Water purifier

Abstract

The utility model relates to a water purifier. The water purifier comprises a shell, a water storage tank, a semiconductor refrigerator, a heat conduction assembly and a heat dissipation assembly, the water storage tank is arranged in the shell, a mounting part is arranged on the side wall of the water storage tank, the semiconductor cooler is arranged on the mounting part and comprises a heating surface and a cooling surface, the heat conduction assembly is arranged on the cooling surface, a mounting hole is formed in the mounting part, and the heat conduction assembly is arranged in the mounting hole. The heat conduction assembly penetrates through the mounting hole and extends into the water storage tank; and the heat dissipation assembly is arranged on the heating surface, and the heat dissipation assembly is used for dissipating heat for the semiconductor cooler. According to the water purifier, the refrigeration efficiency of the water purifier can be improved.

Description

Technical Field

[0001] This utility model relates to the field of water purifiers, specifically to a water purifier. Background Technology

[0002] A water purifier, also called a water purification machine or water quality purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. Most of the cooling technologies in this area use semiconductor coolers. However, due to improper placement of the semiconductor cooler within the water purifier, heat dissipation can easily become poor during ice tank cooling, resulting in long cooling times and low cooling efficiency. Utility Model Content

[0003] Therefore, this utility model provides a water purifier. The water purifier can improve the efficiency of the water purifier during cooling.

[0004] This utility model provides the following technical solution:

[0005] A water purifier includes: a housing, a water storage tank, a semiconductor cooler, a heat-conducting component, and a heat dissipation component;

[0006] The water storage tank is disposed inside the shell, and a mounting part is provided on the side wall of the water storage tank. The semiconductor cooler is disposed on the mounting part, and the semiconductor cooler includes a heating surface and a cooling surface. The heat conduction component is disposed on the cooling surface. The mounting part is provided with a mounting hole, and the heat conduction component extends through the mounting hole into the water storage tank.

[0007] The heat dissipation component is disposed on the heating surface and is used to dissipate heat from the semiconductor cooler.

[0008] Furthermore, the heat-conducting component includes: a heat-absorbing element and multiple heat-conducting sheets;

[0009] Multiple heat-conducting sheets are spaced apart on the heat-absorbing element along a first direction, the heat-absorbing element is attached to the cooling surface, and the heat-conducting sheets are used to release heat.

[0010] Further progress also includes: limiting components;

[0011] The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

[0012] Furthermore, the heat dissipation component includes: heat dissipation fins, a heat-conducting component, and a driving component;

[0013] The heat dissipation fins are disposed on the heat-conducting component, the driving component is disposed on the heat dissipation fins, and the heat-conducting component is disposed on the heating surface.

[0014] Furthermore, the heat dissipation fins include a plurality of heat dissipation fins, which are spaced apart along the length of the heat-conducting component, and a flow channel is formed between two adjacent heat dissipation fins. The driving component is used for airflow within the flow channel.

[0015] Further progress also includes: the first baffle and the second baffle;

[0016] The first baffle and the second baffle are spaced apart within the housing along the length direction of the housing, and the first baffle and the second baffle divide the housing into a first cavity, a second cavity, and a mounting cavity;

[0017] The installation cavity is equipped with a filter element, the first cavity is equipped with a booster pump, and the water storage tank is installed in the second cavity.

[0018] Further improvements also include: filter elements and booster pumps;

[0019] The booster pump is connected to the filter element, and the filter element is connected to the water storage tank. The filter element is used to provide purified water to the water storage tank.

[0020] Furthermore, the mounting cavity is provided with a mounting component, which is disposed on two opposite side walls of the housing, and the mounting component is provided with a sliding groove;

[0021] The filter element is provided with a guide member, which cooperates with the slide groove to fix the filter element.

[0022] Furthermore, the water purifier also includes: a mounting base;

[0023] The mounting base is disposed within the mounting cavity, and the mounting base has a groove. The filter element has a guide block, and when the filter element is installed on the mounting base, the guide block is located within the groove.

[0024] Further progress also includes: vane pumps;

[0025] The vane pump is located in the second cavity and is connected to the water storage tank. The vane pump is used to supply water to water-using equipment.

[0026] The aforementioned water purifier has a water storage tank inside its casing, and an installation cavity with mounting holes on the side wall of the tank. By installing the heat-conducting component into the mounting holes, the component can come into contact with the water flow in the tank, thus improving the heat exchange efficiency of the water purifier. The cooling surface of the semiconductor cooler in the water purifier is connected to the heat-conducting component, allowing the cooling energy generated by the cooler to be transferred to the water storage tank, thereby improving the efficiency of cold water production in the tank. The heat dissipation component on the heating surface of the cooler removes heat from the surface, further enhancing the cooling efficiency of the cooler and improving the efficiency of the water purifier in producing cold water. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 One of the cross-sectional views of the water purifier provided in the embodiment of this utility model;

[0029] Figure 2 This is a schematic diagram of the structure of the heat-conducting component provided in an embodiment of the present utility model;

[0030] Figure 3 A schematic diagram of the structure of the water storage tank provided in this embodiment of the utility model;

[0031] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0032] Figure 5 This is a schematic diagram of the structure of the heat dissipation assembly provided in an embodiment of the present utility model;

[0033] Figure 6 This is a schematic diagram of the structure of the heat dissipation fins provided in an embodiment of the present utility model;

[0034] Figure 7 One of the structural schematic diagrams of the water purifier provided in the embodiments of this utility model;

[0035] Figure 8 This is the second structural schematic diagram of the water purifier provided in the embodiment of the present utility model;

[0036] Figure 9 The third schematic diagram of the structure of the water purifier provided in the embodiment of this utility model;

[0037] Figure 10 for Figure 9 Enlarged view of point B in the middle;

[0038] Figure 11 for Figure 9 A magnified view of point C in the middle.

[0039] Explanation of reference numerals in the attached figures:

[0040] 100-Water purifier; 10-Shell; 11-First baffle; 12-Second baffle; 13-First cavity; 14-Second cavity; 15-Mounting cavity; 16-Mounting component; 161-Slide groove; 20-Water storage tank; 21-Mounting part; 22-Mounting hole; 30-Semiconductor cooler; 31-Heating surface; 32-Cooling surface; 40-Heat-conducting component; 41-Heat-absorbing component; 42-Heat-conducting fin; 50-Heat-dissipating component; 51-Heat-dissipating fin; 511-Heat-dissipating fin; 512-Flow channel; 52-Heat-conducting component; 53-Driver; 60-Limiting component; 61-Extension; 62-Limiting part; 70-Filter element; 71-Booster pump; 72-Guide component; 73-Guide block; 80-Mounting base; 81-Groove; 82-Vessel pump. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0042] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0043] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0044] A water purifier, also called a water purification machine or water quality purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. Most of the cooling technologies in this area use semiconductor coolers. However, due to improper placement of the semiconductor cooler within the water purifier, heat dissipation can easily become poor during ice tank cooling, resulting in long cooling times and low cooling efficiency.

[0045] Therefore, this embodiment provides a water purifier 100. The water purifier 100 can improve the efficiency of the water purifier 100 during cooling.

[0046] Please see Figures 1 to 3 A water purifier 100 includes: a housing 10, a water storage tank 20, a semiconductor cooler 30, a heat-conducting component 40, and a heat dissipation component 50;

[0047] The water storage tank 20 is disposed inside the housing 10. A mounting portion 21 is provided on the side wall of the water storage tank 20. The semiconductor cooler 30 is disposed on the mounting portion 21. The semiconductor cooler 30 includes a heating surface 31 and a cooling surface 32. The cooling surface 32 is disposed on the mounting portion 21. The heat-conducting component 40 is disposed on the cooling surface 32. The mounting portion 21 is provided with a mounting hole 22. The heat-conducting component 40 extends into the water storage tank 20 through the mounting hole 22. The heat dissipation component 50 is disposed on the heating surface 31. The heat dissipation component 50 is used to dissipate heat from the semiconductor cooler 30.

[0048] The aforementioned water purifier 100 has a water storage tank 20 inside the housing 10, and a mounting part 21 is provided on the side wall of the water storage tank 20. The mounting part 21 has a mounting hole 22. By installing the heat-conducting component 40 into the mounting hole 22, the heat-conducting component 40 can come into contact with the water flow in the water storage tank 20, thereby improving the heat exchange efficiency of the water purifier 100. The cooling surface 32 of the semiconductor cooler 30 provided in the water purifier 100 is connected to the heat-conducting component 40, so that the cooling energy generated by the semiconductor cooler 30 can be transferred to the water storage tank 20 through the heat-conducting component 40, thereby improving the efficiency of cold water preparation in the water storage tank 20. The heat dissipation component 50 provided on the heating surface 31 of the semiconductor cooler 30 can remove the heat from the heating surface 31 of the semiconductor cooler 30, thereby enabling the semiconductor cooler 30 to have higher cooling efficiency, further improving the efficiency of the water purifier 100 in preparing cold water.

[0049] Understandably, a water storage tank 20 is provided inside the housing 10. One or more water storage tanks 20 can be provided, which can be determined according to the volume inside the housing 10. Providing multiple water storage tanks 20 can enable the water purifier 100 to cool more cold water in a shorter time. A mounting part 21 is provided on the water storage tank 20. The mounting part 21 is a portion of the water storage tank 20. A semiconductor cooler 30 is provided on the mounting part 21. The cooling surface 32 of the semiconductor cooler 30 is in contact with the mounting part 21. In this way, the cooling energy generated by the semiconductor cooler 30 can be transferred to the water storage tank 20, thus enabling the water storage tank 20 to prepare cold water.

[0050] Understandably, the mounting part 21 of the water storage tank 20 is provided with a mounting hole 22, and a heat-conducting component 40 is provided in the mounting hole 22. One end of the heat-conducting component 40 is in contact with the cooling surface 32 of the semiconductor cooler 30, and the other end of the heat-conducting component 40 extends into the interior of the water storage tank 20. In this way, the heat of the semiconductor cooler 30 can be transferred to the water storage tank 20 through the heat-conducting component 40. The water flow in the water storage tank 20 can directly contact the heat-conducting component 40, so that heat exchange between the water flow and the heat-conducting component 40 can be realized. This can more efficiently transfer the cold energy generated in the semiconductor cooler 30 to the water storage tank 20, thereby improving the heat exchange efficiency of the water purifier 100.

[0051] Understandably, the thermoelectric cooler 30 generates a significant amount of heat during cooling. This heat not only affects the efficiency of the thermoelectric cooler 30 in generating cooling capacity but also affects the temperature of the water storage tank 20, causing the internal temperature of the water storage tank 20 to rise. Consequently, the purified water in the water storage tank 20 is also heated while being cooled. Therefore, a heat dissipation component 50 is provided on the heating surface 31 of the thermoelectric cooler 30 to remove the heat generated by the thermoelectric cooler 30 from the heating surface 31. This not only reduces the internal temperature of the casing 10 but also improves the heating efficiency of the thermoelectric cooler 30.

[0052] Please see Figure 2 In some embodiments, the heat-conducting component 40 includes: a heat-absorbing element 41 and a plurality of heat-conducting sheets 42;

[0053] Multiple heat-conducting sheets 42 are spaced apart on the heat-absorbing element 41 along a first direction. The heat-absorbing element 41 is attached to the cooling surface 32. The heat-conducting sheets 42 are used to release heat.

[0054] Understandably, the heat-conducting component 40 includes a heat-absorbing element 41 and heat-conducting plates 42. The heat-absorbing element 41 is connected to the heat exchanger and is used to collect the heat generated by the heat exchanger. Multiple heat-conducting plates 42 are spaced apart on the heat-absorbing element 41 and are perpendicular to the heat-absorbing element 41. The heat-conducting plates 42 extend into the water storage tank 20. In this way, the cold energy on the heat-absorbing element 41 can be transferred to the water storage tank 20 through the heat-conducting component 40. Thus, the cold energy generated by the semiconductor cooler 30 can be transferred to the water storage tank 20 through the heat-absorbing element 41 and the heat-conducting plates 42. The multiple heat-conducting plates 42 can accelerate the efficiency of energy transfer, so that energy can enter the water storage tank 20 faster and more evenly, realize heat exchange, and thus enable the heat-conducting component 40 to conduct heat.

[0055] Please see Figure 2 and Figure 4 In some embodiments, it also includes: a limiting member 60;

[0056] The limiting member 60 is disposed around the outer periphery of the mounting hole 22. The limiting member 60 includes an extension 61 and a limiting part 62, wherein the limiting part 62 is disposed on the extension 61 and there is an included angle between the extension 61 and the limiting part 62; when the heat-conducting component 40 is installed in the mounting hole 22, the limiting part 62 is parallel to the heat-conducting sheet 42.

[0057] Understandably, a limiting member 60 is provided on the outer periphery of the mounting hole 22. The limiting member 60 is used to cooperate with the heat-conducting component 40 to limit the relative position of the heat-conducting component 40 with respect to the water storage tank 20. The limiting member 60 includes an extension 61 and a limiting part 62. The extension 61 extends away from the mounting hole 22 (i.e., extends to the outside of the water storage tank 20). The limiting part 62 is disposed on the extension 61. The limiting part 62 can be disposed perpendicularly on the extension 61 or form an angle with the limiting part 62. This allows the limiting part 62 to limit the installation position of the heat-conducting component 40, making the installation of the heat-conducting component 40 more convenient.

[0058] Understandably, after the heat-conducting component 40 is installed on the limiting part 62, a seal can be provided between the limiting part 62 and the heat-conducting component 40 to prevent water leakage from the mounting hole 22. The heat-conducting component 40 can be directly fixed on the limiting part 62. Specifically, the limiting part 62 can be connected by providing the mounting hole 22 on the limiting part 62 and by connecting the heat-conducting component 40 to the mounting hole 22.

[0059] Please see Figure 5 In some embodiments, the heat dissipation assembly 50 includes: heat dissipation fins 51, heat conduction element 52, and driving element 53;

[0060] The heat dissipation fins 51 are disposed on the heat-conducting component 52, the driving component 53 is disposed on the heat dissipation fins 51, and the heat-conducting component 52 is disposed on the heating surface 31.

[0061] Understandably, the heat dissipation component 50 includes: heat dissipation fins 51, a heat-conducting element 52, and a driving element 53. The heat-conducting element 52 is disposed on the heating surface 31, and the heat dissipation fins 51 are disposed on the heat-conducting element 52. Multiple heat dissipation fins 51 are disposed vertically on the side of the heat-conducting element 52 away from the heating surface 31. In this way, heat can be transferred to the heat dissipation fins 51 through the heat-conducting element 52. Once the heat is conducted to the heat dissipation fins 51, the airflow near the heat dissipation fins 51 can exchange heat with them, thus carrying away the heat from the heat dissipation fins 51 and achieving heat dissipation. A driving element 53 is also disposed on one side of the heat dissipation fins 51. The driving element 53 accelerates the airflow near the heat dissipation fins 51, thereby carrying away the heat from the heat dissipation fins 51 and achieving efficient heat dissipation. Specifically, when the heating surface 31 of the semiconductor cooler 30 generates heat, the heat is transferred to the heat conductor 52, and then to the heat dissipation fins 51. The driving component 53 on the heat dissipation fins 51 can accelerate the airflow near the heat dissipation fins 51, thereby achieving the purpose of cooling the semiconductor cooler 30.

[0062] Understandably, heat dissipation holes can be provided on the housing 10 at positions corresponding to the drive member 53. The through-hole drive member 53 drives airflow to exit through the heat dissipation holes, thus dissipating heat into the housing 10. To further enhance the heat dissipation effect, an air inlet can be provided below the heat dissipation holes. By providing the drive member 53 at the air inlet, airflow can enter the housing 10 through the air inlet. After heat exchange with the heat dissipation fins 51, the airflow exits into the housing 10 through the heat dissipation holes, achieving more efficient cooling and thus improving the heat dissipation effect.

[0063] Please see Figure 6 In some embodiments, the heat dissipation fins 51 include a plurality of heat dissipation fins 511, which are spaced apart along the length of the heat conductor 52, and a flow channel 512 is formed between two adjacent heat dissipation fins 511. The driving member 53 is used for airflow within the flow channel 512.

[0064] Understandably, the heat sink 51 includes multiple heat sinks 511, and the heat sinks 511 are spaced apart along the length of the heat conductor 52. This forms a flow channel 512 between two adjacent heat sinks 511, allowing airflow to pass through. In order to make the heat sinks 511 better receive heat, the heat sink is placed on the side of the heat sink 51 away from the thermoelectric cooler 30. This allows the driving member 53 to drive the airflow near the heat sink 51 to flow between the two heat sinks 51. When the heat sink drives the airflow, the hot airflow first passes through the heat sink 511, which improves the heat dissipation effect of the driving member 53 and allows the airflow to exchange heat with the heat conductor 52 as much as possible, so as to remove the heat on the heat conductor 52 through heat exchange, thereby achieving the purpose of improving the heat dissipation effect of the heat dissipation component 50.

[0065] Please see Figure 7 and Figure 8 In some embodiments, it also includes: a first baffle 11 and a second baffle 12;

[0066] The first baffle 11 and the second baffle 12 are spaced apart within the housing 10 along the length direction of the housing 10, and the first baffle 11 and the second baffle 12 divide the housing 10 into a first cavity 13, a second cavity 14, and a mounting cavity 15;

[0067] The installation cavity 15 is equipped with a filter element 70, the first cavity 13 is equipped with a booster pump 71, and the water storage tank 20 is installed in the second cavity 14.

[0068] Understandably, a first baffle 11 and a second baffle 12 are also provided inside the housing 10. The first baffle 11 and the second baffle 12 are spaced apart inside the housing 10. After the first baffle 11 and the second baffle 12 are installed inside the housing 10, the first baffle 11 and the second baffle 12 are parallel. In this way, the inside of the housing 10 can be divided into a first chamber, a second chamber 14, and an installation cavity 15 by the first baffle 11 and the second baffle 12.

[0069] The mounting cavity 15 has a semi-enclosed structure for installing the filter element 70. The semi-enclosed structure facilitates the installation and removal of the filter element 70. The first cavity 13 and the second cavity 14 are both inside the housing 10. The first cavity 13 is used to install the booster pump 71, and the second cavity 14 is used to install the water storage tank 20. The booster pump 71 is used to pressurize the filter element 70. By pressurizing the water flow through the booster pump 71, the water flow can be filtered through the filter element 70. The filtered water flows into the water storage tank 20 for storage and cooling.

[0070] Please see Figure 8 and Figure 9 In some embodiments, it also includes: filter element 70 and booster pump 71;

[0071] The booster pump 71 is connected to the filter element 70, and the filter element 70 is connected to the water storage tank 20. The filter element 70 is used to provide purified water to the water storage tank 20.

[0072] Understandably, the filter element 70 is installed in the mounting cavity 15, the booster pump 71 is installed in the first cavity 13, and the water storage tank 20 is installed in the second cavity 14. The booster pump 71 is connected to the filter element 70, and the municipal water supply is connected to the booster pump 71. After being pressurized by the booster pump 71, the municipal water supply enters the filter element 70. The purified water filtered by the filter element 70 flows into the water storage tank 20. Then, the semiconductor cooler 30 generates cooling energy to cool the purified water in the water storage tank 20. The user can preset the temperature in the water storage tank 20. When the preset temperature is above 10°C, the semiconductor cooler 30 cools the water storage tank 20. When the preset temperature is below 10°C, the semiconductor cooler 30 stops working or enters the heat preservation mode. When the user needs hot water, it can be delivered to the water-using equipment through the outlet of the heat storage tank.

[0073] Understandably, the booster pump 71 is used to pressurize the unpurified water because the filter element 70 contains an RO filter element 70 (Reverse Osmosis membrane). The water pressure of the municipal water supply is insufficient to allow the water to pass through the RO filter element 70 during water purification. In order to ensure that the water can pass through the filter element 70 smoothly, the booster pump 71 is set up to ensure that the water can flow into the filter element 70 and at the same time ensure the purification efficiency of the filter element 70.

[0074] Please see Figures 9 to 11 In some embodiments, a mounting member 16 is provided in the mounting cavity 15, the mounting member 16 is provided on two opposite side walls of the housing 10, and a sliding groove 161 is provided on the mounting member 16;

[0075] The filter element 70 is provided with a guide 72, which cooperates with the slide groove 161 to fix the filter element 70.

[0076] Understandably, the mounting cavity 15 is disposed on the housing 10, and a mounting member 16 is disposed within the mounting cavity 15. The mounting member 16 is disposed as follows: Figure 7 or Figure 11The upper part of the mounting cavity 15 is shown, and it is set on the side walls on both sides of the mounting cavity 15; the mounting member 16 is provided with a sliding groove 161, and the guide member 72 is provided on the two opposite side walls of the filter element 70. The guide member 72 on the filter element 70 is adapted to the sliding groove 161. Therefore, when the filter element 70 is installed into the mounting cavity 15, the guide member 72 can be inserted into the sliding groove 161 and cooperate with the mounting cavity 15. In this way, the horizontal displacement of the filter element 70 in the mounting cavity 15 can be restricted by the mounting member 16, and it will not move in the vertical direction of the filter element 70 due to gravity. This can improve the stability of the filter element 70 after installation, ensure that the filter element 70 will not move during normal use, and thus improve the stability of the water purifier 100.

[0077] Please see Figures 9 to 11 In some embodiments, the water purifier 100 further includes: a mounting base 80;

[0078] The mounting base 80 is disposed in the mounting cavity 15. The mounting base 80 is provided with a groove 81. The filter element 70 is provided with a guide block 73. When the filter element 70 is installed on the mounting base 80, the guide block 73 is located in the groove 81.

[0079] Understandably, the housing 10 is provided with an installation cavity 15, and an installation base 80 is provided in the installation cavity 15. The installation base 80 is used to install the filter element 70. The installation base 80 and the filter element 70 are detachably connected. The installation base 80 is provided with a water channel structure that is compatible with the filter element 70. When the filter element 70 is installed on the installation base 80, the filter element 70 can be used normally.

[0080] Understandably, to facilitate the installation of the filter element 70 onto the mounting base 80, a groove 81 is provided on the mounting base 80, extending through the top of the mounting base 80. A guide block 73 is provided on the side of the filter element 70 away from the handle, and the guide block 73 is adapted to the size of the groove 81. The guide block 73 is used to cooperate with the groove 81. When the filter element 70 is installed on the base, the guide block 73 can be inserted into the groove 81 to position the filter element 70. At the same time, the cooperation between the filter element 70 and the guide block 73 can also restrict the rotation of the filter element 70 along its circumference. This can improve the stability of the filter element 70 after installation, ensuring that the filter element 70 will not move during normal use, thereby improving the stability of the water purifier 100.

[0081] Please see Figure 8 In some embodiments, it also includes: a vane pump 82;

[0082] The vane pump 82 is disposed in the second cavity 14 and is connected to the water storage tank 20. The vane pump 82 is used to supply water to water-using equipment.

[0083] Understandably, the vane pump 82 can be installed at any location within the housing 10, such as in the first chamber 13 or the second chamber 14, and is connected to the water storage tank 20. In this way, the vane pump 82 can pressurize the purified water in the water storage tank 20 and deliver the pressurized water to the user end to supply water to the water purification equipment. Specifically, the hot water in the heat storage tank flows out through the outlet of the heat storage tank and flows to the vane pump 82. After pressurizing the hot water, the vane pump 82 delivers it to the user end for use. The vane pump 82 can ensure that the installation position of the heat storage tank is not affected by water pressure and can smoothly deliver the hot water in the heat storage tank to the water-using equipment to improve the user experience.

[0084] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A water purifier, characterized in that, The water purifier comprises a shell, a water storage tank, a semiconductor refrigerator, a heat conduction assembly, and a heat dissipation assembly. The water storage tank is arranged in the shell, and a mounting portion is arranged on the side wall of the water storage tank. The semiconductor refrigerator is arranged in the mounting portion, and comprises a heating surface and a refrigeration surface. The heat conduction assembly is arranged on the refrigeration surface.

2. The water purifier according to claim 1, wherein The heat dissipation assembly is arranged on the heating surface and used for dissipating heat of the semiconductor refrigerator. The heat conduction assembly comprises a heat absorption member and a plurality of heat conduction fins.

3. The water purifier according to claim 2, wherein The plurality of heat conduction fins are arranged on the heat absorption member in a first direction. The heat absorption member is attached to the refrigeration surface. The heat conduction fins are used for releasing heat.

4. The water purifier according to claim 1, wherein Further comprising: a limiting member.

5. The water purifier according to claim 4, wherein The limiting member is arranged around the outer periphery of the mounting hole.

6. The water purifier according to claim 1, wherein The limiting member comprises an extension portion and a limiting portion. The limiting portion is arranged on the extension portion. An included angle is formed between the extension portion and the limiting portion. When the heat conduction assembly is mounted in the mounting hole, the limiting portion is parallel to the heat conduction fins.

7. The water purifier according to claim 6, wherein The heat dissipation assembly comprises a heat dissipation fin, a heat conduction member, and a driving member. The heat dissipation fin is arranged on the heat conduction member. The driving member is arranged on the heat dissipation fin.

8. The water purifier according to claim 7, wherein The heat conduction member is arranged on the heating surface. The heat dissipation fin comprises a plurality of heat dissipation fins.

9. The water purifier according to claim 8, wherein The plurality of heat dissipation fins are arranged in a length direction of the heat conduction member. An adjacent two heat dissipation fins form a flow channel.

10. The water purifier according to claim 6, wherein The driving member is used for airflow flow in the flow channel. Further comprising: a first baffle and a second baffle. The first baffle and the second baffle are arranged in the shell in a length direction of the shell. The first baffle and the second baffle divide the shell into a first cavity, a second cavity, and a mounting cavity. The mounting cavity is provided with a filter element. The first cavity is provided with a booster pump. The water storage tank is arranged in the second cavity. Further comprising: a filter element and a booster pump. The booster pump is connected with the filter element. The filter element is connected with the water storage tank. The filter element is used for providing pure water to the water storage tank. The mounting cavity is provided with a mounting member. The mounting member is arranged on two opposite side walls of the shell. The mounting member is provided with a sliding groove. The filter element is provided with a guide member. The water purifier further comprises a mounting base. The mounting base is arranged in the mounting cavity. The mounting base is provided with a recess. The filter element is provided with a guide block. When the filter element is mounted to the mounting base, the guide block is located in the recess. Further comprising: a vane pump. The vane pump is arranged in the second cavity. The vane pump is connected with the water storage tank. The vane pump is used for supplying water to a water using device.

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