Chip tantalum capacitor bonding clamp

Abstract

The utility model discloses a chip tantalum capacitor bonding clamp comprising a bonding base station, the bonding base station is provided with a bonding positioning plate, the bonding positioning plate is provided with a limiting assembly, and the limiting assembly is used for limiting a tantalum core; the problem that the tantalum core is easily adhered to be deviated in the manual adhesion process is solved, the adhesion precision is improved, the product percent of pass is increased, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of tantalum capacitor technology, and in particular to a bonding clamp for chip tantalum capacitors. Background Technology

[0002] Lead-frameless chip tantalum capacitors are a new type of chip tantalum capacitor developed in recent years to achieve higher volumetric efficiency and more efficient packaging.

[0003] The manufacturing process of leadless tantalum chip capacitors involves bonding an array of tantalum cores onto a PCB substrate, followed by curing, encapsulation, and cutting to produce the final product. To maintain production efficiency, the spacing between the tantalum cores bonded to the PCB substrate is very small, typically between 0.2mm and 1mm, thus placing higher demands on the precision of the bonding process.

[0004] While manually bonding tantalum cores to the PCB substrate in an array is simple, it is susceptible to human error, leading to inconsistent bonding precision and the possibility of misaligned cores. This error can result in the core being cut during the dicing process, reducing product yield and increasing production costs. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a chip tantalum capacitor bonding clamp.

[0006] This utility model is achieved through the following technical solution.

[0007] This utility model provides a bonding fixture for a chip tantalum capacitor, including a bonding base, a bonding positioning plate on the bonding base, and a limiting component on the bonding positioning plate for limiting the tantalum core.

[0008] Preferably, the limiting component includes multiple positioning teeth, all of which are disposed on one side of the adhesive positioning plate along its length, and the multiple positioning teeth are distributed at equal intervals.

[0009] Preferably, a positioning groove is formed between two adjacent positioning teeth.

[0010] Preferably, the bonding positioning plate is provided with positioning pins at both ends along its length, and the bonding base is provided with hollow grooves on both sides. The two hollow grooves are symmetrically arranged along the center line of the bonding base, and the two positioning pins are respectively inserted into the two hollow grooves and are slidably arranged along the length of the hollow grooves.

[0011] Preferably, the bonding base is made of aluminum.

[0012] Preferably, the adhesive positioning plate is made of stainless steel.

[0013] Preferably, the length of the positioning groove is set to 1 to 10 mm.

[0014] Preferably, the width of the positioning teeth is set to 1 to 10 mm.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. By fixing the PCB substrate onto the bonding base, the bonding positioning plate is placed on the PCB substrate through the positioning holes on the PCB substrate. Multiple positioning teeth fit against the PCB substrate, and the positioning groove formed between two adjacent positioning teeth is used to limit the tantalum core. Adhesive silver paste is applied to the contact position between the tantalum core and the PCB substrate using a dispensing machine. The adhesive silver paste bonds the tantalum core to the PCB substrate. At the same time, the positioning groove limits and stabilizes the tantalum core, avoiding the problem of misalignment of the tantalum core that is easy to occur during manual bonding. This improves the bonding accuracy, increases the product qualification rate, and reduces production costs.

[0017] 2. By setting positioning teeth and positioning grooves of different sizes, tantalum cores with different spacings can be bonded. Due to the use of different bonding fixtures, the bonding process is faster and more convenient, thereby improving production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the adhesive base of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the adhesive positioning plate of this utility model;

[0020] Figure 3 This is a front view of the adhesive positioning plate of this utility model;

[0021] Figure 4 This is a front view of the adhesive base of this utility model;

[0022] In the diagram: 1-locating pin; 2-locating tooth; 3-locating groove; 4-hollow groove; 5-bonding base; 6-bonding positioning plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] In this embodiment, refer to Figure 1 and Figure 2 The system includes an adhesive base 5, which has a thickness of 15mm, a length of 120mm, and a width of 120mm. The adhesive base 5 is made of aluminum and features high strength, good electrical and thermal conductivity, and good corrosion resistance. It is also resistant to deformation under high temperatures. An adhesive positioning plate 6 is provided on the adhesive base 5. The adhesive positioning plate 6 has a length of 120mm and a thickness of 2mm. The adhesive positioning plate 6 is made of stainless steel and features high strength and durability. It is suitable for limiting and clamping tantalum chip capacitors.

[0026] In this embodiment, refer to Figure 2 and Figure 3 A limiting component is provided on the adhesive positioning plate 6. The limiting component is used to limit the tantalum core. The limiting component includes multiple positioning teeth 2. The multiple positioning teeth 2 are all arranged on one side of the adhesive positioning plate 6 along the length direction. The multiple positioning teeth 2 are evenly distributed. The positioning teeth 2 are integrally connected to the adhesive positioning plate 6. The specific width of the positioning teeth 2 is set to 1.8mm, the specific length of the positioning teeth 2 is set to 4mm, and a positioning groove 3 is formed between two adjacent positioning teeth 2.

[0027] During the fixing process, the tantalum core is located in the positioning groove 3. There are two tantalum cores in each positioning groove 3. One side of the positioning tooth 2 and one side of the adhesive positioning plate 6 work together to limit and stabilize the tantalum core, so as to avoid the tantalum core from being skewed during fixing. Using one side of the positioning tooth 2 and one side of the positioning plate 6 to fix the tantalum core prevents the tantalum core from not being able to be embedded in the positioning groove when there is an error in the tantalum core size. Each tantalum core is spaced 1.8mm apart, realizing the array bonding of multiple tantalum cores and improving the bonding accuracy of the tantalum core.

[0028] In this embodiment, refer to Figure 2 and Figure 4 The bonding positioning plate 6 is fixedly connected to both ends of the length direction with positioning pins 1. The bonding base 5 is provided with hollow grooves 4 on both sides. The width of the hollow grooves 4 is set to 5mm and the length of the hollow grooves 4 is 90mm. The two hollow grooves 4 are symmetrically arranged along the center line of the bonding base 5. The two positioning pins 1 are respectively inserted into the two hollow grooves 4. The positioning pins 1 are slidably arranged along the length direction of the hollow grooves 4 to control the bonding positioning plate 6 to limit the tantalum core at different positions on the PCB substrate, thereby helping to realize the array distribution of tantalum core on the PCB substrate.

[0029] The working principle of this embodiment is as follows: First, the PCB substrate is bonded and fixed on the bonding base 5, and at the same time, two positioning pins 1 are inserted into the hollow groove 4. The two positioning pins 1 move along the length of the hollow groove 4 to the position where the tantalum core needs to be bonded. At this time, the bonding positioning plate 6 is fixed on the PCB substrate. Silver paste is applied to the PCB substrate, and the tantalum core is placed at the bonding position so that the tantalum core and the PCB substrate are bonded together. The tantalum core is limited and fixed by the positioning groove 3 and the positioning teeth 2. Then, the tantalum core and the PCB substrate are pressed together to avoid the problem of the tantalum core being bonded off-center during manual bonding, thus improving the bonding accuracy of the tantalum core. The bonded tantalum core and the PCB substrate are placed in a forced-air drying oven along with the bonding base 5 and cured at a temperature of 180°C for 30 minutes to complete the curing, thus completing the bonding of the tantalum core and the PCB substrate.

[0030] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A chip tantalum capacitor bonding jig characterized by: The application relates to a bonding base (5) which is provided with a bonding positioning plate (6), the bonding positioning plate (6) is provided with a limiting assembly, and the limiting assembly is used for limiting a tantalum core; the bonding positioning plate (6) is provided with a positioning pin (1) at both ends along the length direction, both sides of the bonding base (5) are provided with hollow grooves (4), the two hollow grooves (4) are symmetrically arranged along the center line of the bonding base (5), the two positioning pins (1) are respectively arranged in the two hollow grooves (4), and the positioning pin (1) is arranged in a sliding mode along the length direction of the hollow groove (4).

2. A chip tantalum capacitor bonding jig as claimed in claim 1, wherein: The limiting assembly comprises a plurality of positioning teeth (2), the plurality of positioning teeth (2) are arranged on one side of the bonding positioning plate (6) along the length direction, and the plurality of positioning teeth (2) are distributed in an equal interval.

3. A chip tantalum capacitor bonding jig as claimed in claim 2, wherein: Positioning grooves (3) are formed between two adjacent positioning teeth (2).

4. A chip tantalum capacitor bonding jig as claimed in claim 1, wherein: The bonding base (5) is made of aluminum.

5. A chip type tantalum capacitor bonding jig according to claim 1, wherein: The bonding positioning plate (6) is made of stainless steel.

6. A chip type tantalum capacitor bonding jig according to claim 3, wherein: The length of the positioning groove (3) is 1-10 mm.

7. A chip type tantalum capacitor bonding jig according to claim 2, wherein: The width of the positioning tooth (2) is 1-10 mm.

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