Wafer oxidation high-temperature diffusion furnace tube

Abstract

The utility model discloses a wafer oxidation high-temperature diffusion furnace tube, which relates to the technical field of wafers and comprises a furnace tube body, a control box is arranged on one side of one end of the furnace tube body, a feeding box is arranged at the center of one end of the furnace tube body in a penetrating manner, and a first closing plate is mounted at the upper end of the feeding box. A connecting plate is mounted on one side of the feeding box, a mounting plate is mounted on the other side of one end of the control box, and an electric push rod is arranged at one end of the mounting plate; a lifting plate is mounted at the position, close to the upper end, in the furnace tube body; compared with the prior art, the wafer oxidation high-temperature diffusion furnace tube has the advantages that the wafer placed in the furnace tube body can be flattened, gas can be in contact with the wafer from the two sides and the center, the oxidation diffusion efficiency of the wafer is improved, the wafer after oxidation diffusion can be pushed out by the wafer oxidation high-temperature diffusion furnace tube, and the wafer oxidation high-temperature diffusion furnace tube is suitable for large-scale production. The collection is convenient.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, specifically to a high-temperature diffusion furnace tube for wafer oxidation. Background Technology

[0002] High-temperature diffusion furnace tubes for wafer oxidation are an important component in the semiconductor equipment field. They are mainly used for oxidation, diffusion and other processes of semiconductor wafers at high temperatures.

[0003] Publication number CN205635862U discloses a high-temperature diffusion furnace tube for wafer oxidation. This utility model has a novel structural design, employing two asymmetrically arranged air inlets to ensure that the incoming gas is distributed on the upper and lower parts of the wafer. A gas equalization device is installed at each air inlet, comprising multiple gas equalization layers and a microporous material layer. The multiple gas equalization layers are staggered to ensure uniform gas flow. The microporous material layer further evenly distributes the gas, ensuring uniformity of the gas entering the inner cavity and improving the uniformity of wafer oxidation. However, this device only introduces gas from both sides of the furnace tube, resulting in slow wafer oxidation diffusion in the middle of the furnace tube. Furthermore, after the wafer is placed in the furnace tube, it generally accumulates in one place, leading to uneven overall distribution and low overall efficiency. Therefore, we propose a high-temperature diffusion furnace tube for wafer oxidation. Utility Model Content

[0004] The purpose of this invention is to provide a high-temperature diffusion furnace tube for wafer oxidation.

[0005] To address the problems mentioned in the background art, this utility model provides the following technical solution: a high-temperature diffusion furnace tube for wafer oxidation, comprising a furnace tube body, a control box disposed on one side of one end of the furnace tube body, a feed box penetrating through the center of one end of the furnace tube body, a first sealing plate mounted on the upper end of the feed box, a connecting plate mounted on one side of the feed box, and an mounting plate mounted on the other side of one end of the control box, with an electric push rod disposed on one end of the mounting plate; a lifting plate is installed inside the furnace tube body near the upper end, and a connecting plate is mounted on one side of the upper end of the lifting plate. The furnace tube body is equipped with a first sliding rod, and a first screw is installed on the other side of the upper end of the lifting plate. A gear cylinder and a first stepper motor are respectively installed on one side of the upper end of the furnace tube body. A gear is installed at the lower end of the first stepper motor. A first air inlet pipe is installed through the center of the upper end of the furnace tube body. A gas disperser is installed at one end of the first air inlet pipe. A second air inlet pipe is installed on both sides of the gas disperser. A first air outlet and a second air outlet are respectively installed at the lower ends of the gas disperser and the second air inlet pipe. A filter plate is installed at the lower ends of both the first air outlet and the second air outlet.

[0006] Preferably, the lifting plate is slidably connected to the furnace tube body, and the lifting plate is fixedly connected to the first sliding rod.

[0007] Preferably, both the first slide rod and the first screw pass through the furnace tube body, and the first slide rod is slidably connected to the furnace tube body.

[0008] Preferably, the furnace tube body is slidably connected to the gear cylinder, and the gear cylinder is meshed with the gear.

[0009] Preferably, a second stepper motor is provided on one side of the furnace tube body, a push plate is installed on one side inside the furnace tube body, and moving blocks are installed on both sides of the upper end of the push plate. A second screw is installed at one end of the second stepper motor, and side plates are installed at both ends of one side of the push plate. A second sealing plate is installed on the inner wall of the side plate, and a second sliding rod is provided through one end of one of the moving blocks.

[0010] Preferably, the second screw passes through the movable block, and both the second screw and the second slide are slidably connected to the movable block.

[0011] Preferably, the side plate is fixedly connected to the second sealing plate, and both the second sealing plate and the push plate are slidably connected to the furnace tube body.

[0012] By adopting the above technical solution, the lifting plate can be raised and lowered inside the furnace tube body through the cooperation of the first stepper motor, gear, gear cylinder and first screw, and can flatten the wafer to make the wafer distribution uniform. Then, through the cooperation of the first air inlet pipe, gas diffuser, second air inlet pipe, first air outlet, second air outlet and filter plate, gas can enter from the center and sides of the lifting plate, so that the wafer oxidation high temperature diffusion furnace tube can flatten the wafer placed inside the furnace tube body, and can make the gas contact the wafer from the sides and the center, thereby improving the wafer oxidation diffusion efficiency.

[0013] By adopting the above technical solution, the pusher plate can push the side plate and the second sealing plate to one side through the cooperation of the second stepper motor, the second screw and the moving block, thereby pushing out the wafer that has completed oxidation and diffusion inside the side plate. Furthermore, the movement of the pusher plate is made more stable through the cooperation of the second slide bar, so that the wafer oxidation high-temperature diffusion furnace tube can push out the wafer after oxidation and diffusion, which is convenient for collection. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure in an embodiment of the present utility model;

[0015] Figure 2 This is a cross-sectional view of an embodiment of the present utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the furnace tube body in an embodiment of this utility model;

[0017] Figure 4 This is a schematic diagram of the connection structure between the second stepper motor and the moving block in an embodiment of this utility model.

[0018] In the diagram: 1. Furnace tube body; 2. Control box; 3. Feed box; 4. First sealing plate; 5. Connecting plate; 6. Mounting plate; 7. Electric push rod; 8. Lifting plate; 9. First slide rod; 10. First screw; 11. Gear cylinder; 12. Gear; 13. First stepper motor; 14. First air inlet pipe; 15. Gas disperser; 16. Second air inlet pipe; 17. First air outlet; 18. Second air outlet; 19. Filter plate; 20. Second stepper motor; 21. Push plate; 22. Second screw; 23. Side plate; 24. Second sealing plate; 25. Second slide rod; 26. Moving block. Detailed Implementation

[0019] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1:

[0021] Please see Figure 1-4 This utility model provides a technical solution: a high-temperature diffusion furnace tube for wafer oxidation, comprising a furnace tube body 1, a control box 2 disposed on one side of one end of the furnace tube body 1, a feed box 3 penetrating through the center of one end of the furnace tube body 1, a first sealing plate 4 installed on the upper end of the feed box 3, a connecting plate 5 installed on one side of the feed box 3, an mounting plate 6 installed on the other side of one end of the control box 2, and an electric push rod 7 disposed on one end of the mounting plate 6; a lifting plate 8 is installed inside the furnace tube body 1 near the upper end, a first sliding rod 9 is installed on one side of the upper end of the lifting plate 8, and an electric push rod 7 is installed on the other side of the upper end of the lifting plate 8. The furnace tube body 1 is equipped with a first screw 10. A gear cylinder 11 and a first stepper motor 13 are respectively installed on one side of the upper end of the furnace tube body 1. A gear 12 is installed at the lower end of the first stepper motor 13. A first air inlet pipe 14 is installed through the center of the upper end of the furnace tube body 1. A gas disperser 15 is installed at one end of the first air inlet pipe 14. A second air inlet pipe 16 is installed on both sides of the gas disperser 15. A first air outlet 17 and a second air outlet 18 are respectively installed at the lower ends of the gas disperser 15 and the second air inlet pipe 16. A filter plate 19 is installed at the lower ends of the first air outlet 17 and the second air outlet 18.

[0022] The lifting plate 8 is slidably connected to the furnace tube body 1, and the lifting plate 8 is fixedly connected to the first sliding rod 9.

[0023] Both the first slide rod 9 and the first screw 10 pass through the furnace tube body 1, and the first slide rod 9 is slidably connected to the furnace tube body 1.

[0024] The furnace tube body 1 is slidably connected to the gear cylinder 11, and the gear cylinder 11 is meshed with the gear 12.

[0025] Specifically, the electric push rod 7 is activated via control box 2, causing it to push the feed box 3 into the furnace tube body 1 via connecting plate 5. The feed box 3 stops when one end reaches the center of the furnace tube body 1. Then, the first sealing plate 4 is opened, and the wafer is fed into the furnace tube body 1 through the feed box 3, falling to the center of the furnace tube body 1. The electric push rod 7 is activated again via control box 2, pulling the feed box 3 back to its original position and returning the first sealing plate 4 to its original position. Then, the first stepper motor 13 is activated via control box 2, causing it to drive the gear 12 to rotate. The gear 12 then drives the gear cylinder 11, which meshes with it, to rotate. The gear cylinder 11 drives the first screw 10 to push the lifting plate 8 down inside the furnace tube body 1. As the lifting plate 8 descends, it pulls the first sliding rod 9 to slide within the furnace tube body 1, and also drives the air... The gas diffuser 15 descends together. When the lifting plate 8 contacts the wafer inside the furnace tube body 1, it will squeeze the wafer to both sides. When the wafer is evenly distributed inside the furnace tube body 1, it stops. Then, gas is injected into the gas diffuser 15 through the first gas inlet pipe 14. The gas diffuser 15 will then transmit the gas to the first gas outlet 17 and through the second gas inlet pipe 16 to the second gas outlet 18, so that the gas is discharged through the first gas outlet 17 and the second gas outlet 18, making the gas evenly dispersed. At the same time, the sealing space formed by the lifting plate 8 and the side plate 23 is small, which improves the oxidation diffusion efficiency of the crystal. After the crystal oxidation diffusion is completed, the first stepper motor 13 is started by the control box 2 to return to the original position, so that the wafer oxidation high temperature diffusion furnace tube can flatten the wafer placed inside the furnace tube body 1, and the gas can contact the wafer from both sides and the center, improving the oxidation diffusion efficiency of the wafer.

[0026] Example 2:

[0027] Please see Figure 1-4 This utility model provides a technical solution: a high-temperature diffusion furnace tube for wafer oxidation, wherein a second stepper motor 20 is provided on one side of the furnace tube body 1, a pusher plate 21 is installed on one side inside the furnace tube body 1, and moving blocks 26 are installed on both sides of the upper end of the pusher plate 21. A second screw 22 is installed on one end of the second stepper motor 20, and side plates 23 are installed on both ends of one side of the pusher plate 21. A second sealing plate 24 is installed on the inner wall of the side plate 23, and a second sliding rod 25 is provided through one end of the moving block 26 on one side.

[0028] The second screw 22 passes through the movable block 26, and both the second screw 22 and the second slide bar 25 are slidably connected to the movable block 26.

[0029] The side plate 23 is fixedly connected to the second sealing plate 24, and both the second sealing plate 24 and the push plate 21 are slidably connected to the furnace tube body 1.

[0030] Specifically, after the wafer oxidation diffusion is complete, the second stepper motor 20 is started by the control box 2, which drives the second screw 22 to rotate. When the second screw 22 rotates, it drives the moving block 26 to move the push plate 21 to one side inside the furnace tube body 1. The moving block 26 slides on the second slide rod 25. When the push plate 21 moves, it pushes the wafer that has completed oxidation diffusion inside the side plate 23 to move together. Then the side plate 23 slides on the furnace tube body 1 and drives the second sealing plate 24 to slide out, so that the second sealing plate 24 disappears from the furnace tube body 1. When the push plate 21 contacts the other side of the furnace tube body 1, the push plate 21 pushes out the wafer that has completed oxidation diffusion. After pushing out, the second stepper motor 20 is started again by the control box 2, so that the push plate 21 returns to its original position. This allows the high-temperature wafer oxidation diffusion furnace tube to push out the wafer that has completed oxidation diffusion for easy collection.

[0031] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A high-temperature diffusion furnace tube for wafer oxidation, comprising a furnace tube body (1), characterized in that: A control box (2) is provided on one side of one end of the furnace tube body (1), and a feed box (3) is provided through the center of one end of the furnace tube body (1). A first sealing plate (4) is installed on the upper end of the feed box (3), and a connecting plate (5) is installed on one side of the feed box (3). An installation plate (6) is installed on the other side of one end of the control box (2), and an electric push rod (7) is provided on one end of the installation plate (6). A lifting plate (8) is installed near the upper end inside the furnace tube body (1). A first sliding rod (9) is installed on one side of the upper end of the lifting plate (8), and a first screw (10) is installed on the other side of the upper end of the lifting plate (8). A gear cylinder (11) and a first stepper motor (13) are respectively provided on one side of the upper end of the furnace tube body (1). A gear (12) is installed at the lower end of the first stepper motor (13). A first air inlet pipe (14) is provided through the center of the upper end of the furnace tube body (1). A gas disperser (15) is installed at one end of the first air inlet pipe (14). A second air inlet pipe (16) is installed on both sides of the gas disperser (15). A first air outlet (17) and a second air outlet (18) are respectively installed at the lower ends of the gas disperser (15) and the second air inlet pipe (16). A filter plate (19) is installed at the lower ends of the first air outlet (17) and the second air outlet (18).

2. The wafer oxidation high-temperature diffusion furnace tube according to claim 1, characterized in that: The lifting plate (8) is slidably connected to the furnace tube body (1), and the lifting plate (8) is fixedly connected to the first slide rod (9).

3. The wafer oxidation high-temperature diffusion furnace tube according to claim 2, characterized in that: The first slide rod (9) and the first screw (10) both pass through the furnace tube body (1), and the first slide rod (9) is slidably connected to the furnace tube body (1).

4. The wafer oxidation high-temperature diffusion furnace tube according to claim 3, characterized in that: The furnace tube body (1) is slidably connected to the gear cylinder (11), and the gear cylinder (11) is meshed with the gear (12).

5. The wafer oxidation high-temperature diffusion furnace tube according to claim 4, characterized in that: A second stepper motor (20) is provided on one side of the furnace tube body (1). A pusher plate (21) is installed on one side inside the furnace tube body (1). Movable blocks (26) are installed on both sides of the upper end of the pusher plate (21). A second screw (22) is installed at one end of the second stepper motor (20). Side plates (23) are installed at both ends of one side of the pusher plate (21). A second sealing plate (24) is installed on the inner wall of the side plate (23). A second slide rod (25) is provided through one end of the movable block (26) on one side.

6. The wafer oxidation high-temperature diffusion furnace tube according to claim 5, characterized in that: The second screw (22) passes through the moving block (26), and both the second screw (22) and the second slide (25) are slidably connected to the moving block (26).

7. The wafer oxidation high-temperature diffusion furnace tube according to claim 5, characterized in that: The side plate (23) is fixedly connected to the second sealing plate (24), and the second sealing plate (24) and the push plate (21) are both slidably connected to the furnace tube body (1).

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