Jig for cleaning chip

Abstract

The utility model discloses a jig for cleaning a chip, and belongs to the technical field of chip manufacturing equipment. The wafer cleaning device comprises a cleaning assembly, an air inlet assembly and an air outlet assembly, the cleaning assembly comprises a cleaning box body, a cleaning unit and wafer carrying tables used for loading wafers, one end of the cleaning box body is open, and the multiple wafer carrying tables are movably inserted into an inner cavity of the cleaning box body; the cleaning unit comprises a first hole body and a second hole body which are arranged in a matched mode, the first hole body is arranged at the closed end of the cleaning box body, the second hole body is formed in the slide holder, the second hole body is arranged between the end face of the slide holder and the wafer, and the wafer can be cleaned through airflow sequentially passing through the first hole body and the second hole body. The air inlet assembly is arranged at the closed end of the cleaning box and used for inputting airflow. The air outlet assembly is arranged at the opening end of the cleaning box body and used for filtering airflow. According to the utility model, large-particle dirt on the surface of the wafer can be efficiently removed.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing equipment technology, and in particular to a fixture for cleaning chips. Background Technology

[0002] Cleaning processes for semiconductor wafers (such as silicon wafers) are a crucial step in semiconductor devices and microelectromechanical systems (MEMS). The yield of silicon wafers is inversely proportional to the defect density (such as cleanliness and particle count) resulting from wafer processing.

[0003] In existing technologies, dust and lint are present during chip transfer. Furthermore, the cleanliness of the wafer surface must be ensured before essential processes such as film growth and photolithography. Therefore, mass production lines require a significant amount of time and effort to clean the wafers to ensure surface cleanliness to meet chip manufacturing requirements, which seriously affects production efficiency. Utility Model Content

[0004] In view of this, it is necessary to provide a fixture for cleaning chips to solve the problem that existing wafer cleaning methods consume a lot of effort and time.

[0005] This utility model provides a fixture for cleaning chips, comprising:

[0006] A cleaning assembly includes a cleaning chamber, a cleaning unit, and a wafer stage for loading wafers. One end of the cleaning chamber is open, and multiple wafer stages are movably inserted into the inner cavity of the cleaning chamber. The cleaning unit includes a first hole and a second hole that are configured to cooperate with each other. The first hole is located at the closed end of the cleaning chamber, and the second hole is formed in the wafer stage. The second hole is located between the end face of the wafer stage and the wafer, and the wafer can be cleaned by airflow through the first hole and the second hole in sequence.

[0007] An air intake assembly is located at the closed end of the cleaning chamber to allow airflow to enter.

[0008] An air outlet assembly is located at the opening end of the cleaning chamber to provide filtered airflow.

[0009] Furthermore, the inner wall of the cleaning chamber is provided with a sliding groove, and multiple sliding grooves are arranged in an array along the cleaning chamber, with multiple slide stages respectively movably inserted into the multiple sliding grooves.

[0010] Furthermore, the axis of the second hole is parallel to the end face of the wafer, and the second hole forms a guide groove on the end face of the wafer stage for guiding airflow.

[0011] Furthermore, multiple first holes are arranged in a relative array, with each first hole corresponding to and connected to the second hole.

[0012] Furthermore, the air intake assembly includes an air intake cavity and an airflow dispersion unit. The air intake cavity has an air intake hole at one end away from the cleaning chamber. The air intake hole communicates with the inner cavity of the air intake cavity. The airflow dispersion unit is located at one end of the air intake cavity near the cleaning chamber. The airflow dispersion unit can disperse the airflow from the air intake hole and input the airflow into the first hole.

[0013] Furthermore, the airflow dispersion unit includes a spiral groove formed on the air intake cavity, and the spiral groove communicates with the inner cavity of the air intake cavity.

[0014] Furthermore, the airflow dispersion unit includes a grid plate formed on the air intake cavity, and the grid plate is provided with airflow grooves for dispersing airflow.

[0015] Furthermore, the air outlet assembly includes a perforated plate and an adsorption mesh arranged opposite to each other, the adsorption mesh being adhered to the perforated plate, and the perforated plate being connected to the open end of the cleaning box.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This invention discloses a fixture for cleaning chips, comprising a cleaning assembly including a cleaning housing, a cleaning unit, and a wafer carrier stage. One end of the cleaning housing is open, and multiple wafer carrier stages are movably inserted into the inner cavity of the cleaning housing. The cleaning housing supports simultaneous processing of multiple wafers, saving loading and unloading time, enabling batch parallel cleaning, improving cleaning efficiency, shortening production cycle time, and adapting to mass production requirements. The cleaning unit includes a first hole and a second hole that are configured to cooperate. The first hole is located at the closed end of the cleaning housing, and the second hole is located within the wafer carrier stage, between the end face of the wafer carrier stage and the wafer. The airflow channel formed by the first and second holes allows for directional airflow from the closed end to the open end. The airflow passing sequentially through the first and second holes performs impact-type cleaning on the wafer surface, effectively removing dust / fibers and improving cleaning efficiency. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0021] Figure 3 This is an exploded view of the entire utility model;

[0022] Figure 4 This is a schematic diagram of the cleaning component in this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the slide stage in this utility model;

[0024] Figure 6 This is a schematic diagram of the air intake assembly in this utility model;

[0025] Figure 7 This is a cross-sectional schematic diagram of the air intake component in this utility model;

[0026] Figure 8 This is a schematic diagram of the air outlet component in this utility model;

[0027] Figure 9 This is a cross-sectional schematic diagram of the air outlet component in this utility model.

[0028] In the figure, 100 is the cleaning component; 110 is the cleaning housing; 111 is the slide; 120 is the cleaning unit; 121 is the first hole; 122 is the second hole; 122a is the guide groove; and 130 is the stage.

[0029] 200, intake assembly; 210, intake chamber; 211, intake port; 220, airflow dispersion unit; 221, spiral groove;

[0030] 300. Air outlet assembly; 310. Perforated plate; 320. Adsorption mesh. Detailed Implementation

[0031] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0032] This embodiment describes a fixture for cleaning chips, which relates to the field of chip manufacturing equipment technology. By setting a cleaning unit 120 in the cleaning chamber 110, the surface of the wafer in each stage 130 is cleaned and large particles of dirt on the wafer surface are efficiently removed.

[0033] Please see Figures 1 to 9This embodiment provides a fixture for cleaning chips, including a cleaning component 100, an air inlet component 200, and an air outlet component 300. The cleaning component 100 can clean multiple wafers on multiple wafer stages 130 at once. The air inlet component 200 can input gas into the cleaning component 100, and the air outlet component 300 can discharge gas from the cleaning component 100.

[0034] The cleaning assembly 100 includes a cleaning housing 110, a cleaning unit 120, and a wafer carrier 130 for loading wafers. One end of the cleaning housing 110 is open, and multiple wafer carriers 130 are movably inserted into the inner cavity of the cleaning housing 110. The cleaning housing 110 supports simultaneous processing of multiple wafers, saves loading and unloading time, realizes batch parallel cleaning, improves cleaning efficiency, shortens production cycle, and adapts to mass production requirements. The cleaning unit 120 includes a first hole 121 and a second hole 122 that are configured together. The first hole 121 is located at the closed end of the cleaning chamber 110, and the second hole 122 is opened in the wafer stage 130. The second hole 122 is located between the end face of the wafer stage 130 and the wafer. The airflow channel formed by the first hole 121 and the second hole 122 can realize directional airflow from the closed end to the open end. The airflow passing through the first hole 121 and the second hole 122 in sequence can perform impact blowing on the wafer surface, thereby effectively removing dust / fibers and improving cleaning efficiency.

[0035] The air intake assembly 200 is located at the closed end of the cleaning chamber 110, and the airflow is introduced from the closed end to avoid airflow disturbance and form a one-way rinsing path. The air outlet assembly 300 is located at the open end of the cleaning chamber 110 to discharge pollutants carried in the airflow and to filter them to prevent backflow of pollutants.

[0036] In some embodiments, please refer to Figure 3 and Figure 4 The cleaning chamber 110 has grooves 111 on its inner wall. Multiple grooves 111 are arranged in an array along the cleaning chamber 110. This array structure allows multiple wafer stages 130 to be neatly arranged inside the cleaning chamber 110, supporting simultaneous cleaning of multiple wafers and significantly improving cleaning efficiency, suitable for the high-paced requirements of mass production lines. The grooves 111 provide physical guidance and constraint for the wafer stages 130, ensuring their stability during insertion, movement, or positioning, and preventing displacement or tilting. The insertion-type design of the wafer stages 130 facilitates quick insertion, removal, replacement, and maintenance by operators, reducing downtime.

[0037] In some embodiments, please refer to Figure 5The second aperture 122 is positioned parallel to the end face of the wafer. The airflow passing through the second aperture 122 will clean the wafer in a surface-mounted, gliding manner, rather than through a vertical impact. This surface-mounted, gliding manner helps to carry away particulate contaminants along the surface, rather than pressing them onto the wafer surface, thereby improving the microparticle removal rate.

[0038] The second aperture 122 forms a guide groove 122a on the end face of the wafer stage 130 for guiding airflow. The matching guide groove 122a can guide the airflow to form a continuous and uniform streamline region on the wafer surface, avoiding airflow divergence or turbulence, thereby effectively improving the cleaning efficiency of gas per unit volume, making the cleaning process more directional and controllable, and reducing gas waste.

[0039] In some embodiments, a plurality of first holes 121 are arranged in a relative array, and each first hole 121 is arranged in a one-to-one correspondence with a second hole 122 and connected to each other. The cleaning airflow source for each wafer is independent and the path is clear, which can effectively avoid the blowing dead corners, insufficient flow or airflow interference caused by airflow sharing among multiple wafers, and improve the uniformity and controllability of particle removal on the surface of a single wafer.

[0040] The first orifice 121 is arrayed and aligned at the end of the cleaning chamber 110, which can make the input airflow distribution uniform and less prone to turbulence. The first orifice 121, together with the corresponding second orifice 122 at the rear end, form a clear airflow channel matrix, systematically controlling the purging pressure and direction, and optimizing the overall flow field structure.

[0041] In some embodiments, please refer to Figure 3 , Figure 6 and Figure 7 The air intake assembly 200 includes an air intake chamber 210 and an airflow dispersion unit 220. An air intake hole 211 is provided at the end of the air intake chamber 210 away from the cleaning chamber 110, and the air intake hole 211 communicates with the inner cavity of the air intake chamber 210. The air intake hole 211 can be connected to an air source to supply gas to the air intake chamber 210.

[0042] The air intake chamber 210 is equivalent to a buffer chamber or pressure stabilizing chamber, which can smoothly handle airflow fluctuations from the air source and help reduce the impact of external air supply system interference on the consistency of cleaning effect.

[0043] The airflow dispersion unit 220 is disposed at one end of the air intake chamber 210 near the cleaning chamber 110. The airflow dispersion unit 220 can disperse the airflow from the air intake hole 211 and input the airflow into the first hole 121.

[0044] The airflow dispersion unit 220 is located at the air outlet of the air inlet chamber 210. It can buffer and distribute the high-speed airflow input from a single point in multiple directions, effectively avoiding concentrated impact and local overpressure when the airflow directly enters the cleaning unit, thus preventing damage to the wafer or affecting the cleaning uniformity.

[0045] It should be noted that the air inlet 211 is connected to a nitrogen generator via a pipe. The nitrogen generator can deliver high-pressure nitrogen into the air inlet chamber 210. High-pressure nitrogen has stable, continuous, and high-kinetic-energy characteristics, which can effectively remove contaminants such as particles, dust, and fibers from the microstructures on the wafer surface or edge. Conventional compressed air may contain trace amounts of water vapor and oxygen, while the use of nitrogen can prevent moisture condensation, oxidation reactions, or adsorption of contaminant particles; improve the dryness and stability of the wafer after cleaning, and extend the cleanliness retention time before subsequent processes.

[0046] In some embodiments, please refer to Figure 6 and Figure 7 The airflow dispersion unit 220 includes a spiral groove 221 formed on the air intake cavity 210, which communicates with the inner cavity of the air intake cavity 210. The spiral groove 221 is designed to disperse the airflow before it enters the cleaning chamber 110, preventing the airflow from accumulating in certain areas and causing fluctuations in airflow strength. The spiral groove 221 can promote the tangential and radial uniform diffusion of the originally linear airflow with a velocity gradient, significantly improving the flow velocity consistency at the multiple first holes 121.

[0047] As an alternative implementation, the airflow dispersion unit 220 includes a grid plate formed on the air inlet cavity 210. The grid plate is provided with airflow grooves for dispersing airflow. The grid plate and airflow grooves can divide and redistribute the airflow path, eliminate the bias pressure and flow deviation in the main airflow, thereby promoting the air supply pressure at multiple downstream first holes 121 to remain balanced, thereby ensuring the consistency and synchronization of wafer cleaning by multiple cleaning paths.

[0048] Before entering the cleaning chamber, the high-speed airflow is buffered and reorganized by multiple separations of the grid plate and the guidance of the airflow channels. This effectively reduces the risk of concentrated airflow impacting the wafer surface, reduces the possibility of particle re-attachment or micro-damage, and improves the gentleness and safety of the cleaning process.

[0049] In some embodiments, please refer to Figure 8 and Figure 9 The exhaust assembly 300 includes a perforated plate 310 and an adsorption net 320 arranged opposite to each other. The adsorption net 320 can effectively capture dust particles, fiber debris, and tiny impurities blown up in the air, preventing them from being carried back to the workshop environment with the exhaust air or falling back onto the wafer surface, thus preventing secondary pollution.

[0050] The porous distribution structure on the perforated plate 310 has the functions of equalizing airflow pressure and buffering. It can integrate and divert the gas exiting from different channels, reduce pressure changes and eddy back suction at the system outlet, and maintain the stability of the airflow field inside the cleaning chamber.

[0051] The adsorption net 320 is adhered to the perforated plate 310, and the perforated plate 310 is connected to the open end of the cleaning box 110.

[0052] Workflow:

[0053] Loading wafers: Place the wafers to be cleaned one by one on the wafer stage 130, making sure that the front of the wafers faces the direction of the airflow; slide the wafer stage 130 along the inner wall of the cleaning box 110 into the corresponding slide groove 111, ensuring that it is aligned with the second hole 122 in the cleaning unit 120.

[0054] Connect the gas supply system: Connect the air inlet 211 of the cleaning fixture to the external nitrogen generator through the pipeline; check the connection for tightness to ensure that the gas path is unobstructed and leak-free.

[0055] Start the nitrogen generator: Set an appropriate gas pressure value (e.g., 0.3-0.6 MPa, depending on the chip's precision);

[0056] Nitrogen gas enters the airflow dispersion unit 220 through the air inlet chamber 210, and then forms a directional airflow through the first orifice 121 and the second orifice 122.

[0057] Wafer purging and cleaning: High-pressure nitrogen gas enters the cleaning channel from the closed end of the cleaning chamber 110 through the airflow dispersion device; after passing through the structure of the first hole 121 → second hole 122 → guide groove 122a, it forms a directional and uniform airflow, which powerfully purifies the wafer surface; the dust, fiber debris and other contaminants blown up flow with the airflow to the open end of the cleaning chamber 110, and are filtered and captured by the perforated plate 310 and the adsorption mesh 320.

[0058] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the present utility model.

Claims

1. A jig for cleaning a chip, characterized by, The utility model relates to a cleaning device for wafer, which comprises a cleaning assembly, an air inlet assembly and an air outlet assembly. The cleaning assembly comprises a cleaning box, a cleaning unit and a wafer loading platform, one end of the cleaning box is open, and a plurality of wafer loading platforms are movably inserted into the inner cavity of the cleaning box. The cleaning unit comprises a first hole body and a second hole body arranged in pairs, the first hole body is arranged at the closed end of the cleaning box, and the second hole body is arranged in the wafer loading platform. The second hole body is arranged between the end surface of the wafer loading platform and the wafer, and the airflow passing through the first hole body and the second hole body in sequence can clean the wafer.

2. The tool for cleaning a chip according to claim 1, wherein The air inlet assembly is arranged at the closed end of the cleaning box to input the airflow.

3. The tool for cleaning a chip according to claim 1, wherein The air outlet assembly is arranged at the open end of the cleaning box to filter the airflow.

4. The tool for cleaning a chip according to claim 1, wherein The inner wall of the cleaning box is provided with a plurality of sliding grooves arranged in an array along the cleaning box, and a plurality of wafer loading platforms are movably inserted into the sliding grooves, respectively.

5. The tool for cleaning a chip according to claim 1, wherein The axis direction of the second hole body is parallel to the end surface of the wafer, and the second hole body forms a guide groove on the end surface of the wafer loading platform for guiding the airflow.

6. The tool for cleaning a chip according to claim 5, wherein A plurality of first hole bodies are arranged in an array, each first hole body is arranged in one-to-one correspondence with the second hole body and is connected to each other.

7. The tool for cleaning a chip according to claim 5, wherein The air inlet assembly comprises an air inlet cavity and an airflow dispersing unit, the air inlet cavity is provided with an air inlet hole at the end away from the cleaning box, the air inlet hole is in communication with the inner cavity of the air inlet cavity, and the airflow dispersing unit is arranged at the end of the air inlet cavity close to the cleaning box.

8. The tool for cleaning a chip according to claim 1, wherein The airflow dispersing unit can disperse the airflow from the air inlet hole and input the airflow into the first hole body. The airflow dispersing unit comprises a spiral groove arranged on the air inlet cavity, and the spiral groove is in communication with the inner cavity of the air inlet cavity. The airflow dispersing unit comprises a grid plate arranged on the air inlet cavity, and the grid plate is provided with an airflow groove for dispersing the airflow. The air outlet assembly comprises a flower hole plate and an adsorption net arranged in pairs, the adsorption net is adhered to the flower hole plate, and the flower hole plate is connected to the open end of the cleaning box.

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