Power device packaging structure

Abstract

The embodiment of the utility model discloses a power device packaging structure. The power device packaging structure comprises a heat dissipation substrate; a double-sided metal-coated substrate; the double-sided metal-coated substrate is arranged on one side of the heat dissipation substrate; a chip; the chip is arranged on one side, far away from the heat dissipation substrate, of the double-sided metal-coated substrate; a pin; one end of each pin is connected with one side, far away from the heat dissipation substrate, of the double-sided metal-coated substrate; bonding a lead; the bonding wires are used for connecting the chip and the pins; a package; the heat dissipation substrate, the chip, one end of the pin, the bonding lead and the double-sided metal-coated substrate are all arranged in the packaging body; and the other end of the pin is arranged outside the packaging body. According to the technical scheme of the embodiment of the utility model, the double-sided metal-coated substrate is arranged in the internal circuit, and the internal circuit is insulated and isolated from the heat dissipation substrate through the double-sided metal-coated substrate, so that the internal insulation of the power device is realized, the link of adding an insulating sheet during application and installation is omitted, the packaging cost is reduced, and the heat dissipation capability is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device packaging technology, and in particular to a power device packaging structure. Background Technology

[0002] Transistor Outline (TO) packages are currently the most commonly used package type in the industry. Taking TO-247 as an example, the chip is placed on a heatsink, and the chip is connected to the pins via bonding wires to form an electrical circuit. However, this type of package has the following problems: the chip is mounted on the heatsink, and the heatsink is connected to the pins, causing the heatsink to become electrically charged. During device use, the back of the device is attached to the application board (or heatsink), which is usually grounded, causing the pins to also become grounded, rendering the product unusable.

[0003] The common solution in the existing technology is to add an insulating sheet to the application end board or apply insulating glue to the back of the device for installation to achieve the isolation effect.

[0004] However, existing technologies that involve adding insulating sheets to the application board or applying insulating adhesive to the back of the device increase the amount of material between the device and the application, raising costs and reducing heat dissipation capabilities. Utility Model Content

[0005] This invention provides a power device packaging structure to solve the problems of increased packaging costs and reduced heat dissipation capacity.

[0006] According to one aspect of the present invention, a power device packaging structure is provided, the power device packaging structure comprising:

[0007] Heat dissipation substrate;

[0008] Double-sided metal-coated substrate; the double-sided metal-coated substrate is disposed on one side of the heat dissipation substrate;

[0009] Chip; The chip is located on the side of the double-sided metal-coated substrate away from the heat dissipation substrate;

[0010] Pin; one end of the pin is connected to the side of the double-sided metal-clad substrate away from the heat sink substrate;

[0011] Bonding wires; bonding wires are used to connect chips and pins;

[0012] Package; the heat dissipation substrate, chip, one end of the pin, bonding wire and double-sided metal-clad substrate are all disposed in the package; the other end of the pin is disposed outside the package.

[0013] Optionally, the double-sided metal-coated substrate includes an insulating substrate, a first metal plate, and a second metal plate;

[0014] The first metal plate is disposed on one side of the heat dissipation substrate; the insulating substrate is disposed on the side of the first metal plate away from the heat dissipation substrate; the second metal plate is disposed on the side of the insulating substrate away from the first metal plate, and the second metal plate is connected to the chip.

[0015] Optionally, the first metal plate includes a copper plate; the second metal plate includes a copper plate.

[0016] Insulating substrates include ceramic substrates.

[0017] Optionally, the power device package structure may further include: a thermally conductive adhesive layer;

[0018] Both the first metal plate and the second metal plate are connected to the insulating substrate through a thermally conductive adhesive layer.

[0019] The chip is connected to the second metal plate via a thermally conductive adhesive layer;

[0020] The first metal plate is connected to the heat dissipation substrate through a thermally conductive adhesive layer.

[0021] Optionally, the thermally conductive adhesive layer may include a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

[0022] Optionally, the double-sided metal-coated substrate is insulated from the heat dissipation substrate by an insulating substrate.

[0023] Optionally, one end of the pin is connected to a second metal plate, and the other end of the pin extends out of the package.

[0024] Optionally, the projected area of ​​the double-sided metal-coated substrate in the package is smaller than the projected area of ​​the heat dissipation substrate in the package.

[0025] Optionally, the first metal plate and the second metal plate have the same projected area on the heat dissipation substrate, and both are smaller than the projected area of ​​the insulating substrate on the heat dissipation substrate.

[0026] Optionally, the heat dissipation substrate includes a copper heat dissipation substrate.

[0027] The technical solution of this utility model embodiment provides a power device packaging structure, including a heat dissipation substrate, a double-sided metal-coated substrate, a chip, pins, bonding wires, and a package body. The double-sided metal-coated substrate is disposed on one side of the heat dissipation substrate, and the chip is disposed on the side of the double-sided metal-coated substrate away from the heat dissipation substrate. The chip and pins are connected by bonding wires. The heat dissipation substrate, the chip, one end of the pins, the bonding wires, and the double-sided metal-coated substrate are all disposed within the package body, while the other end of the pins protrudes from the package body and is disposed outside the package body. Through the double-sided metal-coated substrate and the heat dissipation substrate, the heat generated by the chip during operation is rapidly conducted away, reducing the chip temperature and improving the reliability and stability of the power device. Furthermore, the back of the package body exposes the heat dissipation substrate, allowing for timely dissipation of heat generated by the chip during operation, thus improving heat dissipation performance. Connecting one end of the pins to the side of the double-sided metal-coated substrate away from the heat dissipation substrate increases the pin's freedom of movement. A double-sided metal-coated substrate is placed between the chip and the heat sink. This substrate provides insulation, and the metal on both sides aids in heat dissipation during chip operation, improving the heat dissipation performance of the power device package structure, enhancing the thermal conductivity and insulation withstand voltage of the power device, and mitigating the risk of insulation failure. By placing a double-sided metal-coated substrate between the chip and the heat sink, electrical insulation between the internal circuitry and the heat sink can be achieved, realizing internal insulation of the power device. This eliminates the need for additional insulating sheets during application installation, reducing packaging costs and simplifying installation at the application end.

[0028] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a side anatomical diagram of a power device packaging structure provided according to an embodiment of the present utility model;

[0031] Figure 2 This is a front anatomical diagram of a power device packaging structure provided according to an embodiment of the present utility model;

[0032] Figure 3 This is a side anatomical diagram of another power device packaging structure provided according to an embodiment of the present utility model. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] Figure 1 This is a side anatomical diagram of a power device packaging structure provided according to an embodiment of the present utility model. Figure 2 This is a front anatomical view of a power device packaging structure provided according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the power device package structure includes: a heat dissipation substrate 10; a double-sided metal-coated substrate 20; the double-sided metal-coated substrate 20 is disposed on one side of the heat dissipation substrate 10; a chip 30; the chip 30 is disposed on the side of the double-sided metal-coated substrate 20 away from the heat dissipation substrate 10; a pin 40; one end of the pin 40 is connected to the side of the double-sided metal-coated substrate 20 away from the heat dissipation substrate 10; a bonding wire 50; the bonding wire 50 is used to connect the chip 30 and the pin 40; and a package body 60; the heat dissipation substrate 10, the chip 30, one end of the pin 40, the bonding wire 50, and the double-sided metal-coated substrate 20 are all disposed inside the package body 60; the other end of the pin 40 is disposed outside the package body 60.

[0036] In this embodiment of the invention, the heat dissipation substrate 10 serves as the main heat dissipation channel of the power device packaging structure, rapidly conducting away the heat generated by the chip 30 during operation, reducing the temperature of the chip 30, and improving the reliability and stability of the power device. The heat dissipation substrate 10 can be made of materials with high thermal conductivity, such as copper, aluminum, or their alloys. A double-sided metal-coated substrate 20 can be soldered to one side of the heat dissipation substrate 10, with the chip 30 positioned on the side of the double-sided metal-coated substrate 20 away from the heat dissipation substrate 10; that is, the double-sided metal-coated substrate 20 is positioned between the chip 30 and the heat dissipation substrate 10. The metal on both sides of the double-sided metal-coated substrate 20 is connected to the chip 30 and the heat dissipation substrate 10 respectively. The substrate provides insulation, and the metal on both sides of the substrate assists in heat dissipation during chip 30 operation, improving the heat dissipation performance of the power device packaging structure, enhancing the thermal conductivity and insulation withstand voltage of the power device, and simultaneously avoiding the risk of insulation failure of the power device. By placing a double-sided metal-coated substrate 20 between the chip 30 and the heat sink substrate 10, electrical insulation between the internal circuitry and the heat sink substrate 10 can be achieved, realizing internal insulation of the power device. This eliminates the need to install insulating sheets during application and installation, reducing the installation difficulty at the application end of the power device. The double-sided metal-coated substrate 20 provides a foundation for support and electrical connection of the chip 30, and can also integrate some auxiliary circuit components, such as resistors or capacitors, to improve the functionality of the power device.

[0037] Chip 30 is the core component of the power device, performing specific power conversion or amplification functions. For example, chip 30 is used for voltage changes in a power management circuit, and for signal amplification in a power amplifier. Chip 30 is fixed to the double-sided metal-clad substrate 20 by soldering or bonding, ensuring good thermal contact between the chip 30 and the substrate 20. This facilitates the timely dissipation of heat generated during chip 30's operation through the double-sided metal-clad substrate 20 and the heat dissipation substrate 10, improving the heat dissipation performance of the power device's package structure.

[0038] Pin 40 is used to electrically connect the power device to an external circuit and to transmit signals or supply power. One end of pin 40 can be connected to the side of the double-sided metal-coated substrate 20 away from the heat sink substrate 10 via metallized vias or direct soldering, achieving electrical connection and mechanical fixation between the double-sided metal-coated substrate 20 and pin 40. The other end of pin 40 extends out of the package 60 and connects to an external circuit board. Unlike the prior art where the heat sink substrate 10 and pin 40 are integrated, in this embodiment of the invention, connecting one end of pin 40 to the side of the double-sided metal-coated substrate 20 away from the heat sink substrate 10 increases the freedom of pin 40, and the metal plate wiring on one side of the double-sided metal-coated substrate 20 can isolate pin 40 from chip 30.

[0039] The bonding wire 50 is used to establish an electrical connection between the chip 30 and the pin 40, connecting the electrodes on the chip 30 to the pin 40, enabling the chip 30 to transmit signals and interact with external circuits. The bonding wire 50 can be made of metal wire, such as gold wire or aluminum wire. For example, one end of the bonding wire 50 can be soldered to the electrode of the chip 30 and the other end can be soldered to the pin 40 using a bonding process.

[0040] The package 60 protects the internal heat dissipation substrate 10, double-sided metal-clad substrate 20, chip 30, one end of pin 40, and bonding wires 50 from external physical impacts, moisture, dust, and other factors, ensuring the normal operation of the power device. The package 60 is made of materials including, but not limited to, plastic or ceramic, serving to protect and insulate the internal components. The back of the package 60 exposes the heat dissipation substrate 10, allowing heat generated by the chip 30 during operation to be dissipated promptly, improving heat dissipation performance.

[0041] The technical solution of this utility model embodiment provides a power device packaging structure, including a heat dissipation substrate, a double-sided metal-coated substrate, a chip, pins, bonding wires, and a package body. The double-sided metal-coated substrate is disposed on one side of the heat dissipation substrate, and the chip is disposed on the side of the double-sided metal-coated substrate away from the heat dissipation substrate. The chip and pins are connected by bonding wires. The heat dissipation substrate, the chip, one end of the pins, the bonding wires, and the double-sided metal-coated substrate are all disposed within the package body, while the other end of the pins protrudes from the package body and is disposed outside the package body. Through the double-sided metal-coated substrate and the heat dissipation substrate, the heat generated by the chip during operation is rapidly conducted away, reducing the chip temperature and improving the reliability and stability of the power device. Furthermore, the back of the package body exposes the heat dissipation substrate, allowing for timely dissipation of heat generated by the chip during operation, thus improving heat dissipation performance. Connecting one end of the pins to the side of the double-sided metal-coated substrate away from the heat dissipation substrate increases the pin's freedom of movement. A double-sided metal-coated substrate is placed between the chip and the heat sink. This substrate provides insulation, and the metal on both sides aids in heat dissipation during chip operation, improving the heat dissipation performance of the power device package structure, enhancing the thermal conductivity and insulation withstand voltage of the power device, and mitigating the risk of insulation failure. By placing a double-sided metal-coated substrate between the chip and the heat sink, electrical insulation between the internal circuitry and the heat sink can be achieved, realizing internal insulation of the power device. This eliminates the need for additional insulating sheets during application installation, reducing packaging costs and simplifying installation at the application end.

[0042] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1Optionally, the double-sided metal-coated substrate 20 includes an insulating substrate 202, a first metal plate 201, and a second metal plate 203; the first metal plate 201 is disposed on one side of the heat dissipation substrate 10; the insulating substrate 202 is disposed on the side of the first metal plate 201 away from the heat dissipation substrate 10; the second metal plate 203 is disposed on the side of the insulating substrate 202 away from the first metal plate 201, and the second metal plate 203 is connected to the chip 30.

[0043] In this embodiment of the invention, an insulating substrate 202 is disposed between the first metal plate 201 and the second metal plate 203 to achieve electrical insulation, prevent short circuits between the upper and lower metal plates, and ensure the normal operation of the circuit. The first metal plate 201 and the second metal plate 203 can be connected to the insulating substrate 202 by welding or bonding to form an integrated structure. The insulating substrate 202 has good insulation properties and can withstand a certain voltage, ensuring the safety of power devices in high-voltage operating environments.

[0044] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, the first metal plate 201 includes a copper plate; the second metal plate 203 includes a copper plate; and the insulating substrate 202 includes a ceramic substrate.

[0045] In this embodiment of the invention, the ceramic substrate and the copper plates on both sides are configured as an integrated structure, which enables both electrical connection with the chip 30 and insulation isolation between the ceramic substrate and the application end board. The ceramic substrate has good heat dissipation performance and is itself an insulating material, which can achieve electrical insulation between the internal circuitry of the product and the heat dissipation substrate 10.

[0046] Figure 3 This is a side anatomical diagram of another power device packaging structure provided according to an embodiment of the present invention. Figure 3 As shown, the power device packaging structure also includes: a thermally conductive adhesive layer 70; the first metal plate 201 and the second metal plate 203 are both connected to the insulating substrate 202 through the thermally conductive adhesive layer 70; the chip 30 is connected to the second metal plate 203 through the thermally conductive adhesive layer 70; and the first metal plate 201 is connected to the heat dissipation substrate 10 through the thermally conductive adhesive layer 70.

[0047] In this embodiment of the invention, the thermally conductive adhesive layer 70 needs to possess high thermal conductivity, good adhesion, and thermal stability. Both the first metal plate 201 and the second metal plate 203 are connected to the insulating substrate 202 via the thermally conductive adhesive layer 70, forming an integrated structure with the insulating substrate 202, the first metal plate 201, and the second metal plate 203, ensuring stable component connection and good thermal conductivity. The chip 30 is connected to the second metal plate 203 via the thermally conductive adhesive layer 70, ensuring that the chip 30 is firmly bonded to the second metal plate 203, preventing displacement or detachment of the chip 30 during operation due to external forces such as vibration and impact. Simultaneously, the high thermal conductivity of the thermally conductive adhesive layer 70 transfers the heat generated by the chip 30 during operation to the heat dissipation substrate 10, which then dissipates heat from the chip 30. The connection between the first metal plate 201 and the heat dissipation substrate 10 via the thermally conductive adhesive layer 70 allows the double-sided metal-coated substrate 20 to be more securely mounted on the heat dissipation substrate 10, improving the stability of the power device packaging structure and its heat dissipation capacity.

[0048] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 3 Optionally, the thermally conductive adhesive layer 70 may include a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

[0049] In this embodiment of the invention, the thermally conductive adhesive layer 70 can be a high thermally conductive adhesive material such as solder paste or sintered silver paste. When setting the thermally conductive adhesive layer 70, a high thermally conductive adhesive material needs to be selected based on requirements such as bonding strength, thermal conductivity, temperature and corrosion resistance, construction process, and cost.

[0050] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, the double-sided metal-coated substrate 20 is insulated from the heat dissipation substrate 10 by the insulating substrate 202.

[0051] In this embodiment of the invention, the double-sided metal-coated substrate 20 includes an insulating substrate 202, which may be a ceramic substrate. Ceramic substrates have high heat dissipation coefficients, good heat dissipation performance, and are themselves insulating materials. The insulating substrate 202 enables internal insulation of the power device. The internal circuitry, consisting of the double-sided metal-coated substrate 20, chip 30, pins 40, and bonding wires 50, is isolated from the application end via the insulating substrate 202, eliminating the need for adding an insulating sheet during application installation and reducing packaging costs.

[0052] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, one end of pin 40 is connected to the second metal plate 203, and the other end of pin 40 extends out of the package 60.

[0053] In this embodiment of the utility model, connecting one end of pin 40 to the second metal plate 203 can improve the degree of freedom of pin 40. Furthermore, a through hole is provided on the side of the second metal plate 203 near pin 40, which can be used to isolate pin 40 from chip 30 through the circuit of the second metal plate 203.

[0054] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, the projected area of ​​the double-sided metal-coated substrate 20 in the package 60 is smaller than the projected area of ​​the heat dissipation substrate 10 in the package 60.

[0055] In this embodiment of the present invention, a double-sided metal-coated substrate 20 is provided between the chip 30 and the heat dissipation substrate 10, and the double-sided metal-coated substrate 20 is located in the middle of the heat dissipation substrate 10. This prevents the surface of the double-sided metal-coated substrate 20 between the chip 30 and the heat dissipation substrate 10 from being contaminated and causing creepage, which would cause the double-sided metal-coated substrate 20 to be polarized and lead to insulation failure.

[0056] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, the first metal plate 201 and the second metal plate 203 have the same projected area on the heat dissipation substrate 10, and both are smaller than the projected area of ​​the insulating substrate 202 on the heat dissipation substrate 10.

[0057] In this embodiment of the present invention, the projected area of ​​the first metal plate 201 and the second metal plate 203 on the heat dissipation substrate 10 is smaller than the projected area of ​​the insulating substrate 202 on the heat dissipation substrate 10, so as to ensure that the first metal plate 201 and the second metal plate 203 on both sides are insulated and isolated by the insulating substrate 202, thereby improving the reliability of the power device packaging structure.

[0058] Based on the above-described technical solutions of the utility model embodiments, and referring to... Figure 1 Optionally, the heat dissipation substrate 10 includes a copper heat dissipation substrate.

[0059] In this embodiment of the invention, the heat dissipation substrate 10 serves as the main heat dissipation channel of the power device packaging structure, rapidly conducting away the heat generated by the chip 30 during operation, reducing the temperature of the chip 30, and improving the reliability and stability of the power device. The material of the heat dissipation substrate 10 can be a material with high thermal conductivity, such as copper, aluminum, or their alloys. In this embodiment of the invention, the heat dissipation substrate 10 can be a copper heat dissipation substrate or a copper heat dissipation frame, further enhancing the heat dissipation capability of the power device packaging structure.

[0060] It should be understood that the various forms of the process shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this utility model can be achieved, and this is not limited herein.

[0061] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A power device package structure, characterized by, The application relates to a packaging structure of a chip, which comprises the following parts: a heat dissipation substrate; a double-sided metal-clad substrate, which is arranged on one side of the heat dissipation substrate; a chip; the chip is arranged on the side of the double-sided metal-clad substrate, which is away from the heat dissipation substrate; a pin, one end of which is connected to the side of the double-sided metal-clad substrate, which is away from the heat dissipation substrate; a bonding wire, which is used for connecting the chip and the pin; a package, in which the heat dissipation substrate, the chip, one end of the pin, the bonding wire and the double-sided metal-clad substrate are arranged; the other end of the pin is arranged outside the package; the double-sided metal-clad substrate comprises an insulating substrate, a first metal plate and a second metal plate; the first metal plate is arranged on one side of the heat dissipation substrate; the insulating substrate is arranged on the side of the first metal plate, which is away from the heat dissipation substrate; the second metal plate is arranged on the side of the insulating substrate, which is away from the first metal plate, and the second metal plate is connected to the chip; one end of the pin is connected to the second metal plate, and the other end of the pin penetrates out of the package.

2. The power device package structure of claim 1, wherein, the first metal plate comprises a copper plate; the second metal plate comprises a copper plate; the insulating substrate comprises a ceramic substrate.

3. The power device package structure of claim 1, wherein, The application further comprises: a heat-conducting adhesive layer; the first metal plate and the second metal plate are connected to the insulating substrate through the heat-conducting adhesive layer; the chip is connected to the second metal plate through the heat-conducting adhesive layer; the first metal plate is connected to the heat dissipation substrate through the heat-conducting adhesive layer.

4. The power device package structure of claim 3, wherein, the heat-conducting adhesive layer comprises a tin heat-conducting adhesive layer or a sintered silver glue heat-conducting adhesive layer.

5. The power device package structure of claim 1, wherein, the double-sided metal-clad substrate is insulated and separated from the heat dissipation substrate through the insulating substrate.

6. The power device package structure of claim 1, wherein, the projection area of the double-sided metal-clad substrate on the package is smaller than the projection area of the heat dissipation substrate on the package.

7. The power device package structure of claim 1, wherein, the projection areas of the first metal plate and the second metal plate on the heat dissipation substrate are the same and are smaller than the projection area of the insulating substrate on the heat dissipation substrate.

8. The power device package structure of claim 1, wherein, the heat dissipation substrate comprises a copper heat dissipation substrate.

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