Dust removal mechanism for testing integrated circuit board
By combining brushing and vacuuming, the dust removal mechanism solves the problems of poor dust removal effect and long time consumption in the existing technology, and realizes efficient integrated circuit board cleaning, which is applicable to fields such as communications, automotive electronics, industrial control and aerospace.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2026-03-20
AI Technical Summary
Existing dust removal mechanisms for integrated circuit board testing have limited effectiveness and are time-consuming, especially in thoroughly cleaning some highly adhesive debris.
The system employs a combination of brushing and vacuuming. Cleaning brushes remove dust from the surface of integrated circuit boards, while fans and dust collection boxes collect the dust. Movable, elastic pressure plates secure the circuit boards to ensure stable dust removal.
It improves dust removal efficiency, shortens dust removal time, ensures the cleanliness of integrated circuit board surfaces, and expands the application range of dust removal mechanisms.
Smart Images
Figure CN224010558U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to dust removal mechanism technical field especially relates to a dust removal mechanism for integrated circuit board test. BACKGROUND
[0002] Integrated circuit board is a carrier of loading integrated circuit, mainly by silica gel constitutes, as a kind of basic component for building electronic equipment, mainly used for integration and connection various electronic components, realizes the specific circuit function, through microfilm or photolithography technology, electronic components are integrated on chip surface, realize high integration and compact design, and are widely used in communication, automotive electronics, industrial control, medical electronics and aerospace.
[0003] Integrated circuit board is tested, in order to avoid dust to influence the precision of test, will carry out dust removal treatment to integrated circuit board before test, but in the prior art, most dust removal mechanisms only remove dust by dust collection, and the dust on the surface of the integrated circuit board cannot be affected by suction force and the dust with a little adhesion force, so it is difficult to clean completely, and repeated suction will increase the processing time. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the problems of limited cleaning effect and long time consumption of the dust removal mechanism for integrated circuit board test in the prior art, and provides a dust removal mechanism for integrated circuit board test.
[0005] In order to achieve the above object, the utility model adopts the following technical scheme: including cleaning table and moving cover plate, the cleaning table top is provided with moving cover plate, the cleaning table rear side is symmetrically installed with electric push rod, and the output ends of two electric push rods are fixed on the bottom surface of moving cover plate, the middle part of cleaning table top is provided with placing groove, the top surface of moving cover plate is provided with wind box, the top of moving cover plate is provided with corrugated air duct, and the two ends of corrugated air duct are connected with moving cover plate and wind box inside respectively, the inside of wind box is provided with fan with air inlet towards corrugated air duct, dust collecting box is inserted into the inside of wind box below fan, the inside of placing groove is slidably sleeved with moving plate, and the bottom surface of moving plate is fixed with cleaning brush.
[0006] Preferably, the four corners of the moving cover plate are slidably sleeved with limiting rods, the bottom surface of each limiting rod is fixed on the top surface of the cleaning table, and the four corners of the moving cover plate are provided with sliding holes matched with the limiting rods.
[0007] Preferably, the inside of moving cover plate above placing groove is provided with air inlet, the bottom of corrugated air duct is connected with the inside of air inlet, the inside of cleaning table in front of placing groove is provided with air inlet window, and the inside of air inlet window is fixed with dustproof filter screen.
[0008] Preferably, one end of the wind box is provided with a slot matched with the dust collecting box, and an exhaust port is arranged in the interior of the end of the wind box and the dust collecting box away from the slot.
[0009] Preferably, the moving plate is threadedly sleeved with a supporting screw at two ends, the supporting screw is rotatably connected in the interior of the cleaning table on the two sides of the placing groove through a bearing, a transmission wheel is fixed at one end of the two supporting screws and connected through a belt transmission between the two transmission wheels, and the supporting screw extending to the outside of the cleaning table is fixed with a crank handle.
[0010] Preferably, a sliding groove is arranged in the interior of the cleaning table below the supporting screw, and a sliding block is symmetrically and slidably sleeved in the interior of the sliding groove.
[0011] Preferably, the two sliding blocks are arranged as horizontally placed convex shapes matched with the sliding groove, a protective rubber pad is glued and fixed on the bottom surface of the two elastic pressing plates, and the end of the two elastic pressing plates away from the sliding block is arranged as an upwardly inclined shape.
[0012] Compared with the prior art, the advantages and positive effects of the utility model lie in that:
[0013] 1、 in the utility model, through the cooperation of brushing and dust collection, when dusting, the dust on the surface of the integrated circuit board is loosened through brushing, so that the dust is conveniently sucked away, the cleaning is more rapid and efficient, the problem of limited cleaning effect and long time consumption of the existing dust removal mechanism for integrated circuit board testing is solved, the dust removal effect of the dust removal mechanism is improved, and the time required for dust removal is ensured.
[0014] 2、 in the utility model, through the movable elastic pressing plate, when cleaning, the integrated circuit board can be fixed, so that the integrated circuit board is placed more stably in the interior of the placing groove, and the size of the integrated circuit board can be adjusted, so that the application range of the dust removal mechanism is fully ensured. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 a three-dimensional structure schematic view of the dust removal mechanism for integrated circuit board testing is provided for the utility model;
[0016] Figure 2 a three-dimensional structure schematic view of the dust removal mechanism for integrated circuit board testing is provided for the utility model;
[0017] Figure 3 a structure schematic view of the dust removal mechanism for integrated circuit board testing when opened is provided for the utility model;
[0018] Figure 4The utility model provides a dust removal mechanism structure section view schematic drawing for integrated circuit board test.
[0019] Legend: 1, cleaning table; 2, moving cover plate; 3, electric push rod; 4, limiting rod; 5, placing groove; 6, wind box; 7, corrugated gas guide pipe; 8, dust collection box; 9, exhaust port; 10, moving plate; 11, cleaning brush; 12, support screw; 13, crank; 14, belt; 15, sliding groove; 16, sliding block; 17, elastic pressing plate; 18, protective rubber pad. DETAILED DESCRIPTION
[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further explained below in combination with drawings and examples.It should be explained that the example and the features in the example in the application can be combined mutually without conflict.
[0021] In the following description, a lot of specific details are set forth in order to fully understand the utility model, but the utility model can also be implemented in other ways different from the description, and therefore, the utility model is not limited to the specific example disclosed in the following description.
[0022] Example one
[0023] As Figures 1-4 shown, the utility model provides a dust removal mechanism for integrated circuit board test, including cleaning table 1 and moving cover plate 2, cleaning table 1 top is provided with moving cover plate 2, and cleaning table 1 rear side is symmetrically installed with electric push rod 3, and the output end of two electric push rods 3 is fixed in moving cover plate 2 bottom, and the middle part of cleaning table 1 top is provided with placing groove 5, and the top of moving cover plate 2 is provided with wind box 6, and the top of moving cover plate 2 is provided with corrugated gas guide pipe 7, and the both ends of corrugated gas guide pipe 7 are connected with moving cover plate 2 and wind box 6 inside through-penetration respectively, and the inside of wind box 6 below fan is inserted with dust collection box 8, and the one end of wind box 6 is provided with slot matched with dust collection box 8, and the inside of the one end of wind box 6 and dust collection box 8 away from slot is provided with exhaust port 9, and the inside of two exhaust ports 9 is fixed with filter screen, and the inside of placing groove 5 is slidably sleeved with moving plate 10, and the bottom of moving plate 10 is fixed with cleaning brush 11, and the both ends of moving plate 10 are threadedly sleeved with support screw 12, and support screw 12 is rotatably connected in the inside of cleaning table 1 on both sides of placing groove 5 through bearing, and the one end of two support screws 12 is fixed with transmission wheel, and the both sides of one support screw 12 extending to the outside of cleaning table 1 are fixed with crank 13 through belt 14 transmission connection.
[0024] The specific settings and effects of the embodiment are as follows: the four corners of the movable cover plate 2 are slidably sleeved with the limiting rods 4, the bottom surface of each limiting rod 4 is fixed on the top surface of the cleaning table 1, the four corners of the movable cover plate 2 are provided with sliding holes matched with the limiting rods 4, the inside of the movable cover plate 2 above the placing groove 5 is provided with an air inlet, the bottom of the corrugated air duct 7 is connected with the inside of the air inlet, when the fan is running, the airflow with dust can be sucked into the inside of the corrugated air duct 7, the inside of the cleaning table 1 in front of the placing groove 5 is provided with an air inlet window, the inside of the air inlet window is fixed with a dustproof filter screen, so as to avoid that the inhaled airflow brings dust and affects the normal dust removal of the integrated circuit board.
[0025] Embodiment two
[0026] As shown in Figures 1-4 the inside of the cleaning table 1 below the supporting screw rod 12 is provided with a sliding groove 15, the inside of the sliding groove 15 is symmetrically slidably sleeved with the sliding blocks 16, the two sliding blocks 16 are arranged as horizontally placed convex shapes matched with the sliding groove 15, the side of each sliding block 16 close to the inside of the placing groove 5 is fixed with the elastic pressing plate 17, the bottom surface of each elastic pressing plate 17 is glued and fixed with the protective rubber pad 18, and the end of each elastic pressing plate 17 away from the sliding block 16 is arranged as an upwardly inclined shape.
[0027] The effect of the whole embodiment is that the integrated circuit board placed in the placing groove 5 can be tightly fixed by the elasticity of the elastic pressing plate 17, so as to avoid that the integrated circuit board is adhered to the air inlet due to the suction force during dust removal, thereby protecting the integrated circuit board and ensuring the dust removal effect.
[0028] The method for using the device and the working principle are as follows: when the integrated circuit board needs to be cleaned, the integrated circuit board is placed in the placing groove 5, then the elastic pressing plate 17 is pulled to drive the sliding block 16 to slide in the sliding groove 15, the elastic pressing plate 17 is moved above the integrated circuit board, the elastic pressing plate 17 is released, the elastic pressing plate 17 drives the protective rubber pad 18 to abut against the top surface of the integrated circuit board under the action of the elasticity of the elastic pressing plate 17, so that the integrated circuit board is fixed in the placing groove 5, at this time, the electric push rod 3 drives the moving cover plate 2 to move downward, after the moving cover plate 2 is covered on the top surface of the cleaning table 1, the fan in the wind box 6 operates to draw air into the placing groove 5, so that the dust on the surface of the integrated circuit board is cleaned, at the same time, the handle 13 is rotated to drive the supporting screw 12 to rotate, under the drive of the transmission wheel and the belt 14, the two supporting screws 12 rotate at the same time, the moving plate 10 is driven to move, when the moving plate 10 moves, the cleaning brush 11 cleans the surface of the integrated circuit board, at the same time, the wind box 6 draws the air flow containing dust into the wind box 6, the air flow is filtered by the filter screen in the dust collecting box 8 and is discharged from the exhaust port 9, the dust collecting box 8 collects the dust in the dust collecting box 8, after the cleaning is completed, the electric push rod 3 drives the moving cover plate 2 to move upward, the supporting screw 12 is rotated to pull the elastic pressing plate 17, so that the supporting screw 12 and the elastic pressing plate 17 are dislocated from the integrated circuit board, then the integrated circuit board is taken out, when the dust collected in the dust collecting box 8 is more, the dust collecting box 8 is pulled out, the dust in the dust collecting box 8 is poured out, and then the dust collecting box 8 is inserted into the wind box 6 again.
[0029] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms, any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made on the basis of the technical essence of the present application to the above embodiments still belongs to the protection scope of the technical scheme of the present application.
Claims
1. A dust removal mechanism for testing integrated circuit boards, comprising a cleaning table (1) and a movable cover plate (2), characterized in that: The cleaning table (1) is provided with a movable cover plate (2) on its top surface. Electric push rods (3) are symmetrically installed on the rear side of the cleaning table (1). The output ends of the two electric push rods (3) are fixed on the bottom surface of the movable cover plate (2). A placement groove (5) is opened in the middle of the top surface of the cleaning table (1). A wind box (6) is provided on the top surface of the movable cover plate (2). A corrugated air guide pipe (7) is provided on the top of the movable cover plate (2). The two ends of the corrugated air guide pipe (7) are respectively connected to the inside of the movable cover plate (2) and the wind box (6). A fan with an air inlet facing the corrugated air guide pipe (7) is provided inside the wind box (6). A dust collection box (8) is inserted inside the wind box (6) below the fan. A movable plate (10) is slidably sleeved inside the placement groove (5). A cleaning brush (11) is fixed on the bottom surface of the movable plate (10).
2. The dust removal mechanism for integrated circuit board testing according to claim 1, characterized in that: The movable cover plate (2) is slidably fitted with limit rods (4) at each of its four corners. The bottom surface of each limit rod (4) is fixed to the top surface of the cleaning table (1). The movable cover plate (2) is provided with sliding holes that cooperate with the limit rods (4) at each of its four corners.
3. The dust removal mechanism for integrated circuit board testing according to claim 1, characterized in that: An air inlet is provided inside the movable cover plate (2) above the placement slot (5). The bottom of the corrugated air guide pipe (7) is connected to the inside of the air inlet. An air inlet window is provided inside the cleaning platform (1) on the front side of the placement slot (5). A dust filter is fixed inside the air inlet window.
4. The dust removal mechanism for integrated circuit board testing according to claim 1, characterized in that: The air box (6) has a slot at one end that matches the dust collection box (8). Both the air box (6) and the dust collection box (8) have exhaust ports (9) at the ends away from the slots. Both exhaust ports (9) have filters fixed inside them.
5. The dust removal mechanism for integrated circuit board testing according to claim 1, characterized in that: Both ends of the movable plate (10) are threaded with support screws (12). The support screws (12) are rotatably connected to the cleaning table (1) on both sides of the placement slot (5) through bearings. One end of each of the two support screws (12) is fixed with a transmission wheel. The two transmission wheels are connected by a belt (14). One of the support screws (12) extends to the outside of the cleaning table (1) and is fixed with a crank handle (13).
6. The dust removal mechanism for integrated circuit board testing according to claim 5, characterized in that: The cleaning table (1) below the support screw (12) has a sliding groove (15) inside. Slider (16) is symmetrically slidably connected inside the sliding groove (15). An elastic pressure plate (17) is fixed on the side of the slider (16) close to the inside of the placement groove (5).
7. A dust removal mechanism for testing integrated circuit boards according to claim 6, characterized in that: Both sliders (16) are configured as convex shapes placed laterally to cooperate with the slide groove (15). The bottom surfaces of both elastic pressure plates (17) are glued with protective pads (18). The ends of both elastic pressure plates (17) away from the sliders (16) are configured to be inclined upwards.