Device for detecting potential difference between high and low sections of CPU (Central Processing Unit) heat dissipation plate

Abstract

The utility model relates to a high-low section potential difference detection device of a CPU heat dissipation plate, the high-low section potential difference detection device of the CPU heat dissipation plate comprises a main body, a fixing block, a supporting block and a detection mechanism, the fixing block is fixedly arranged on the main body, the supporting block is arranged on the fixing block, and one end, far away from the fixing block, of the supporting block is clamped with a CPU mounting groove; the detection mechanism comprises a moving block, a detection block, a moving assembly and a detection assembly, the moving block is arranged on the main body in a sliding mode through the moving assembly, the detection block is arranged on the moving block, and the section of the detection block is gradually reduced in the direction away from the moving block; and the detection assembly is arranged on the moving block. The method has the effect of ensuring the accuracy of the detection result.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of detection devices, in particular to a high-low section difference detection device for a CPU heat dissipation plate. BACKGROUND

[0002] Reference Figure 1 The CPU heat dissipation plate 1 is usually made of aluminum or copper, one side of the CPU heat dissipation plate 1 is provided with a CPU mounting groove 11, and the other side is provided with a copper pipe mounting groove 12 in communication with the CPU mounting groove 11. If the high-low section difference between the groove bottom of the CPU mounting groove 11 and the groove bottom of the copper pipe mounting groove 12 is low, the CPU and the heat dissipation copper pipe will be excessively abutted, which will affect the installation effect of the CPU or the heat dissipation copper pipe. If the high-low section difference between the groove bottom of the CPU mounting groove 11 and the groove bottom of the copper pipe mounting groove 12 is high, the contact effect between the CPU and the heat dissipation copper pipe will be reduced, which will affect the CPU heat dissipation.

[0003] After the production of the CPU heat dissipation plate 1, the high-low section difference of the CPU heat dissipation plate 1 is usually detected by a laser ranging method. During detection, the CPU heat dissipation plate 1 is first placed below a laser ranging device. The laser ranging device first measures the depth of the CPU mounting groove 11 or the copper pipe mounting groove 12. Then the CPU heat dissipation plate 1 is turned over to measure the depth of the copper pipe mounting groove 12 or the CPU mounting groove 11. Then the high-low section difference of the CPU heat dissipation plate 1 is obtained according to the measured data.

[0004] When a large number of CPU heat dissipation plates 1 are measured, the operator may forget to turn over the CPU heat dissipation plate 1, which will cause problems in the detection result. Practical new type content

[0005] In order to ensure the accuracy of the detection result, the application provides a high-low section difference detection device for a CPU heat dissipation plate.

[0006] The application provides a high-low section difference detection device for a CPU heat dissipation plate, which adopts the following technical scheme:

[0007] A high-low section difference detection device for a CPU heat dissipation plate, comprising a main body, a fixed block, a supporting block and a detection mechanism, the fixed block is fixedly arranged on the main body, the supporting block is arranged on the fixed block, and the end of the supporting block away from the fixed block is connected with the CPU mounting groove; the detection mechanism comprises a moving block, a detection block, a moving assembly and a detection assembly, the moving block is slidably arranged on the main body through the moving assembly, the detection block is arranged on the moving block, and the cross section of the detection block gradually decreases in the direction away from the moving block; the detection assembly is arranged on the moving block.

[0008] By adopting the technical scheme, the CPU mounting groove of the CPU heat sink plate is clamped with the supporting block, then the moving assembly drives the moving block to move towards the supporting block, so that the detection block and the detection assembly detect the CPU heat sink plate; the detection device is set without the need of the operator to turn over the CPU heat sink plate, the phenomenon of forgetting to turn over the CPU heat sink plate is reduced, and thus the accuracy of the detection result is ensured.

[0009] Optionally, the detection assembly comprises a follower block, a PIN needle and a sensor, the follower block is arranged on the moving block, and the PIN needle is arranged on the follower block; and the sensor is arranged on the main body.

[0010] By adopting the technical scheme, when the sensor detects the PIN needle, the end of the detection block away from the moving block is located in the copper pipe mounting groove, which indicates that the CPU heat sink plate is qualified; and when the sensor does not detect the PIN needle, it indicates that the CPU heat sink plate is unqualified.

[0011] Optionally, the moving assembly comprises a first connecting ring, a second connecting ring, a spring and a connecting bolt, the first connecting ring and the second connecting ring are arranged at two ends of the spring respectively, the connecting bolt is connected to the moving block, the first connecting ring is sleeved on the connecting bolt, the second connecting ring is connected to the main body, and the spring is always in a deformed state; and the main body is provided with a blocking assembly connected with the follower block.

[0012] By adopting the technical scheme, before the CPU heat sink plate is detected, the blocking assembly blocks the follower block, so that the moving block does not move; when the CPU heat sink plate is detected, the blocking mechanism is first blocked from the follower block, the elastic deforming force of the spring drives the moving block to move, the moving block drives the follower block to move, the follower block drives the PIN needle to move, and the sensor can detect the PIN needle.

[0013] Optionally, the blocking assembly comprises a first air cylinder and a blocking block, the first air cylinder is arranged on the main body, and the blocking block is arranged on the first air cylinder and can abut against the follower block.

[0014] By adopting the technical scheme, when the CPU heat sink plate is detected, the first air cylinder is started to drive the blocking block to move, so that the blocking block no longer abuts against the follower block, and thus the moving block drives the follower block to move towards the fixed block; when the detection of the CPU heat sink plate is completed, the first air cylinder is started to drive the blocking block to move the follower block, the follower block drives the moving block to move away from the fixed block, and the detection block is separated from the CPU heat sink plate.

[0015] Optionally, the main body is provided with a pressing mechanism, the pressing mechanism comprises a first connecting block, a second connecting block, a pressing block, a fixing bolt and a lifting assembly, the first connecting block is slidably arranged on the main body through the lifting assembly, a first through hole is formed in the first connecting block, the pressing block is arranged on the second connecting block, and one end of the pressing block away from the second connecting block penetrates through the first through hole of the first connecting block, and the pressing block can abut against the CPU heat sink; and the fixing bolt is threadedly connected with the second connecting block and the first connecting block.

[0016] By adopting the above technical scheme, when the CPU mounting groove is clamped with the supporting block, the lifting assembly is started, the first connecting block is driven to move, the second connecting block on the first connecting block drives the pressing block to move, and the pressing block abuts against the CPU heat sink; the pressing mechanism arranged can improve the stability of the CPU heat sink during detection, thereby ensuring the accuracy of the detection result.

[0017] Optionally, the lifting assembly comprises a stand, a fixed plate, a second cylinder and a lifting block, the stand is arranged on the main body, the fixed plate is arranged at one end of the stand away from the main body, the second cylinder is arranged on the fixed plate, the lifting block is arranged on the piston rod of the second cylinder, and the first connecting block is arranged on the lifting block.

[0018] By adopting the above technical scheme, the second cylinder is started, the piston rod of the second cylinder drives the lifting block to move, the lifting block drives the first connecting block to move, and the second connecting block on the first connecting block drives the pressing block to move; the lifting assembly arranged has a simple structure and is convenient to operate.

[0019] Optionally, the fixed block is provided with a limiting mechanism, the limiting mechanism comprises a plurality of limiting pins, the plurality of limiting pins form a limiting space on the main body, the fixed block is located in the limiting space, and the second connecting ring is sleeved on one of the limiting pins.

[0020] By adopting the above technical scheme, when the CPU mounting groove is clamped with the supporting block, the CPU heat sink is located in the limiting space, and the plurality of limiting pins abut against the CPU heat sink, so that the CPU heat sink can be better clamped with the supporting block, and the adjustment time is reduced.

[0021] Optionally, the main body is provided with an adjusting mechanism, the adjusting mechanism comprises a third connecting block, an adjusting block and an adjusting assembly, the third connecting block is arranged on the main body, and the adjusting block is slidably arranged on the third connecting block through the adjusting assembly; the limiting pins except the second connecting ring are arranged on the adjusting block, a second through hole is formed in the main body, and one end of the limiting pins away from the adjusting block penetrates through the second through hole.

[0022] By adopting the above technical solution, after the CPU heatsink is tested, the adjustment component is activated. The adjustment component drives the adjustment block to move, so that the adjustment block's limiting pin moves downward. This reduces the safety hazards to the operator when the operator picks up the tested CPU heatsink.

[0023] Optionally, the adjustment assembly includes an adjustment motor, an adjustment gear, an adjustment rod, and an adjustment rack. The adjustment motor is mounted on the third connecting block, and the adjustment gear is keyed to the adjustment motor. The adjustment rod is slidably mounted on the third connecting block and connected to the adjustment block, and the adjustment rack is mounted on the adjustment rod and meshes with the adjustment gear.

[0024] By adopting the above technical solution, the output shaft on the motor drives the adjusting gear to rotate, the adjusting rack meshing with the adjusting gear drives the adjusting rod to move, and the adjusting rod drives the adjusting block to move; the set adjusting component has a simple structure and is easy to operate.

[0025] In summary, this application includes at least one of the following beneficial technical effects:

[0026] 1. The detection device eliminates the need for operators to flip the CPU heatsink, reducing the likelihood of forgetting to flip it and thus ensuring the accuracy of the test results;

[0027] 2. The downward pressure mechanism can improve the stability of the CPU heatsink during testing, thereby ensuring the accuracy of the test results. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of a CPU heatsink in the prior art;

[0029] Figure 2 This is a schematic diagram of the structure of the CPU heatsink height difference detection device in the embodiments of this application;

[0030] Figure 3 This is a schematic diagram of the structure of the testing mechanism in the embodiments of this application;

[0031] Figure 4 This is a schematic diagram of the blocking component in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the adjustment mechanism in the embodiments of this application;

[0033] Figure 6 This is a schematic diagram of the lifting component in an embodiment of this application;

[0034] Figure 7 This is a schematic diagram of the structure of the mobile component in an embodiment of this application.

[0035] Fig. 1, CPU heat sink; 11, CPU mounting slot; 12, copper pipe mounting slot; 21, main body; 22, fixed block; 23, support block; 3, detection mechanism; 31, moving block; 32, detection block; 33, moving assembly; 331, first connecting ring; 332, second connecting ring; 333, spring; 334, connecting bolt; 341, follow-up block; 342, PIN pin; 343, sensor; 35, blocking assembly; 351, first air cylinder; 352, blocking block; 36, slide rail; 4, pressing mechanism; 41, first connecting block; 411, first through hole; 42, second connecting block; 43, pressing block; 44, fixing bolt; 45, lifting assembly; 451, stand column; 452, fixed plate; 453, second air cylinder; 454, lifting block; 5, limiting needle; 6, adjusting mechanism; 61, third connecting block; 62, adjusting block; 63, adjusting assembly; 631, adjusting motor; 632, adjusting gear; 633, adjusting rod; 634, adjusting rack; 71, rack; 72, sliding frame; 73, adjusting assembly; 731, adjusting motor; 732, adjusting screw. DETAILED DESCRIPTION

[0036] The following will be described in detail in combination with the accompanying drawings Figures 2-7 The application is further described in detail.

[0037] The embodiment of the application discloses a high-low section difference detection device of a CPU heat sink.

[0038] Reference Figure 2 A high-low section difference detection device of a CPU heat sink, comprising a rack 71, a sliding frame 72 is slidably connected to the rack 71, and a main body 21 is clamped to the sliding frame 72; and an adjusting assembly 73 is arranged on the rack 71 and connected with the main body 21.

[0039] Reference Figure 2 The adjusting assembly 73 comprises an adjusting screw 732, the adjusting screw 732 penetrates through the sliding frame 72 and is threadedly connected with the sliding frame 72; an adjusting motor 731 is fixedly connected to the rack 71, and an output shaft of the adjusting motor 731 is connected with one end of the adjusting screw 732.

[0040] The adjusting motor 731 is started, the output shaft of the adjusting motor 731 drives the adjusting screw 732 to rotate, the adjusting screw 732 drives the sliding frame 72 to move, and the sliding frame 72 drives the main body 21 to move. In this way, the position of the main body 21 relative to the rack 71 can be adjusted according to the work habit of an operator.

[0041] Reference Figure 2 and Figure 3The main body 21 is fixedly connected with a fixed block 22, the fixed block 22 is fixedly connected with a supporting block 23, and the CPU mounting groove 11 on the CPU heat dissipation plate 1 is clamped with the supporting block 23; the main body 21 is provided with a pressing mechanism 4 for pressing the CPU heat dissipation plate 1; and the main body 21 is provided with a detection mechanism 3.

[0042] With reference to Figure 4 and Figure 5 The main body 21 is provided with a limiting mechanism, the limiting mechanism comprises a plurality of limiting needles 5, the plurality of limiting needles 5 form a limiting space on the main body 21, and the fixed block 22 is located in the limiting space; when the CPU mounting groove 11 is clamped with the supporting block 23, the plurality of limiting needles 5 all abut against the CPU heat dissipation plate 1.

[0043] A plurality of second through holes are formed in the main body 21, the main body 21 is provided with an adjusting mechanism 6, the adjusting mechanism 6 comprises a third connecting block 61 fixedly connected with the main body 21, and the third connecting block 61 is located on the side of the main body 21 away from the fixed block 22. The third connecting block 61 is provided with an adjusting assembly 63, the adjusting assembly 63 comprises an adjusting motor 631 fixedly connected with the third connecting block 61, and an adjusting gear 632 is journally connected with the output shaft of the adjusting motor 631; a sliding groove is formed in the third connecting block 61, an adjusting rod 633 is slidably connected in the sliding groove, and an adjusting rack 634 engaged with the adjusting gear 632 is integrally arranged on the adjusting rod 633. An adjusting block 62 is fixedly connected to one end of the adjusting rod 633 close to the main body 21, only one limiting needle 5 is not connected with the adjusting block 62, and the other limiting needles 5 are all connected with the adjusting block 62 through the second through holes in the main body 21.

[0044] The adjusting motor 631 is started, the output shaft of the adjusting motor 631 drives the adjusting gear 632 to rotate, the adjusting gear 632 drives the adjusting rack 634 to move, the adjusting rack 634 drives the adjusting rod 633 to move, the adjusting rod 633 drives the adjusting block 62 to move away from the main body 21, and the adjusting block 62 drives the plurality of limiting needles 5 to move, so that the limiting needles 5 move downward, thereby facilitating the operator to take the CPU heat dissipation plate 1.

[0045] With reference to Figure 3 and Figure 6The pressing mechanism 4 comprises a lifting assembly 45, the lifting assembly 45 comprises a stand 451 fixedly connected to the main body 21, a fixed plate 452 is fixedly connected to an end of the stand 451 away from the main body 21, a second air cylinder 453 is connected to the fixed plate 452, a lifting block 454 is connected to a piston rod of the second air cylinder 453, the lifting block 454 is located above the fixed block 22, and a third through hole is formed in the lifting block 454 and used for the stand 451 to pass through. The lifting block 454 is integrally provided with the first connecting block 41, the first connecting block 41 is located directly above the fixed block 22, four first through holes 411 are formed in the first connecting block 41, and the first connecting block 41 is provided with the second connecting block 42 away from the main body 21. Four pressing blocks 43 are fixedly connected to the second connecting block 42, one pressing block 43 corresponds to one first through hole 411, and an end of the pressing block 43 away from the second connecting block 42 passes through the first through hole 411 in the first connecting block 41. Two pressing blocks 43 are located on the CPU heat dissipation plate 1 on one side of the copper pipe mounting groove 12, and the other two pressing blocks 43 correspond to the CPU heat dissipation plate 1 on the other side of the copper pipe mounting groove 12. The second connecting block 42 abuts against the first connecting block 41, and a fixing bolt 44 is arranged on the second connecting block 42 and is screwed with the first connecting block 41.

[0046] The second air cylinder 453 is started, the piston rod of the second air cylinder 453 drives the lifting block 454 to slide on the stand 451, the lifting block 454 drives the first connecting block 41 to move, the first connecting block 41 drives the second connecting block 42 to move, the second connecting block 42 drives the pressing block 43 to move, the pressing block 43 moves towards the fixed block 22, and abuts against the CPU heat dissipation plate 1.

[0047] Reference Figure 3 And Figure 7 The detection mechanism 3 comprises a sliding rail 36 fixedly connected to the main body 21, the sliding rail 36 is located on one side of the fixed block 22, a moving block 31 is slidably connected to the sliding rail 36, a detection block 32 is fixedly connected to an end of the moving block 31 close to the fixed block 22, the detection block 32 is in a stepped shape, and a vertical section of the detection block 32 gradually decreases away from the moving block 31.

[0048] The moving block 31 is provided with a moving assembly 33, the moving assembly 33 comprises a spring 333, one end of the spring 333 is fixedly connected with a first connecting ring 331 and the other end is fixedly connected with a second connecting ring 332, the second connecting ring 332 is sleeved on the limiting needle 5 which is not connected with the adjusting block 62, the limiting needle 5 sleeved with the second connecting ring 332 is located on the side of the fixed block 22 away from the slide rail 36. The moving block 31 is threadedly connected with a connecting bolt 334, the first connecting ring 331 is sleeved on the connecting bolt 334. The spring 333 is always in a compressed state, and the spring 333 is located below the supporting block 23, so that the spring 333 does not hinder the installation of the CPU heat dissipation plate 1 on the supporting block 23. And the spring 333 is located between the two limiting needles 5 connected with the adjusting block 62 and the fixed block 22, so that the spring 333 can be limited.

[0049] The moving block 31 is provided with a detection assembly, the detection assembly comprises a follow-up block 341 fixedly connected with the moving block 31, the follow-up block 341 is located at one end of the moving block 31 away from the detection block 32; the follow-up block 341 is fixedly connected with a PIN needle 342. The lifting block 454 is fixedly connected with a sensor 343, the sensor 343 is located above the PIN needle 342.

[0050] The main body 21 is provided with a blocking assembly 35, the blocking assembly 35 comprises a first air cylinder 351 fixedly connected with the main body 21, the piston rod of the first air cylinder 351 is connected with a blocking block 352, the blocking block 352 abuts against the side of the follow-up block 341 close to the detection block 32.

[0051] The thickness of all the CPU heat sinks 1 is the same, when the pressing blocks 43 abut against the CPU heat sink 1, the first cylinder 351 is started, the piston rod of the first cylinder 351 drives the blocking block 352 to move, the blocking block 352 moves towards the fixed block 22, the elastic deformation force of the spring 333 drives the moving block 31 to move on the slide rail 36 towards the fixed block 22. When the moving block 31 stops moving, the PIN pin 342 is located directly below the sensor 343, the sensor 343 can sense the PIN pin 342, and the part of the detection block 32 away from the moving block 31 is located in the copper pipe mounting groove 12, which indicates that the CPU heat sink 1 is qualified; if the PIN pin 342 is located on the side of the sensor 343 away from the fixed block 22, it indicates that when the depth of the CPU mounting groove 11 is normal, the depth of the copper pipe mounting groove 12 is shallower, so that the high-low level difference of the CPU heat sink 1 is higher; or when the depth of the copper pipe mounting groove 12 is normal, the depth of the CPU mounting groove 11 is shallower, so that the high-low level difference of the CPU heat sink 1 is higher. If the PIN pin 342 is located on the side of the sensor 343 close to the fixed block 22, it indicates that when the depth of the CPU mounting groove 11 is normal, the depth of the copper pipe mounting groove 12 is deeper, so that the high-low level difference of the CPU heat sink 1 is lower; or when the depth of the copper pipe mounting groove 12 is normal, the depth of the CPU mounting groove 11 is deeper, so that the high-low level difference of the CPU heat sink 1 is lower.

[0052] The implementation principle of the high-low level difference detection device for the CPU heat sink is as follows: the CPU heat sink 1 to be detected is placed in the limiting area, and the CPU mounting groove 11 on the CPU heat sink 1 is clamped with the supporting block 23, all the limiting pins 5 abut against the CPU heat sink 1. Then the second cylinder 453 is started, so that all the pressing blocks 43 abut against the CPU heat sink 1. Then the first cylinder 351 is started, so that the blocking block 352 moves towards the fixed block 22, the elastic deformation force of the spring 333 drives the moving block 31 to move on the slide rail 36 towards the fixed block 22, and the state of the PIN pin 342 and the detection block 32 is used to judge whether the CPU heat sink 1 is qualified.

[0053] When the detection of the CPU heat sink 1 is completed, the first cylinder 351 is started first, so that the blocking block 352 moves away from the fixed block 22, the blocking block 352 abuts against the follow-up block 341 and drives the follow-up block 341 to move, the follow-up block 341 drives the moving block 31 to move away from the fixed block 22; then the first cylinder 351 is started, so that the pressing block 43 moves away from the fixed block 22 and does not abut against the CPU heat sink 1; then the adjusting motor 631 is started, so that the adjusting block 62 drives the limiting pin 5 to move downwards, which is convenient for the operator to take the detected CPU heat sink 1.

[0054] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: all equivalent changes made according to the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A device for detecting the height difference of a CPU heatsink, characterized in that, The device includes a main body (21), a fixing block (22), a support block (23), and a detection mechanism (3). The fixing block (22) is fixedly mounted on the main body (21), and the support block (23) is mounted on the fixing block (22). The end of the support block (23) away from the fixing block (22) is engaged with the CPU mounting slot (11). The detection mechanism (3) includes a moving block (31), a detection block (32), a moving component (33), and a detection component. The moving block (31) is slidably mounted on the main body (21) through the moving component (33). The detection block (32) is mounted on the moving block (31), and the cross-section of the detection block (32) gradually decreases in the direction away from the moving block (31). The detection component is mounted on the moving block (31).

2. The CPU heatsink height difference detection device according to claim 1, characterized in that, The detection component includes a follower block (341), a PIN pin (342), and a sensor (343). The follower block (341) is disposed on the moving block (31), the PIN pin (342) is disposed on the follower block (341), and the sensor (343) is disposed on the main body (21).

3. The CPU heatsink height difference detection device according to claim 2, characterized in that, The moving component (33) includes a first connecting ring (331), a second connecting ring (332), a spring (333), and a connecting bolt (334). The first connecting ring (331) and the second connecting ring (332) are respectively disposed at both ends of the spring (333). The connecting bolt (334) is connected to the moving block (31). The first connecting ring (331) is sleeved on the connecting bolt (334). The second connecting ring (332) is connected to the main body (21), and the spring (333) is always in a deformed state. The main body (21) is provided with a blocking component (35) connected to the follower block (341).

4. The CPU heatsink height difference detection device according to claim 3, characterized in that, The blocking assembly (35) includes a first cylinder (351) and a blocking block (352). The first cylinder (351) is disposed on the main body (21), and the blocking block (352) is disposed on the first cylinder (351). The blocking block (352) is capable of abutting against the follower block (341).

5. The CPU heatsink height difference detection device according to claim 1, characterized in that, The main body (21) is provided with a pressing mechanism (4), which includes a first connecting block (41), a second connecting block (42), a pressing block (43), a fixing bolt (44), and a lifting assembly (45). The first connecting block (41) is slidably disposed on the main body (21) through the lifting assembly (45). A first through hole (411) is provided on the first connecting block (41). The pressing block (43) is disposed on the second connecting block (42), and one end of the pressing block (43) away from the second connecting block (42) passes through the first through hole (411) on the first connecting block (41). The pressing block (43) can abut against the CPU heat sink (1). The fixing bolt (44) passes through the second connecting block (42) and is threadedly connected to the first connecting block (41).

6. The CPU heatsink height difference detection device according to claim 5, characterized in that, The lifting assembly (45) includes a column (451), a fixing plate (452), a second cylinder (453), and a lifting block (454). The column (451) is mounted on the main body (21). The fixing plate (452) is mounted on the end of the column (451) away from the main body (21). The second cylinder (453) is mounted on the fixing plate (452). The lifting block (454) is mounted on the piston rod of the second cylinder (453). The first connecting block (41) is mounted on the lifting block (454).

7. The CPU heatsink height difference detection device according to claim 3, characterized in that, The fixing block (22) is provided with a limiting mechanism, which includes a limiting needle (5). Multiple limiting needles (5) are provided, and multiple limiting needles (5) form a limiting space on the main body (21). The fixing block (22) is located in the limiting space, and the second connecting ring (332) is sleeved on one of the limiting needles (5).

8. The CPU heatsink height difference detection device according to claim 7, characterized in that, An adjustment mechanism (6) is provided on the main body (21). The adjustment mechanism (6) includes a third connecting block (61), an adjustment block (62), and an adjustment component (63). The third connecting block (61) is provided on the main body (21), and the adjustment block (62) is slidably provided on the third connecting block (61) through the adjustment component (63). The other limiting pins (5) except for the second connecting ring (332) are provided on the adjustment block (62). A second through hole is provided on the main body (21), and one end of the limiting pin (5) away from the adjustment block (62) passes through the second through hole.

9. The CPU heatsink height difference detection device according to claim 8, characterized in that, The adjustment assembly (63) includes an adjustment motor (631), an adjustment gear (632), an adjustment rod (633), and an adjustment rack (634). The adjustment motor (631) is mounted on the third connecting block (61), and the adjustment gear (632) is keyed to the adjustment motor (631). The adjustment rod (633) is slidably mounted on the third connecting block (61) and connected to the adjustment block (62). The adjustment rack (634) is mounted on the adjustment rod (633) and meshes with the adjustment gear (632).

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