Heating assembly and heating non-combustion device
By using snap-fit components to fix the heating element in the mounting cavity of the heat transfer substrate in the heating non-combustible device, the problem of unstable interface contact quality under high temperature environment is solved, and the stability and efficiency of heat transfer effect are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-03-17
AI Technical Summary
In traditional heating non-combustion devices, the interfacial contact quality between the heating element and the heat transfer substrate is difficult to stabilize under high-temperature conditions, affecting heat transfer performance.
The heating element is fixed in the mounting cavity of the heat transfer substrate by snap-fit components, and is pressed against the cavity wall near the heating cavity by the snap-fit components to form a tight contact and improve heat transfer stability.
Maintaining the contact quality between the heating element and the heat transfer substrate in high-temperature environments improves the stability and efficiency of heat transfer.
Smart Images
Figure CN223994414U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of aerosol generation equipment technology, specifically to a heating component and a heating non-combustible device. Background Technology
[0002] The heating components of a heated non-combustible device typically include a heat transfer substrate and a heating element. The heat transfer substrate has a heating cavity to contain and heat a solid aerosol matrix. The heating element is located outside the heat transfer substrate and generates heat, which is conducted through the heat transfer substrate to the aerosol matrix within the heating cavity, thus heating it to produce an aerosol. Therefore, the quality of the interfacial contact between the heating element and the heat transfer substrate has a significant impact on the overall heat transfer performance.
[0003] Traditional interfacial heat transfer often requires the use of organic thermally conductive interface materials (such as thermally conductive silicone rubber) for bonding to enhance heat transfer. However, the heat transfer temperature is limited by the heat resistance temperature of the organic thermally conductive interface material, making it difficult to apply stably in some application scenarios where the heat transfer temperature is higher than the heat resistance temperature of the organic thermally conductive interface material. Utility Model Content
[0004] This application provides a new heating component and a heating non-combustible device to improve the stability of heat transfer effect of heating element and heat transfer substrate in high-temperature applications.
[0005] According to a first aspect, one embodiment provides a heating assembly, comprising:
[0006] A heat transfer substrate having an adjacently arranged heating cavity and a mounting cavity, the heating cavity being used to contain and heat at least a portion of the aerosol matrix;
[0007] A heating element is disposed in the mounting cavity;
[0008] And a snap-fit component, snapped onto the cavity wall of the mounting cavity, to press the heating element against the cavity wall of the mounting cavity near the heating cavity.
[0009] In one embodiment, the heat transfer substrate includes a main body and a protrusion, the heating cavity is disposed on the main body, the main body has a heat transfer surface exposed to the outside of the main body for heat transfer by the heating element; the protrusion is disposed around the heat transfer surface on the main body, and the protrusion and the heat transfer surface surround to form the mounting cavity.
[0010] In one embodiment, both the heat transfer surface and the surface of the heating element that contacts the heat transfer surface are planar.
[0011] In one embodiment, the main body is a cup structure with side walls and a bottom wall, and the protrusion is disposed on the bottom wall of the main body;
[0012] Alternatively, the main body may include a tubular portion, one side of which has a surface that serves as the heat transfer surface, and the protrusion is disposed on the surface.
[0013] In one embodiment, the snap-fit element is a metal snap spring, and the cavity wall of the mounting cavity is provided with a snap groove, in which the snap spring is snapped.
[0014] In one embodiment, the groove wall on the side of the slot away from the heating chamber is sloped to form an flared opening, which is used to provide the pushing force of the retaining spring to push the heating element.
[0015] In one embodiment, the heating element is one of a high-temperature co-fired ceramic heating element, a stainless steel thick-film heating element, a ceramic thick-film heating element, or a mesh-bonded ceramic heating element.
[0016] In one embodiment, the contact surface between the heating element and the cavity wall of the mounting cavity is provided with a thermally conductive layer; the thermal conductivity of the thermally conductive layer is not less than 50 W / (m·K).
[0017] In one embodiment, one end of the heating chamber has a matrix inlet for inserting an aerosol matrix. The wall of the heating chamber is provided with an air passage that communicates with the matrix inlet. The air passage is used to allow airflow from outside the heat transfer substrate to flow into the heating chamber and enter the aerosol matrix contained in the heating chamber.
[0018] According to a second aspect, one embodiment provides a heating non-combustible device, comprising:
[0019] case;
[0020] A heating component is disposed in the housing, and the heating component is the heating component described in any of the above embodiments;
[0021] And a power supply component, which supplies power to the heating element.
[0022] According to the heating assembly of the above embodiment, by providing an installation cavity adjacent to the heating cavity on the heat transfer substrate, an installation space is provided for the heating element and the snap-fit component, so that the snap-fit component can be snapped into the installation cavity to press the heating element against the cavity wall of the installation cavity near the heating cavity, which helps to enhance the heat transfer quality of the heating element to the heating cavity; and compared with the heat transfer enhancement method of using organic thermally conductive interface material bonding, it is beneficial to maintain the snap-fit effect in high-temperature environment, thereby ensuring the contact quality between the heating element and the heat transfer substrate, and improving the stability of the heat transfer effect of the heating element and the heat transfer substrate in high-temperature applications. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the exploded structure of a heating assembly according to one embodiment;
[0024] Figure 2 This is a cross-sectional structural diagram of a heating assembly according to one embodiment;
[0025] Figure 3 This is a cross-sectional structural diagram of the heating assembly in another embodiment;
[0026] Figure 4 This is a cross-sectional structural schematic diagram of a heating non-combustible device according to one embodiment.
[0027] In the figure, 100 is the heat transfer substrate; 110 is the heating cavity; 111 is the substrate insertion port; 120 is the mounting cavity; 121 is the slot; 130 is the main body; 131 is the heat transfer surface; 132 is the side wall; 133 is the bottom wall; 134 is the tubular part; and 140 is the protrusion.
[0028] 200. Heating element; 210. Lead wire;
[0029] 300. SIM card connector;
[0030] 400. Housing; 410. Insertion port;
[0031] 500. Power supply components;
[0032] 600. Fixed components; 610. Isolation space;
[0033] 700, aerosol matrix. Detailed Implementation
[0034] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.
[0035] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.
[0036] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).
[0037] In this embodiment, the heating element 200 is fixed in the mounting cavity 120 adjacent to the heating cavity 110 using the snap-fit member 300, and the heating element 200 is pressed against the cavity wall of the mounting cavity 120 near the heating cavity 110. This not only helps to enhance the heat transfer quality, but also, compared with the heat transfer enhancement method of using organic thermally conductive interface materials for bonding, it is beneficial to maintain the snap-fit effect in high-temperature environments, ensuring the contact quality between the heating element 200 and the heat transfer substrate 100, and helping to improve the stability of the heat transfer effect of the heating element 200 and the heat transfer substrate 100 in high-temperature applications.
[0038] Embodiments of the heating component in this application:
[0039] In one embodiment, please refer to Figures 1-3 The heating assembly includes a heat transfer substrate 100, a heating element 200, and a snap-fit element 300.
[0040] Please refer to Figure 1 and Figure 2 The heating element 200 can be understood as a heat-generating component in a heating assembly; the heat transfer substrate 100 can be understood as a heat transfer component used to transfer the heat generated by the heating element 200 to the aerosol matrix 700. In one embodiment, please refer to... Figure 2 The heat transfer substrate 100 has a heating cavity 110 and a mounting cavity 120 arranged adjacent to each other. The heating cavity 110 is used to contain and heat at least a portion of the aerosol matrix 700, and the heating element 200 is disposed in the mounting cavity 120.
[0041] Please refer to Figure 1 and Figure 2The snap-fit component 300 can be understood as a fixing component used to fix the heating element 200 in the mounting cavity 120, and the snap-fit component 300 also has the function of enhancing the heat transfer effect between the heating element 200 and the heat transfer substrate 100. In one embodiment, the snap-fit component 300 is snapped onto the cavity wall of the mounting cavity 120 and presses the heating element 200 against the cavity wall of the mounting cavity 120 near the heating cavity 110, so that the heating element 200 and the heat transfer substrate 100 can be in close contact, which helps to enhance the heat transfer quality.
[0042] Compared to the enhanced heat transfer method of bonding organic thermally conductive interface materials, the snap-fit component 300 is more likely to maintain stable mechanical properties in high-temperature environments, which helps to ensure the contact quality between the heating element 200 and the heat transfer substrate 100, thereby maintaining the stable heat transfer effect of the heating element 200 and the heat transfer substrate 100 in high-temperature environments and improving the heat transfer stability of the heating component.
[0043] To reduce heat loss, in one embodiment, the heat transfer substrate 100 can be made of a material with a thermal conductivity of not less than 30 W / (m·K), such as aluminum alloy, magnesium alloy, silver alloy, copper alloy, or a double-layer metal composite material; the double-layer metal composite material includes an inner layer material and an outer layer material, with the outer layer material covering the outside of the inner layer material, and the thermal conductivity of the outer layer material being lower than that of the inner layer material. These materials can be purchased from the market and will not be described further here.
[0044] In one embodiment, please refer to Figure 1 and Figure 2 The heat transfer substrate 100 may include a main body 130 and a protrusion 140. A heating cavity 110 is disposed on the main body 130. The main body 130 has a heat transfer surface 131 exposed to the outside of the main body 130 for heat transfer by the heating element 200. The protrusion 140 is disposed on the main body 130 around the heat transfer surface 131, and the protrusion 140 and the heat transfer surface 131 surround to form an mounting cavity 120.
[0045] Those skilled in the art will understand that the shapes of the heat transfer surface 131 and the surfaces of the heating element 200 that are in contact with the heat transfer surface 131 should at least partially match each other in order to facilitate heat transfer. For example, the surfaces of the heat transfer surface 131 and the heating element 200 that are in contact with the heat transfer surface 131 can both be set as planes or both as adapted curved surfaces.
[0046] Furthermore, in different embodiments, the heat transfer substrate 100 can be integrally formed from the main body 130 and the protrusion 140, or it can be assembled separately. Alternatively, the protrusion 140 can be omitted, and a groove can be provided on the main body 130 to serve as a mounting cavity 120.
[0047] In one embodiment, please refer to Figure 2The main body 130 can be a cup structure with side walls 132 and bottom walls 133, and the protrusion 140 is provided on the bottom wall 133 of the main body 130.
[0048] For example, the bottom wall 133 can be circular, and its thickness can be set to 0.2mm-2mm; the side wall 132 can be cylindrical and disposed on one side of the bottom wall 133 along the thickness direction, and its thickness can be 0.2mm-0.8mm; the protrusion 140 can be annular and disposed on the side of the bottom wall 133 opposite to the side wall 132, so as to form a circular mounting cavity 120 with the bottom wall 133. In other embodiments, the side wall 132 and the bottom wall 133 can also be configured with other shapes and sizes that meet design and usage requirements.
[0049] In another embodiment, please refer to Figure 3 The main body 130 includes a tubular portion 134, one side of which has a surface serving as a heat transfer surface 131, and a protrusion 140 is provided on the surface.
[0050] For example, the cross-section of the tubular portion 134 may be generally D-shaped, and the tubular portion 134 has a plane on one side along the axial direction as a heat transfer surface 131, and the protrusion 140 is disposed on the plane to surround and form an installation cavity 120.
[0051] In some further embodiments, the main body 130 may also include a bottom sealing portion, which may be disposed at one end of the tubular portion 134 to form a heating cavity 110 together with the tubular portion 134.
[0052] In different embodiments, the specific shape of the protrusion 140 is not limited. For example, it can be a continuously arranged ring or a ring formed by multiple spaced parts, as long as it can form the mounting cavity 120.
[0053] In one embodiment, please refer to Figures 1-3 The retaining element 300 can be a metal retaining spring. The cavity wall of the mounting cavity 120 can be provided with a retaining groove 121, in which the retaining spring is engaged to limit the movement of the heating element 200. The retaining spring can be made of stainless steel, copper, nickel alloy, or other non-metallic materials. The cross-sectional shape of the retaining spring can be circular to allow it to engage with the retaining groove 121 during installation.
[0054] For example, please refer to Figure 1 The snap-fit component 300 is a circular snap ring with an opening on one side, which provides space for the snap ring to deform. The snap ring is made of 304 stainless steel and has a circular cross-section.
[0055] In a further embodiment, in order for the retaining spring to push the heating element 200 against the heat transfer surface 131, the groove wall of the retaining groove 121 away from the heating cavity 110 can be set as a slope, so that the retaining groove 121 forms an opening to provide a pushing force for the retaining spring to push the heating element 200. Exemplarily, the cross-sectional shape of the retaining groove 121 can be an isosceles trapezoid to provide a pushing force for the heating element 200 while limiting the retaining spring.
[0056] In other embodiments, the snap-fit element 300 may also be a metal spring or other structural component capable of snapping onto the cavity wall of the mounting cavity 120. A snap-fit protrusion may also be provided on the cavity wall of the mounting cavity 120 instead of a slot 121 to position the snap-fit element 300.
[0057] In one embodiment, the heating element 200 can be one of a high-temperature co-fired ceramic heating element, a stainless steel thick-film heating element, a ceramic thick-film heating element, or a mesh-bonded ceramic heating element. Furthermore, the thickness and diameter of the heating element 200 can be set as needed; for example, the thickness of the heating element 200 can be 0.2mm-1mm, and the diameter can be 6mm-10mm. These heating element forms have a large heating area, which helps to improve the heating efficiency of the heating assembly.
[0058] Among them, the high-temperature co-fired ceramic heating element is made by sintering multiple layers of ceramic materials together with a metal conductor at high temperature. It generates heat through the conduction of electricity through the metal conductor and has good electrical insulation properties. The stainless steel thick-film heating element is made by sequentially printing and sintering an insulating thick-film layer, a thick-film heating layer, a thick-film electrode layer, and a thick-film protective layer on a stainless steel substrate. The ceramic thick-film heating element is composed of a thick-film heating layer, a thick-film electrode layer, and a protective layer formed by printing and sintering on a ceramic substrate, and also has good electrical insulation properties. The mesh-bonded ceramic heating element can be understood as a heating element formed by binding a heating mesh to a ceramic substrate. The heating element 200 mentioned above can be purchased from the market, and its specific structure and manufacturing method will not be described here.
[0059] In one embodiment, the side of the heating element 200 away from the heat transfer surface 131 may also be provided with a lead wire 210 for electrical connection with the power supply component 500, so as to generate heat when energized.
[0060] In one embodiment, the contact surface where the heating element 200 abuts against the cavity wall of the mounting cavity 120 is provided with a heat-conducting layer (not shown in the figure); the thermal conductivity of the heat-conducting layer can be not less than 50 W / (m·K) to improve the heat conduction efficiency.
[0061] In some embodiments, the thermally conductive layer may be a thermally conductive plating layer formed by plating, and the plating material of the thermally conductive plating layer may be silver, aluminum, silver-copper alloy, or other materials. In other embodiments, the thermally conductive layer may also be a thermally conductive coating layer formed by coating, and the coating material of the thermally conductive coating layer may be graphite or other materials.
[0062] In one embodiment, please refer to Figure 2 The heating chamber 110 has a matrix inlet 111 at one end for inserting the aerosol matrix 700. An air passage (not shown in the figure) is provided on the wall of the heating chamber 110, communicating with the matrix inlet 111. The air passage allows airflow from outside the heat transfer substrate 100 to flow into the heating chamber 110 and enter the aerosol matrix 700 contained within it. This enables the heat transfer substrate 100 to heat the airflow in the air passage to generate a hot airflow, which in turn heats the aerosol matrix 700, thereby improving heating efficiency and heating uniformity.
[0063] Those skilled in the art will understand that the arrangement of the air passage is not limited, as long as it meets the design and usage requirements. For example, for a heat transfer substrate 100 with a cup-shaped main body 130, interconnected air guide grooves can be provided on the side wall 132 and bottom wall 133 of the heating chamber 110 to form an air passage. Alternatively, protrusions can be provided on the side wall 132 and bottom wall 133 of the heating chamber 110 so that the gaps between the protrusions form an air passage.
[0064] In some embodiments, the end of the heat transfer substrate 100 with the substrate insertion port 111 may also have a protruding edge so as to fix the heat transfer substrate 100 by means of the protruding edge.
[0065] Examples of the heating non-combustion device in this application:
[0066] In one embodiment, please refer to Figure 4 The heated non-combustible device includes a housing 400, an energy supply component 500, and a heating component as described in any of the above embodiments. The heating component is disposed in the housing 400, and the energy supply component 500 is used to supply energy to the heating element 200 in the heating component so that the heating element 200 heats up. The energy supply component 500 may also be disposed in the housing 400.
[0067] The power supply component 500 can be understood as a battery cell or a collection of related components such as a battery cell and a circuit board, used to supply power to the heating element 200. In some embodiments, the power supply component 500 can also be used to control the heating power of the heating element 200, or to support other functions of the heated non-combustible device, such as displaying usage status information of the heated non-combustible device.
[0068] In one embodiment, please refer to Figure 4The housing 400 has an insertion port 410, and a fixing component 600 is installed inside the housing 400 corresponding to the insertion port 410. The fixing component 600 can be understood as a collection of parts or related parts used to install and fix the heating component. The fixing component 600 has a fixing cavity communicating with the insertion port 410 for installing the heating component. When the heating component is installed in the fixing cavity, there is an isolation space 610 on the outside of the heating component, so that an air insulation layer can be formed on the outer periphery of the heating component, which helps to reduce heat loss during heating and improve heating efficiency.
[0069] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.
Claims
1. A heating assembly, characterized by, The heat transfer base comprises a main body part and a protruding part, the heating cavity is arranged on the main body part, the main body part has a heat transfer surface exposed outside the main body part for heat transfer of the heating element, and the protruding part is arranged on the main body part around the heat transfer surface, and the protruding part and the heat transfer surface form the mounting cavity. The heat transfer surface and the surface of the heating element in contact with the heat transfer surface are both planes. The main body part is a cup structure having a side wall and a bottom wall, and the protruding part is arranged on the bottom wall of the main body part. Or, the main body part comprises a tubular part, one side of the tubular part has a surface as the heat transfer surface, and the protruding part is arranged on the surface.
2. The heating assembly of claim 1, wherein, The clamping piece is a metal spring, and the cavity wall of the mounting cavity is provided with a clamping groove, and the spring is clamped in the clamping groove.
3. The heating assembly of claim 2, wherein, The groove wall of the clamping groove away from the heating cavity is a slope surface to form a flared clamping groove for providing a pushing force of the spring to push the heating element.
4. The heating assembly of claim 3, wherein, The heating element is one of a high-temperature co-fired ceramic heating sheet, a stainless steel thick film heating sheet, a ceramic thick film heating sheet, and a bound net type ceramic heating sheet. The contact surface of the heating element in contact with the cavity wall of the mounting cavity is provided with a heat conduction layer, and the heat conduction coefficient of the heat conduction layer is not less than 50 W / (m·K).
5. The heating assembly of any one of claims 1 to 4, wherein, One end of the heating cavity has a substrate insertion port for insertion of an aerosol substrate, the cavity wall of the heating cavity is provided with an air channel, the air channel is in communication with the substrate insertion port, and the air channel is used for flowing of air outside the heat transfer base into the heating cavity and into the aerosol substrate contained in the heating cavity.
6. The heating assembly of claim 5, wherein, The heat transfer base comprises a main body part and a protruding part, the heating cavity is arranged on the main body part, the main body part has a heat transfer surface exposed outside the main body part for heat transfer of the heating element, and the protruding part is arranged on the main body part around the heat transfer surface, and the protruding part and the heat transfer surface form the mounting cavity.
7. The heating assembly of any one of claims 1 to 4, wherein, The heat transfer surface and the surface of the heating element in contact with the heat transfer surface are both planes.
8. The heating assembly of any one of claims 1 to 4, wherein, The main body part is a cup structure having a side wall and a bottom wall, and the protruding part is arranged on the bottom wall of the main body part.
9. The heating assembly of any one of claims 1 to 4, wherein, Or, the main body part comprises a tubular part, one side of the tubular part has a surface as the heat transfer surface, and the protruding part is arranged on the surface.
10. A heat-not-burn device, characterized in that The clamping piece is a metal spring, and the cavity wall of the mounting cavity is provided with a clamping groove, and the spring is clamped in the clamping groove. The groove wall of the clamping groove away from the heating cavity is a slope surface to form a flared clamping groove for providing a pushing force of the spring to push the heating element. The heating element is one of a high-temperature co-fired ceramic heating sheet, a stainless steel thick film heating sheet, a ceramic thick film heating sheet, and a bound net type ceramic heating sheet. The contact surface of the heating element in contact with the cavity wall of the mounting cavity is provided with a heat conduction layer, and the heat conduction coefficient of the heat conduction layer is not less than 50 W / (m·K). One end of the heating cavity has a substrate insertion port for insertion of an aerosol substrate, the cavity wall of the heating cavity is provided with an air channel, the air channel is in communication with the substrate insertion port, and the air channel is used for flowing of air outside the heat transfer base into the heating cavity and into the aerosol substrate contained in the heating cavity. The heat transfer base comprises a main body part and a protruding part, the heating cavity is arranged on the main body part, the main body part has a heat transfer surface exposed outside the main body part for heat transfer of the heating element, and the protruding part is arranged on the main body part around the heat transfer surface, and the protruding part and the heat transfer surface form the mounting cavity. The heat transfer surface and the surface of the heating element in contact with the heat transfer surface are both planes. The main body part is a cup structure having a side wall and a bottom wall, and the protruding part is arranged on the bottom wall of the main body part. Or, the main body part comprises a tubular part, one side of the tubular part has a surface as the heat transfer surface, and the protruding part is arranged on the surface. The clamping piece is a metal spring, and the cavity wall of the mounting cavity is provided with a clamping groove, and the spring is clamped in the clamping groove. The groove wall of the clamping groove away from the heating cavity is a slope surface to form a flared clamping groove for providing a pushing force of the spring to push the heating element. The heating element is one of a high-temperature co-fired ceramic heating sheet, a stainless steel thick film heating sheet, a ceramic thick film heating sheet, and a bound net type ceramic heating sheet. The contact surface of the heating element in contact with the cavity wall of the mounting cavity is provided with a heat conduction layer, and the heat conduction coefficient of the heat conduction layer is not less than 50 W / (m·K). One end of the heating cavity has a substrate insertion port for insertion of an aerosol substrate, the cavity wall of the heating cavity is provided with an air channel, the air channel is in communication with the substrate insertion port, and the air channel is used for flowing of air outside the heat transfer base into the heating cavity and into the aerosol substrate contained in the heating cavity.