Pressing head for PIN-to-PIN crimping

Abstract

The utility model provides a pressure head for PIN-to-PIN crimping, which comprises a first mounting plate, a probe template and a second mounting plate which are sequentially mounted, the probe template is mounted on the upper surface of the second mounting plate, and the first mounting plate is mounted on the upper surface of the probe template; a first circuit board is arranged on the upper surface of the first mounting plate, the surface of the first circuit board comprises a crimping area provided with golden fingers, and the golden fingers on the lower side of the crimping area are in corresponding contact with the probes in the probe template. In the crimping process, the golden finger at the crimping end of the to-be-tested product is directly contacted with the golden finger of the first circuit board and does not need to be directly contacted with the probe. According to the design, the mode that the probe needs to stretch out and draw back frequently for crimping in a traditional pressure head device is thoroughly changed, so that the mechanical movement of the probe is remarkably reduced.

Description

Technical Field

[0001] This utility model belongs to the field of automatic crimping technology for vehicle panels, and particularly relates to a crimping head for PIN-to-PIN crimping. Background Technology

[0002] In existing crimping head devices, the probe inside the crimping head is designed to precisely align with the gold fingers of the product under test and perform the crimping operation. However, this traditional design has significant limitations. Specifically, the probe needs to extend and retract each time a crimping task is performed. This frequent mechanical movement not only accelerates the wear process of the probe but also greatly increases the risk of probe damage. As a key component in the crimping process, the wear of the probe directly affects the success rate and stability of crimping. Once the probe wears out or is damaged, it will directly lead to crimping failure, thereby affecting the overall quality of the product and production efficiency. In addition, due to the easily worn characteristics of the probe, the crimping yield of existing crimping head devices is generally low after long-term operation, which not only increases production costs but also reduces the market competitiveness of the product. Although the industry has tried to alleviate this problem by optimizing probe materials and improving crimping processes, the effects have not been significant. Therefore, how to design a crimping head device that can reduce probe wear and improve crimping success rate and yield has become an urgent technical challenge to be solved. Utility Model Content

[0003] To address all or part of the problems of the prior art, this invention provides a PIN-to-PIN crimping head, in which the gold fingers of the crimping end of the product under test directly contact the gold fingers of the first circuit board without direct contact with the probe, significantly reducing the mechanical movement of the probe.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A PIN-to-PIN crimping head includes a first mounting plate, a probe template, and a second mounting plate installed sequentially. The probe template is mounted on the upper surface of the second mounting plate, and the first mounting plate is mounted on the upper surface of the probe template. A first circuit board is disposed on the upper surface of the first mounting plate. The surface of the first circuit board includes a crimping area with gold fingers. The gold fingers on the lower side of the crimping area make corresponding contact with the probes in the probe template.

[0006] It also includes an alignment structure, which includes a light-transmitting window formed on the surface of the first mounting plate and a light source disposed on the second mounting plate corresponding to the light-transmitting window, wherein the light emitted by the light source passes through the light-transmitting window; the alignment structure is used to confirm whether the gold fingers of the crimping end of the product under test are aligned with the gold fingers on the upper side of the crimping area.

[0007] A diffuser plate is installed on the light-transmitting window, and the side of the first circuit board is adjacent to the diffuser plate.

[0008] The alignment structure also includes alignment marks symmetrically arranged on both sides of the first circuit board. The alignment marks include a first mark, which is an alignment gold finger arranged parallel to the gold finger on the first circuit board.

[0009] The alignment structure also includes alignment marks symmetrically arranged on both sides of the first circuit board. The alignment marks include a second mark. An extension area is symmetrically arranged on the first circuit board, and the second mark is arranged on the extension area. The second mark is at least one light-transmitting hole opened on the extension area, and the product under test is provided with a through hole corresponding to the light-transmitting hole.

[0010] The diffuser plate has a groove area on its side adjacent to the first circuit board that matches the extension area. The groove area is located inside the light-transmitting window. When the product under test is placed on the first mounting plate, some of the light emitted by the light source on the second mounting plate passes through the light-transmitting window, is uniformly scattered by the diffuser plate, and illuminates the side edge of the product under test. Some of the light is emitted through the light-transmitting hole in the extension area of ​​the first circuit board and the through hole of the product under test.

[0011] The upper surface of the second mounting plate is provided with a first step and a second step, the second step being higher than the first step. The probe template is mounted on the first step, and the surface of the second step is provided with the light source, the position of which corresponds to the light-transmitting window.

[0012] The probe template includes a probe plate, a second circuit board, and an adapter plate installed sequentially. The probe plate is equipped with multiple probes, and the probes on the probe plate are in contact with the gold fingers on the second circuit board one by one. The adapter plate is located below the second circuit board, and the lower surface of the adapter plate is in contact with the first step of the second mounting plate.

[0013] The lower surface of the first mounting plate is provided with a third step and a fourth step, the upper surface of the probe plate is in contact with the third step of the first mounting plate, and the second step of the second mounting plate is in contact with the fourth step of the first mounting plate.

[0014] The upper surface of the first mounting plate also includes a guide area located in front of the light-transmitting window. The guide area is sloped to guide the crimping end of the product to be tested.

[0015] This utility model has at least the following beneficial effects:

[0016] 1) A first circuit board is integrated into a first mounting plate, with gold fingers on it corresponding one-to-one with the probes in the probe template. During the crimping process, the gold fingers of the product under test directly contact the gold fingers of the first circuit board, without needing to directly contact the probes. This design completely changes the traditional crimping head device where probes need to frequently extend and retract for crimping, thus significantly reducing the mechanical movement of the probes. Since the extension and retraction of the probes is one of the main causes of probe wear and damage, this design effectively reduces the wear rate of the probes, extends their service life, and thus improves the durability and stability of the entire crimping head device.

[0017] 2) An alignment structure is also provided on the first mounting plate, including symmetrically arranged alignment marks and light-transmitting windows. These structures are used to ensure that the gold fingers of the product under test are aligned with the gold fingers on the first circuit board before crimping, thus avoiding crimping failures caused by misalignment. Furthermore, through the combination of the light-transmitting windows and the light source, operators can visually observe the alignment, further improving the accuracy and efficiency of alignment. This design not only significantly improves the success rate and yield of crimping but also makes the entire crimping process more efficient and stable, optimizing production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a PIN-to-PIN crimping head in Embodiment 1 of this utility model.

[0020] Figure 2 Provided for Embodiment 1 of this utility model Figure 1 Top view of the intermediate pressure head.

[0021] Figure 3 Provided for Embodiment 1 of this utility model Figure 2 Cross-sectional view of the medium pressure head AA.

[0022] Figure 4 This is a schematic diagram of the structure of a PIN-to-PIN crimping head applied to a crimping device in Embodiment 2 of this utility model.

[0023] Figure 5 Provided for Embodiment 2 of this utility model Figure 4 A schematic diagram of the structure of the pressure head configured in the middle left workstation.

[0024] Figure 6 Provided for Embodiment 2 of this utility model Figure 5 Side view of the pressure head configured at the middle left workstation.

[0025] Figure 7 Provided for Embodiment 2 of this utility model Figure 4 A schematic diagram of the structure of the pressure head configured in the middle right station.

[0026] Reference numerals: 1-First mounting plate; 101-First circuit board; 102-Light-transmitting window; 103-Guide area; 2-Probe template; 201-Probe board; 2011-Probe; 202-Second circuit board; 203-Adapter board; 3-Second mounting plate; 301-Light source; 4-Alignment mark; 401-First mark; 402-Second mark; 5-Product under test; 6-Pressing component; 7-Left station configuration; 8-Right station configuration. Detailed Implementation

[0027] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] Example 1

[0029] In this embodiment of the utility model, in conjunction with reference to the reference Figures 1 to 3 As shown, a dedicated crimping head for PIN-to-PIN bonding is provided. This crimping head mainly consists of a first mounting plate 1, a probe template 2, and a second mounting plate 3, which are sequentially mounted. Specifically, the probe template 2 is mounted on the upper surface of the second mounting plate 3, and the first mounting plate 1 is positioned on top of the probe template 2. A first circuit board 101 is arranged on the upper surface of the first mounting plate 1. The surface of the first circuit board 101 includes a crimping area with gold fingers. The gold fingers on the lower side of the crimping area correspond to and contact the probes 2011 in the probe template 2, ensuring stable transmission of electrical signals. To further improve crimping accuracy and efficiency, the crimping head also features an alignment structure. This design aims to determine whether the gold fingers on the crimped end of the product under test 5 are completely aligned with the gold fingers on the first circuit board 101. The alignment structure not only simplifies the operation process but also effectively reduces connection problems caused by misalignment, significantly improving the accuracy and reliability of the test.

[0030] The alignment structure includes a light-transmitting window 102 formed on the surface of the first mounting plate 1, and a light source 301 corresponding to the light-transmitting window 102, disposed on the second mounting plate 3. The light emitted by the light source 301 can pass smoothly through the light-transmitting window 102, providing sufficient and uniform illumination for the alignment process. To further optimize the light distribution and improve alignment accuracy, a diffuser plate is also installed on the light-transmitting window 102. This diffuser plate can effectively diffuse the light emitted by the light source 301, making the light softer and more uniformly illuminate the alignment area of ​​the product under test 5, thereby reducing alignment errors caused by excessively concentrated or unevenly distributed light. The side of the first circuit board 101 is adjacent to the diffuser plate. This layout ensures that the gold finger area can receive sufficient illumination and observation during the crimping process, further improving the accuracy and reliability of the crimping.

[0031] In this embodiment, the alignment structure also includes alignment marks 4 symmetrically arranged on both sides of the first circuit board 101. These alignment marks 4 play a crucial role in ensuring the accurate positioning of the product under test 5. Specifically, the alignment marks 4 include a first mark 401 and a second mark 402. The first mark 401 is an alignment gold finger, which is arranged parallel to the gold fingers on the first circuit board 101. The first circuit board 101 has symmetrically arranged extension areas, which provide space for the second mark 402, which is disposed on the extension areas. The diffuser plate has a groove area on its side adjacent to the first circuit board 101 that matches the extension area. The groove area is located within the range of the light-transmitting window 102. The second mark 402 is specifically at least one light-transmitting hole. The position, size, and number of these light-transmitting holes are carefully designed to ensure complete correspondence with the through holes on the product under test 5. When the product under test 5 is accurately aligned and placed on the first mounting plate 1, the light source 301 configured on the second mounting plate 3 emits light. Part of the light passes through the light-transmitting window 102 and is then finely scattered by the diffuser plate, uniformly illuminating the side edges of the product under test 5. This provides additional visual assistance for the alignment and correction operation during the crimping process. Simultaneously, another portion of the light is emitted directly through the light-transmitting holes in the extension area of ​​the first circuit board 101 and the through-holes in the product under test 5, forming a more intuitive alignment indication to ensure precise alignment between the gold fingers on the crimping end of the product under test 5 and the gold fingers on the first circuit board 101. It is worth noting that the alignment structure of this invention is not limited to the specific embodiments described above. Its design concept has broad adaptability and can be flexibly adjusted according to actual needs. For example, other forms of visual marking or mechanical positioning structures can be used to further expand its versatility and practicality in different application scenarios.

[0032] The upper surface of the second mounting plate 3 is designed with two stepped structures of different heights: a first step and a second step, with the second step positioned higher than the first. This design cleverly utilizes the height difference in space to achieve effective layout and installation of different components. Specifically, the probe template 2 is mounted on the first step, and a light source 301 component is set on the surface of the second step, its position precisely calculated to ensure a corresponding layout with the light-transmitting window 102 on the first mounting plate 1. This design allows the light emitted by the light source 301 to accurately penetrate the light-transmitting window 102, providing clear and intuitive optical indication for the alignment process. The probe template 2 is composed of a probe plate 201, a second circuit board 202, and an adapter plate 203 stacked sequentially. Multiple probes 2011 are mounted on the probe plate 201, and these probes 2011 achieve precise one-to-one contact with the gold fingers on the second circuit board 202, ensuring stable signal transmission and data accuracy. Meanwhile, the adapter plate 203 is located below the second circuit board 202, with its lower surface contacting the first step of the second mounting plate 3. The lower surface of the first mounting plate 1 is designed to include a third step and a fourth step, and the upper surface of the probe plate 201 is in contact with the third step of the first mounting plate 1. The second step of the second mounting plate 3 is designed to contact the fourth step of the first mounting plate 1, so that the light source 301 on the second mounting plate 3 corresponds to the light-transmitting window 102 on the first mounting plate 1, while strengthening the connection between the two. After the pressure head is assembled, the height between the third step and the first step is equal to the height of the probe template 2. In addition, the upper surface of the first mounting plate 1 is also provided with a guide area 103, which is set in a ramp shape and located in front of the light-transmitting window 102. The ramp-shaped guide surface can guide the crimping end of the product under test 5 to move smoothly along the horizontal path to the crimping area, improving the accuracy and efficiency of the alignment process, thereby effectively reducing the deviation that may occur in the product under test 5 during the crimping process.

[0033] This invention also provides a PIN-to-PIN alignment method, implemented using the aforementioned pressure head, aimed at ensuring that the crimped end of the product under test 5 can be accurately aligned with the gold fingers on the first circuit board 101. When the crimped end of the product under test 5 is placed on the first mounting plate 1, if no light is observed to pass through the through-hole of the product under test 5, this alignment method is activated. The specific implementation steps of this method are as follows:

[0034] S1. Call the distance information between the first identifier 401 and the first gold finger on the first circuit board 101, and the distance information between the second identifier 402 and the first gold finger;

[0035] S2. Adjust the distance between the first gold finger of the crimp end of the product under test 5 and the first mark 401, or adjust the distance between the first gold finger of the crimp end of the product under test 5 and the second mark 402, so that the gold fingers of the product under test 5 are aligned with the gold fingers of the first circuit board 101.

[0036] S3. If light passes through the through hole of the product under test 5, then the gold fingers of the product under test 5 and the first circuit board 101 are aligned. If no light passes through, then repeat step S2.

[0037] To address the technical challenges of wear, damage, and decreased crimping yield caused by frequent extension and retraction of the probe 2011 in existing crimping devices, this invention proposes a dedicated PIN-to-PIN crimping head and its matching alignment method. By optimizing the structural design of the crimping head device, the extension and retraction of the probe 2011 during the crimping process is significantly reduced, effectively lowering the wear rate and risk of damage. This improvement not only extends the service life of the probe 2011 but also enhances the stability and reliability of the crimping process, ensuring that each crimp achieves the expected connection effect. By introducing a high-precision alignment structure and optical auxiliary system, precise alignment between the gold fingers of the crimping end of the product under test (5) and the gold fingers of the first circuit board (101) is achieved. The implementation of this alignment method simplifies the operation process, significantly improves the success rate and yield of crimping, reduces connection defects caused by misalignment, and further enhances the overall product quality and production efficiency. These improvements enable the crimping head device to maintain good crimping performance even after long-term operation, reducing production costs and improving the product's market competitiveness.

[0038] In summary, this utility model, through innovative structural design and alignment method, successfully solves the technical problems of high probe 2011 wear and low crimping success rate and yield in existing crimping devices, providing an efficient, reliable and economical solution for the field of PIN to PIN crimping.

[0039] Example 2

[0040] In this embodiment of the utility model, in conjunction with reference to the reference Figures 4 to 7As shown, the PIN-to-PIN crimping head provided in Embodiment 1 is specifically applied to a crimping device for display panels, which is designed to perform efficient and reliable crimping tests on display panels. This crimping device is equipped with a pressing component 6 adapted to the crimping head. The pressing contact end of the pressing component 6 employs advanced overmolding technology. This unique design not only significantly improves the coefficient of friction between the pressing component 6 and the contact surface to be tested, effectively preventing slippage or positional displacement that may occur during the crimping process, but also provides excellent cushioning performance of the overmolding material, offering comprehensive protection for the surface of the pressed display panel and avoiding scratches or damage that may be caused by direct hard contact. Furthermore, to fully meet the diverse crimping end design requirements widely present in display panel products, the crimping head of this invention incorporates a high degree of flexibility in its design, allowing users to configure the crimping device with a left-position configuration 7 and a right-position configuration 8.

[0041] Specifically, in the left-side configuration 7, the pressure head uses the alignment mark 4 on the right side as a reference point. The first circuit board 101 is located in the right-side area of ​​the first mounting plate 1, closely fitted with the light source 301, the light-transmitting window 102, the probe template 2, and the second mounting plate 3. These components are all arranged accordingly. During the crimping test, the gold fingers on the crimping end of the product under test 5 must be precisely aligned with the first gold finger counted from right to left. Correspondingly, in the right-side configuration 8, the opposite alignment strategy is adopted. The pressure head is positioned based on the alignment mark 4 on its left side. The first circuit board 101 is located in the left-side area of ​​the first mounting plate 1, and the light source 301, the light-transmitting window 102, the probe template 2, and the second mounting plate 3 are all arranged accordingly. During the crimping test, the gold fingers on the crimping end of the product under test 5 must be precisely aligned with the first gold finger counted from left to right. Whether configured on the left or right workstation, the pressure head of this invention demonstrates excellent compatibility and adaptability, and can flexibly meet the pressing test requirements of display panels of different models and layouts.

[0042] The pressure head design of this invention is not limited to the crimping operation of display panels. In fact, this pressure head also demonstrates broad applicability to other electronic components and assemblies requiring high-precision PIN-to-PIN crimping. These components include, but are not limited to, semiconductor chips, integrated circuit boards, connectors, and other various precision electronic interfaces. Through its precise alignment mechanism, excellent matching, and powerful crimping capability, the crimping device and pressure head of this invention can ensure high accuracy and reliability in the crimping process of various electronic components and assemblies, providing an innovative and efficient solution for the precision crimping needs of the electronics manufacturing industry.

[0043] It should be noted that, for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A pin-to-pin crimping ram characterized by, The utility model provides a kind of probe template, including sequentially installed first mounting plate (1), probe template (2) and second mounting plate (3), the probe template (2) is installed on the upper surface of the second mounting plate (3), and the first mounting plate (1) is installed on the upper surface of the probe template (2);The upper surface of the first mounting plate (1) is provided with first circuit board (101), and the surface of the first circuit board (101) includes the crimping area provided with gold finger, and the gold finger below the crimping area is contacted with each probe (2011) in the probe template (2) correspondingly;When crimping, the gold finger of the crimping end of the product (5) to be measured is completely aligned with the gold finger on the first circuit board (101).

2. The ram of claim 1 wherein, It also includes an alignment structure, which includes a light-transmitting window (102) opened on the surface of the first mounting plate (1), and a light source (301) provided on the second mounting plate (3) corresponding to the light-transmitting window (102), and the light emitted by the light source (301) passes through the light-transmitting window (102).

3. The ram of claim 2 wherein, A diffusion plate is installed on the light-transmitting window (102), and the side edge of the first circuit board (101) is adjacent to the diffusion plate.

4. The ram of claim 2 wherein, The alignment structure further includes alignment marks (4) symmetrically provided on both sides of the first circuit board (101), and the alignment marks (4) include first marks (401), which are alignment gold fingers arranged in parallel with the gold fingers on the first circuit board (101).

5. The ram of claim 3 wherein, The alignment structure further includes alignment marks (4) symmetrically provided on both sides of the first circuit board (101), and the alignment marks (4) include second marks (402), and the first circuit board (101) is symmetrically provided with an extension area, and the second marks (402) are provided on the extension area; The second marks (402) are at least one light-transmitting hole opened on the extension area, and a through hole corresponding to the light-transmitting hole is opened on the product (5) to be measured.

6. The ram of claim 5 wherein, The side edge of the diffusion plate adjacent to the first circuit board (101) is provided with a groove area matching the extension area, and the groove area is located in the light-transmitting window (102); When the product (5) to be measured is placed in alignment on the first mounting plate (1), the light emitted by the light source (301) on the second mounting plate (3) partially passes through the light-transmitting window (102), is uniformly scattered through the diffusion plate, and is irradiated to the side edge of the product (5) to be measured, and part of the light passes through the light-transmitting hole of the extension area of the first circuit board (101) and the through hole of the product (5) to be measured.

7. The ram of claim 2 wherein, The upper surface of the second mounting plate (3) is provided with a first step and a second step, the second step is higher than the first step, the probe template (2) is installed on the first step, and the surface of the second step is provided with the light source (301), and the position of the light source (301) corresponds to the light-transmitting window (102).

8. The ram of claim 7 wherein, The probe template (2) comprises a probe plate (201), a second circuit board (202) and an adapter plate (203) installed in sequence, a plurality of probes (2011) are installed on the probe plate (201), the probes (2011) on the probe plate (201) are in one-to-one corresponding contact connection with the gold fingers on the second circuit board (202); the adapter plate (203) is located below the second circuit board (202), and the lower surface of the adapter plate (203) is in contact with the first step of the second mounting plate (3).

9. The ram of claim 8 wherein, The lower surface of the first mounting plate (1) is provided with a third step and a fourth step, the upper surface of the probe plate (201) is in contact with the third step of the first mounting plate (1), and the second step of the second mounting plate (3) is in contact with the fourth step of the first mounting plate (1).

10. The ram of claim 2 wherein, The upper surface of the first mounting plate (1) further comprises a guide area (103) located in front of the light-transmitting window (102), the guide area (103) is provided in the form of a slope, and is used for guiding the crimping end of the product to be tested (5).

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