 305 and the wafer chuck 304 shuttle in the first opening K1 and the second opening K2.

[0095] In combination with FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 9 and FIG. 10, according to the embodiment of the present application, the Z direction lifting and rotating mechanism 3 further comprises a plurality of suction nozzles 309 and a power-on degaussing type electromagnet 311 mounted on the second bottom plate 305.

[0096] Specifically, the suction nozzle base 308 is fixed on the second bottom plate 305, and the plurality of suction nozzles 309 are mounted on the suction nozzle base 308. In the embodiment, three suction nozzles 309 are provided, and in some embodiments, the number of suction nozzles is set according to specific needs, which is not limited in the present application.

[0097] The power-on degaussing type electromagnet base 310 is fixed on the suction nozzle base 308, and the power-on degaussing type electromagnet 311 is mounted on the power-on degaussing type electromagnet base 310.

[0098] As shown in FIG. 7, the wafer chuck 304 is provided with a plurality of suction nozzle holes 3042 for passing through the plurality of suction nozzles 309. When the wafer chuck 304 moves along the Z direction, the plurality of suction nozzles 309 shuttle in the plurality of suction nozzle holes 3042.

[0099] In the embodiment, three suction nozzle holes 3042 are provided, and in some embodiments, the number of suction nozzle holes 3042 is set according to the number of suction nozzles 309, that is, the number of suction nozzle holes 3042 is the same as the number of suction nozzles 309.

[0100] As shown in FIG. 9 and FIG. 10, according to the embodiment of the present application, the third opening K3 is opened in the second mounting plate 305, so that the plurality of suction nozzles 309 and the power-on degaussing type electromagnet 311 pass through the second mounting plate 305.

[0101] When the second mounting plate 305 reciprocates along the Z direction, the plurality of suction nozzles 309 and the energized degaussing electromagnet 311 shuttle in the third opening K3.

[0102] When the second mounting plate 305 and the wafer chuck 304 move downward along the Z direction to the initial position (the initial position refers to the initial position of the second mounting plate 305 and the wafer chuck 304 before the ball mounting of the wafer is performed), the energized degaussing electromagnet 311 adsorbs the wafer chuck 304. When the ball mounting of the wafer of different sizes is performed, the wafer chuck 304 is replaced, and only the energized degaussing electromagnet 311 is energized, and the adsorption of the wafer chuck 304 by the energized degaussing electromagnet 311 is eliminated, so that the wafer chuck 304 can be replaced.

[0103] According to the embodiment of the present application, the ball mounting steel mesh suction plate air port 3021 is mounted on the first mounting plate 303, and is used to vacuumize the inside of the ball mounting steel mesh suction plate 302. Specifically, the ball mounting steel mesh suction plate air port 3021 is mounted on the lower surface of the first mounting plate 303, as shown in FIG. 2 and FIG. 9. In this embodiment, four ball mounting steel mesh suction plate air ports 3021 are mounted on the lower surface of the first mounting plate 303 at the positions of the four buckles 3031.

[0104] The ball mounting steel mesh suction plate 302 is hollow inside, and the upper surface of the ball mounting steel mesh suction plate 302 has a plurality of suction holes for adsorbing the steel mesh. When the ball mounting steel mesh suction plate air port 3021 is vacuumized, the ball mounting steel mesh suction plate 302 adsorbs the steel mesh through the suction holes on the upper surface.

[0105] According to the embodiment of the present application, the wafer chuck air port 3044 is mounted on the second mounting plate 305, and is used to vacuumize the inside of the wafer chuck 304. Specifically, the wafer chuck air port 3044 is mounted on the lower surface of the second mounting plate 305, as shown in FIG. 10. In this embodiment, three wafer chuck air ports 3044 are mounted on the lower surface of the second mounting plate 305, as shown in FIG. 10.

[0106] The wafer chuck 304 is hollow inside, and the upper surface of the wafer chuck 304 has a plurality of suction holes for adsorbing the wafer. When the wafer chuck air port 3044 is vacuumized, the wafer chuck 304 adsorbs the wafer through the suction holes on the upper surface.

[0107] According to the embodiment of the present application, the suction nozzle air port 3091 is arranged on the suction nozzle base 308, and is used to vacuumize the inside of the suction nozzle 309, as shown in FIG. 3. When the suction nozzle air port 3091 is vacuumized, the suction nozzle 309 adsorbs the wafer.

[0108] The working process of the wafer fixing platform for wafer ball mounting according to the present application is described in detail below.

[0109] In combination with FIGS. 12-17, before the wafer fixing platform for wafer ball mounting is started, the second mounting plate 305 and the wafer chuck 304 are located at the initial position, the wafer chuck 304 is located in the first opening K1 of the ball mounting steel wire mesh suction plate 302, and the second mounting plate 305 is located in the second opening K2 of the first mounting plate 303. The energized degaussing electromagnet 311 passes through the third opening K3 of the second mounting plate 305 to adsorb the wafer chuck 304, the suction nozzle 309 passes through the third opening K3 of the second mounting plate 305 and the suction nozzle hole 3042 of the wafer chuck 304, and extends to the upper surface of the wafer chuck 304, as shown in FIGS. 2 and 12.

[0110] The working process of the wafer fixing platform for wafer ball mounting includes the following steps:

[0111] Step S1, the suction nozzle 309 adsorbs the wafer J.

[0112] The wafer interface gripper transports the wafer J to above the suction nozzle 309, the suction nozzle 309 draws vacuum through the suction nozzle air port 3091, and the suction nozzle 309 adsorbs the wafer J, as shown in FIG. 12.

[0113] Step S2, the wafer chuck 304 adsorbs the wafer J.

[0114] The energized degaussing electromagnet 311 is energized to eliminate the adsorption of the wafer chuck 304 by the energized degaussing electromagnet 311.

[0115] The second lifting motor 316 is started to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer chuck 304 to move upward along the Z direction to the position where the upper surface of the wafer chuck 304 is flush with the suction nozzle 309. The wafer chuck 304 draws vacuum through the wafer chuck air port 3044, the suction nozzle 309 breaks vacuum, and the wafer chuck 304 adsorbs the wafer J, as shown in FIG. 13.

[0116] The Y-direction linear motor module 2 and the X-direction linear motor module 1 drive the Z-direction lifting and rotating mechanism 3 to move to a working position below the steel mesh G, as shown in FIG. 13.

[0117] In an embodiment, if the wafer J needs to be adjusted in position, the rotary drive motor 318 is started to drive the rotary connecting piece 319 to drive the second bottom plate 306 to rotate around the Z direction relative to the first bottom plate 301, so that the second lifting mechanism 315, the suction nozzle base 308, the energized degaussing electromagnet 311, the suction nozzle 309, the second mounting plate 305 and the wafer chuck 304 on the second bottom plate 306 rotate as a whole around the Z direction, and the position of the wafer chuck 304 is adjusted, so that the position of the wafer J adsorbed by the wafer chuck 304 is adjusted.

[0118] Step S3, the ball mounting steel wire mesh suction plate 302 adsorbs the steel mesh G.

[0119] The first lifting motor 313 is started to drive the first lifting mechanism 312 to drive the first mounting plate 303 and the ball mounting steel wire mesh suction plate 302 to move upward along the Z direction until the upper surface of the ball mounting steel wire mesh suction plate 302 is attached to the lower surface of the steel mesh G. The ball mounting steel wire mesh suction plate 302 is vacuumized through the ball mounting steel wire mesh suction plate air port 3021, and the ball mounting steel wire mesh suction plate 302 adsorbs the steel mesh G, as shown in FIG. 14.

[0120] In step S4, the wafer J is attached to the steel mesh G, and the ball mounting is performed on the wafer J.

[0121] The second lifting motor 316 is started to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction disc 304 to move upward along the Z direction until the upper surface of the wafer J adsorbed by the wafer suction disc 304 is attached to the lower surface of the steel mesh G, as shown in FIG. 15. At this time, the plurality of magnet blocks 3041 between the wafer suction disc 304 and the second mounting plate 305 adsorb the steel mesh G, so that the wafer J is more flatly attached to the steel mesh G.

[0122] After the upper surface of the wafer J is attached to the lower surface of the steel mesh G, the solder balls (such as tin balls, copper balls, etc.) are implanted into the upper surface of the wafer J through the apertures of the steel mesh G to perform a ball mounting process on the wafer J.

[0123] In step S5, the next ball mounting is performed.

[0124] The ball mounting steel wire mesh suction plate 302 is broken vacuum, the first lifting motor 313 is started to drive the first lifting mechanism 312 to drive the first mounting plate 303 and the ball mounting steel wire mesh suction plate 302 to move downward along the Z direction; at the same time, the second lifting motor 316 is started to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction disc 304 to move downward along the Z direction until the upper surface of the wafer suction disc 304 is flush with the suction nozzle 309, as shown in FIG. 16.

[0125] Then, the Y-direction linear motor module 2 and the X-direction linear motor module 1 drive the Z-direction lifting and rotating mechanism 3 to move to the next station below the steel mesh G.

[0126] The first lifting motor 313 is started to drive the first lifting mechanism 312 to drive the first mounting plate 303 and the ball mounting steel wire mesh suction plate 302 to move upward along the Z direction; at the same time, the second lifting motor 316 is started to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction disc 304 to move upward along the Z direction until the upper surface of the wafer J adsorbed by the wafer suction disc 304 is attached to the lower surface of the steel mesh G.

[0127] The ball mounting steel wire mesh suction plate 302 is vacuumized through the ball mounting steel wire mesh suction plate air port 3021, and the ball mounting steel wire mesh suction plate 302 adsorbs the steel mesh G. At this time, the wafer suction plate 304 and the ball mounting steel wire mesh suction plate 302 return to the working state shown in FIG. 15, and the plurality of magnet blocks 3041 between the wafer suction plate 304 and the second mounting plate 305 adsorb the steel mesh G, so that the wafer J is more flatly attached to the steel mesh G.

[0128] After the upper surface of the wafer J is attached to the lower surface of the steel mesh G, the solder balls (such as tin balls, copper balls, etc.) are implanted on the upper surface of the wafer J through the apertures of the steel mesh G to perform a ball mounting process on the wafer J.

[0129] The step S5 is repeated until the ball mounting on the wafer is completed for all stations.

[0130] Step S6, reset.

[0131] After the ball mounting on the wafer is completed for the last station, the ball mounting steel wire mesh suction plate 302 is broken, the first lifting motor 313 is started, the first lifting mechanism 312 drives the first mounting plate 303 and the ball mounting steel wire mesh suction plate 302 to move downward along the Z direction to the initial position.

[0132] At the same time, the second lifting motor 316 is started, the second lifting mechanism 315 drives the second mounting plate 305 and the wafer suction plate 304 to move downward along the Z direction to the initial position, the wafer suction plate 304 is broken, and the suction nozzle 309 is vacuumized through the suction nozzle air port 3091. The suction nozzle 309 adsorbs the wafer J.

[0133] Then, the second lifting motor 316 continues to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction plate 304 to move downward along the Z direction to the initial position, and the energized degaussing electromagnet 311 is powered off. The energized degaussing electromagnet 311 adsorbs the wafer suction plate 304.

[0134] Finally, after the wafer interface gripper positions the wafer J, the suction nozzle 309 is broken, and the wafer interface gripper takes away the wafer J after the ball mounting.

[0135] Although the embodiments of the present application have been shown and described above, it should be understood that the above-described embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.

Claims

1. A wafer fixing platform for wafer ball mounting, characterized in that, The wafer fixing platform comprises at least a Z-direction lifting and rotating mechanism; The Z-direction lifting and rotating mechanism comprises a first bottom plate, a plurality of first lifting mechanisms, a first mounting plate and a ball mounting steel wire mesh suction plate; The plurality of first lifting mechanisms are fixed on the first bottom plate, the first mounting plate is fixed on the top of the plurality of first lifting mechanisms, and the ball mounting steel wire mesh suction plate is detachably attached to the first mounting plate; The first lifting mechanism is configured to reciprocate along the Z-direction to drive the first mounting plate and the ball mounting steel wire mesh suction plate to reciprocate along the Z-direction; The Z-direction lifting and rotating mechanism further comprises a second bottom plate, a plurality of second lifting mechanisms, a second mounting plate and a wafer suction disc; The second bottom plate is mounted on the first bottom plate, and the second bottom plate is configured to rotate relative to the first bottom plate around the Z-direction; The plurality of second lifting mechanisms are fixed on the second bottom plate, the second mounting plate is fixed on the top of the plurality of second lifting mechanisms, the wafer suction disc is detachably attached to the second mounting plate, and a plurality of magnet blocks are arranged between the wafer suction disc and the second mounting plate; The second lifting mechanism is configured to reciprocate along the Z-direction to drive the second mounting plate and the wafer suction disc to reciprocate along the Z-direction; The ball mounting steel wire mesh suction plate is provided with a first opening, and the first mounting plate is provided with a second opening, so that the second mounting plate and the wafer suction disc pass through the first mounting plate and the ball mounting steel wire mesh suction plate; The Z-direction lifting and rotating mechanism further comprises a plurality of suction nozzles mounted on the second bottom plate and a power-on degaussing electromagnet; the wafer suction disc is provided with a suction nozzle hole for passing through the plurality of suction nozzles; The second mounting plate is provided with a third opening for passing through the plurality of suction nozzles and the power-on degaussing electromagnet.

2. The wafer fixation stage of claim 1, wherein, The wafer fixing platform further comprises an X-direction linear motor module and a Y-direction linear motor module; The first bottom plate of the Z-direction lifting and rotating mechanism is connected with the Y-direction linear motor module, and the Y-direction linear motor module is connected with the X-direction linear motor module; The Y-direction linear motor module is used to drive the Z-direction lifting and rotating mechanism to reciprocate along the Y-direction; The X-direction linear motor module is used to drive the Y-direction linear motor module and the Z-direction lifting and rotating mechanism to reciprocate along the X-direction.

3. The wafer fixation platform of claim 1, wherein The first bottom plate and the second bottom plate are connected by a rotating disc; A rotating drive motor is fixed on the first bottom plate, and the rotating drive motor is connected with the second bottom plate through a rotating connecting piece; The rotating drive motor is used to drive the rotating connecting piece to drive the second bottom plate to rotate relative to the first bottom plate around the Z-direction.

4. The wafer fixation platform of claim 1, wherein A ball mounting steel wire mesh suction plate air port is mounted on the first mounting plate, and is used to vacuum the inside of the ball mounting steel wire mesh suction plate; A wafer suction disc air port is mounted on the second mounting plate, and is used to vacuum the inside of the wafer suction disc.

5. The wafer fixation platform of claim 1, wherein A plurality of suction nozzles are mounted on a suction nozzle base fixed on the second bottom plate; A power-on degaussing electromagnet base is fixed on the suction nozzle base, and the power-on degaussing electromagnet is mounted on the power-on degaussing electromagnet base.

6. The wafer fixation platform of claim 5, wherein, The suction nozzle base is provided with a suction nozzle air port for vacuumizing the inside of the suction nozzle.

7. The wafer fixation platform of claim 1, wherein The wafer chuck lower surface is provided with a plurality of magnet grooves, and a plurality of magnet blocks are embedded in the magnet grooves, so that a plurality of magnet blocks are arranged between the wafer chuck and the second mounting plate.

8. The wafer fixation platform of claim 1, wherein, The first mounting plate is fixed with the ball implantation steel wire mesh suction plate through a plurality of buckles, so that the ball implantation steel wire mesh suction plate is detachably attached to the first mounting plate.

9. The wafer fixation platform of claim 1, wherein, The first lifting mechanism comprises a first housing fixed with the first bottom plate. A first bearing is installed in the first housing, the outer ring of the first bearing is fixed with the inner wall of the first housing, and the inner ring of the first bearing is fixed with a first pulley. A first screw rod nut is embedded and fixed in the first pulley, a first screw rod is installed in the first screw rod nut, the top of the first screw rod is fixed with a first connecting block, and the first connecting block is fixed with the first mounting plate. When the first pulley rotates, the first pulley drives the first screw rod nut to rotate, the first screw rod drives the first connecting block to reciprocate along the Z direction, thereby driving the first mounting plate and the ball implantation steel wire mesh suction plate to reciprocate along the Z direction.

10. The wafer fixation platform of claim 1, wherein, The second lifting mechanism comprises a second housing fixed with the second bottom plate. A second bearing is installed in the second housing, the outer ring of the second bearing is fixed with the inner wall of the second housing, and the inner ring of the second bearing is fixed with a second pulley. A second screw rod nut is embedded and fixed in the second pulley, a second screw rod is installed in the second screw rod nut, the top of the second screw rod is fixed with a second connecting block, and the second connecting block is fixed with the second mounting plate. When the second pulley rotates, the second pulley drives the second screw rod nut to rotate, the second screw rod drives the second connecting block to reciprocate along the Z direction, thereby driving the second mounting plate and the wafer chuck to reciprocate along the Z direction.

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