Multifunctional chip pin tinning equipment

Abstract

The utility model relates to multifunctional chip pin tinning equipment, a movable feeding mechanism comprises a feeding moving seat, the feeding moving seat is provided with a swing angle motor and a chip suction assembly, the chip suction assembly comprises a mechanism fixing plate, the lower end of the mechanism fixing plate is provided with a suction cup, an identification camera and a rotating motor, and the lower end of the mechanism fixing plate is provided with a rotating shaft. A chip is sucked through a suction cup after information is recognized through a recognition camera, the suction cup is driven by a rotating motor to rotate, a mechanism fixing plate is driven by a swing angle motor to swing, and the chip is driven by a feeding moving seat to a chip detection mechanism to be detected. And the qualified chips are driven by the feeding moving seat to sequentially pass through the preheating mechanism, the soldering flux mechanism, the gold and tin removing furnace, the tin coating furnace and the hot air flattening mechanism. According to the utility model, the tin coating process requirements of different types of chips can be met, the chips can be detected and screened before and after tin coating, and the consistency of the chip tin coating process can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip pin tinning, specifically a multifunctional chip pin tinning device. Background Technology

[0002] Currently, in many fields, such as medical, electronics, and military industries, due to the special characteristics of chip products such as small batches, multiple batches, and unconventional processes, the gold removal and tinning processes of chips are still often completed manually using tweezers during the production process. This method has low production efficiency and inconsistent tinning results, which will affect the stability and reliability of subsequent chips. In addition, long-term inhalation of gaseous tin can also damage the respiratory and nervous systems of operators.

[0003] To address the above issues, existing chip pin tinning equipment has emerged. However, some existing tinning equipment can only tinnate single-type chips. Different types of chips require multiple devices operating in parallel to complete the tinning process, resulting in very high costs. Furthermore, existing tinning equipment places high demands on the size of the chip loading tray and manual placement. The chips must not rotate freely within the tray's slots and must be placed at the correct angle. If the chip's angle is inconsistent or it rotates excessively, the system cannot adjust it due to the lack of automatic angle adjustment. Additionally, some existing chip pin tinning equipment lacks automatic solder level detection, which can lead to problems such as chip corrosion due to improper height control during tinning. In such cases, the chip generally has to be scrapped, affecting the success rate of chip pin tinning. Some tinning equipment can only perform the tinning action in a simple way, and the quality of the tinned chips can only be judged manually, which significantly impacts the efficiency and quality of chip pin tinning inspection.

[0004] Patent CN205764332U discloses an automatic chip pin tinning device, which includes a four-axis linear platform, a tinning head, and other structures. However, this device cannot automatically detect and screen the quality of the chips before and after tinning. Furthermore, it only automatically picks up chips from the extraction box and cannot adjust the chip orientation or corresponding process parameters according to different chip types. Patent CN214134370U discloses a chip pin tinning device, which includes a tinning fixture base, a tinning fixture handle, a device placement area, a magnetic positioning cover, and other structures. However, this device is mainly designed for the requirements of load-bearing positioning, uniform tinning, and pin protection during TSSOP chip pin tinning and is not applicable to different types of chips. Additionally, this device is manually operated and cannot meet the requirements of automated production. Utility Model Content

[0005] The purpose of this invention is to provide a multifunctional chip pin tinning equipment that can automatically identify chip types and automatically adjust conditions such as chuck specifications, chip loading posture angle, and process parameters according to chip types, thereby meeting the tinning process requirements of different types of chips. In addition, this invention can automatically detect and screen chips before and after tinning, while ensuring the consistency of the chip tinning process, thus ensuring product quality.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A multifunctional chip pin tinning device includes a main frame, on which are mounted a moving feeding mechanism, a chip inspection mechanism, a flux mechanism, a preheating mechanism, a gold and solder removal furnace, a tinning furnace, and a hot air leveling mechanism. The moving feeding mechanism includes a feeding moving seat with multiple degrees of freedom of movement. The feeding moving seat is equipped with a swing motor and a chip picking assembly. The chip picking assembly includes a mechanism fixing plate, and the lower end of the mechanism fixing plate is equipped with a suction cup, a recognition camera, and a rotary motor. The chip is picked up by the suction cup after the recognition camera identifies the information. The suction cup is driven to rotate by the rotary motor. The mechanism fixing plate is driven to swing by the swing motor. The chip is carried by the feeding moving seat to the chip inspection mechanism for inspection. The qualified chip is then carried by the feeding moving seat to pass through the preheating mechanism, the flux mechanism, the gold and solder removal furnace, the tinning furnace, and the hot air leveling mechanism in sequence.

[0008] The chip-collecting assembly's mechanism fixing plate is provided with a first adjusting fixing seat, a first adjusting bolt, a recognition camera support, and a recognition camera fixing block. The recognition camera support and the first adjusting fixing seat are both fixed on the mechanism fixing plate. The recognition camera fixing block is slidably inserted into the recognition camera support and its upper side is connected to the first adjusting fixing seat through the first adjusting bolt. The recognition camera is mounted on the recognition camera fixing block. The lower end of the mechanism fixing plate is provided with a recognition light source fixing plate, and the recognition light source fixing plate is provided with a recognition light source that cooperates with the recognition camera to collect light.

[0009] The mobile loading mechanism includes an X-axis moving module, a Y-axis moving module, and a Z-axis moving module. The Y-axis moving module is mounted on a module support base, which is mounted on the main frame. The Y-axis moving module has a Y-axis moving seat, and the two ends of the X-axis moving module are respectively mounted on corresponding Y-axis moving seats. The X-axis moving module has an X-axis moving seat, and the Z-axis moving module is mounted on the X-axis moving seat. The Z-axis moving module has a Z-axis moving seat, and the loading moving seat is mounted on the Z-axis moving seat.

[0010] The feeding moving seat is equipped with a solder liquid height detection component, which is located on the rear side of the mechanism fixing plate. The solder liquid height detection component includes a detection probe, a probe fixing seat, a probe lifting seat, and a probe lifting cylinder. The probe lifting cylinder is fixed on the feeding moving seat, and the probe lifting seat is driven to lift and lower by the probe lifting cylinder. The probe fixing seat is fixed at the lower end of the probe lifting seat, and two detection probes are fixed in the probe fixing seat.

[0011] The chip testing mechanism includes a mounting base and a testing camera. The upper side of the mounting base is fixedly connected to the main frame, the testing camera is provided on one side of the mounting base, and the table surface of the main frame has an opening for the testing camera to be exposed.

[0012] The chip testing mechanism includes a second adjusting base, a second adjusting bolt, a testing camera support base, and a testing camera fixing block. The second adjusting base and the testing camera support base are both fixed on the mounting base. The testing camera fixing block is slidably inserted into the testing camera support base, and its upper end is connected to the second adjusting base via the second adjusting bolt. The testing camera is fixed on the testing camera fixing block. A testing light source fixing plate is provided on one side of the mounting base of the chip testing mechanism, and a testing light source that cooperates with the testing camera to collect light is provided on the testing light source fixing plate.

[0013] The preheating mechanism includes a preheating shell, and a preheating port is provided on the upper side of the preheating shell. A preheating plate, a heat insulation plate and a preheating support plate are arranged in sequence from top to bottom inside the upper end of the preheating shell. An inspection door with an inspection handle is provided on one side of the preheating shell, and a high-temperature resistant glass baffle is provided on the preheating port.

[0014] The flux mechanism includes a trough, a trough support plate, a circulating pump, and a flux container. The trough support plate is fixed to the main frame, the trough is disposed on the trough support plate, the circulating pump is disposed on the lower side of the trough support plate and is connected to the inlet hole in the middle of the trough through a flux feeding pipe, and the circulating pump is connected to the flux container through a pipeline. A return trough is provided on the outside of the trough, and the return trough is connected to the flux container through a return pipeline.

[0015] The hot air leveling mechanism includes a tin dross recovery housing with an open top. A fixed support is provided on one side of the tin dross recovery housing. A height adjustment shaft is threaded onto the fixed support. A horizontally set angle adjustment shaft is threaded onto the upper end of the height adjustment shaft. The angle adjustment shaft is connected to an angle adjustment seat. A hot air knife is provided on the angle adjustment seat. A tin dross recovery drawer is provided at the lower end of the tin dross recovery housing.

[0016] The main frame is equipped with an automatic suction cup changing mechanism, which includes a suction cup placement seat, a suction cup changing baffle, and a suction cup changing cylinder. The suction cup placement seat has a cover plate on its upper side, and an insertion plate cavity is formed between the cover plate and the upper surface of the suction cup placement seat. The suction cup changing baffle is driven to move by the suction cup changing cylinder, and the suction cup changing baffle has a horizontal insertion plate portion that inserts into the insertion plate cavity. The suction cup shaft of the suction cup has a grooved lower flange and a grooved upper flange, and a suction cup groove is formed between the grooved lower flange and the grooved upper flange. The lower end of the rotary motor is equipped with a quick-change connector that connects to the upper end of the suction cup shaft. When the suction cup is inserted into the corresponding insertion hole on the suction cup placement seat, the grooved upper flange abuts against the cover plate, and the suction cup groove connects with the insertion plate cavity. The insertion plate portion of the suction cup changing baffle is inserted into the insertion plate cavity and blocks the grooved lower flange.

[0017] The advantages and positive effects of this utility model are as follows:

[0018] 1. When picking up chips, this utility model can use the recognition camera in the chip picking component to detect and collect chip information, and can automatically change to a suitable chuck based on the collected chip information. At the same time, the equipment control system can also automatically call the relevant chip gold removal and tinning process flow and related parameters, thereby eliminating process redundancy and improving tinning efficiency. In addition, the rotary motor and swing motor in the chip picking component can also adjust the chip loading posture angle according to the collected chip information, and can also automatically judge and initially reject chips that are unqualified in size, appearance, etc.

[0019] 2. This utility model allows for chip inspection by a chip testing mechanism both before and after tinning. On the one hand, it can further ensure the rejection of unqualified chips before gold removal and tinning, and on the other hand, it can ensure product quality after gold removal and tinning.

[0020] 3. This utility model is equipped with a molten tin height detection component on the feeding moving seat, which can automatically detect the molten tin height in the gold removal tin furnace and the tinning furnace. Then, based on the molten tin height detection result, the immersion depth of the chip can be accurately controlled to ensure that the tinning effect of the chip will not be inconsistent due to changes in the molten tin height.

[0021] 4. In the flux mechanism of this utility model, the material tank is fed in by a circulating pump in the middle, and a return tank is provided on the outside of the material tank. The return tank is connected to the flux container through a return pipeline to realize flux return. This can form a complete flux loop so that the flux liquid level in the material tank is always kept at the same height. This ensures that the chip can accurately pick up the flux and will not cause inconsistent flux dosage due to changes in the flux liquid level, thereby further ensuring process consistency. Attached Figure Description

[0022] Figure 1 This is the overall structural schematic diagram of the utility model.

[0023] Figure 2 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the loading tray in

[0024] Figure 3 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the chip detection mechanism in

[0025] Figure 4 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the preheating mechanism in

[0026] Figure 5 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the flux mechanism in

[0027] Figure 6 It is Figure 5 the schematic diagram of the structure of the flux container supporting the flux mechanism in

[0028] Figure 7 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the tinning furnace in

[0029] Figure 8 It is Figure 7 the overall schematic diagram of the tinning furnace in

[0030] Figure 9 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the hot air leveling mechanism in

[0031] Figure 10 It is Figure 1 the schematic diagram of the cooperation state between the chip suction component and the automatic suction cup changing mechanism in

[0032] Figure 11 It is Figure 10 the overall structural schematic diagram of the automatic suction cup changing mechanism in

[0033] Figure 12 It is Figure 2 the schematic diagram of the cooperation state between the tin liquid height detection component located behind the chip suction component and the tinning furnace in

[0034] Figure 13 It is Figure 12 the structural schematic diagram of the tin liquid height detection component in

[0035] Wherein, 1 is a moving feeding mechanism; 101 is a suction cup; 1011 is a suction cup groove; 1102 is a groove lower flange; 1103 is a groove upper flange; 102 is a rotary motor; 103 is a vacuum pressure gauge; 104 is a vacuum generator; 105 is a mechanism fixing plate; 106 is a first adjusting fixing seat; 107 is a first adjusting bolt; 108 is a recognition camera support; 109 is a recognition camera fixing block; 110 is a recognition camera; 111 is a recognition camera lens; 112 is a recognition light source fixing plate; 113 is a recognition light source; 114 is a vacuum filter; 115 is a pneumatic rotary joint; 116 is a swing angle motor; 117 is the X-axis moving module; 118 is the Z-axis moving module; 119 is the Y-axis moving module; 120 is the module support base; 121 is the detection probe; 122 is the probe cover; 123 is the probe fixing block; 124 is the probe fixing seat; 125 is the probe lifting seat; 126 is the probe lifting cylinder; 127 is the feeding moving seat; 128 is the chip picking assembly; 129 is the molten solder height detection assembly; 2 is the gold-removing solder furnace; 3 is the hot air leveling mechanism; 301 is the molten solder recovery housing; 302 is the molten solder recovery drawer; 303 is the fixed support; 304 is the height adjustment shaft; 305 is the hot air generating pipe; 306 is... Angle adjustment seat; 307 is angle adjustment shaft; 308 is hot air knife; 4 is chip detection mechanism; 401 is fixed base plate; 402 is mounting seat; 403 is detection light source; 404 is detection light source fixing plate; 405 is detection camera lens; 406 is detection camera support seat; 407 is second adjustment fixing seat; 408 is second adjustment bolt; 409 is detection camera; 410 is detection camera fixing block; 5 is feeding tray; 6 is unqualified tray; 7 is automatic suction cup changing mechanism; 701 is suction cup changing cylinder; 702 is cylinder fixing seat; 703 is suction cup placement seat; 704 is suction cup changing baffle; 7041 is... Insertion plate section; 705 is cover plate; 8 is main frame; 9 is preheating mechanism; 901 is preheating shell; 902 is preheating port; 903 is preheating support plate; 904 is heat insulation plate; 905 is preheating plate; 906 is maintenance handle; 907 is maintenance door; 10 is flux mechanism; 1001 is material tank; 1002 is limit stop; 1003 is material tank support plate; 1004 is flux feeding pipe; 1005 is circulating pump; 1006 is flux container; 1007 is liquid level sensor; 1008 is flux feeding port; 1009 is cleaning agent feeding port; 11 is tinning furnace; 1101 is tinning furnace opening. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings.

[0037] like Figures 1-13As shown, this utility model includes a main frame 8, and the main frame 8 is equipped with a moving feeding mechanism 1, a chip detection mechanism 4, a flux mechanism 10, a preheating mechanism 9, a gold-removing solder furnace 2, a soldering furnace 11, and a hot air leveling mechanism 3, wherein... Figure 2 , Figure 3 , Figure 7 and Figure 9 As shown, the mobile loading mechanism 1 includes a loading moving seat 127 with multiple degrees of freedom of movement. The loading moving seat 127 is equipped with a swing angle motor 116 and a chip picking assembly 128. The chip picking assembly 128 includes a mechanism fixing plate 105, and the lower end of the mechanism fixing plate 105 is equipped with a suction cup 101, a recognition camera 110, and a rotary motor 102. The chip is identified by the recognition camera 110 and then picked up by the suction cup 101. The suction cup 101 is then driven to rotate by the rotary motor 102 to adjust the chip's angle. The mechanism fixing plate 105... The chip's swing angle is adjusted by the swing motor 116, and then the chip is carried to the chip inspection mechanism 4 by the loading moving seat 127 for inspection. The qualified chip is then driven by the loading moving seat 127 to pass through the preheating mechanism 9, the flux mechanism 10, the gold removal furnace 2, the tinning furnace 11, and the hot air leveling mechanism 3 in sequence. The preheating mechanism 9 preheats the chip, the flux mechanism 10 provides the chip with flux, the gold removal furnace 2 and the tinning furnace 11 complete the gold removal and tinning processes of the chip, and after tinning, the hot air leveling mechanism 3 uses hot air to level the molten tin at the bottom of the chip.

[0038] like Figures 2-3 As shown, in this embodiment, the chip-collecting assembly 128 has a vacuum generator 104, a vacuum filter 114, and a pneumatic rotary joint 115 connected in sequence on its mechanism fixing plate 105. The pneumatic rotary joint 115 is connected to the suction cup 101 via a pipeline to realize the vacuum suction function of the suction cup 101. The vacuum generator 104, vacuum filter 114, and pneumatic rotary joint 115 are all known technologies in the art and are commercially available products. In addition, the rotary motor 102 can be a hollow motor, which is a known technology in the art. For example, see the hollow motor and suction cup structure in patent CN205397488U.

[0039] like Figures 2-3As shown, in this embodiment, the mechanism fixing plate 105 of the chip picking assembly 128 is further provided with a first adjusting fixing seat 106, a first adjusting bolt 107, a recognition camera support 108, and a recognition camera fixing block 109. The recognition camera support 108 and the first adjusting fixing seat 106 are both fixed to the mechanism fixing plate 105. The recognition camera fixing block 109 is slidably inserted into the recognition camera support 108 and its upper side is connected to the first adjusting fixing seat 106 via the first adjusting bolt 107. The recognition camera 110 is mounted on the recognition camera fixing block 109. When this invention is in operation, the height of the recognition camera fixing block 109 can be changed by turning the first adjusting bolt 107, thereby changing the height of the recognition camera 110. The recognition camera 110 is a technology known in the art and is a commercially available product.

[0040] like Figures 2-3 As shown, in this embodiment, the lower end of the mechanism fixing plate 105 of the chip absorbing component 128 is provided with an identification light source fixing plate 112, and the identification light source fixing plate 112 is provided with an identification light source 113 that cooperates with the light collection of the identification camera 110. The identification camera lens 111 is located on the upper side of the identification light source fixing plate 112. The identification light source 113 is a technology known in the art.

[0041] In operation, information such as chip type, placement angle, and coordinate position is acquired by the recognition camera 110 and transmitted to the equipment control system. After calculation and analysis, the equipment control system controls the rotary motor 102 and the tilting motor 116 to drive the suction cup 101 to adjust the chip's posture. For example, in one application of this invention, the information fed back by the recognition camera 110 can be used to determine whether the chip has pins on both sides or on all four sides. Then, the tilting motor 116 and the rotary motor 102 are controlled to change the position of the pins on each side of the chip. Figure 2 As shown, the rotary motor 102 directly drives the suction cup 101 to rotate, adjusting the chip's rotation angle, as... Figure 7 As shown, the swing angle motor 116 drives the mechanism fixing plate 105 to swing, which in turn drives the suction cup 101 to swing and adjust the chip swing angle.

[0042] like Figure 9As shown, in this embodiment, the mobile loading mechanism 1 includes an X-axis moving module 117, a Y-axis moving module 119, and a Z-axis moving module 118. The Y-axis moving module 119 is mounted on a module support base 120, which is mounted on the main frame 8. The Y-axis moving module 119 is provided with a Y-axis moving seat. The two ends of the X-axis moving module 117 are respectively mounted on corresponding Y-axis moving seats. The X-axis moving module 117 is provided with an X-axis moving seat, and the Z-axis moving module is mounted on the X-axis moving seat. The Z-axis moving module is provided with a Z-axis moving seat, and the loading moving seat 127 is mounted on the Z-axis moving seat. The X-axis moving module 117, Y-axis moving module 119, and Z-axis moving module 118 can be selected according to actual needs. For example, in this embodiment, the above moving modules can all be rodless cylinders. The Y-axis moving seat, X-axis moving seat, and Z-axis moving seat are respectively fixedly connected to the moving blocks on the corresponding rodless cylinders to achieve movement.

[0043] like Figure 2 , Figure 9 and Figures 12-13 As shown, in this embodiment, the feeding moving seat 127 is equipped with a molten tin height detection component 129 for detecting the molten tin level inside the gold-removing tin furnace 2 and the tin-plating tin furnace 11. In this embodiment, as... Figure 13 As shown, the molten tin height detection assembly 129 includes a detection probe 121, a probe fixing seat 124, a probe lifting seat 125, and a probe lifting cylinder 126. The probe lifting cylinder 126 is fixed on the loading moving seat 127. The probe lifting seat 125 is driven to lift by the probe lifting cylinder 126. The probe fixing seat 124 is fixed at the lower end of the probe lifting seat 125. Two detection probes 121 are fixed in the probe fixing seat 124. When the molten solder height detection component 129 is working, the two detection probes 121 are respectively energized with positive and negative current and moved downwards by the probe lifting seat 125. Before contacting the molten solder, the two detection probes 121 are in an open circuit state. At the moment of contact with the molten solder, the two detection probes 121 connect to form a circuit and transmit the signal back to the equipment control system. The equipment control system uses this signal to confirm the molten solder level inside the gold-plating furnace 2 and the tinning furnace 11, thereby accurately controlling the descent distance of the Z-axis moving module 118 to ensure that the chip immersion depth picked up by the suction cup 101 is consistent, thus avoiding inconsistent process due to changes in molten solder height. In addition, the molten solder height detection component 129 is located behind the mechanism fixing plate 105 of the chip picking component 128, which ensures a compact overall structure of the device without affecting operation.

[0044] like Figures 12-13As shown, in this embodiment, the probe holder 124 is provided with a probe cover 122 and a probe fixing block 123, wherein the detection probe 21 is fixed on the probe fixing block 123, and both the detection probe 21 and the probe fixing block 123 are located in the probe cover 122.

[0045] like Figure 3 As shown, in this embodiment, the chip detection mechanism 4 includes a mounting base 402 and a detection camera 409. The mounting base 402 has a fixed base plate 401 on its upper side, which is fixedly connected to the main frame 8. The detection camera 409 is located on one side of the mounting base 402. Figure 1 As shown, the main frame 8 has an opening on its platform for the inspection camera 409 to be exposed. During operation, the loading moving seat 127 moves the suction cup 101 and the chip to the position above the opening. Then, the inspection camera 409 inspects the chip pins, external dimensions, etc. Additionally, the X-axis moving module 117, Y-axis moving module 119, and Z-axis moving module 118 of the moving loading mechanism 1 can automatically adjust the chip's detection position and orientation based on the chip information confirmed by the recognition camera 110, to meet the defect detection needs of different types of chips.

[0046] like Figure 3 As shown, in this embodiment, the chip detection mechanism 4 further includes a second adjusting fixing seat 407, a second adjusting bolt 408, a detection camera support seat 406, and a detection camera fixing block 410. The second adjusting fixing seat 407 and the detection camera support seat 406 are both fixed to the mounting base 402. The detection camera fixing block 410 is slidably inserted into the detection camera support seat 406, and its upper end is connected to the second adjusting fixing seat 407 via the second adjusting bolt 408. The detection camera 409 is fixed to the detection camera fixing block 410. During operation, the height of the detection camera fixing block 410 can be adjusted by turning the second adjusting bolt 408, thereby adjusting the height of the detection camera 409.

[0047] like Figure 3 As shown, in this embodiment, a detection light source fixing plate 404 is provided on one side of the mounting base 402 of the chip detection mechanism 4, and a detection light source 403 is provided on the detection light source fixing plate 404 to cooperate with the detection camera 409 for light collection. The detection light source fixing plate 404 is located above the detection camera lens 405, and the detection light source 403 is a technology known in the art.

[0048] like Figure 1 As shown, in this embodiment, the main frame 8 is also provided with a feeding tray 5 and a defective tray 6, such as... Figure 2 As shown, the loading moving seat 127 drives the suction cup 101 to pick up the chip from the loading tray 5, as... Figure 3The chips are sent to the chip testing mechanism 4 for testing, and the defective chips are sent to the defective tray 6.

[0049] like Figure 4 As shown, in this embodiment, the preheating mechanism 9 includes a preheating housing 901, and a preheating port 902 is provided on the upper side of the preheating housing 901. From top to bottom, a preheating plate 905, a heat insulation plate 904, and a preheating support plate 903 are sequentially arranged inside the upper end of the preheating housing 901. A maintenance door 907 with a maintenance handle 906 is provided on one side of the preheating housing 901. In this embodiment, a heating resistance wire is provided on the preheating plate 905 for preheating by electrical heating. The heating temperature of the resistance wire can be automatically controlled by the equipment control system according to factors such as the chip type, that is, the preheating temperature of the preheating plate 905 is controlled. Additionally, a high-temperature resistant glass baffle is provided on the preheating port 902 to prevent foreign objects from entering the preheating housing 901.

[0050] like Figures 5-6 As shown, in this embodiment, the flux mechanism 10 includes a trough 1001, a trough support plate 1003, a circulating pump 1005, and a flux container 1006. The trough support plate 1003 is fixed on the main frame 8. The trough 1001 is limited on the trough support plate 1003 by a plurality of limiting blocks 1002. The circulating pump 1005 is located on the lower side of the trough support plate 1003 and is connected to the feed hole in the middle of the trough 1001 through a flux feeding pipe 1004. At the same time, the circulating pump 1005 is connected to the flux container 1006 through a pipeline. A return trough is provided on the outside of the trough 1001, and the return trough is connected to the flux container 1006 through a return pipeline. When the chip needs to be coated with flux, the circulating pump 1005 starts to draw flux from the flux container 1006 into the flux tank 1001, and the flux in the flux tank 1001 flows back to the flux container 1006 through the return tank to form a complete loop. This ensures that the liquid level in the flux tank 1001 is always kept at the same height, thereby ensuring the consistency of the chip being coated with flux.

[0051] like Figure 6As shown, in this embodiment, the flux container 1006 has a flux chamber and a cleaning agent chamber inside. The flux chamber has a flux inlet 1008 on its upper side, and the cleaning agent chamber has a cleaning agent inlet 1009 on its upper side. The circulation pump 1005 can be connected to the corresponding chambers via pipelines to switch between flux input and cleaning agent input. When it is necessary to replace the flux or clean the material tank 1001, the circulation pump 1005 switches to cleaning mode, and the flux solution can only be replaced after cleaning. In addition, in this embodiment, both the flux chamber and the cleaning agent chamber are equipped with level sensors 1007 to detect the remaining liquid volume in the corresponding chambers in real time. When it is necessary to replenish the solvent liquid, the corresponding liquid can be input from the flux inlet 1008 and the cleaning agent inlet 1009 respectively.

[0052] like Figures 7-8 As shown, both the gold-removing solder furnace 2 and the tin-enameling solder furnace 11 have solder furnace openings 1101 on their upper sides for the suction cup 101, the chip, and the detection probe 121 to pass through. Both the gold-removing solder furnace 2 and the tin-enameling solder furnace 11 are technologies known in the art and are commercially available products.

[0053] like Figure 9 As shown, in this embodiment, the hot air leveling mechanism 3 includes a molten solder recovery housing 301 with an opening at the top, and a hot air blade 308 is provided on one side of the molten solder recovery housing 301. After tinning is completed, the chip is moved to the upper side of the molten solder recovery housing 301 by the feeding moving seat 127. The hot air blade 308 blows hot air to level the molten solder at the bottom of the chip, while the solidified molten solder falls into the molten solder recovery housing 301 and does not fly around.

[0054] like Figure 9 As shown, in this embodiment, a fixed support 303 is provided on one side of the tin dross recycling shell 301, and a height adjustment shaft 304 is threaded onto the fixed support 303. Twisting the height adjustment shaft 304 can change its height relative to the fixed support 303. A horizontally arranged angle adjustment shaft 307 is threaded onto the upper end of the height adjustment shaft 304, and the angle adjustment shaft 307 is connected to the angle adjustment seat 306. Twisting the angle adjustment shaft 307 can change the angle of the angle adjustment seat 306. A hot air blade 308 is provided on the angle adjustment seat 306, and the hot air blade 308 is connected to the hot air device through the hot air generating pipe 305. In addition to adjusting the hot air blowing posture of the chip according to the chip type using the swing motor 116 and the rotary motor 102, the hot air blade 308 can also adjust the hot air blowing angle according to actual needs through the above-mentioned height adjustment shaft 304, angle adjustment shaft 307, angle adjustment seat 306, etc., to achieve a better leveling effect.

[0055] like Figure 9As shown in this embodiment, the lower end of the tin dross recycling shell 301 is provided with a tin dross recycling drawer 302. After the tin dross recycling drawer 302 is pulled out, the solidified tin dross can be cleaned up.

[0056] like Figures 10-11 As shown, the main frame 8 is equipped with an automatic suction cup changing mechanism 7, which includes a suction cup placement seat 703, a suction cup changing baffle 704, and a suction cup changing cylinder 701. The suction cup placement seat 703 has a cover plate 705 on its upper side, and an insertion plate cavity is formed between the cover plate 705 and the upper surface of the suction cup placement seat 703. The suction cup changing baffle 704 is driven to move by the suction cup changing cylinder 701. The suction cup changing baffle 704 is L-shaped, with its vertical connecting part connected to the suction cup changing cylinder 701, and its horizontal insertion plate part 7041 inserted into the insertion plate cavity. Figure 10 As shown, the suction cup 101 has a lower groove flange 1102 and an upper groove flange 1103 on its suction cup shaft, and a suction cup groove 1011 is formed between the lower groove flange 1102 and the upper groove flange 1103. The lower end of the rotary motor 102 is provided with a quick-change connector connected to the upper end of the suction cup shaft. When the suction cup 101 is inserted into the corresponding insertion hole on the suction cup placement seat 703, the upper groove flange 1103 abuts against the cover plate 705 and connects the suction cup groove 1011 with the insertion plate cavity. The insertion plate portion 7041 of the suction cup changing baffle 704 is inserted into the insertion plate cavity and blocks... The lower flange 1102 of the groove is blocked, preventing the suction cup 101 from being lifted, thus achieving automatic disengagement of the suction cup shaft from the quick-change connector. When the suction cup 101 needs to be installed, after the identification camera 110 confirms the suction cup model corresponding to the chip, the loading moving seat 127 moves the mechanism fixing plate 105 in the chip picking assembly 128 and connects the quick-change connector with the suction cup shaft of the corresponding suction cup 101. At this time, the insertion plate portion 7041 of the suction cup changing baffle 704 is in the retracted state and no longer obstructs, allowing the chip picking assembly 128 to lift and move the new suction cup 101 away. The quick-change connector is a well-known technology in the field; for example, see the suction cup quick-change structure in patent CN222328226U.

[0057] The working principle of this utility model is as follows:

[0058] The present invention includes the following steps in operation:

[0059] Step 1: The chip picking component 128 is moved to the top of the chip corresponding to the loading tray 5 by the loading moving seat 127 in the moving loading mechanism 1.

[0060] Step 2: The chip acquisition component 128 acquires the chip information from the recognition camera 110 and transmits it to the device control system.

[0061] Step 3: If the chip and suction cup 101 do not match the specifications, the equipment control system controls the feeding moving seat 127 to move the chip picking component 128 to the automatic suction cup changing mechanism 7 to replace the corresponding suction cup 101. If the chip and suction cup 101 match the specifications, this step is ignored.

[0062] Step 4: The feeding moving seat 127 drives the chip picking component 128 to descend so that the suction cup 101 picks up the chip.

[0063] Step 5: The equipment control system controls the rotary motor 102 and the tilting motor 116 to adjust the chip posture based on the chip information identified by the recognition camera 110.

[0064] Step 6: The feeding moving seat 127 drives the chip picking component 128, along with the chip, to the chip detection mechanism 4 for detection. If the chip passes the detection, it proceeds to the next process; if the chip fails the detection, it is placed in the unqualified material tray 6.

[0065] During the testing process, the feeding moving seat 127 can be moved according to actual needs, and the rotary motor 102 and the swing motor 116 can be rotated according to actual needs to ensure that the chip testing is thorough and there are no missed tests.

[0066] Step 7: After the chip passes the inspection, the feeding moving seat 127 drives the chip picking component 128, along with the chip, to the preheating mechanism 9 to complete the chip preheating.

[0067] During preheating, the feeding moving seat 127 can be moved as needed, and the rotary motor 102 and the sway motor 116 can rotate as needed to ensure thorough chip preheating. Additionally, as... Figure 4 As shown, the preheating plate 905 in the preheating mechanism 9 can also control the preheating temperature to ensure the preheating effect of the chip.

[0068] Step 8: After the chip is preheated, the feeding moving seat 127 drives the chip picking component 128, along with the chip, to the flux mechanism 10 to pick up the flux.

[0069] Among them, such as Figure 5 As shown, the flux mechanism 10 has a material tank 1001 in the middle that is driven to feed material by a circulating pump 1005. At the same time, a return tank is provided on the outside of the material tank 1001 and is connected to the flux container 1006 through a return pipeline to realize flux return. This can form a complete flux loop so that the liquid level in the material tank 1001 is always kept at the same height, thereby ensuring that the depth of flux adhering to the chip is consistent, thus ensuring the consistency of the process.

[0070] Step 9: After the chip has been coated with flux, the feeding moving seat 127 moves the chip picking assembly 128 along with the chip to the gold removal furnace 2 for the gold removal process.

[0071] Among them, such as Figures 12-13 As shown, the feeding moving seat 127 is equipped with a molten tin height detection component 129 to detect the molten tin level inside the gold-removing tin furnace 2, thereby ensuring that the equipment control system can accurately control the descent distance of the Z-axis moving module 118 so that the chips picked up by the suction cup 101 are immersed in the molten tin at a consistent depth, ensuring the consistency of the process.

[0072] Step 10: After the chip completes the gold removal process, the loading moving seat 127 drives the chip picking component 128 to move the chip together to the tinning furnace 11 to complete the tinning process.

[0073] Among them, such as Figures 12-13 As shown, the molten tin height detection component 129 is used to detect the molten tin level inside the tinning furnace 11, thereby ensuring that the equipment control system can accurately control the descent distance of the Z-axis moving module 118, so that the chip picked up by the suction cup 101 is immersed in the molten tin to a consistent depth, ensuring the consistency of the process.

[0074] Step 11: After the chip completes the soldering process, the feeding moving seat 127 moves the chip picking component 128 along with the chip to the hot air leveling mechanism 3, and the hot air leveles the solder at the bottom of the chip.

[0075] Among them, such as Figure 9 As shown, in addition to the feeding moving seat 127 being able to move according to actual needs, the rotary motor 102 and the swing motor 116 can also be rotated according to actual needs to ensure that the chip gets a good hot air leveling effect. The hot air knife 308 in the hot air leveling mechanism 3 can also be adjusted according to actual needs to ensure the leveling effect. At the same time, the solidified solder dross will fall into the solder dross recycling shell 301 and will not fly around.

[0076] Step 12: After the chip is heated and leveled by hot air, the material moving seat 127 moves the chip picking component 128 along with the chip to the chip testing mechanism 4 for testing to determine whether the product is qualified.

Claims

1. A multi-functional chip pin soldering apparatus, characterized by: The utility model relates to a chip soldering device, including main frame (8), and be equipped with mobile feeding mechanism (1), chip detection mechanism (4), flux mechanism (10), preheating mechanism (9), gold tin removal furnace (2), tin furnace (11) and hot air chasing mechanism (3) on main frame (8), wherein mobile feeding mechanism (1) includes the feeding movement seat (127) with multiple movement degrees of freedom, is equipped with swing motor (116) and chip suction assembly (128) on feeding movement seat (127), chip suction assembly (128) includes mechanism fixed plate (105), and the lower end of mechanism fixed plate (105) is equipped with suction disc (101), identification camera (110) and rotary motor (102), wherein chip is taken through suction disc (101) after the information of chip is identified through identification camera (110), suction disc (101) is driven to rotate through rotary motor (102), mechanism fixed plate (105) is driven to swing through swing motor (116), and chip is detected at chip detection mechanism (4) through feeding movement seat (127), and the chip that detects qualified is driven in turn through feeding movement seat (127) and passes through preheating mechanism (9), flux mechanism (10), gold tin removal furnace (2), tin furnace (11) and hot air chasing mechanism (3).

2. The multi-functional chip pin soldering apparatus of claim 1, wherein: The mechanism fixed plate (105) of chip suction assembly (128) is equipped with first adjustment fixed seat (106), first adjustment bolt (107), identification camera support (108) and identification camera fixed block (109), wherein identification camera support (108) and first adjustment fixed seat (106) are fixed on mechanism fixed plate (105), identification camera fixed block (109) is slidably inserted into identification camera support (108) and is connected to first adjustment fixed seat (106) through first adjustment bolt (107) on the upper side, and identification camera (110) is arranged on identification camera fixed block (109); The lower end of mechanism fixed plate (105) is equipped with identification light source fixed plate (112), and identification light source fixed plate (112) is equipped with identification light source (113) matched with the light collection of identification camera (110).

3. The multi-functional chip pin soldering apparatus of claim 1, wherein: The mobile feeding mechanism (1) includes X-direction movement module (117), Y-direction movement module (119) and Z-direction movement module (118), wherein the Y-direction movement module (119) is arranged on the module support base (120), the module support base (120) is arranged on the main frame (8), the Y-direction movement module (119) is provided with a Y-direction movement seat, and the X-direction movement module (117) is arranged on the Y-direction movement seat on the corresponding side, the X-direction movement module (117) is provided with an X-direction movement seat, and the Z-direction movement module is arranged on the X-direction movement seat, the Z-direction movement module is provided with a Z-direction movement seat, and the feeding movement seat (127) is arranged on the Z-direction movement seat.

4. The multi-functional chip pin soldering apparatus of claim 1, wherein: The upper feeding moving seat (127) is provided with a tin liquid level detection assembly (129), and the tin liquid level detection assembly (129) is arranged on the rear side of the mechanism fixed plate (105). The tin liquid level detection assembly (129) comprises a detection probe (121), a probe fixed seat (124), a probe lifting seat (125) and a probe lifting cylinder (126). The probe lifting cylinder (126) is fixedly arranged on the upper feeding moving seat (127), the probe lifting seat (125) is driven to lift by the probe lifting cylinder (126), the probe fixed seat (124) is fixedly arranged on the lower end of the probe lifting seat (125), and two detection probes (121) are fixedly arranged in the probe fixed seat (124).

5. The multi-functional chip pin soldering apparatus of claim 1, wherein: The chip detection mechanism (4) comprises a mounting seat (402) and a detection camera (409). The upper side of the mounting seat (402) is fixedly connected with the main frame body (8). The mounting seat (402) is provided with a detection camera (409) on one side. The main frame body (8) is provided with an opening on the table surface for the detection camera (409) to expose.

6. The multi-functional chip pin soldering apparatus of claim 5, wherein: The chip detection mechanism (4) comprises a second adjusting fixed seat (407), a second adjusting bolt (408), a detection camera support seat (406) and a detection camera fixed block (410). The second adjusting fixed seat (407) and the detection camera support seat (406) are fixedly arranged on the mounting seat (402). The detection camera fixed block (410) is slidingly inserted into the detection camera support seat (406) and is connected with the second adjusting fixed seat (407) through the second adjusting bolt (408) at the upper end. The detection camera (409) is fixedly arranged on the detection camera fixed block (410). The mounting seat (402) of the chip detection mechanism (4) is provided with a detection light source fixed plate (404) on one side. The detection light source fixed plate (404) is provided with a detection light source (403) for light collection in cooperation with the detection camera (409).

7. The multi-functional chip pin soldering apparatus of claim 1, wherein: The preheating mechanism (9) comprises a preheating shell (901), and the upper side of the preheating shell (901) is provided with a preheating port (902). The inside of the upper end of the preheating shell (901) is sequentially provided with a preheating plate (905), an insulation plate (904) and a preheating support plate (903) from top to bottom. The preheating shell (901) is provided with a maintenance door (907) with a maintenance handle (906) on one side. The preheating port (902) is provided with a high-temperature-resistant glass baffle.

8. The multi-functional chip pin soldering apparatus of claim 1, wherein: The flux mechanism (10) includes a tank (1001), a tank support plate (1003), a circulating pump (1005) and a flux container (1006), wherein the tank support plate (1003) is fixed on the main frame (8), the tank (1001) is arranged on the tank support plate (1003), the circulating pump (1005) is arranged on the lower side of the tank support plate (1003) and communicates with the middle feeding hole of the tank (1001) through a flux feeding pipeline (1004), and the circulating pump (1005) is connected with the flux container (1006) through a pipeline. The outer side of the tank (1001) is provided with a reflux tank, and the reflux tank is connected with the flux container (1006) through a reflux pipeline.

9. The multi-functional chip pin soldering apparatus of claim 1, wherein: The hot air chasing mechanism (3) includes an open-ended tin slag recovery shell (301), a fixed support (303) is arranged on one side of the tin slag recovery shell (301), a height adjusting shaft (304) is threadedly inserted on the fixed support (303), a horizontally arranged angle adjusting shaft (307) is threadedly inserted on the upper end of the height adjusting shaft (304), the angle adjusting shaft (307) is connected with an angle adjusting seat (306), a hot air knife (308) is arranged on the angle adjusting seat (306), and a tin slag recovery drawer (302) is arranged at the lower end of the tin slag recovery shell (301).

10. The multi-functional chip pin soldering apparatus of claim 1, wherein: The main frame (8) is provided with an automatic suction disc changing mechanism (7), the automatic suction disc changing mechanism (7) includes a suction disc placing seat (703), a suction disc changing baffle (704) and a suction disc changing cylinder (701), wherein a cover plate (705) is arranged on the upper side of the suction disc placing seat (703), and a plug plate cavity is formed between the cover plate (705) and the upper surface of the suction disc placing seat (703), the suction disc changing baffle (704) is driven to move by the suction disc changing cylinder (701), the suction disc changing baffle (704) is provided with a horizontal plug plate part (7041) inserted into the plug plate cavity, a recess lower flange (1102) and a recess upper flange (1103) are arranged on the suction disc shaft of the suction disc (101), and a suction disc recess (1011) is formed between the recess lower flange (1102) and the recess upper flange (1103), a quick-change joint is arranged at the lower end of the rotary motor (102) and connected with the upper end of the suction disc shaft, when the suction disc (101) is inserted into the corresponding insertion hole of the suction disc placing seat (703), the recess upper flange (1103) abuts against the cover plate (705), the suction disc recess (1011) is connected with the plug plate cavity, and the plug plate part (7041) of the suction disc changing baffle (704) is inserted into the plug plate cavity and blocks the recess lower flange (1102).

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