Automatic compensation control device of power supply control chip

Abstract

The utility model relates to the technical field of power supply control chips, in particular to an automatic compensation control device of a power supply control chip, a multi-range DAC (Digital-to-Analog Converter) module is composed of at least two sub-DAC units connected in parallel, full-range voltage can be dynamically adjusted, resolution ratio and voltage control range are improved, a temperature compensation module integrates zero-temperature, positive-temperature and negative-temperature current sources, and the temperature compensation module is connected with the power supply control chip. A current weighting ratio, an output temperature coefficient current source and a compensation temperature influence are configured through a weighting resistor and at least two registers, a transconductance amplifier of a Gm conversion module is connected with a multi-range DAC module, an offset current injection branch comprises a plurality of offset currents, an overlapping area of upper and lower limit voltages and 10% of partial full-range voltage width is arranged in a sub-interval, and the width of the full-range voltage is larger than that of the Gm conversion module. Precise voltage-current conversion is achieved, and a TZ module of the mode switching circuit is combined with a level shifter and a two-way switch to achieve positive / negative voltage mode switching.

Description

Technical Field

[0001] This utility model relates to the field of power control chip technology, specifically to an automatic compensation control device for power control chips. Background Technology

[0002] In today's era of rapid development in electronic devices, the performance requirements for power control chips are becoming increasingly stringent. Especially in fields such as RF power amplifier bias control, power control chips are required to have high-precision voltage regulation capabilities, good temperature adaptability, and flexible voltage output modes.

[0003] Traditional digital-to-analog converter (DAC) technology has limitations in meeting the requirements of high resolution and wide voltage control range. Common single DAC chips, to achieve high resolution—for example, Texas Instruments' AMC7904 uses a 13-bit DAC to cover a 10V voltage range, achieving an accuracy of 1.22mV per step—significantly increase chip area, which is a major obstacle in miniaturized and integrated electronic devices. Furthermore, a single DAC struggles to maintain high resolution across different voltage ranges, failing to flexibly adapt to complex and ever-changing circuit requirements.

[0004] In terms of temperature compensation, traditional circuits typically lack precise temperature coefficient current regulation mechanisms. When ambient temperature changes, circuit parameters are prone to drift, affecting the stability of overall performance. For example, some power control chips without a complete temperature compensation module may exhibit deviations in output voltage or current under conditions of large temperature fluctuations, leading to abnormal device operation.

[0005] Voltage-to-current conversion also faces challenges. Traditional voltage-to-current conversion circuits cannot precisely control the conversion process, making it difficult to meet the requirements of complex circuits for different current characteristics. Furthermore, in terms of voltage output mode, many devices only support a single positive or negative voltage output, unable to flexibly switch according to actual application scenarios, thus limiting their application range. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this utility model provides an automatic compensation control device for power control chips.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution: The power control chip automatic compensation control device of this utility model includes:

[0010] Multi-range DAC module: consists of at least two sub-DAC units connected in parallel, each sub-DAC unit is configured with an independent N-bit DAC chip;

[0011] Temperature compensation module: includes zero-temperature current source, positive-temperature current source and negative-temperature current source. The temperature compensation module is equipped with a weighted resistor, and the three electrical sources output temperature coefficient current sources through the weighted resistor.

[0012] Gm conversion module: includes a transconductance amplifier and an offset current injection branch, wherein the input of the transconductance amplifier is connected to the output of the multi-range DAC module;

[0013] Mode switching circuit: includes a TZ module, a level converter, and a dual-channel switch. The TZ module is connected to the Gm conversion module and the temperature coefficient current. The level converter is connected to the TZ module and the dual-channel switch. The dual-channel switch includes a positive voltage output path and a negative voltage output path.

[0014] Preferably, the offset current injection branch includes several offset currents, and there are sub-intervals between the several offset currents.

[0015] More preferably, each sub-interval of the Gm conversion module is divided into an upper limit voltage and a lower limit voltage, and an overlapping area is provided between adjacent sub-intervals. The width of the overlapping area is 10% of the full-scale voltage of a portion of the sub-interval.

[0016] Preferably, the temperature compensation module includes at least two registers, and the two registers are configured with the weighting ratio of the positive temperature coefficient current and the negative temperature coefficient current, respectively.

[0017] Preferably, the level converter includes an operational amplifier and a negative voltage generation circuit.

[0018] More preferably, the Gm conversion module includes a total offset current, and a current switch is provided between each offset current and the total offset current.

[0019] Preferably, the full-scale voltage of the multi-range DAC module can be dynamically adjusted.

[0020] Preferably, the multi-range DAC module, temperature compensation module, Gm conversion module, and mode switching circuit are configured on the same CMOS chip.

[0021] (III) Beneficial Effects

[0022] Compared with the prior art, the present invention provides an automatic compensation control device for power control chips, which has the following beneficial effects:

[0023] High resolution and wide-range voltage control: The multi-range DAC module consists of at least two parallel sub-DAC units, each equipped with an independent N-bit DAC chip, and the full-scale voltage can be dynamically adjusted. This allows for flexible changes in voltage step size across different sub-ranges, improving resolution without increasing the number of DAC bits.

[0024] Precise Temperature Compensation: The temperature compensation module integrates zero-temperature, positive-temperature, and negative-temperature current sources. Through weighted resistors and at least two registers, it can precisely configure the weighting ratio of positive and negative temperature coefficient currents, outputting a temperature coefficient current source that meets the requirements. This effectively compensates for circuit parameter drift caused by temperature changes, ensuring stable operation of the device under different temperature environments and improving system reliability.

[0025] Precise voltage-to-current conversion and sub-range control: The transconductance amplifier in the Gm conversion module converts the DAC voltage into current. Offset current injection, in conjunction with a current switch, achieves parallel shifting of the current characteristic curve, dividing it into multiple sub-ranges. Each sub-range has upper and lower limit voltages and an overlapping area of ​​1 / 10 of the full-scale voltage width, ensuring high accuracy and continuity of the voltage-to-current conversion and improving signal processing quality.

[0026] Flexible voltage mode switching: The TZ module of the mode switching circuit, the level converter, and the dual-channel switch work together. The operational amplifier and negative voltage generation circuit in the level converter help the dual-channel switch quickly switch between positive and negative voltage output paths, meeting the diverse needs of different circuits for positive / negative voltages.

[0027] Integration advantages: The multi-range DAC module, temperature compensation module, Gm conversion module and mode switching circuit are integrated into the same CMOS chip. This not only significantly reduces the chip area and production costs, but also reduces signal transmission loss between modules, improves overall performance and stability, and enhances product competitiveness. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the device architecture of this utility model;

[0029] Figure 2 This is a schematic diagram showing the relationship between the full-scale voltage of the DAC and the LSB of this utility model;

[0030] Figure 3 This is a schematic diagram of the offset current of the Gm conversion module of this utility model;

[0031] Figure 4 This is a schematic diagram of the sub-interval configuration and overlapping areas of this utility model;

[0032] Figure 5 This is a schematic diagram illustrating the positive and negative voltage modes supported by the TZ module and level converter of this utility model. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figure 1-5 The power control chip automatic compensation control device of this utility model includes:

[0035] Multi-range DAC module: consists of at least two sub-DAC units connected in parallel, each sub-DAC unit is configured with an independent N-bit DAC chip;

[0036] Temperature compensation module: includes zero-temperature current source, positive-temperature current source and negative-temperature current source. The temperature compensation module is equipped with a weighted resistor, and the three electrical sources output temperature coefficient current sources through the weighted resistor.

[0037] Gm conversion module: includes a transconductance amplifier and an offset current injection branch, wherein the input of the transconductance amplifier is connected to the output of the multi-range DAC module;

[0038] Mode switching circuit: includes a TZ module, a level converter and a dual-channel switch. The TZ module is connected to the Gm conversion module and the temperature coefficient current. The level converter is connected to the TZ module and the dual-channel switch. The dual-channel switch includes a positive voltage output path and a negative voltage output path.

[0039] Working principle

[0040] Multi-range DAC module: Multiple sub-DAC units are connected in parallel, and the N-bit DAC chip of each sub-unit works independently.

[0041] Preferred solutions, such as Figure 2 As shown, by dynamically adjusting the full-scale voltage, the minimum voltage step size (LSB) is changed, and the voltage step size (LSB) decreases as the full-scale voltage (VFS) decreases, more precise voltage control is achieved in different sub-intervals, thereby improving the overall DAC resolution. For example, the step size of a 10-bit DAC can be reduced from 5mV to 2.5mV or even smaller. At the same time, the voltage control range is expanded to meet the stringent requirements of voltage accuracy and range in various application scenarios.

[0042] Temperature compensation module: Zero-temperature current source (I_TC0), positive-temperature current source (I_TC+), and negative-temperature current source (I_TC-) generate currents with different temperature characteristics. Weighted resistors mix these currents in a specific ratio to form the temperature coefficient current (ITC(T)).

[0043] In the preferred embodiment, at least two registers are configured with a weighting ratio of positive and negative temperature coefficient currents, so that the output current can be automatically adjusted according to temperature changes to compensate for circuit parameter drift caused by temperature.

[0044] Gm Conversion Module: The transconductance amplifier converts the voltage output from the multi-range DAC module into current. Offset current is injected into several offset currents in the branch.

[0045] Preferred solutions, such as Figure 3 and Figure 4 As shown, each offset current is connected to the total offset current via a current switch, thus combining with the DAC current. This allows the current characteristics associated with the DAC input code to be shifted in parallel, thereby dividing the current into multiple sub-intervals. Each sub-interval has an upper and lower voltage limit, and adjacent sub-intervals have a 10% overlap region (VOVL) of the full-scale voltage width of the sub-interval, ensuring the accuracy and continuity of the voltage-to-current conversion.

[0046] Mode switching circuit: The TZ module receives the current and temperature coefficient current output from the Gm conversion module and converts them into a voltage signal.

[0047] In a preferred embodiment, the level shifter is configured with an operational amplifier that works in conjunction with a negative voltage generation circuit to convert the signal into a negative voltage in negative voltage mode, such as... Figure 5 As shown, the dual-channel switch selects either the positive or negative voltage output path according to requirements, thereby switching between positive and negative voltage modes.

[0048] Detailed Workflow

[0049] Initialization settings: At least two registers of the temperature compensation module can be configured with an SPI or I2C interface platform to determine the weighting ratio of positive temperature coefficient current and negative temperature coefficient current. Simultaneously, the full-scale voltage of the multi-range DAC module is dynamically adjusted, and the operating parameters of each sub-DAC unit are set.

[0050] Temperature coefficient current generation: The zero-temperature current source, positive-temperature current source, and negative-temperature current source in the temperature compensation module generate corresponding currents. These currents are mixed by a weighted resistor, and the weighting ratio is controlled by a register to finally output a temperature coefficient current that meets the temperature characteristic requirements.

[0051] Voltage-to-current conversion and sub-range control: The multi-range DAC module outputs voltage to the input of the transconductance amplifier in the Gm conversion module, where the transconductance amplifier converts the voltage into current. The offset current injection branch selects different offset currents via a current switch, which, combined with the DAC current, causes the current characteristic curve to shift parallel, forming multiple sub-ranges. The upper and lower voltage limits of the sub-ranges, as well as the overlapping areas, ensure the accuracy and stability of the voltage-to-current conversion.

[0052] Mode Switching and Output: The current output from the Gm conversion module and the temperature coefficient current both enter the TZ module and are converted into a voltage signal. The dual-switch in the mode switching circuit selects either the positive voltage output path to directly output a positive voltage, or the negative voltage output path, which is then converted to a negative voltage by a level converter before being output, providing a stable positive / negative voltage to external circuits. Throughout this process, the multi-range DAC module, temperature compensation module, Gm conversion module, and mode switching circuit work collaboratively on the same CMOS chip to achieve the automatic compensation control function of the power supply control chip.

[0053] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power supply control chip automatic compensation control device, characterized in that, The application relates to a multi-range DAC module, a temperature compensation module, a Gm conversion module and a mode switching circuit. The multi-range DAC module is composed of at least two sub-DAC units in parallel, and each sub-DAC unit is configured with an independent N-bit DAC chip. The temperature compensation module comprises a zero-temperature current source, a positive-temperature current source and a negative-temperature current source, is configured with a weighted resistor, and outputs the temperature coefficient current sources through the weighted resistor. The Gm conversion module comprises a transconductance amplifier and an offset current injection branch, and the input end of the transconductance amplifier is connected with the output end of the multi-range DAC module. The mode switching circuit comprises a TZ module, a level converter and a two-way switch, the TZ module is connected with the Gm conversion module and the temperature coefficient current, the level converter is connected with the TZ module and the two-way switch, and the two-way switch comprises a positive voltage output path and a negative voltage output path.

2. The power supply control chip automatic compensation control device according to claim 1, characterized in that, The offset current injection branch comprises a plurality of offset currents, and a sub-interval is arranged between the offset currents.

3. The power supply control chip automatic compensation control device according to claim 2, characterized in that, Each sub-interval of the Gm conversion module is divided into an upper limit voltage and a lower limit voltage, an overlapping area is arranged between adjacent sub-intervals, and the width of the overlapping area is 10% of the partial sub-interval full-scale voltage.

4. The power control chip automatic compensation control device according to claim 3, characterized in that, The temperature compensation module comprises at least two registers, and the two registers are respectively configured with the weighted ratio of the positive temperature coefficient current and the negative temperature coefficient current.

5. The power control chip automatic compensation control device of claim 1, wherein, The level converter comprises an operational amplifier and a negative voltage generation circuit.

6. The power control chip automatic compensation control device according to claim 3, wherein, The Gm conversion module comprises a total offset current, and a current switch is arranged between each offset current and the total offset current.

7. The power control chip automatic compensation control device of claim 1, wherein, The full-scale voltage of the multi-range DAC module can be dynamically adjusted.

8. The power control chip automatic compensation control device of claim 6, wherein, The multi-range DAC module, the temperature compensation module, the Gm conversion module and the mode switching circuit are arranged on the same CMOS chip.

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