Semiconductor wafer surface foreign matter cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, in particular to a semiconductor wafer surface foreign matter cleaning device which comprises a base frame and a discharging device, buckle plates arranged at the front end and the rear end are manually pulled open, the buckle plate arranged at the front end drives an insertion rod to move forwards, at the moment, a buffer spring is in a stretching state, and the insertion rod and a sleeve slide; one end of a wafer is manually placed in the strip plate at the rear end, then the buckle plate arranged at the front end is slowly loosened, the buckle plate and the strip plate arranged at the front end are gradually reset under the action of the buffer spring, the first sponge strip and the third sponge strip make contact with the wafer in an attached mode, and through the first sponge strip, the second sponge strip and the third sponge strip which can be soaked and wetted, the wafer can be placed on the wafer. The device body can drive the wafer to shake slightly, the device body is used for improving the cleaning effect on the wafer in cooperation with ultrasonic cleaning and the first sponge strip, the second sponge strip and the third sponge strip, and through the arrangement, the device body can be used for rapidly and flexibly installing and clamping the wafer conveniently.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically to a semiconductor wafer surface foreign matter cleaning device. Background Technology

[0002] After wafer electroplating, the wafer needs to be cleaned to remove residual electroplating solution from the wafer surface and avoid the electroplating solution from affecting the wafer. Take the wafer clamping component of a semiconductor wafer surface foreign matter cleaning device suitable for ultrasonic cleaning as an example.

[0003] Some semiconductor wafer surface foreign matter cleaning devices have wafer clamping components that are not convenient for quick and flexible installation and clamping of wafers. Therefore, a semiconductor wafer surface foreign matter cleaning device is proposed to address the above problem. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor wafer surface foreign matter cleaning device to solve the problem that some semiconductor wafer surface foreign matter cleaning devices have wafer clamping components that are not convenient for quick and flexible installation and clamping of wafers.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor wafer surface foreign matter cleaning device includes a base frame and a feeding device. Two feeding devices are symmetrically arranged on the bottom left and bottom right sides of the base frame. Each feeding device includes a panel, a bending plate, a folding plate, and an assembly. The bending plate and folding plate are fixedly arranged at the top of the panel. The assembly is arranged inside the bending plate and folding plate. The assembly includes a latch plate, a first sponge strip, a strip plate, a second sponge strip, a third sponge strip, a sleeve, a plug rod, and a buffer spring. The first sponge strip is fixedly arranged inside the latch plate at the front and rear ends near the wafer. The front and rear buckles are fixedly provided with strips near the wafer end. The inner walls of the left and right ends of the strips are symmetrically provided with second sponge strips. The inner walls of the top and bottom ends of the strips are symmetrically provided with third sponge strips. The front end of the rear buckle is fixedly provided with a sleeve. The rear end of the front buckle is fixedly provided with a rod. The rod slides inside the sleeve. A buffer spring is fixedly provided between the front and rear buckles. The buffer spring is spirally distributed on the outside of the sleeve and the rod.

[0007] Preferably, a shaft block is fixedly provided at the top of the panel, a driven gear is fixedly provided at the top of the shaft block, and a first shaft is fixedly provided at the top of the driven gear, with the top of the first shaft rotatably connected to the bottom of the base frame.

[0008] Preferably, a stepper motor is fixedly installed inside the base frame, a second shaft is fixedly installed at the end of the main shaft of the stepper motor, a drive gear is fixedly installed at the bottom end of the second shaft, and the drive gear meshes with two driven gears symmetrically arranged at the left and right ends.

[0009] Preferably, a suspension plate is provided on the top of the base frame, and a hydraulic cylinder device is fixedly provided at the bottom end of the suspension plate. The telescopic component at the bottom end of the hydraulic cylinder device is fixedly provided to the top end of the base frame.

[0010] Preferably, the wafer is placed inside the strips set at the front and rear ends, and the first and third sponge strips are in contact with the wafer.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. In this utility model, the buckles at both ends are manually pulled open. The buckle at the front end moves the insert rod forward. At this time, the buffer spring is in a stretched state, and the insert rod slides with the sleeve. One end of the wafer is manually placed inside the rear strip. Then, the buckle at the front end is slowly released. Under the action of the buffer spring, the buckle and strip at the front end gradually return to their original positions, so that the first sponge strip and the third sponge strip are in close contact with the wafer, and the wafer is flexibly installed and clamped. Through the above settings, the main body of the device can quickly and flexibly install and clamp the wafer.

[0013] 2. In this utility model, the stepper motor starts and drives the second shaft and the drive gear to rotate. The drive gear drives the driven gears set on the left and right sides to mesh and rotate. At this time, the feeding device, the shaft block and the driven gear rotate synchronously, keeping the angle between the driven gear and the initial position within the range of -30 degrees to 30 degrees. The forward and reverse rotation of the stepper motor realizes the reciprocating small-amplitude rotation of the driven gear, which is used to drive the wafer to shake slightly. The wafer will come into contact with the second sponge strip set on one side. This reciprocating motion, combined with ultrasonic cleaning, and the first, second and third sponge strips that can be soaked and moistened, through the above-mentioned settings, the main body of the device can drive the wafer to shake slightly. Combined with ultrasonic cleaning and the first, second and third sponge strips, the cleaning effect on the wafer is improved. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal component structure of the feeding device of this utility model;

[0016] Figure 3 This is a schematic diagram of the internal component structure of the assembly of this utility model;

[0017] Figure 4This is a schematic diagram showing the distribution of the second and third sponge strips of this utility model.

[0018] In the diagram: 1. Base frame; 2. Feeding device; 21. Panel; 22. Bending plate; 23. Folding plate; 24. Assembly component; 241. Buckle plate; 242. First sponge strip; 243. Strip plate; 244. Second sponge strip; 245. Third sponge strip; 246. Sleeve; 247. Insert rod; 248. Buffer spring; 3. Shaft block; 4. Driven gear; 5. First shaft; 6. Stepper motor; 7. Second shaft; 8. Drive gear; 9. Suspension plate; 10. Hydraulic cylinder device. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the embodiments of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the position or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Similarly, words such as "a," "one," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0021] Furthermore, in the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0022] Please see Figure 1-4 This utility model provides a technical solution:

[0023] A semiconductor wafer surface foreign matter cleaning device includes a base frame 1 and a feeding device 2. Two feeding devices 2 are symmetrically arranged on the bottom left and bottom right sides of the base frame 1. Each feeding device 2 includes a panel 21, a bending plate 22, a folding plate 23, and an assembly 24. The bending plate 22 and folding plate 23 are fixedly arranged at the top of the panel 21. The assembly 24 is arranged inside the bending plate 22 and folding plate 23. The assembly 24 includes a buckle plate 241, a first sponge strip 242, a strip 243, a second sponge strip 244, a third sponge strip 245, a sleeve 246, a plug 247, and a buffer spring 248. The buckle plate 241, located at the front and rear ends, has a first sponge strip fixedly arranged inside the end closest to the wafer. The sponge strip 242 has a front and rear buckle plate 241 with a strip plate 243 fixedly installed near the wafer end. The inner walls of the left and right ends of the strip plate 243 are symmetrically and fixedly provided with second sponge strips 244. The inner walls of the top and bottom ends of the strip plate 243 are symmetrically and fixedly provided with third sponge strips 245. The front end of the buckle plate 241 is fixedly provided with a sleeve 246. The rear end of the buckle plate 241 is fixedly provided with an insert rod 247. The insert rod 247 slides inside the sleeve 246. A buffer spring 248 is fixedly provided between the front and rear buckle plates 241. The buffer spring 248 is spirally distributed on the outside of the sleeve 246 and the insert rod 247.

[0024] A shaft block 3 is fixedly installed at the top of the panel 21, a driven gear 4 is fixedly installed at the top of the shaft block 3, and a first shaft 5 is fixedly installed at the top of the driven gear 4. The top of the first shaft 5 is rotatably connected to the bottom of the base frame 1. Through the above arrangement, the feeding device 2, the shaft block 3 and the driven gear 4 can rotate around the vertical central axis of the first shaft 5.

[0025] A stepper motor 6 is fixedly installed inside the base frame 1. A second shaft 7 is fixedly installed at the end of the main shaft of the stepper motor 6. A drive gear 8 is fixedly installed at the bottom of the second shaft 7. The drive gear 8 meshes with two driven gears 4 symmetrically arranged at the left and right ends. Through the above arrangement, the stepper motor 6 drives the drive gear 8 to rotate, thereby driving the two driven gears 4 arranged at the left and right ends to mesh and rotate.

[0026] A suspension plate 9 is provided on the top of the base frame 1, and a hydraulic cylinder device 10 is fixedly provided at the bottom of the suspension plate 9. The telescopic component at the bottom of the hydraulic cylinder device 10 is fixedly provided to the top of the base frame 1. Through the above arrangement, the hydraulic cylinder device 10 is used to adjust the height of the feeding device 2.

[0027] The wafer is placed inside the strips 243 set at the front and rear ends. The first sponge strip 242 and the third sponge strip 245 are in close contact with the wafer. Through the above settings, in conjunction with ultrasonic cleaning and the first sponge strip 242, the second sponge strip 244 and the third sponge strip 245 that can be soaked and moistened, the cleaning effect on the wafer is improved.

[0028] Workflow: This utility model provides a wafer clamping component for a semiconductor wafer surface foreign matter cleaning device, which is suitable for ultrasonic cleaning of wafers. The main body of the device facilitates flexible installation and clamping of the wafer, and the main body of the device can drive the wafer to make a small shaking motion. In conjunction with ultrasonic cleaning and the first sponge strip 242, the second sponge strip 244, and the third sponge strip 245, it is used to improve the cleaning effect of the wafer.

[0029] The stepper motor 6 and hydraulic cylinder device 10 installed inside the device are controlled by an external PLC controller, and the stepper motor 6 and hydraulic cylinder device 10 are electrically connected to an external power supply. The top of the suspension plate 9 is fixedly installed on the top of the ultrasonic cleaning tank with the factory hanger.

[0030] First, the wafer is assembled and placed. The buckles 241 at both ends are manually pulled open. The buckle 241 at the front end moves the insertion rod 247 forward. At this time, the buffer spring 248 is in a stretched state. The insertion rod 247 slides with the sleeve 246. One end of the wafer is manually placed inside the rear strip 243. Then, the buckle 241 at the front end is slowly released. Under the action of the buffer spring 248, the buckle 241 and strip 243 at the front end gradually return to their original positions, so that the first sponge strip 242 and the third sponge strip 245 are in close contact with the wafer. The wafer is flexibly installed and clamped. The buckle 241 is then attached and clamped to the bending plate 22 and the folding plate 23.

[0031] The hydraulic cylinder device 10 drives the base frame 1, the feeding device 2, the shaft block 3, the driven gear 4, the first shaft 5, the stepper motor 6, the second shaft 7, and the driving gear 8 to move vertically until the liquid level in the ultrasonic cleaning tank reaches the middle position of the vertical height of the shaft block 3. At this time, the feeding device 2 and the wafer are both submerged in the ultrasonic cleaning liquid.

[0032] Stepper motor 6 starts and drives the second shaft 7 and drive gear 8 to rotate. Drive gear 8 drives the driven gears 4 set on the left and right sides to mesh and rotate. At this time, the feeding device 2, shaft block 3 and driven gear 4 rotate synchronously, keeping the angle between driven gear 4 and the initial position between -30 degrees and 30 degrees. The forward and reverse rotation of stepper motor 6 realizes the reciprocating small-amplitude rotation of driven gear 4, which is used to drive the wafer to shake slightly. The wafer will come into contact with the second sponge strip 244 set on one side. This reciprocating motion, combined with ultrasonic cleaning, uses the soakable and moistened first sponge strip 242, second sponge strip 244 and third sponge strip 245 to improve the cleaning effect on the wafer.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer surface foreign matter cleaning device comprising a base frame (1) and a feeding device (2), characterized in that: The base frame (1) bottom left, bottom right symmetrical arrangement of two feeding device (2), the feeding device (2) includes panel (21), bending plate (22), folding plate (23) and assembly (24), the panel (21) top end fixedly provided with bending plate (22), folding plate (23), the bending plate (22), folding plate (23) inside provided with assembly (24), the assembly (24) includes buckle plate (241), first sponge strip (242), strip plate (243), second sponge strip (244), third sponge strip (245), sleeve (246), plug rod (247) and buffer spring (248), the buckle plate (241) is arranged at the front end and the rear end, and the first sponge strip (242) is fixedly arranged inside the buckle plate (241) close to the one end of the wafer, the buckle plate (241) is arranged at the front end and the rear end, and the strip plate (243) is fixedly arranged close to the one end of the wafer, the second sponge strip (244) is fixedly arranged on the left end inner wall and the right end inner wall of the strip plate (243) symmetrically, the third sponge strip (245) is fixedly arranged on the top end inner wall and the bottom end inner wall of the strip plate (243) symmetrically, the sleeve (246) is fixedly arranged at the front end of the buckle plate (241) arranged at the rear side, the plug rod (247) is fixedly arranged at the rear end of the buckle plate (241) arranged at the front side, the plug rod (247) and the sleeve (246) are arranged inside the sleeve (246), the buffer spring (248) is arranged between the buckle plate (241) arranged at the front side and the rear side, and the buffer spring (248) is arranged outside the sleeve (246) and the plug rod (247) in a spiral manner.

2. The semiconductor wafer surface foreign matter cleaning device according to claim 1, characterized by: The panel (21) top end fixedly provided with shaft block (3), the shaft block (3) top end fixedly provided with driven gear (4), the driven gear (4) top end fixedly provided with first shaft rod (5), the first shaft rod (5) top end with base frame (1) bottom end rotation setting.

3. The apparatus according to claim 2, wherein the apparatus further comprises a cleaning liquid supply unit for supplying a cleaning liquid to the cleaning unit. The base frame (1) inside fixedly provided with step motor (6), the step motor (6) main shaft end fixedly provided with second shaft rod (7), the second shaft rod (7) bottom end fixedly provided with driving gear (8), the driving gear (8) and the two driven gears (4) arranged symmetrically at both ends are engaged.

4. The semiconductor wafer surface foreign matter cleaning device according to claim 1, characterized by: The base frame (1) top provided with suspension plate (9), the suspension plate (9) bottom end fixedly provided with hydraulic cylinder device (10), the hydraulic cylinder device (10) bottom end telescopic assembly and base frame (1) top end fixedly provided.

5. The apparatus according to claim 1, wherein the apparatus is characterized by: The wafer is placed inside the strip plate (243) arranged at the front and rear end, and the first sponge strip (242) and the third sponge strip (245) are in contact with the wafer.

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