Surface polishing device for machining tungsten-copper alloy optical module chip base

Abstract

The utility model relates to a surface polishing device for machining a tungsten-copper alloy optical module chip base, and belongs to the technical field of chip machining. The surface polishing device comprises a base, a supporting frame is arranged above the base, the top end of the supporting frame is connected with a polishing machine, and the upper surface of the base is connected with a scrap collecting unit; according to the device, through cooperation of a scrap collecting cover, an air inlet groove, a scrap collecting groove, an adjusting block, a limiting groove and a first spring, scraps generated during polishing can be conveniently and rapidly collected, the scraps are prevented from splashing, the machining safety of operators is improved, the whole scrap collecting cover can be conveniently disassembled and assembled, maintenance is convenient, and the machining efficiency is improved. And through cooperation of a scrap collecting cover, a fixing piece, a positioning column, a positioning block, a positioning groove and an adjusting groove, the scrap collecting cover can be conveniently and rapidly disassembled and assembled, scraps can be conveniently cleaned and collected, and the blocking risk is reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip processing, and particularly relates to a surface polishing device for processing a tungsten-copper alloy optical module chip base. BACKGROUND

[0002] The tungsten-copper alloy optical module chip is a high-performance component used in the field of optical communication, and is usually used in an optical module as a key part for heat management, heat dissipation and mechanical support. The tungsten-copper alloy optical module chip combines the advantages of tungsten and copper, has excellent heat dissipation performance, strength and stability, and is suitable for application scenarios that need to work under high temperature and high power conditions.

[0003] During the processing of the tungsten-copper alloy optical module chip base, polishing the chip is an important step. During polishing, a large amount of debris is generated, which splashes and diffuses in the air, causing damage to the body of the worker. The existing equipment has poor debris cleaning and collecting effect, which affects the safety of the processing operation. Therefore, the application provides a surface polishing device for processing a tungsten-copper alloy optical module chip base. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the application is to provide a surface polishing device for processing a tungsten-copper alloy optical module chip base, which can solve the problems raised in the background art.

[0005] The technical solution adopted by the application is as follows:

[0006] A surface polishing device for processing a tungsten-copper alloy optical module chip base, comprising a base, a support frame arranged above the base, a polishing machine connected to the top end of the support frame, and a debris collecting unit connected to the upper surface of the base.

[0007] The debris collecting unit comprises a mounting seat, a debris collecting cover connected to the upper surface of the mounting seat, a plurality of debris collecting grooves arranged in a ring shape on the inner side wall of the debris collecting cover, a dust screen arranged on the inner bottom side of the mounting seat, two limiting columns connected to the two side surfaces of the debris collecting cover, and four connecting blocks connected to the outer surface of the mounting seat.

[0008] The application is further provided with an air inlet groove formed in the upper surface of the base, a processing table arranged on the upper surface of the base, and four fixing columns arranged on the outer side of the mounting seat.

[0009] The application is further provided with two positioning blocks arranged on the two side surfaces of the mounting seat, a fixing member connected to one side surface of each positioning block, a positioning column arranged at the bottom of the fixing member, two positioning grooves formed in the side surface of each positioning block corresponding to the positioning column, and an adjusting groove formed between the two positioning grooves.

[0010] The application is further provided that: the two side surfaces of the base are connected with guide columns, the outer surface of the guide column is connected with an adjusting block, the side surface of the adjusting block and the outer surface of the guide column are connected with a first spring, and a limiting groove is arranged on the side surface of the adjusting block and the corresponding position of the sliding path of the fixed column.

[0011] The application is further provided that: the side surface of the fixed part and the corresponding position of the sliding path of the limiting column are provided with a matched blocking rod, the outer diameter size of the debris collecting cover is matched with the inner diameter size of the mounting seat, the inner diameter size of the positioning groove is matched with the positioning column, and the inner diameter size of the adjusting groove is matched with the sliding path of the positioning column.

[0012] The application is further provided that: the inner diameter size of the limiting groove is matched with the sliding path of the fixed column, the inner diameter size of the connecting block is matched with the outer diameter size of the fixed column, and the mounting seat is connected with the base through the connecting block, the adjusting block and the fixed column.

[0013] The application achieves the following technical effects:

[0014] The surface polishing device for processing a tungsten-copper alloy optical module chip base can quickly collect the debris generated during polishing, prevent the debris from splashing, improve the processing safety of the operator, and facilitate the disassembly and assembly of the debris collecting cover for maintenance and improved debris processing effect.

[0015] The surface polishing device for processing a tungsten-copper alloy optical module chip base can quickly disassemble and assemble the debris collecting cover, facilitate the cleaning and collection of debris, and reduce the risk of blockage. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a structural schematic diagram of the application;

[0017] Figure 2 is a structural schematic diagram of the debris collecting unit in the application;

[0018] Figure 3 is a top view of the application;

[0019] Figure 4 is an A-A sectional view in the application Figure 3 ;

[0020] Figure 5 is an exploded structural schematic diagram of the application;

[0021] Figure 6The enlarged view of A in the present application Figure 5

[0022] In the figure: 1, base; 11, air inlet slot; 12, processing table; 13, fixed column; 14, guide column; 15, adjusting block; 16, limiting groove; 17, first spring; 2, support frame; 3, polishing machine; 31, polishing head; 4, debris collection unit; 41, mounting seat; 42, debris collection cover; 43, debris collection groove; 44, dust screen; 45, connecting block; 46, limiting column; 47, fixing piece; 48, positioning column; 49, blocking rod; 401, positioning block; 402, positioning groove; 403, adjusting groove; DETAILED DESCRIPTION

[0023] In order to make the purpose and advantages of the present application more clear, the present application is specifically described below in combination with examples. It should be understood that the following text is only used to describe one or several specific embodiments of the present application, and does not strictly limit the scope of protection specifically requested by the present application.

[0024] As Figures 1-4 shown, the utility model provides a kind of surface polishing device technical scheme of processing tungsten copper alloy optical module chip base, including base 1, the upper portion of base 1 is provided with support frame 2, the top of support frame 2 is connected with polishing machine 3, the upper surface of base 1 is connected with debris collection unit 4, debris collection unit 4 includes mounting seat 41, the upper surface of mounting seat 41 is connected with debris collection cover 42, the inner side wall of debris collection cover 42 is annularly provided with multiple debris collection grooves 43, the inner bottom side of mounting seat 41 is provided with dust screen 44, the both side surfaces of debris collection cover 42 are connected with two limiting columns 46, the outer surface of mounting seat 41 is connected with four connecting blocks 45.

[0025] As Figures 1-5 shown, the upper surface of base 1 is provided with air inlet slot 11, the upper surface of base 1 is provided with processing table 12, the upper surface of base 1 and the outside of mounting seat 41 are provided with four fixed columns 13, the both side surfaces of base 1 are connected with guide column 14, the outer surface of guide column 14 is connected with adjusting block 15, the side of adjusting block 15 and the outer surface of guide column 14 are connected with first spring 17, the side of adjusting block 15 and the corresponding place of sliding path of fixed column 13 are provided with limiting groove 16, the inner diameter size of limiting groove 16 is matched with the sliding path of fixed column 13, the inner diameter size of connecting block 45 is matched with the outer diameter size of fixed column 13, mounting seat 41 is connected with base 1 by connecting block 45 and adjusting block 15 and fixed column 13, it needs to be explained that the cooperation of adjusting block 15 and limiting groove 16 and connecting block 45 can facilitate the quick disassembly between base 1 and mounting seat 41, facilitate the cleaning maintenance of debris collection cover 42, ensure the smooth collection of debris, prevent debris from scattering. ​

[0026] As Figures 3-6 shown, the two side surfaces of the mounting seat 41 are each provided with two positioning blocks 401, one side surface of each of the positioning blocks 401 is connected with a fixing piece 47, the bottom of the fixing piece 47 is provided with a positioning column 48, the side surface of each of the positioning blocks 401 is provided with two positioning grooves 402 corresponding to the positioning column 48, an adjusting groove 403 is provided between the two positioning grooves 402, a stop rod 49 is provided on the side surface of the fixing piece 47 corresponding to the sliding path of the limiting column 46, the outer diameter of the debris collecting cover 42 is adapted to the inner diameter of the mounting seat 41, the inner diameter of the positioning groove 402 is adapted to the positioning column 48, the inner diameter of the adjusting groove 403 is adapted to the sliding path of the positioning column 48, it should be noted that the cooperation of the fixing piece 47, the positioning column 48 and the stop rod 49 can facilitate the quick disassembly of the debris collecting cover 42 and the mounting seat 41, facilitate the collection and processing of debris, and prevent the debris collecting cover 42 from being blocked.

[0027] The working principle of the present application is as follows: the base is placed on the surface of the machining table 12, the base is polished by the polishing machine 3 and the polishing head 31, the debris collecting groove 43 collects debris, the debris enters the debris collecting cover 42 and is blocked by the dust screen 44, and the collection of debris is completed. During maintenance, the adjusting block 15 is slid along the outer surface of the guide column 14, the first spring 17 is compressed, the adjusting block 15 is separated from the fixed column 13, the mounting seat 41 is lifted upward, the connecting block 45 is separated from the fixed column 13, and the debris collecting cover 42 can be disassembled and maintained.

[0028] The two fixing pieces 47 are slid to the two sides, the limiting column 46 is slid along the positioning groove 402, the limiting column 46 is slid into another positioning groove 402 along the adjusting groove 403, the fixing piece 47 is separated from the limiting column 46, and the debris collecting cover 42 and the mounting seat 41 can be separated, and the debris can be cleaned.

[0029] The above is only the preferred embodiment of the present application, it should be pointed out that for ordinary skilled in the art, without departing from the principle of the present application, a number of improvements and refinements can be made, these improvements and refinements should be considered as the protection scope of the present application. The structures, devices and operation methods not specifically described and explained in the present application, such as no special description and limitation, are implemented according to the conventional means in the art.

Claims

1. A surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates, characterized in that: Includes a base (1): a support frame (2) is provided above the base (1), a polishing machine (3) is connected to the top of the support frame (2), and a debris collection unit (4) is connected to the upper surface of the base (1). The debris collection unit (4) includes a mounting base (41), the upper surface of which is connected to a debris collection cover (42). The inner sidewall of the debris collection cover (42) is provided with a plurality of debris collection grooves (43) in a ring shape. A dustproof net (44) is provided on the inner bottom side of the mounting base (41). Two limiting posts (46) are connected to both sides of the debris collection cover (42). Four connecting blocks (45) are connected to the outer surface of the mounting base (41).

2. The surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates according to claim 1, characterized in that: The upper surface of the base (1) is provided with an air inlet groove (11), the upper surface of the base (1) is provided with a processing table (12), and the upper surface of the base (1) and the outside of the mounting base (41) are provided with four fixing columns (13).

3. The surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates according to claim 1, characterized in that: The mounting base (41) has two positioning blocks (401) on both sides. Each positioning block (401) has a fixing member (47) connected to one side. The fixing member (47) has a positioning post (48) at the bottom. Each positioning block (401) has two positioning grooves (402) corresponding to the positioning post (48). An adjustment groove (403) is provided between the two positioning grooves (402).

4. The surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates according to claim 1, characterized in that: Guide posts (14) are connected to both sides of the base (1). An adjustment block (15) is connected to the outer surface of the guide post (14). A first spring (17) is connected to one side of the adjustment block (15) and located on the outer surface of the guide post (14). A limit groove (16) is opened at the corresponding position of the sliding path of the fixed post (13) on one side of the adjustment block (15).

5. The surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates according to claim 3, characterized in that: A stop bar (49) is provided on one side surface of the fixing member (47) at the corresponding position of the sliding path of the limiting post (46). The outer diameter of the debris collection cover (42) is adapted to the inner diameter of the mounting base (41). The inner diameter of the positioning groove (402) is adapted to the positioning post (48). The inner diameter of the adjusting groove (403) is adapted to the sliding path of the positioning post (48).

6. The surface polishing apparatus for processing tungsten-copper alloy optical module chip substrates according to claim 4, characterized in that: The inner diameter of the limiting groove (16) is adapted to the sliding path of the fixed column (13), the inner diameter of the connecting block (45) is adapted to the outer diameter of the fixed column (13), and the mounting base (41) is connected to the base (1) through the connecting block (45), the adjusting block (15) and the fixed column (13).

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