Linear cutting system

Abstract

The embodiment of the utility model provides a wire cutting system. The wire cutting system comprises a stock solution ground pool; the system reuse water inlet is connected with a spraying pipe assembly in a cutting chamber in the wire cutting machine through a first pipeline, and liquid entering from the system reuse water inlet is conveyed to the spraying pipe assembly. And liquid sprayed by the spraying pipe assembly enters the stock solution ground pool. According to the linear cutting system, the liquid cyclic utilization rate can be increased, the cutting quality is improved, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to wire cutting technology, and more particularly to a wire cutting system. Background Technology

[0002] Solar power generation technology is one of the fastest-growing and most dynamic research fields in recent years. Crystalline silicon cells are one of the important components of solar panels, and their quality is crucial. Typically, a slicing machine is used to slice a square rod to obtain silicon wafers, which are then diced into smaller wafers using a dicing machine to manufacture crystalline silicon cells.

[0003] During the slicing process, the slicing machine uses a cutting wire for cutting and sprays cutting fluid onto the cutting area for cooling and to wash away silicon powder adhering to the cutting wire, thereby reducing silicon powder on the silicon surface and improving surface quality. As cutting continues, the concentration of silicon powder in the cutting fluid increases, which will affect the cutting quality of the silicon wafer surface, necessitating timely reduction of the silicon powder concentration.

[0004] Traditionally, pure water is injected into the slicing machine's supply tank to reduce silicon powder concentration. However, in actual operation, it was found that the amount of pure water used is very large, resulting in high production costs. Furthermore, using a feedstock cart to supply liquid to the supply tank for rinsing or other functions also incurs high costs. Moreover, the supply tank needs to have a large volume to meet the supply of cutting fluid, making the overall size and weight of the slicing machine relatively large. Summary of the Invention

[0005] To address one of the aforementioned technical deficiencies, this application provides a wire cutting system.

[0006] According to a first aspect of the embodiments of this application, a wire cutting system is provided, comprising: a raw liquid pool;

[0007] The system's recycled water inlet is connected to the spray pipe assembly in the cutting chamber of the wire EDM machine via the first pipeline. The liquid entering from the system's recycled water inlet is sent to the spray pipe assembly; the liquid sprayed out by the spray pipe assembly enters the raw liquid pool.

[0008] The technical solution provided in this application connects the system's recycled water inlet to the spray pipe assembly in the cutting chamber of the wire EDM machine via a first pipeline. Liquid entering from the system's recycled water inlet is delivered to the spray pipe assembly, shortening the liquid's circulation path in the initial cutting stage. This allows the cutting fluid to quickly reach the spray pipe assembly to coordinate with the cutting process, significantly improving cutting efficiency. Furthermore, the liquid sprayed from the spray pipe assembly enters the raw liquid pool for centralized filtration. Therefore, it is not necessary to supply a large amount of pure water to the slicing machine's supply cylinder, saving water consumption and reducing production costs.

[0009] Furthermore, the need for a raw material cart to supply cutting fluid to the supply cylinder is eliminated, simplifying the cutting process and system configuration, thus reducing production costs. Similarly, the pipeline and equipment for supplying pure water to the supply cylinder, as in traditional solutions, are eliminated, further simplifying the system configuration. Attached Figure Description

[0010] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0011] Figure 1 A schematic diagram of the wire cutting system provided in the embodiments of this application;

[0012] Figure 2 Another schematic diagram of the wire cutting system provided in the embodiments of this application.

[0013] Figure label:

[0014] 11-First filter cartridge; 12-Second filter cartridge;

[0015] 2-Large plate heat exchanger;

[0016] 3-Spray pipe assembly;

[0017] 4-Liquid supply cylinder;

[0018] 5-Original solution pool;

[0019] 6- Wastewater treatment plant;

[0020] 7-Flow meter;

[0021] 81-First pipeline; 82-Second pipeline; 83-Third pipeline; 84-Fourth pipeline; 85-Fifth pipeline;

[0022] 9. Air conditioning. Detailed Implementation

[0023] To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0024] This embodiment provides a wire EDM system capable of supplying cutting fluid to the cutting chamber of a wire EDM machine to cool the chamber and wash away powder adhering to the cutting wire. The wire EDM machine can be a squaring machine or a slicing machine; this embodiment uses a slicing machine as an example. The slicing machine is used to slice hard and brittle materials such as silicon, magnetic materials, and sapphire; this embodiment uses a silicon rod (hereinafter referred to as a silicon rod) as an example.

[0025] like Figure 1 As shown, the slicer is equipped with a cutting chamber, inside which is a spray pipe assembly 3. The silicon rod is located in the cutting chamber and is cut by a cutting line. The slicer is also equipped with a liquid supply cylinder 4.

[0026] The wire cutting system provided in this embodiment includes a raw material pool 5. The wire cutting system has a unified system recycled water inlet, which is connected to a spray pipe assembly 3 via a first pipe 81. Liquid entering from the system recycled water inlet is directly sent to the spray pipe assembly 3, which sprays cutting fluid into the cutting chamber. This cools the cutting chamber, improving the surface quality of the cut silicon rod, and also washes away silicon powder adhering to the cutting wire, further improving the surface quality of the cut silicon rod and thus increasing the yield.

[0027] The liquid sprayed from the spray pipe assembly 3 is collected by the liquid collection device at the bottom of the cutting chamber, and then enters the raw liquid pool directly through the pipeline, bypassing the supply cylinder 4. The raw liquid pool can centrally filter the cutting liquid discharged from multiple slicing machines, which can reduce the volume of the supply cylinder in a single slicing machine, thereby simplifying the structure of the slicing machine, reducing its weight, and facilitating assembly and transportation.

[0028] In traditional solutions, a feedstock cart supplies cutting fluid to the supply tank, while pure water is supplied from the return water inlet to the supply tank to adjust the silicon powder concentration in the cutting fluid to meet cutting requirements. On one hand, the traditional solution relies on the feedstock cart, making the system relatively complex. On the other hand, at the beginning of cutting, the cutting fluid does not actually need filtration, nor does it require monitoring or adjustment of the silicon powder concentration. However, in the traditional solution, the cutting fluid first enters the supply tank and then is supplied to the spray pipe assembly via a circulation loop, resulting in a slow initial return flow rate of the cutting fluid, which affects cutting efficiency. As the cutting time increases, the silicon powder concentration in the cutting fluid increases, requiring the addition of more pure water, resulting in a large water consumption.

[0029] The technical solution provided in this embodiment connects the system's recycled water inlet to the spray pipe assembly in the cutting chamber of the wire EDM machine via a first pipeline. Liquid entering from the system's recycled water inlet is delivered to the spray pipe assembly, shortening the liquid's circulation path during the initial cutting phase. This allows the cutting fluid to quickly reach the spray pipe assembly and coordinate with the cutting process, significantly improving cutting efficiency. Furthermore, the liquid sprayed from the spray pipe assembly enters the raw liquid pool for centralized filtration. Therefore, it is not necessary to supply a large amount of pure water to the slicing machine's supply cylinder, saving water consumption and reducing production costs.

[0030] Furthermore, the need for a raw material cart to supply cutting fluid to the supply cylinder is eliminated, simplifying the cutting process and system configuration, thus reducing production costs. Similarly, the pipeline and equipment for supplying pure water to the supply cylinder, as in traditional solutions, are eliminated, further simplifying the system configuration.

[0031] The above technical solution enables direct water supply for cutting, allowing for rapid and coordinated cutting. A flow detector is installed on the first pipeline 81 to detect and control the liquid flow rate, and a temperature detector can also be installed to detect the liquid temperature.

[0032] Based on the above technical solution, the wire cutting system also includes: a first filter barrel 11 and a large plate heat exchanger 2. The liquid supply cylinder 4 is connected to the first filter barrel 11. The liquid in the liquid supply cylinder 4 is filtered by the first filter barrel 11 and then cooled by the large plate heat exchanger 2 before being sent to the spray pipe assembly 3.

[0033] As cutting continues, the concentration of silicon powder in the cutting fluid increases. The liquid in the cutting chamber can then enter the supply cylinder 4, be filtered by the first filter barrel 11, and then cooled by the large plate heat exchanger 2 before being sent to the spray pipe assembly 3. This reduces the concentration of silicon powder in the cutting fluid and helps improve the cutting quality.

[0034] Furthermore, the system's recycled water inlet is connected to the supply cylinder 4 via a second pipeline 82, and the liquid entering from the system's recycled water inlet is sent to the supply cylinder 4. A flow meter is installed on the pipeline upstream of the supply cylinder 4 to detect the concentration of silicon powder in the cutting fluid, and a solenoid valve is installed to control the flow rate of pure water supplied to the supply cylinder 4 from the system's recycled water inlet, thereby adjusting the concentration of silicon powder in the cutting fluid to meet the cutting requirements. In the above method, the wastewater discharged from the supply cylinder 4 is discharged into the system's wastewater ditch.

[0035] In addition, the raw liquid pool 5 is connected to the liquid supply cylinder 4. The liquid discharged from the liquid supply cylinder 4 enters the raw liquid pool 5 for centralized filtration treatment.

[0036] Furthermore, the first filter barrel 11 is also connected to the liquid inlet of the liquid supply cylinder 4, and the liquid in the liquid supply cylinder 4 is filtered by the first filter barrel 11 and then flows back to the liquid supply cylinder 4.

[0037] Furthermore, the system's recycled water inlet is also connected to the liquid supply cylinder 4 via a third pipeline 83. The liquid entering from the recycled water inlet is sent to the liquid supply cylinder 4 for rinsing, and the rinsed water is directly discharged into the sewage station 6.

[0038] Alkaline solution can also be added to the supply tank 4 for circulation to perform alkaline cleaning of the pipeline. After alkaline cleaning, the liquid in the supply tank is discharged into the sewage station 6. This scheme can perform alkaline cleaning of the liquid pipeline and the supply tank to adjust the conductivity of the pipeline.

[0039] Furthermore, the system's recycled water inlet is connected to the supply cylinder 4 via a fourth pipe 84, so that the liquid entering from the system's recycled water inlet is sent to the supply cylinder 4. The supply cylinder 4 supplies the cutting chamber with the retraction liquid, which then flows back to the supply cylinder 4. Flow meters and solenoid valves are installed on the pipeline to achieve flow control. The liquid discharged from the supply cylinder 4 enters the wastewater treatment plant 6.

[0040] Furthermore, the system's recycled water inlet is also connected to the liquid supply cylinder 4 via the fifth pipeline 85, so that the liquid entering from the system's recycled water inlet is sent to the liquid supply cylinder 4. The liquid supply cylinder 4 supplies liquid to the cutting chamber to flush the cutting chamber, and the flushed liquid enters the sewage station 6.

[0041] Furthermore, a second filter barrel 12 is provided on the pipeline between the large plate heat exchanger 2 and the spray pipe assembly 3 to perform secondary filtration on the liquid entering the spray pipe assembly 2, thereby reducing the silicon powder in the liquid and improving the cutting quality.

[0042] A flow meter 7, such as a mass flow meter, is installed on the pipeline between the large plate heat exchanger 2 and the spray pipe assembly 3 to detect the silicon powder concentration in the liquid on the pipeline. The flow rate of pure water supplied to the liquid supply cylinder 4 can be adjusted accordingly to adjust the silicon powder concentration in the liquid to meet the cutting requirements.

[0043] Based on the above technical solution, it also includes: an air conditioner 9. The large plate heat exchanger 2 is connected to the factory cooling water inlet and the factory cooling water outlet; the air conditioner 9 is used to cool the liquid entering from the factory cooling water inlet, and the cooled liquid is provided to the large plate heat exchanger 2 for cooling the liquid flowing through it.

[0044] The above solution uses centralized filtration in the raw liquid pool 5, which reduces the volume of the liquid supply cylinder in the slicer, making the liquid supply cylinder easier to move and replace. In addition, less water is stored in the pipeline, making it easier to drain and facilitating water separation during cutting and blade retraction.

[0045] The liquid discharged from the liquid supply cylinder 4 goes to the raw liquid pool 5 for centralized filtration treatment, and then passes through the second filter barrel 12 to supply the spray pipe assembly 3, and finally flows into the sewage station 6.

[0046] In the above scheme, when the various cutting functions overlap, they can be switched automatically and in conjunction. A designated tank is used to supply overflow water, separating the rinsing water, cutting water, and blade retraction water for separate supply and treatment. This ensures that different water qualities meet different operational needs, thereby improving operational efficiency and product quality. By optimizing cutting and blade retraction parameters, problems such as heat loss, impurity contamination, scratches, and damage can be reduced.

[0047] like Figure 2 As shown, the wire cutting system provided in this embodiment also includes: a raw material tank, a filter press system, a mixing tank, and a finished product tank. The provision of cutting fluid to the wire cutting machine, mentioned below, can be for supplying cutting fluid to the system's recycled water inlet.

[0048] The cutting fluid discharged from the wire cutting machine is collected in the raw fluid pool, where it undergoes preliminary sedimentation and filtration.

[0049] Both the raw material tank and the mixing tank receive the cutting fluid discharged from the raw material pool. The cutting fluid discharged from the raw material pool can either enter the raw material tank or the mixing tank.

[0050] The pressure filtration system is located between the raw fluid tank and the mixing tank. The cutting fluid discharged from the raw fluid tank first enters the pressure filtration system, and after filtration, it enters the mixing tank. New cutting fluid can be added to the mixing tank to compensate for the loss of cutting fluid in the circulation, and acidic or alkaline substances can also be added to adjust parameters such as pH or conductivity of the cutting fluid.

[0051] The mixing tank is connected to the raw material tank, and the cutting fluid discharged from the raw material tank can also be directly fed into the mixing tank if the direct supply conditions are met.

[0052] The finished product tank receives the cutting fluid discharged from the mixing tank and feeds it into the wire cutting machine so that the cutting fluid can be recycled.

[0053] Based on the above scheme, the cutting fluid in the raw fluid pool can be monitored. If the quality is good enough to be directly returned to the slicing machine or only requires preliminary filtration, the cutting fluid in the raw fluid pool can be directly transported to the mixing tank, and then sent back to the slicing machine via the finished product tank. This shortens the flow path of the cutting fluid and improves circulation efficiency. However, when the quality of the cutting fluid in the raw fluid pool is poor, it can be filtered sequentially through the raw fluid tank, pressure filtration system, mixing tank, and finished product tank before being sent back to the slicing machine, ensuring that the cutting fluid returned to the slicing machine meets the usage requirements.

[0054] The above solution can flexibly control the flow path of the cutting fluid. When the quality of the cutting fluid discharged from the slicing machine is good, it can be quickly returned to the slicing machine for reuse, which improves circulation efficiency, reduces the time the cutting fluid stays in other tanks, reduces component material consumption, and thus reduces production costs.

[0055] Furthermore, the cutting fluid in the raw material tank can directly enter the mixing tank without passing through the filter press system, thus improving circulation efficiency, provided it meets the conditions for direct water supply. The cutting fluid in the raw material tank can be monitored; if the quality is high, it can directly enter the mixing tank without passing through the filter press system, further improving circulation efficiency.

[0056] Furthermore, the mixing tank can be directly connected to the wire EDM machine via pipeline to supply cutting fluid directly to it. The cutting fluid in the mixing tank can be monitored, and when the quality of the cutting fluid in the mixing tank is high, it can be sent directly to the slicing machine without passing through the finished product tank, further improving circulation efficiency.

[0057] The mass of the cutting fluid can be determined by the concentration of silicon powder in it. A high silicon powder concentration is considered low mass, while a concentration meeting requirements is considered high mass. The silicon powder concentration can be monitored using a density meter.

[0058] The above-mentioned cutting fluid circulation system can simultaneously provide circulating cutting fluid to multiple wire EDM machines. The cutting fluid discharged from multiple wire EDM machines does not pass through the machine's own supply tank, but enters the raw fluid pool through pipelines. The above-mentioned scheme is used to perform filtration, discharge, etc., and then circulates to each wire EDM machine to achieve large-scale circulation of cutting fluid.

[0059] When the silicon powder concentration of the cutting fluid meets the requirements and the conditions for direct supply are met, it can bypass the pressure filtration system and skip a certain liquid tank.

[0060] Using circulating water with a constant silicon powder concentration for wafer slicing allows for on-demand silicon powder mixing and quantitative control based on different sawing depths. Existing methods mostly involve single-machine closed-loop slicing, with the common process using recycled clean water initially. During the cutting process, the silicon powder concentration continuously increases, making early cutting easier due to low silicon powder content, but later, with higher silicon powder concentrations, cutting becomes more difficult, requiring additional kerf and causing stress damage to the wafer.

[0061] The technical solution provided in this embodiment adjusts the silicon powder concentration and adds cutting fluid at the large circulation end, changing the slicing machine from a closed single-machine circulation to an open one. Water is supplied through the large circulation system, and the slicing machine is linked with the large circulation system. The water quality is controllable and adjustable, and the water is directly supplied to the cutting area of ​​the slicing machine. While balancing the silicon powder concentration, it eliminates the efficiency loss caused by the cumbersome steps of adding water and cutting fluid to the liquid supply cylinder in the traditional solution, thereby improving cutting efficiency and silicon wafer quality.

[0062] In addition, the technical solution provided in this embodiment adopts a direct supply mode, in which water enters the large liquid circulation system directly from the cutting chamber without passing through the liquid supply cylinder. Only the inlet and outlet water pipes on the slicer are connected to the large circulation system, which reduces the unit cost of the slicer by more than 100,000 yuan, giving it a great economic advantage.

[0063] Furthermore, an online flow meter can be installed on the pipeline to detect the cutting fluid and adjust the water flow rate according to different sawing depths to achieve quantitative control of silicon powder concentration.

[0064] The above solution can improve the silicon powder concentration in the cutting fluid, thereby meeting the cutting needs of the wire EDM machine and improving production efficiency.

[0065] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0067] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0068] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0069] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wire cutting system applied to a wire cutting machine, characterized in that, The system comprises: a raw liquid pool; a system recycled water inlet connected to a spray pipe assembly in a cutting chamber of the wire cutting machine through a first pipeline, liquid entering from the system recycled water inlet being sent to the spray pipe assembly; liquid sprayed from the spray pipe assembly entering the raw liquid pool; further comprising a first filter barrel and a large plate heat exchanger; a liquid supply cylinder of the wire cutting machine being connected to the first filter barrel, liquid in the liquid supply cylinder being filtered by the first filter barrel and then cooled by the large plate heat exchanger before being sent to the spray pipe assembly.

2. The wire cutting system of claim 1, wherein, the system recycled water inlet being connected to the liquid supply cylinder through a second pipeline, liquid entering from the system recycled water inlet being sent to the liquid supply cylinder.

3. The wire cutting system of claim 2, wherein, the raw liquid pool being connected to the liquid supply cylinder, liquid discharged from the liquid supply cylinder entering the raw liquid pool.

4. The wire cutting system of claim 1, wherein, the first filter barrel being further connected to a liquid inlet of the liquid supply cylinder, liquid of the liquid supply cylinder being filtered by the first filter barrel before being returned to the liquid supply cylinder.

5. The wire cutting system of claim 1, wherein, the system recycled water inlet being further connected to the liquid supply cylinder through a third pipeline, liquid entering from the recycled water inlet being sent to the liquid supply cylinder for flushing.

6. The wire cutting system of claim 1, wherein, the system recycled water inlet being further connected to the liquid supply cylinder through a fourth pipeline, liquid entering from the system recycled water inlet being sent to the liquid supply cylinder, the liquid supply cylinder providing withdrawal liquid to the cutting chamber, the withdrawal liquid returning to the liquid supply cylinder.

7. The wire cutting system of claim 1, wherein, the system recycled water inlet being further connected to the liquid supply cylinder through a fifth pipeline, liquid entering from the system recycled water inlet being sent to the liquid supply cylinder, the liquid supply cylinder providing liquid to the cutting chamber for flushing, the flushed liquid entering a sewage station.

8. The wire cutting system of claim 1, wherein, a second filter barrel being arranged on a pipeline between the large plate heat exchanger and the spray pipe assembly.

9. The wire cutting system of claim 7, wherein, a flow meter being arranged on the pipeline between the large plate heat exchanger and the spray pipe assembly.

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