Multilayer ceramic capacitor
By dividing the dielectric layer stacking direction of the multilayer ceramic capacitor into regions and adjusting the arrangement density of the internal electrodes and the thickness of the protective cover, the problem of easy bending of the multilayer ceramic capacitor under external force is solved, and the bending strength is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-17
AI Technical Summary
Existing multilayer ceramic capacitors are prone to bending and deformation when subjected to external forces, and their bending strength is insufficient.
The ceramic body is divided into a first region, a second region, and a third region in the direction of dielectric layer stacking. The dielectric layer thickness gradually decreases in the second region, the internal electrode arrangement density gradually increases, and the thickness of the protective cap in the first and third regions is less than the maximum thickness of the dielectric layer.
While maintaining the same capacitor size and capacitance, the bending strength of the capacitor is improved, making it particularly suitable for large-size, low-capacitance multilayer ceramic capacitors.
Smart Images
Figure CN224005786U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor technology, and in particular to a multilayer ceramic capacitor. Background Technology
[0002] Multilayer ceramic capacitors (MLCCs) consist of three parts: an inner electrode, a ceramic dielectric layer, and an outer electrode. The inner electrodes are stacked on the ceramic dielectric layer in a staggered manner and then sintered at high temperature in one go to form a ceramic chip. Finally, a metal layer (which is the outer electrode) is sealed at both ends of the ceramic chip to obtain a complete multilayer ceramic capacitor.
[0003] Commonly used technologies include large-size, low-capacitance MLCCs, such as Figure 1 As shown, thicker protective covers are usually provided in the upper region A' and lower region B' of the effective part S' of the capacitor. In other words, there are no internal electrodes in the upper region A' and lower region B' of the MLCC, which easily leads to weak bending strength of the MLCC. When subjected to external force, the MLCC is easily bent and deformed. Utility Model Content
[0004] The purpose of this invention is to provide a multilayer ceramic capacitor that improves the bending strength of the capacitor structure and reduces the risk of bending and deformation when subjected to external forces.
[0005] The objective of this utility model is achieved through the following technical solution:
[0006] One embodiment of this utility model provides a multilayer ceramic capacitor, including a ceramic body and an external electrode disposed on the ceramic body. The ceramic body includes a plurality of dielectric layers stacked together and an internal electrode disposed on the dielectric layers. The internal electrode and the external electrode are connected.
[0007] The ceramic body is divided into a first region, a second region, and a third region along the stacking direction of the dielectric layer. The second region is located between the first region and the third region. In the direction from the second region to the first region and / or the third region, the thickness of at least a portion of the dielectric layer gradually decreases.
[0008] As a further improvement of one embodiment of the present invention, the second region includes at least two dielectric layers of the same thickness, and the dielectric layer thickness in the second region is greater than the dielectric layer thickness in the first region and / or the third region.
[0009] As a further improvement of one embodiment of the present invention, the arrangement density of the inner electrodes located in the second region is less than the arrangement density of the inner electrodes located in the first region and / or the third region.
[0010] As a further improvement of one embodiment of the present invention, the thickness of the dielectric layer gradually decreases in the direction from the second region to the first region and the third region.
[0011] As a further improvement of one embodiment of the present invention, the second region is configured as a non-capacitive part, and the first region and the third region are configured as capacitive parts. The capacitive part includes the dielectric layer and the inner electrode. The inner electrode in each of the capacitive parts is alternately connected to the outer electrode of different polarities. The inner electrode of the capacitive parts in the first region and the third region that is closest to the non-capacitive part is the first inner electrode. The first inner electrodes are all connected to the outer electrode of the same polarity.
[0012] In the direction away from the non-capacitor portion, the thickness of the dielectric layer of the capacitor portion gradually decreases.
[0013] As a further improvement of one embodiment of the present invention, the non-capacitive part is configured as a ceramic layer, and the thickness of the ceramic layer is greater than the thickness of the dielectric layer in the capacitive part.
[0014] As a further improvement of one embodiment of the present invention, the non-capacitive part includes at least two second internal electrodes, and the second internal electrodes and the first internal electrode are connected to an external electrode of the same polarity.
[0015] The non-capacitor portion further includes a ceramic layer disposed between adjacent second inner electrodes and between the first inner electrode and the second inner electrode.
[0016] As a further improvement of one embodiment of the present invention, the thickness of the ceramic layer is less than the thickness of the dielectric layer of the capacitor portion.
[0017] As a further improvement of one embodiment of the present invention, the second region is disposed in the middle region of the ceramic body along the stacking direction of the dielectric layer, and the first region and the third region are symmetrically disposed relative to the second region.
[0018] As a further improvement of one embodiment of the present invention, the ceramic body further includes a protective cover, which is disposed on the side of the first region and the third region away from the second region;
[0019] The thickness of the protective cover is less than the maximum thickness of the dielectric layer.
[0020] Compared with the prior art, the beneficial effects of this utility model include at least the following: in the direction from the second region to the first region and / or the third region, the thickness of at least part of the dielectric layer gradually decreases, that is, in the direction from the second region to the first region and / or the third region, the arrangement density of at least part of the internal electrodes gradually increases, which is equivalent to making the internal electrodes relatively uniformly arranged in the ceramic body as a whole, rather than just concentrated in the central region of the ceramic body. Therefore, while ensuring that the size and capacitance of the multilayer ceramic capacitor remain unchanged, the bending strength of the ceramic capacitor can be effectively improved. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of a multilayer ceramic capacitor, a commonly used technology.
[0022] Figure 2 This is a schematic diagram of the structure of the multilayer ceramic capacitor according to Embodiment 1 of this utility model;
[0023] Figure 3 This is a schematic diagram of the structure of the multilayer ceramic capacitor according to Embodiment 2 of this utility model;
[0024] Figure 4 This is a schematic diagram of the structure of the multilayer ceramic capacitor of Embodiment 3 of this utility model.
[0025] In the diagram: A', upper region; B', lower region; S', effective portion of the capacitor; 1, ceramic body; 11, dielectric layer; 12, inner electrode; 121, first inner electrode; 122, second inner electrode; 13, protective cover; 2, outer electrode; A, first region; B, second region; C, third region; S, capacitor portion; w1, w2, w3, thickness of the dielectric layer. Detailed Implementation
[0026] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.
[0027] The terms used to describe position and direction in this utility model are illustrated with the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this utility model.
[0028] This invention provides a multilayer ceramic capacitor, comprising a ceramic body 1 and an external electrode 2 disposed on the ceramic body 1. The ceramic body 1 includes multiple dielectric layers 11 stacked together and an internal electrode 12 disposed on the dielectric layers 11, the internal electrode 12 and the external electrode 2 being connected. The ceramic body 1 is divided into a first region A, a second region B and a third region C along the stacking direction of the dielectric layers 11, the second region B being located between the first region A and the third region C, and the thickness of at least a portion of the dielectric layers 11 gradually decreasing in the direction from the second region B to the first region A and / or the third region C.
[0029] Example 1
[0030] Reference Figure 2 The multilayer ceramic capacitor includes a ceramic body 1 and external electrodes 2, with the external electrodes 2 disposed on the ceramic body 1. Specifically, external electrodes 2 are disposed at both ends of the ceramic body 1 along its length, and the external electrodes 2 at both ends have different polarities.
[0031] The ceramic body 1 includes a plurality of dielectric layers 11 stacked together and a plurality of internal electrodes 12 formed along the interfaces between the plurality of dielectric layers 11. That is, the internal electrodes 12 are respectively disposed between two adjacent dielectric layers 11, and the plurality of internal electrodes 12 are alternately exposed at both ends of the ceramic body 1 in the length direction so as to achieve electrical connection with the external electrode 2.
[0032] The dielectric layer 11 can be made of a ceramic material with a high dielectric constant, including but not limited to barium titanate, strontium titanate, etc.
[0033] The materials of the inner electrode 12 and the outer electrode 2 can be nickel, silver, copper or other conductive materials or combinations thereof.
[0034] The ceramic body 1 is divided into a first region A, a second region B and a third region C along the stacking direction of the dielectric layer 11. The second region B is located between the first region A and the third region C. In the direction from the second region B to the first region A and / or the third region C, the thickness of at least part of the dielectric layer 11 gradually decreases.
[0035] Specifically, the second region B includes at least two dielectric layers 11 of the same thickness, and the thickness of the dielectric layer 11 located in the second region B is greater than the thickness of the dielectric layer 11 located in the first region A and / or the third region C.
[0036] In one embodiment, the second region B includes at least two dielectric layers 11 of the same thickness. The thickness of each dielectric layer 11 in the second region B can be greater than the thickness of each dielectric layer 11 in the first region A, or greater than the thickness of each dielectric layer 11 in the third region C. Correspondingly, the arrangement density of the inner electrodes 12 in the second region B can be less than the arrangement density of the inner electrodes 12 in the first region A, or less than the arrangement density of the inner electrodes 12 in the third region C. The arrangement density is defined by the spacing between adjacent inner electrodes 12. The larger the spacing between adjacent inner electrodes 12, the smaller the arrangement density of the inner electrodes 12; conversely, the smaller the spacing between adjacent inner electrodes 12, the larger the arrangement density of the inner electrodes 12. Thus, the arrangement density of the inner electrodes 12 in the first region A or the third region C is high, and since the inner electrodes 12 are generally made of metals such as nickel, silver, or copper, they have high structural strength, which can improve the bending strength of the first region A or the third region C to a certain extent.
[0037] In a preferred embodiment, the second region B includes at least two dielectric layers 11 of the same thickness, wherein the thickness of each dielectric layer 11 in the second region B is greater than the thickness of each dielectric layer 11 in the first region A and the third region C. Correspondingly, the arrangement density of the internal electrodes 12 in the second region B is less than the arrangement density of the internal electrodes 12 in the first region A and the third region C. Thus, the arrangement density of the internal electrodes 12 in both the first region A and the third region C is greater than the arrangement density of the internal electrodes 12 in the second region B, thereby simultaneously improving the bending strength of both the first region A and the third region C.
[0038] In one embodiment, the thickness of the dielectric layer 11 gradually decreases in the direction from the second region B to the first region A or the third region C. That is, in the direction from the second region B to the first region A or the third region C, the spacing between adjacent inner electrodes 12 gradually decreases, and the arrangement density of the inner electrodes 12 gradually increases. The arrangement density of the inner electrodes 12 disposed on the side of the first region A or the third region C that is further away from the second region B is greater, which can more effectively reduce the risk of the first region A or the third region C of the capacitor being squeezed and deformed when subjected to external force.
[0039] In another embodiment, the thickness of the dielectric layer 11 gradually decreases in the direction from the second region B to the first region A and the third region C. That is, in the direction from the second region B to the first region A and the third region C, the spacing between adjacent inner electrodes 12 gradually decreases, and the density of the inner electrodes 12 gradually increases, which can simultaneously reduce the risk of the first region A and the third region C of the capacitor being squeezed and deformed when subjected to external forces.
[0040] In one embodiment, the second region B is disposed in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11, and the first region A and the third region C are symmetrically disposed relative to the second region B to balance the structure of the capacitor and enhance the structural strength to a certain extent.
[0041] Of course, in other embodiments, the second region B may not be located in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11. The second region B may be located either slightly above or slightly below the middle region of the ceramic body 1. Alternatively, the second region B may be located in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11, and the first region A and the third region C may be asymmetrically arranged relative to the second region B. For example, the specific thickness of each dielectric layer 11 in the first region A may be different from the specific thickness of each dielectric layer 11 in the third region C, or the thickness of the dielectric layer 11 in the first region A and the third region C may vary in the direction away from the second region B. This utility model does not impose any limitations on this and the choice can be made according to the actual needs of the product.
[0042] Furthermore, the ceramic body 1 also includes a protective cover 13, which is disposed on the side of the first region A and the third region C away from the second region B.
[0043] The thickness of the protective cover 13 is less than the maximum thickness of the dielectric layer 11. Compared with the prior art where a thicker protective cover is provided on the side of the first region A and the third region C away from the second region B, this application appropriately reduces the thickness of the protective cover 13 and gradually increases the arrangement density of the inner electrodes 12 in the regions of the first region A and the third region C that are gradually away from the second region B. Without changing the number of inner electrodes 12, compared with capacitors with a thicker protective cover 13 in commonly used technologies, this is equivalent to making the inner electrodes 12 relatively uniform in the ceramic body 1 as a whole. Under the premise of ensuring that the size and capacitance of the capacitor remain unchanged, the bending strength of the capacitor can be effectively improved.
[0044] For example, such as Figure 2As shown, the second region B is located in the middle region of the ceramic body 1 along the stacking direction of the dielectric layers 11. The first region A and the third region C are symmetrically arranged relative to the second region B. The second region B includes three dielectric layers 11 of the same thickness, and the thickness w1 of each dielectric layer 11 is set to 3h. The first region A and the third region C are respectively provided with dielectric layers 11. In the direction away from the second region B in the first region A and the third region C, the thickness of the dielectric layers 11 gradually decreases. The thickness w2 of the dielectric layers 11 in the first region A and the third region C near the second region B is set to 2h, and the thickness w3 of the dielectric layers 11 in the first region A and the third region C away from the second region B is set to h. Thus, the thickness of the second region B is approximately half the thickness of the entire ceramic body 1. Without changing the size and capacitance of the capacitor, the inner electrodes 12 are distributed in the first region A and the third region C, and the arrangement density of the inner electrodes 12 in the first region A and the third region C is greater than the arrangement density of the electrodes 12 in the central region, which can effectively improve the bending strength of the capacitor.
[0045] Example 2
[0046] Reference Figure 3 The multilayer ceramic capacitor includes a ceramic body 1 and external electrodes 2, with the external electrodes 2 disposed on the ceramic body 1. Specifically, external electrodes 2 are disposed at both ends of the ceramic body 1 along its length, and the external electrodes 2 at both ends have different polarities.
[0047] The ceramic body 1 includes a plurality of dielectric layers 11 stacked together and a plurality of internal electrodes 12 formed along the interfaces between the plurality of dielectric layers 11, wherein the internal electrodes 12 are electrically connected to the external electrodes 2.
[0048] Similarly, the ceramic body 1 is divided into a first region A, a second region B and a third region C along the stacking direction of the dielectric layer 11. The second region B is located between the first region A and the third region C. In the direction from the second region B to the first region A and / or the third region C, the thickness of at least part of the dielectric layer 11 gradually decreases.
[0049] Unlike Embodiment 1, in this embodiment, the second region B is set as a non-capacitive portion, and the first region A and the third region C are set as capacitive portions S. The dielectric layer 11 and the internal electrodes 12 forming the capacitance are both disposed within the capacitive portions S. The internal electrodes 12 in each capacitive portion S are alternately connected to external electrodes 2 of different polarities, for example, to the external electrodes 2 at both ends of the ceramic body 1. The internal electrode 12 closest to the non-capacitive portion in the capacitive portions S of the first region A and the third region C is the first internal electrode 121. The first internal electrodes 121 are all electrically connected to external electrodes 2 with the same polarity (e.g., ...). Figure 3On the outer electrode 2 at the right end. Since the two first inner electrodes 121 are electrically connected to the outer electrode 2 with the same polarity, no capacitance is formed in the region (i.e., the second region B) formed between the two first inner electrodes 121.
[0050] In the direction away from the non-capacitor portion S, the thickness of the dielectric layer 11 within the capacitor portion S gradually decreases. That is, in the direction away from the non-capacitor portion S, the arrangement density of the internal electrodes 12 within the capacitor portion S gradually increases.
[0051] Specifically, the non-capacitor section is made of ceramic layer.
[0052] More specifically, the thickness of the ceramic layer is set to be greater than the thickness of the dielectric layer 11 in the capacitor section S.
[0053] In other words, the second region B of the ceramic body 1 is set as a ceramic layer, and the inner electrode 12 and the dielectric layer 11 are set in the first region A and the third region C. In the direction away from the second region B, the arrangement density of the inner electrode 12 in the first region A and the third region C gradually increases, thereby further improving the bending strength of the ceramic capacitor without changing the capacitance value.
[0054] The ceramic layer can be made of the same material as the dielectric layer 11, including but not limited to barium titanate, strontium titanate, etc. Therefore, the ceramic layer can be formed by a single dielectric layer 11 with a relatively thick thickness, or by directly stacking multiple dielectric layers 11.
[0055] This invention does not limit the specific thickness of the ceramic layer or the material used to make it; these can be selected and adjusted according to the actual product size and performance requirements.
[0056] In one embodiment, the non-capacitive portion is disposed in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11, and the two capacitive portions S are symmetrically disposed relative to the non-capacitive portion to improve the structural strength of the ceramic body 1.
[0057] Of course, in other embodiments, the non-capacitive portion may not be located in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11. Instead, the non-capacitive portion may be located slightly above or slightly below the middle region of the ceramic body 1. Alternatively, the non-capacitive portion may be located in the middle region of the ceramic body 1 along the stacking direction of the dielectric layer 11, with the two capacitive portions S asymmetrically arranged relative to the non-capacitive portion. For example, the specific thickness of each dielectric layer 11 in the capacitive portion S above the non-capacitive portion may differ from the specific thickness of each dielectric layer 11 in the capacitive portion S below the non-capacitive portion, or the thickness of the dielectric layer 11 in the capacitive portion S may vary in the direction away from the non-capacitive portion. This invention does not impose limitations in this regard and can be selected according to actual product requirements.
[0058] Furthermore, the ceramic body 1 also includes a protective cover 13 disposed in the first region A and the third region C. The protective cover 13 is disposed on the side of the two capacitor parts S away from the non-capacitor parts, and the thickness of the protective cover 13 is less than the maximum thickness of the dielectric layer 11.
[0059] Example 3
[0060] Reference Figure 4 Similarly, the second region B is designated as a non-capacitive portion, and the first region A and the third region C are designated as capacitive portions S. The dielectric layer 11 and the internal electrodes 12 forming the capacitance are both disposed within the capacitive portions S. The internal electrodes 12 in each capacitive portion S are alternately connected to external electrodes 2 of different polarities, for example, to the external electrodes 2 at both ends of the ceramic body 1. The internal electrodes 12 closest to the non-capacitive portions in the capacitive portions S of the first region A and the third region C are designated as first internal electrodes 121. The first internal electrodes 121 are all electrically connected to external electrodes 2 of the same polarity (e.g., external electrodes 2 at both ends of the ceramic body 1). Figure 4 On the outer electrode 2 at the right end. Since the two first inner electrodes 121 are electrically connected to the outer electrode 2 with the same polarity, no capacitance is formed in the region (i.e., the second region B) formed between the two first inner electrodes 121.
[0061] In the direction away from the non-capacitor portion S, the thickness of the dielectric layer 11 within the capacitor portion S gradually decreases. That is, in the direction away from the non-capacitor portion S, the arrangement density of the internal electrodes 12 within the capacitor portion S gradually increases.
[0062] Unlike Embodiment 2, the non-capacitive portion in this embodiment includes at least two second internal electrodes 122. These second internal electrodes 122 are electrically connected to the external electrode 2 of the same polarity as the first internal electrode 121. Therefore, no capacitance is formed between the second internal electrodes 122 and the first internal electrode 121, or between adjacent second internal electrodes 122. By adding second internal electrodes 122 without changing the capacitor's capacitance, the number of internal electrodes in the ceramic capacitor is increased, further improving the capacitor's bending strength.
[0063] Furthermore, the non-capacitor portion also includes a ceramic layer disposed between adjacent second inner electrodes 122 and between the first inner electrode 121 and the second inner electrode 122.
[0064] With the thickness of the non-capacitor portion remaining constant, the thickness of the ceramic layer is related to the number of second internal electrodes 122 disposed within the non-capacitor portion; the more second internal electrodes 122 disposed, the smaller the thickness of the ceramic layer. Specifically, the thickness of the ceramic layer is set to be less than the thickness of the dielectric layer 11 of the capacitor portion S.
[0065] The ceramic layer can be made of the same material as the dielectric layer 11, including but not limited to barium titanate, strontium titanate, etc., and the ceramic layer can be formed from a thinner dielectric layer 11.
[0066] Of course, with the thickness of the non-capacitor portion remaining constant, the more second inner electrodes 122 are provided, the smaller the thickness of each ceramic layer. Because there are more second inner electrodes 122 in the second region B, the structural strength of the second region B can be further increased, resulting in better bending resistance of the capacitor. This invention does not limit the number of second inner electrodes 122 provided in the non-capacitor portion, the specific thickness of each ceramic layer, or the material used to manufacture the ceramic layers; these can be selected and adjusted according to the actual product size and performance requirements.
[0067] For example, the non-capacitive section includes two second internal electrodes 122 and three ceramic layers. The second internal electrodes 122 and the first internal electrode 121 are both electrically connected to an external electrode 2 of the same polarity (e.g., ...). Figure 4 On the right-end outer electrode 2), the thickness of each ceramic layer is less than the minimum thickness of the dielectric layer 11 inside the capacitor part S.
[0068] In this embodiment, the inner electrode 12 located within the capacitor section S has a gradually increasing arrangement density in the direction from the second region B to the first region A and the third region C. The arrangement density of the second inner electrode 122 located outside the capacitor section can be less than or greater than the arrangement density of the inner electrode 12 located within the capacitor section S.
[0069] In summary, this application gradually reduces the thickness of at least a portion of the dielectric layer 11 in the direction from the second region B to the first region A and the third region C of the ceramic body 1. That is, the arrangement density of the internal electrodes 12 gradually increases in the direction from the second region B to the first region A and the third region C. Compared with capacitors with thicker protective covers 13 in commonly used technologies, this is equivalent to making the internal electrodes 12 relatively uniformly arranged in the ceramic body 1 as a whole, rather than just concentrated in the central region of the ceramic body 1 along the stacking direction. Therefore, while ensuring that the size and capacitance of the multilayer ceramic capacitor remain unchanged, the bending strength of the ceramic capacitor can be effectively improved. Moreover, the multilayer ceramic capacitor in this application is more suitable as a capacitor with large size, low capacitance and a small number of internal electrodes 12.
[0070] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.
Claims
1. A multilayer ceramic capacitor, characterized by, The ceramic body comprises a plurality of dielectric layers and inner electrodes arranged on the dielectric layers, and an outer electrode arranged on the ceramic body and connected with the inner electrodes; The ceramic body is divided into a first region, a second region and a third region along the stacking direction of the dielectric layers, and the second region is located between the first region and the third region, and the thickness of at least part of the dielectric layers gradually decreases from the second region to the first region and / or the third region.
2. The multilayer ceramic capacitor of claim 1, wherein, The second region comprises at least two dielectric layers with the same thickness, and the thickness of the dielectric layers in the second region is greater than that of the dielectric layers in the first region and / or the third region.
3. The multilayer ceramic capacitor of claim 1, wherein, The arrangement density of the inner electrodes in the second region is less than that of the inner electrodes in the first region and / or the third region.
4. The multilayer ceramic capacitor of claim 1, wherein, The thickness of the dielectric layers gradually decreases from the second region to the first region and the third region.
5. The multilayer ceramic capacitor of claim 1, wherein, The second region is arranged as a non-capacitive part, and the first region and the third region are arranged as capacitive parts, the capacitive parts comprise the dielectric layers and the inner electrodes, the inner electrodes in each of the capacitive parts are alternately connected to the outer electrodes of different polarities, and the inner electrodes closest to the non-capacitive part in the first region and the third region are first inner electrodes, and the first inner electrodes are connected to the outer electrodes of the same polarity. The thickness of the dielectric layers in the capacitive parts gradually decreases away from the non-capacitive part.
6. The multilayer ceramic capacitor of claim 5, wherein, The non-capacitive part is arranged as a ceramic layer, and the thickness of the ceramic layer is greater than that of the dielectric layers in the capacitive parts.
7. The multilayer ceramic capacitor of claim 5, wherein, The non-capacitive part comprises at least two second inner electrodes, and the second inner electrodes and the first inner electrodes are connected to the outer electrodes of the same polarity. The non-capacitive part further comprises a ceramic layer arranged between adjacent second inner electrodes and between the first inner electrode and the second inner electrode.
8. The multilayer ceramic capacitor of claim 7, wherein, The thickness of the ceramic layer is less than that of the dielectric layers in the capacitive parts.
9. The multilayer ceramic capacitor of claim 1 or 5, wherein, The second region is arranged in the middle region of the ceramic body along the stacking direction of the dielectric layers, and the first region and the third region are symmetrically arranged relative to the second region.
10. The multilayer ceramic capacitor of claim 1, wherein, The ceramic body further comprises a protective cover arranged on the side of the first region and the third region away from the second region. The thickness of the protective cover is less than the maximum thickness of the dielectric layers.